WO2001058657A1 - A method and apparatus for producing injection molded tablets - Google Patents
A method and apparatus for producing injection molded tablets Download PDFInfo
- Publication number
- WO2001058657A1 WO2001058657A1 PCT/SG2000/000025 SG0000025W WO0158657A1 WO 2001058657 A1 WO2001058657 A1 WO 2001058657A1 SG 0000025 W SG0000025 W SG 0000025W WO 0158657 A1 WO0158657 A1 WO 0158657A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cavity
- ejector pin
- support block
- mold support
- compound
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/462—Injection of preformed charges of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/03—Injection moulding apparatus
- B29C45/04—Injection moulding apparatus using movable moulds or mould halves
- B29C45/06—Injection moulding apparatus using movable moulds or mould halves mounted on a turntable, i.e. on a rotating support having a rotating axis parallel to the mould opening, closing or clamping direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/03—Injection moulding apparatus
- B29C45/04—Injection moulding apparatus using movable moulds or mould halves
- B29C45/06—Injection moulding apparatus using movable moulds or mould halves mounted on a turntable, i.e. on a rotating support having a rotating axis parallel to the mould opening, closing or clamping direction
- B29C2045/065—Injection moulding apparatus using movable moulds or mould halves mounted on a turntable, i.e. on a rotating support having a rotating axis parallel to the mould opening, closing or clamping direction continuously rotating turntables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/25—Solid
- B29K2105/253—Preform
- B29K2105/255—Blocks or tablets
Definitions
- This invention relates to injection molding machines and; more particularly, to injection
- Injection molding machines are typically employed for producing tablets, which tablets
- thermosetting resin can, for example, be comprised of a thermosetting resin.
- the tablets are ordinarily used for
- the semiconductor device is positioned in a mold cavity. Meanwhile, the tablet is separately
- thermo resin encapsulated device is further processed for shaping and curing the encapsulated
- thermosetting resin is conventionally formed into tablets at a pressure
- thermosetting resin tablets of about 0.5 to 1.0 ton/cm.sup.2.
- Compressibility (%) tablet density/density of molded product. Since the density of the molded product remains the same for each type of thermosetting resin, the tablet density increases with an increase in the compressibility. In other words, the
- voids of about 0.1 mm size can be detected. Some have several voids of 0.5 to 1.0 mm. Such
- encapsulated semiconductor device especially its resistance to thermal shock and to humidity.
- An object of the present invention is to provide a method and apparatus for producing
- the apparatus comprising a cylindrical mold support block rotatably mounted on a drive shaft.
- the drive shaft is coupled with a motor for rotating the shaft about a central axis of rotation.
- the mold support block includes a plurality of bores uniformly spaced about a
- An ejector pin is slidably mounted in each bore defined on
- Each ejector pin includes a first end and a second end. The first end of
- each ejector pin is dimensioned to engage an actuator so that actuation thereof forces the second
- a cylindrical cavity plate is mounted on the mold support block such that a plurality of cavities defined on the cavity plate substantially align with the bores defined on the mold support block.
- An injection head segment is mounted adjacent to and in close proximity with the cavity
- the injection head segment includes an orifice that is dimensioned to accept a first end of
- a second end of the plasticizing screw is coupled with a hopper or
- Each cavity containing compound is initially compressed between a portion of the
- a clamping segment is mounted immediately adjacent to the injection head segment for providing a predetermined compression or clamping force on the
- the mold support block and cavity plate mounted thereon continues to rotate about the
- each ejector pin associated with each cavity is individually actuated
- a rotary injection molding apparatus including a drive shaft
- the mold support block and cavity plate are arranged so that the bores defined on the
- mold support block and the central bores defined on the base of each cavity are substantially identical
- the ejector pin actuator engages the first end of each ejector pin to actuate each ejector
- the orifice defined on the injection head segment receives the first end of the plasticizing
- a continuous stream of compound is ejected from the first end of the plasticizing screw
- each cavity is thereafter compressed; permitted to cool;
- Fig 1(a) is a partial cross-sectional view of the rotary injection molding apparatus having
- Fig 1(b) is a front view of the cavity plate shown in Fig. 1(a);
- Fig 2(a) is an elevated side view of the mold support block shown in Fig.1(a);
- Fig 2(b) is a front view of the cavity plate, injection head segment, and clamping plate
- Fig 3 is a linearized side view of an ejector pin action device.
