WO2001057923A1 - Method for producing electrical connections in particular for an electronic device - Google Patents

Method for producing electrical connections in particular for an electronic device Download PDF

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Publication number
WO2001057923A1
WO2001057923A1 PCT/FR2001/000332 FR0100332W WO0157923A1 WO 2001057923 A1 WO2001057923 A1 WO 2001057923A1 FR 0100332 W FR0100332 W FR 0100332W WO 0157923 A1 WO0157923 A1 WO 0157923A1
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WO
WIPO (PCT)
Prior art keywords
conductive
connection element
microcircuit
electrical
polymerization
Prior art date
Application number
PCT/FR2001/000332
Other languages
French (fr)
Inventor
Philippe Patrice
Didier Elbaz
Original Assignee
Gemplus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus filed Critical Gemplus
Priority to AU31974/01A priority Critical patent/AU3197401A/en
Publication of WO2001057923A1 publication Critical patent/WO2001057923A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
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    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Definitions

  • the present invention relates to the field of electrical connections, in particular for electronic devices. It relates more particularly to the making of connections between electronic circuits and communication interfaces in electronic devices, in particular portable electronic devices such as smart cards and the like.
  • the invention thus applies very especially, but not exclusively, to smart cards of all types, both contactless and contactless, as well as electronic labels, among others.
  • the term “electronic circuits” is understood here to mean simple integrated circuits, commonly known as “chips”, but also integrated circuits further comprising passive elements, such as for example capacitors, resistors, inductors, etc., such as is the case in logic circuits with resistors-capacitors-tranoistors ' RCTL, in English resistor-capacitor-transistor logic).
  • circuit device designates both chip cards with flush contacts as well as contactless chip cards, hybrid chip cards, electronic tags and all other types of devices which may include one or more circuit chips. integrated, on a support or even on their original substrate.
  • Connection or “electrical connection” is understood here to mean the establishment of an electrically conductive link between two electrically separated conductive elements.
  • Said conductive elements may be connection points of a device or a circuit, or still connecting tracks, themselves connected to a circuit or to an electrical member, in particular.
  • the points to be connected are respectively the pads of the electronic circuit and those of the communication interfaces associated with them.
  • the contact pads can be input pads or output pads, depending on the architecture of the electronic device and its functionalities.
  • the communication interface can be formed by contact pads and / or an antenna, or even by connecting tracks electrically connected to said contact pads and / or at the ends of the antenna. It has elements or areas for its connection, conventionally known as interface pads.
  • connection between said chip and the communication interfaces is carried out: either by a so-called wired technology, or by the technique called flip-chip, or even by means of an electrically conductive substance.
  • the so-called wired technology includes micro-wiring or welding of the connections of the contact pads of the chip with the communication interface.
  • wire bonding does not require any particular characteristic for the component constituting the integrated circuit.
  • the wired connection is made by means of wires, generally gold, which makes this technology delicate and expensive.
  • a coating must then cover the chip and the soldered connection wires, to protect them.
  • the equipment used requires high-precision equipment for making the connections, which is a factor in slowing production rates.
  • the chip must include pads or protuberances ("pads”) and the chip is then turned over so that its active face is oriented towards the dielectric support on which it is conventionally fixed, while the electrical connection is ensured by means of an anisotropic conductive polymer, establishing contact between the contact pads of the chip and the communication interface.
  • pads pads or protuberances
  • the chip is fixed on a support and the connections between its contact pads and the communication interfaces are made by means of a bead of isotropic adhesive conductive substance, which follows the relief of support.
  • the problem which is the a ⁇ e of the invention is to have a method of making electrical connections easy to implement and providing reliable connections, possibly modular and / or adjustable to suit.
  • the problem is to have a method for connecting the chips with their communication interfaces, which is easy to implement, inexpensive, and which allows very precise interconnection and at very high speed.
  • the object of the invention is therefore to provide a method which makes it possible to best resolve the difficulties inherent in traditional methods of electrical connection, in particular between an electronic microcircuit or chip and communication interfaces, and to overcome as far as possible constraints then encountered.
