WO2001060736A3 - Methods and apparatus for a vertically-integrated sensor structure - Google Patents

Methods and apparatus for a vertically-integrated sensor structure Download PDF

Info

Publication number
WO2001060736A3
WO2001060736A3 PCT/US2001/004850 US0104850W WO0160736A3 WO 2001060736 A3 WO2001060736 A3 WO 2001060736A3 US 0104850 W US0104850 W US 0104850W WO 0160736 A3 WO0160736 A3 WO 0160736A3
Authority
WO
WIPO (PCT)
Prior art keywords
sensor structure
methods
integrated sensor
sensor device
sensing element
Prior art date
Application number
PCT/US2001/004850
Other languages
French (fr)
Other versions
WO2001060736A2 (en
Inventor
William G Mcdonald
David J Monk
Mark Layne Shaw
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to AU2001241499A priority Critical patent/AU2001241499A1/en
Publication of WO2001060736A2 publication Critical patent/WO2001060736A2/en
Publication of WO2001060736A3 publication Critical patent/WO2001060736A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

A vertically integrated sensor structure (10) includes a sensor device (50) having a sensing element (54) formed thereon. The sensor device (50) is bonded directly to a control device (42), which itself is bonded to a mounting area (13) of a package (12). The sensing element (54) is electrically coupled to the control circuitry (46), which includes control circuitry (46) configured to receive input signals from the sensor device (50).
PCT/US2001/004850 2000-02-18 2001-02-15 Methods and apparatus for a vertically-integrated sensor structure WO2001060736A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001241499A AU2001241499A1 (en) 2000-02-18 2001-02-15 Methods and apparatus for a vertically-integrated sensor structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US50728000A 2000-02-18 2000-02-18
US09/507,280 2000-02-18

Publications (2)

Publication Number Publication Date
WO2001060736A2 WO2001060736A2 (en) 2001-08-23
WO2001060736A3 true WO2001060736A3 (en) 2002-03-21

Family

ID=24017988

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/004850 WO2001060736A2 (en) 2000-02-18 2001-02-15 Methods and apparatus for a vertically-integrated sensor structure

Country Status (2)

Country Link
AU (1) AU2001241499A1 (en)
WO (1) WO2001060736A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006052468A1 (en) * 2006-11-07 2008-05-08 Robert Bosch Gmbh Micromechanical sensor with integrated chip capacitor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0762096A1 (en) * 1995-09-05 1997-03-12 Motorola, Inc. Vertically integrated sensor structure and method for making same
EP0793103A2 (en) * 1996-02-27 1997-09-03 Seiko Instruments R&D Center Inc. Semiconductor acceleration sensor
WO1998005935A1 (en) * 1996-08-08 1998-02-12 Integrated Sensing Systems, Inc. Method for packaging microsensors
JPH10318869A (en) * 1998-03-20 1998-12-04 Hokuriku Electric Ind Co Ltd Pressure sensor and its manufacturing method
DE19830538A1 (en) * 1998-07-08 2000-01-20 Siemens Ag Pressure sensor arrangement, in particular for pressure detection in an oil-loaded pressure area of a motor vehicle transmission

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0762096A1 (en) * 1995-09-05 1997-03-12 Motorola, Inc. Vertically integrated sensor structure and method for making same
EP0793103A2 (en) * 1996-02-27 1997-09-03 Seiko Instruments R&D Center Inc. Semiconductor acceleration sensor
WO1998005935A1 (en) * 1996-08-08 1998-02-12 Integrated Sensing Systems, Inc. Method for packaging microsensors
JPH10318869A (en) * 1998-03-20 1998-12-04 Hokuriku Electric Ind Co Ltd Pressure sensor and its manufacturing method
DE19830538A1 (en) * 1998-07-08 2000-01-20 Siemens Ag Pressure sensor arrangement, in particular for pressure detection in an oil-loaded pressure area of a motor vehicle transmission

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
BOUWSTRA S: "Stacked multi-chip-module technology for high performance intelligent transducers", MICROMACHINED DEVICES AND COMPONENTS II, AUSTIN, TX, USA, 14-15 OCT. 1996, vol. 2882, 14 October 1996 (1996-10-14) - 15 October 1996 (1996-10-15), Proceedings of the SPIE - The International Society for Optical Engineering, 1996, SPIE-Int. Soc. Opt. Eng, USA, pages 49 - 52, XP001039853, ISSN: 0277-786X *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 03 31 March 1999 (1999-03-31) *
TANIGAWA H ET AL: "MOS INTEGRATED SILICON PRESSURE SENSOR", IEEE TRANSACTIONS ON ELECTRON DEVICES, IEEE INC. NEW YORK, US, vol. 32, no. 7, 1 July 1985 (1985-07-01), pages 1191 - 1195, XP000604685, ISSN: 0018-9383 *

Also Published As

Publication number Publication date
WO2001060736A2 (en) 2001-08-23
AU2001241499A1 (en) 2001-08-27

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