- the present invention is directed to a method and apparatus for producing injection
- apparatus 5 is set forth comprising mold support block 10 which is rotatably mounted on drive
- Mold support block 10 includes a plurality of cylindrical bores 17, which bores 17 are
- Actuator 25 which can be an electric motor or hydraulic motor, is coupled to
- drive shaft 10 for rotating shaft 10 about a central axis of rotation 30.
- drive shaft 10 for rotating shaft 10 about a central axis of rotation 30.
- Ejector pin guide plate 35 which includes a plurality of cylindrical bores 40 defined
- each bore 40 defined thereon substantially aligns with one of the ejector pins 18 mounted in each of the bores 17 defined on mold support
- Bores 40 defined on ejector pin guide plate 35 are each dimensioned to closely
- Cavity plate 50 which includes a plurality of
- cylindrical cavities 55 formed thereon is mounted on ejector pin guide plate 35 so that each of
- cavities 55 defined on cavity plate 50 substantially aligns with each of the ejector pins 18.
- base 55a of each cavity 55 includes central bore 60 dimensioned to
- central portion 10a of mold support block 10 includes cooling chamber 65 dimensioned to permit a cooling fluid (not shown) to circulate through cooling
- Cooling chamber 65 for cooling mold support block 10. Cooling chamber 65 further includes cooling
- Cooling fluid inlet 65a and cooling fluid outlet 65b Cooling fluid inlet 65a and cooling fluid outlet 65b
- cooling chamber 65 to be coupled with a cooling fluid supply (not shown).
- Injection head segment 70 is mounted in close proximity to cavity plate 50 so that several
- Injection head segment 70 includes an orifice 75 which is dimensioned to accept first end 80a of plasticizing screw 80.
- Second end 80b of plasticizing screw 80 is coupled to a hopper, or compound supply (not shown).
- Axial rotation of plasticizing screw 80 in the direction of arrow-90 translates to linear motion of a compound (not shown) introduced to the compound supply, which compound is moved from second end 80b of plasticizing screw 80 to first end 80a of plasticizing screw 80 via hollow threaded interior portion 80c defined in plasticizing screw 80. While the compound traverses from second end
- Clamping plate segment 90 is mounted in close proximity to cavity plate 50 immediately
- clamping plate segment 90 is
- plate segment 90 provides a compression force on the plasticized compound contained in each cavity 55 of cavity plate 50 until the compound solidifies.
- One preferred compression force of clamping plate segment 90 ranges from approximately 20 tons to approximately 50 tons.
- Fig, 2(b) illustrates a front view of cavity plate which includes the plurality of
- cylindrical ly shaped cavities as well as injection head segment 70 with orifice 75 defined thereon
- each ejector pin 18 is spring biased so that first end 18a of each
- ejector pin 18 can be momentarily actuated by ejector pin actuation device 100 to slide ejector
- ejector pin actuation device 100 comprises first ramped segment 100a and second ramped segment 100b coupled to ejector track 100c. Ejector pin actuation device 100 is secured to the mounting table 20 (Fig. 1) in close proximity to
- 100c is dimensioned to slidably engage with first end 18a of each ejector pin 18 so that first end
- first end 18a of ejector pin 18 rides upwardly along the first ramped segment 100a to
- end 18b of ejector pin 18 is guided into an adjacently aligned cavity 55 defined on cavity plate 50 via ejector pin guide plate 35 (Fig. 1). Thereafter, first end 18a of ejector pin 18 rides
- ejector pin actuation device 100 including first ramped segment 100a
- second ramped segment 100b can have a substantially arcuate shape.