  • the invention provides a method for making electrical connections between at least two conductive elements, in which: a) a mass of non-conductive material, capable of being provided, is placed between at least two of said elements to be connected with an electrical conductivity, b) it hardens and / or is polymerized and / or fixed said material, and c) it activates at least a fraction of said material, located along a path connecting at least two of said conductive elements to be connected , with an energetic means to induce an electrical conductivity.
  • the electrical conductivity induced or created by the process according to the invention can be permanent or not.
  • Said material is a distributable or applicable material, which preferably hardens and / or polymerizes and / or is fixed at least partially, according to its nature and / or its composition, as will be described below.
  • the term “fixing” is understood here to mean the optional operation consisting in adhering and / or at least partially hardening said material to give it a consistency allowing it to remain in place.
  • activation of at least part of said material is meant the activation and / or excitation thereof before and / or after, preferably after, an optional at least partial hardening of said material.
  • said electrical connections are made by deposition, overlapping over all or part of the active face of the microcircuit and of said communication interface elements or connection points or associated connection tracks, of a non-conductive material, capable of being provided with an electrical conductivity, advantageously fixable on the microcircuit or the support thereof and / or polymerizable, it hardens and / or polymerizes and / or fixes said material, and treats said material with an energetic means capable of inducing a localized electrical conductivity at a t Rajet connecting each input or output terminal to a communication interface element and / or to a connection point and / or to an associated connection track.
  • Fig. 1 shows a schematic sectional side view of a connection between a chip and a communication interface according to the known wire technique.
  • Fig. 2 shows a schematic sectional side view of a connection according to the so-called flip-chip technique.
  • - Fig. 3 shows a schematic sectional side view of a connection between a chip and a communication interface by deposition of an electrically conductive substance.
  • Fig. 4 shows a top view of a chip on a support (on the left) and of a first form of connection of said chip by the method according to the invention (on the right).
  • Fig. 5 shows a top view of a chip on a support (on the left) and of a second form of connection of said chip by a variant of the method according to the invention (on the right).
  • Fig. 6 shows a schematic sectional side view of another form of connection between chip and communication interface by the method according to the invention.
  • a microcircuit or chip I comprising input or output pads 3, is connected to communication interface elements 4 by means, according to the prior art, of a wired connection 5 (see Fig. 1) , of a flip-chip 6 connection (see Fig. 2) or a connection with an electrically conductive substance 7. (see Fig. 3;
  • a connection according to the invention comprises a deposit in the form of a bead between two conductive elements of a material as defined above, which, once hardened, fixed and / or polymerized and subjected to appropriate radiation revealing the electrical conductivity of said material, has all or almost all of the desired electrical conductivity.
  • FIGS 4, 5 and 6 attached illustrate three embodiments of connections according to the invention, in which there is deposited between at least two points to be connected, respectively constituted by a pad 3 of a chip 1 and a communication interface 4 or connection points on support 2, a material 8 which is non-conductive of electricity, but is capable of becoming so under radiation.
  • the material 8 can thus be deposited on a set of more than two points to be connected, as illustrated in Figs. 4 and 5 appended.
  • the material deposition 8 does not partially cover the chip 1, but this is enough to protect said chip.
  • the material is distributed over two distinct zones, covering separate zones, straddling at least two edges of the chip, and extending over at least two pairs of points to be connected, in this case a pair and three pairs respectively.
  • the material 8 covers all of the points to connect and the chip in full, and therefore provides complete protection thereof.
  • the conductive plane portions 9 can extend from the material deposition plane 8 to the external surface of the latter.
  • the layer of deposited material covers all of the connection points 3, 4 and of the chip 1, itself fixed by an adhesive on a support 2, while the action of the energy means is made not only directive, but also focused by appropriate means, known to those skilled in the art.
  • Said portions of the material 8 made conductive can then be located entirely: the interior of the mass of material 8, which therefore protects _.msi mechanically and electrically isolates the area made conductive 9.
  • the zones 9 made conductive can thus be distant from the sides of the chip 1, that is to say do not touch them. This is of particular interest for chips having flanks that conduct electricity.
  • the invention is p rticulièrement suitable for the manufacture of smart card- according to the methods using a micromodule.
  • An advantageously dielectric material is then used as support 2 for the micromodule which, provided with at least a chip of integrated circuits 1 and its connections with respective points 3,4 to be connected by the technique according to the invention, is embedded in a card body.
