WO2001063201A3 - Optical endpoint detection system for chemical mechanical polishing - Google Patents

Optical endpoint detection system for chemical mechanical polishing Download PDF

Info

Publication number
WO2001063201A3
WO2001063201A3 PCT/US2001/005420 US0105420W WO0163201A3 WO 2001063201 A3 WO2001063201 A3 WO 2001063201A3 US 0105420 W US0105420 W US 0105420W WO 0163201 A3 WO0163201 A3 WO 0163201A3
Authority
WO
WIPO (PCT)
Prior art keywords
well
detection system
mechanical polishing
chemical mechanical
housing
Prior art date
Application number
PCT/US2001/005420
Other languages
French (fr)
Other versions
WO2001063201A2 (en
Inventor
Gregory A Olsen
Mark A Meloni
John M Garcia
Matthew S Weldon
Original Assignee
Speedfam Ipec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Ipec Corp filed Critical Speedfam Ipec Corp
Publication of WO2001063201A2 publication Critical patent/WO2001063201A2/en
Publication of WO2001063201A3 publication Critical patent/WO2001063201A3/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

An apparatus for monitoring the thickness of a film on a substrate includes a housing having a first end and a second end with a well at the first end. The housing also has a bore which extends through the housing to the well, and a fluid channel which is in fluid communication with the well. The apparatus also includes an optical detector assembly positioned within the bore to optically detect a substrate being polished. The apparatus may further include a fluid discharge canal having a first end in fluid communication with the well and extending from the well to a surface of the housing.
PCT/US2001/005420 2000-02-25 2001-02-20 Optical endpoint detection system for chemical mechanical polishing WO2001063201A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US18488400P 2000-02-25 2000-02-25
US60/184,884 2000-02-25
US71272100A 2000-11-14 2000-11-14
US09/712,721 2000-11-14

Publications (2)

Publication Number Publication Date
WO2001063201A2 WO2001063201A2 (en) 2001-08-30
WO2001063201A3 true WO2001063201A3 (en) 2002-03-07

Family

ID=26880566

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/005420 WO2001063201A2 (en) 2000-02-25 2001-02-20 Optical endpoint detection system for chemical mechanical polishing

Country Status (2)

Country Link
TW (1) TW490361B (en)
WO (1) WO2001063201A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITBO20070504A1 (en) 2007-07-20 2009-01-21 Marposs Spa EQUIPMENT AND METHOD FOR THE CONTROL OF THE THICKNESS OF A PROCESSED ELEMENT
DE102007048295A1 (en) * 2007-10-08 2009-04-16 Precitec Optronik Gmbh Apparatus and method for thickness measurement
TWI638399B (en) * 2016-09-07 2018-10-11 台灣積體電路製造股份有限公司 Semiconductor fabrication apparatus and polish module thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5081796A (en) * 1990-08-06 1992-01-21 Micron Technology, Inc. Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer
US5609511A (en) * 1994-04-14 1997-03-11 Hitachi, Ltd. Polishing method
US5972162A (en) * 1998-01-06 1999-10-26 Speedfam Corporation Wafer polishing with improved end point detection

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5081796A (en) * 1990-08-06 1992-01-21 Micron Technology, Inc. Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer
US5609511A (en) * 1994-04-14 1997-03-11 Hitachi, Ltd. Polishing method
US5972162A (en) * 1998-01-06 1999-10-26 Speedfam Corporation Wafer polishing with improved end point detection

Also Published As

Publication number Publication date
WO2001063201A2 (en) 2001-08-30
TW490361B (en) 2002-06-11

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