- plasticizing screw 80 to permit compound previously ejected into cavity 55 to cool and solidify.
- the size of the ramps may be adjusted accordingly to take into account the number of cavities
- ramped segment 100b of ejector pin actuation device 100 are oriented approximately 180- degrees from first end 80a of plasticizing screw 80. The position of ramped segments 100a and
- plasticizing screw 80 is positioned in close proximity to cavities 55 defined on cavity plate 50.
- plasticized reactive epoxy moiding compound is continuously ejected out of first end 80a of screw 80 via hollow threaded interior portion 80c defined in plasticizing screw 80.
- mold support block 10 ejector pins 18, ejector pin guide plate, and cavity plate 50 are
- cooling fluid is circulated through mold support block 10.
- the cooling fluid thermally
- each cavity 55 rotates about central axis
- ejector pins 18 slide along ejector track 100c and sequentially ride up and ride down first 100a
- tablets 120 are sequentially ejected from cavities 55. After tablet 120 is ejected from an
- second end 18b of ejector pin 18 is retracted therefrom as first end 18a of
- ejector pin 18 rides downwardly along second ramped segment 100b of ejector pin actuation device 100. Thereafter, the ejected solidifed tablets 120 can be subjected to further processing for encapsulating electronic devices.
- the tablets include a relatively high
- the tablets contain minimal voids and minimal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/SG2000/000025 WO2001058657A1 (en) | 2000-02-11 | 2000-02-11 | A method and apparatus for producing injection molded tablets |
AU2000228418A AU2000228418A1 (en) | 2000-02-11 | 2000-02-11 | A method and apparatus for producing injection molded tablets |
JP2001557741A JP2003522048A (en) | 2000-02-11 | 2000-02-11 | Method and apparatus for manufacturing injection molded tablets |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/SG2000/000025 WO2001058657A1 (en) | 2000-02-11 | 2000-02-11 | A method and apparatus for producing injection molded tablets |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001058657A1 true WO2001058657A1 (en) | 2001-08-16 |
Family
ID=20428791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/SG2000/000025 WO2001058657A1 (en) | 2000-02-11 | 2000-02-11 | A method and apparatus for producing injection molded tablets |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2003522048A (en) |
AU (1) | AU2000228418A1 (en) |
WO (1) | WO2001058657A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110603127A (en) * | 2017-03-20 | 2019-12-20 | 戈特弗里德·施泰纳 | Method and device for producing a component or profile |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2375955A (en) * | 1942-09-07 | 1945-05-15 | Roger R Smith | Apparatus for producing solid or hollow pellets |
US2693007A (en) * | 1950-04-18 | 1954-11-02 | Us Rubber Co | Molding method |
GB1438406A (en) * | 1973-11-16 | 1976-06-09 | Talis N S | Press-moulding machines |
US5804126A (en) * | 1994-12-23 | 1998-09-08 | Amoco Corporation | Process for making preforms useful for encapsulating semiconductors |
-
2000
- 2000-02-11 JP JP2001557741A patent/JP2003522048A/en not_active Withdrawn
- 2000-02-11 AU AU2000228418A patent/AU2000228418A1/en not_active Abandoned
- 2000-02-11 WO PCT/SG2000/000025 patent/WO2001058657A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2375955A (en) * | 1942-09-07 | 1945-05-15 | Roger R Smith | Apparatus for producing solid or hollow pellets |
US2693007A (en) * | 1950-04-18 | 1954-11-02 | Us Rubber Co | Molding method |
GB1438406A (en) * | 1973-11-16 | 1976-06-09 | Talis N S | Press-moulding machines |
US5804126A (en) * | 1994-12-23 | 1998-09-08 | Amoco Corporation | Process for making preforms useful for encapsulating semiconductors |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110603127A (en) * | 2017-03-20 | 2019-12-20 | 戈特弗里德·施泰纳 | Method and device for producing a component or profile |
Also Published As
Publication number | Publication date |
---|---|
JP2003522048A (en) | 2003-07-22 |
AU2000228418A1 (en) | 2001-08-20 |
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