  • This support is in practice implemented in the form of a film from which the micromodules to be transferred to said card body are then cut.
  • the support 2 on which the microcircuit is thin can be a substrate, a polymer sheet, or the like.
  • the material 8 is advantageously a fixable material.
  • fixable material is understood here to mean any material capable of being retained by mechanical and / or physical and / or chemical bonding on the materials on which it is deposited, in particular on a microcircuit, and in particular by adhesion or attachment, by adsorption and / or by polymerization. This fixation can take place either directly or indirectly by means of an appropriate fixing agent.
  • this material 8 must be capable of locally presenting an electrical conductivity, permanent or not, after induction of the latter by appropriate means.
  • the fixable material 8 is a material having adhesive or bonding properties with respect to the microcircuit and / or the support thereof. This preferred property makes it possible to dispense with a fixing means, such as an adhesive, for the drop of material deposited, which then suffices in itself to remain in place, provide the desired electrical conduct and protect the active face of mi c rocircuit.
  • the non-conductive material used according to the invention may for example comprise: an inorganic material, such as silver salts, in particular carbonate or silver chloride, which under the influence of an applied radiation, for example UV irradiation, and in the presence of a reducing agent ⁇ 0
  • a mixed mineral / organic material such as for example silver salts selected from citrate or its hydrate, cyclohexane utyrate, thiocarbamate, lactate, acetylacetonate, acrylates or methacrylates, this mixed material also being able give rise to a deposit of ary metal under the influence of applied radiation, for example UV irradiation, in the presence of a reducing agent such as for example an amine, among others; and / or an organic material, in particular chosen from: precursor monomers of intrinsically conductive polymers such as, for example, polyacetylene, polyphenylene acetylene, the polymerization of which can preferably be carried out in the presence of suitable catalysts and under irradiation, by known means of a person skilled in the art, and suitable oligomers, in particular specific oligomers constituted by poly (bis (alkylthio) acetylenes, preferably of average
  • At least one mineral and / or mineral / organic material mentioned above is used as the filler of at least one monomer which can be polymerized by cationic or radical means, in order to render the polymer ex * fully electrically conductive. formed from said monomer.
  • the materials of the abovementioned categories can be used either individually or according to any mixtures.
  • a person skilled in the art is able to determine, if necessary at mc * * in iterative tests, the better choice of materials and respective proportions of them to make these mixtures.
  • the abovementioned materials or their mixtures can optionally be combined with other materials which are also non-conductive, but which are not capable of providing electrical conductivity in themselves.
  • the material 8 according to the invention can be heterogeneous, if it has been formed by a precipitation giving grains.
  • the portions of non-conductive material and the conductive portions however represent an assembly constituting a homogeneous or substantially homogeneous structure, or the same network and, in particular in the case of polymeric materials, the network then constitutes an identical basic matrix for the portions of material. 8 and 9.
  • oliomers of poly (bis (alkylthio) acetylene) type indicated above mention may be made of the compounds supplied by the company Aldrich Chemical Co. under the references 44600-9 and 44601-7 respectively for a poly (bis (methylthioj acetylene) and for a poly (bis (ethylthioj acetylene).
  • the product referenced 44600-9 has a weight average molar mass of approximately 4000 and its elemental analysis gives the following percentages: carbon 40.38%, hydrogen 4.95%, nitrogen 0.02%, sulfur 55.16%.
  • the product referenced 44601-7 has a weight average molar mass of approximately 1200 and its analysis elementary gives the following percentages: carbon 49.47%, hydrogen 7.05%, sulfur 45.31%
  • the absorption bands corresponding to the "excitation" of polyacetylene are at wavelengths respectively of about 300 nm for a weight average molecular weight of 500 and to about 600 nm for a molecular weight weight average of 12,000.
  • the selected polythioacetylene is subjected to cryogenic grinding until a powder having an adequate particle size is obtained and this powder is dispersed in a polymerizable formulation of monomeric acrylic type with radical polymerization.
  • the proportion of the powder is preferably about 30 to 80%, advantageously about 30 to 50% by weight of the acrylic type formulation.
  • a radical polymerization is accomplished in the presence of an epoxy catalyst, advantageously between 50 and 80 °. C approx.
  • the areas that we want to make electrically conductive are then irradiated with appropriate energy levels and electrical connections are obtained according to the invention.
  • the aim is the manufacture of electronic cards, the card body of which comprises a polymerized plastic layer and that it is then recommended that the polymerization implemented does not lead to shrinkage of the plastic material, while 'It is indicated that a polymer / (monomer + polymer) ratio greater than the threshold triggering the gel effect would give the plastic a too high viscosity, which is not desired.
  • the polymerization shrinkage is on the contrary an advantage for making the connections thus made reliable and it is therefore sought after, and on the other hand the viscosity of the material used must not be too low and a certain viscosity is even sought, to limit the flow of the material during the treatment.
  • the material 8 can be in a form already at least partially polymerized before its deposition and applied according to a "holt melt” type procedure.
  • the material used is thermoplastic and is made thermosetting by post-crosslinking, according to procedures as described in document FR 2,743,336.
  • the material used according to the invention may comprise a mixed formulation suitable for cationic polymerization and for radical polymerization respectively.
  • the material 8 can thus comprise, for example, monomers with cationic polymerization capable of producing a soluble polymer, and monomers with radical polymerization, with for example epoxy catalysis between 50 and 100 ° C. in the solvent phase (in particular methyl ethyl ketone), with in option an anti-sedimentation agent. If the glass transition temperature is lower than 130 ° C., a deposition according to the so-called hot-melt technique is recommended, otherwise the deposition can be carried out in solution. The irradiation is then focused on the areas of the polymeric material to be made conductive.
  • the invention therefore also relates to a composition of non-conductive material, capable of being made electrically conductive under the action of an energetic means, said composition of material comprising a combination of at least one polymerization monomer. cationic and of at least one monomer with radical polymerization, as well as optionally a filler capable of rendering electrically conductive the polymer formed from at least one of said monomers.
  • This optional filler is preferably a silver salt, advantageously combined with a reducing agent.
  • the material is not intrinsically capable of becoming electrically conductive by the method according to the invention, said material is added to an appropriate charge to confer on it an extrinsic electrical conductivity.
  • silver salts useful indications concerning them can be found in the article by M.R.V. Sahyun, "Recent Development in Photography Development", CHEMTECH, July 1992, 22, 413-424.
  • Silver salts both organic and inorganic, are sensitive to light and not only to UV radiation, and the energy received determines the greater or lesser proportion of their conversion to silver metal.
  • UV rays can then be used to polymerize the double bond of visible molecules and visible light to precipitate / form the conductive metal silver.
  • developer / developer agents which can be used as an option, the skilled person can refer to the above article, as well as to the literature cited therein.
  • the proportion of material capable of being made electrically conductive in such mixtures can vary between approximately 15 and 100% by weight of the total material 8, 100- representing the case of pure products, ⁇ ar example oligomers which can be polymerized and ⁇ _ adiees to present in themselves an electroconducti ". * rté induced.
  • the proportion of silver salt or any other charge capable of imparting an extrinsic electrical conductivity is advantageously 20-50% in weight relative to the weight of the non-conductive material used.
  • said materials can be used in the aqueous phase, in the solvated phase in non-reactive or reactive solvents, or in the molten state if their stability to heat allows it.
  • the material used can be in solution, in dispersion or in emulsion.
  • said material is deposited in accordance with the invention, for example by a technique for dispensing aid or viscous matter called "dispensing technique" known to those skilled in the art, in the form of one or more drops of suitable size, deposited using conventional equipment, such as a suitable nozzle or syringe.
  • Dan ⁇ practice 1 'i * radiation to impart the desired electrical conductivity, localized according to the invention in a path connecting each input pad been output to a communication interface element or a connection point or to the associated connecting track, can be directed to the areas to be electroconductive of the material as deposited, that is to say in its initial state after dispensation. This irradiation is then followed, if necessary, by one or more of the stages mentioned above of evaporation and / or of polymerization, as the case may be.
  • said irradiation can be carried out, optionally with directivity on the zones to be made electroconductive, after drying, evaporation of solvent and / c * vices. material polymerization 8.
  • the material deposited and made electrically conductive according to the present invention is, after optional treatment, solid or semi-solid.
  • the means of induction or creation of a localized electrical conductivity can be * chosen in practice, for example, from irra ⁇ iation, in particular irradiation with visible light, irradiation with near or distant UV, irradiation with X-rays, irradiation by means of appropriate laser radiation, and / or treatment by thermal means, in particular by direct and localized blowing of hot air.
  • These induction modes are not, however, limiting and it is within the reach of those skilled in the art to determine by means of tests which the preferred specific wavelengths can be, relating to each of the products used according to the invention. .
  • Those skilled in the art know in particular, or can easily determine, the energies (power and duration of excitation at a determined wavelength) required to lead to excitation in each concrete case.
  • the induction of an electrical conductivity can, if desired, be made directive by any known appropriate directive means, along a path connecting an input or output pad to a communication interface element or a point of - annexation or an associated linking track.
  • path is meant _ci the zone or the mean plane of deployment of the conductive zone between a pad of the microcircuit and the corresponding interface element or the associated connecting track, but also the possible displacement of the induction means or creation of electrical conductivity, if provision is made to create this electrical conductivity by a relative displacement of the means used and / or of the microcircuit with respect to each other.
  • the technique according to 1 the invention per e ** further shift in time of the réalrsation ___a all or part of the desired connections. It allows in particular to make connections on a finished product, previously provided with at least one mass of material 8 in which no connection or only part of the desired connections has been made.
  • the present invention also relates to a new electrical connection element, comprising a composition of material as defined above, deposited between at least two conductive elements to be connected, at least a portion 9 of this same material being conductive of the electric quoted.
  • Said electrical connection element considered. at a given time, is advantageously composed of a mass of material which is not electrically conductive, at least one portion of which is electrically conductive, while the remaining fraction is capable of being made electrically conductive by l intermediary of an energetic means.
  • the characterization of the above-mentioned respective fractions or portions of such an element can be carried out by electrical conductivity measurements, according to methods known to those skilled in the art, and / or by means of electrochromic dyes (for example oxazolidine derivatives), which are compounds having the property of having coloring / discoloration wavelengths defined according to whether or not they are subjected to an electric current, which causes the color to change in the conductive zone.
  • electrochromic dyes for example oxazolidine derivatives
  • electrochromic dyes as a developer, for example by depositing them on the surface or on a longitudinal or transverse section of a mass of material 8.9 to reveal the presence of zones of conductive material of the electricity and / or that of non-electrically conductive zones, as well as the conversion of a non-conductive zone into an electrically conductive zone after the application of an appropriate energy means in accordance with the invention.
  • the present invention also relates to an electronic device comprising at least one microcircuit (1) on a support (2), provided with input and output pads (3), and at least one communication interface element (4 ) and / or connecting points and / or tracks, as well as at least one connection element, in which at least one connection element connecting said microcircuit to said communication interface and / or to points and / or link is a connection element as described above.
  • the invention also relates to a smart card module comprising electrical connection elements as defined above, as well as a smart card comprising such a module, inserted in a card body.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

The invention concerns a method for producing electrical connections between at least two conductive elements (3, 4), which consists in: a) positioning between at least two of said elements to be connected a mass of non-conductive material (8), capable of being provided with electrical conductivity; b) hardening and/or polymerising and/or setting said material; and c) activating at least a fraction (9) of said material located along a path connecting said conductive elements, with energy means to induce therein electrical conductivity.

Description

PROCÉDÉ POUR LA RÉALISATION DE CONNEXIONS ÉLECTRIQUES, NOTAMMENT POUR UN DISPOSITIF ÉLECTRONIQUE METHOD FOR MAKING ELECTRICAL CONNECTIONS, ESPECIALLY FOR AN ELECTRONIC DEVICE
La présente invention oncerne le domaine des connexions électriques, en particulier pour des dispositifs électroniques. Elle concerne plus particulièrement la réalisation des connexions entre circuits électroniques et interfaces de communication dans les dispositifs électroniques, notamment les dispositifs électroniques portables tels que les cartes à puce et analogues. L'invention s'applique ainsi tout spécialement, mais non exclusivement, aux cartes à puces de tous types, aussi bien à contacts que sans contact, ainsi qu'aux étiquettes électroniques, entre autres. On entend ici par "circuits électroniques" des circuits intégrés simples, couramment dénommés "puces", mais également des circuits intégrés comportant en outre des éléments passifs, tels que par exemple des condensateurs, des résistances, des inductances, etc., comme c'est le cas dans les circuits logiques à résistances-condensateurs-tranoistors 'RCTL, en anglais resistor-capacitor-transistor logic) .The present invention relates to the field of electrical connections, in particular for electronic devices. It relates more particularly to the making of connections between electronic circuits and communication interfaces in electronic devices, in particular portable electronic devices such as smart cards and the like. The invention thus applies very especially, but not exclusively, to smart cards of all types, both contactless and contactless, as well as electronic labels, among others. The term “electronic circuits” is understood here to mean simple integrated circuits, commonly known as “chips”, but also integrated circuits further comprising passive elements, such as for example capacitors, resistors, inductors, etc., such as is the case in logic circuits with resistors-capacitors-tranoistors ' RCTL, in English resistor-capacitor-transistor logic).
L'expression "dispositif à circuits électroniques" désigne aussi bien des cartes à puce à contacts affleurants que des cartes à puce sans contact, des cartes à puces hybrides, des étiquettes électroniques et tous autres types de dispositifs pouvant comporter une ou plusieurs puces de circuit intégré, sur un support ou même sur leur substrat d'origine. On entend ici par "connexion" ou "connexion électrique" l'établissement d'une liaison conductrice de l'électricité entre deux éléments conducteurs séparés électriquement .The expression “electronic circuit device” designates both chip cards with flush contacts as well as contactless chip cards, hybrid chip cards, electronic tags and all other types of devices which may include one or more circuit chips. integrated, on a support or even on their original substrate. “Connection” or “electrical connection” is understood here to mean the establishment of an electrically conductive link between two electrically separated conductive elements.
Lesdits éléments conducteurs peuvent être des points de connexion d'un appareil ou d'un circuit, ou encore des pistes de liaison, reliées elles-mêmes à un circuit ou à un organe électrique, notamment.Said conductive elements may be connection points of a device or a circuit, or still connecting tracks, themselves connected to a circuit or to an electrical member, in particular.
Bien qu'elle concerne de manière générale les connexions électriques d'éléments électroconducteurs de tous types, la présente invention sera décrite ci-après, à des fins de simplification et d'illustration concrète, en référence à son application dans le secteur des objets portables tels que les cartes à puce.Although it generally relates to the electrical connections of electrically conductive elements of all types, the present invention will be described below, for the purposes of simplification and concrete illustration, with reference to its application in the sector of portable objects. such as smart cards.
Dans le cas de tels dispositifs électroniques à circuit intégré, les points à connecter sont respectivement les plots du circuit électronique et ceux des interfaces de communication qui leur sont associés.In the case of such electronic integrated circuit devices, the points to be connected are respectively the pads of the electronic circuit and those of the communication interfaces associated with them.
Les plots de contact peuvent être des plots d'entrée ou des plots de sortie, selon l'architecture du dispositif électronique et ses fonctionnalités.The contact pads can be input pads or output pads, depending on the architecture of the electronic device and its functionalities.
L'interface de communication peut être constituée par des plages de contact et/ou une antenne, ou encore par des pistes de liaison reliées électriquement aux dites plages de contact et/ou aux extrémités de l'antenne. Elle possède des éléments ou des zones pour sa connexion, classiquement dénommés plots de 1 ' interface.The communication interface can be formed by contact pads and / or an antenna, or even by connecting tracks electrically connected to said contact pads and / or at the ends of the antenna. It has elements or areas for its connection, conventionally known as interface pads.
D'ordinaire, dans les dispositifs électroniques à circuit intégré ou puce, la connexion entre ladite puce et les interfaces de communication s'effectue: soit par une technologie dite filaire, soit par la technique dénommée flip-chip, soit encore au moyen d'une substance électriquement conductrice . La technologie dite filaire comprend le microcâblage ou soudage des connexions des plots de contact de la puce avec 1 ' nterface de communicationOrdinarily, in electronic devices with integrated circuit or chip, the connection between said chip and the communication interfaces is carried out: either by a so-called wired technology, or by the technique called flip-chip, or even by means of an electrically conductive substance. The so-called wired technology includes micro-wiring or welding of the connections of the contact pads of the chip with the communication interface.
( "wire bonding" ) . Elle ne requiert aucune caractéristique particulière pour le composant constituant le circuit intégré. Cependant, la connexion filaire s'effectue au moyen de fils, généralement en or, ce qui rend cette technologie délicate et coûteuse. Un enrobage ("potting") doit ensuite recouvrir la puce et les fils de connexion soudés, pour les protéger. Le matériel utilisé nécessite un appareillage de haute précision pour la réalisation des connexions, ce qui constitue un facteur de ralentissement des cadences de production.("wire bonding"). It does not require any particular characteristic for the component constituting the integrated circuit. However, the wired connection is made by means of wires, generally gold, which makes this technology delicate and expensive. A coating ("potting") must then cover the chip and the soldered connection wires, to protect them. The equipment used requires high-precision equipment for making the connections, which is a factor in slowing production rates.
Avec la technique dite 'flip-chip", la puce doit comporter des plots ou protubérances ("pads") et la puce est alors retournée pour que sa face active soit orientée vers le support diélectrique sur lequel elle est classiquement fixée, tandis que la connexion électrique est assurée au moyen d'un polymère conducteur anisotrope, établissant un contact entre les plots de contact de la puce et l'interface de communication.With the so-called " flip-chip" technique, the chip must include pads or protuberances ("pads") and the chip is then turned over so that its active face is oriented towards the dielectric support on which it is conventionally fixed, while the electrical connection is ensured by means of an anisotropic conductive polymer, establishing contact between the contact pads of the chip and the communication interface.
Dans la technique de connexion utilisant une substance électriquement conductrice, la puce est fixée sur un support et les connexions entre ses plots de contact et les interfaces de communication sont réalisées au moyen d'un cordon de substance conductrice adhésive, isotrope, qui suit la relief du support.In the connection technique using an electrically conductive substance, the chip is fixed on a support and the connections between its contact pads and the communication interfaces are made by means of a bead of isotropic adhesive conductive substance, which follows the relief of support.
Ces deux dernières techniques de connexion sont toutefois assez lentes à exécuter et peu adaptées pour l'interconnexion de circuits ayant un faible nombre d'entrées et sorties, tel que par exemple 4 à 8 entrées et sorties pour le microcircuit.These last two connection techniques are however rather slow to execute and unsuitable for the interconnection of circuits having a small number of inputs and outputs, such as for example 4 to 8 inputs and outputs for the microcircuit.
Des contraintes analogues se rencontrent également dans le cas des connexions électriques de dispositifs électroniques au sens général . Le problème qui est à la aεe de l'invention est de disposer d'un procédé de réalisation de connexions électriques aisé à mettre en oeuvre et procurant des connexions fiables, éventuellement modulables et/ou ajustables à convenance. Dans le domaine plus particulier des dispositifs électroniques portables de type carte à puce évoqués plus haut, le problème est de disposer d'un procédé pour la connexion des puces avec leurs interfaces de communication, qui soit aisé à mettre en oeuvre, d'un coût avantageux, et qui permette une interconnexion très précise et à très haute cadence.Similar constraints are also encountered in the case of electrical connections of electronic devices in the general sense. The problem which is the aεe of the invention is to have a method of making electrical connections easy to implement and providing reliable connections, possibly modular and / or adjustable to suit. In the more specific field of portable electronic devices of the smart card type mentioned above, the problem is to have a method for connecting the chips with their communication interfaces, which is easy to implement, inexpensive, and which allows very precise interconnection and at very high speed.
L'invention a ainsi pour but de procurer un procédé permettant de résoudre au mieux les difficultés inhérentes aux procédés traditionnels de connexion électrique, notamment entre u_._ microcircuit électronique ou puce et des interfaces de communication, et de s'affranchir autant que possible des contraintes alors rencontrées .The object of the invention is therefore to provide a method which makes it possible to best resolve the difficulties inherent in traditional methods of electrical connection, in particular between an electronic microcircuit or chip and communication interfaces, and to overcome as far as possible constraints then encountered.
Ce but, ainsi que d'autres qui apparaîtront à la lecture de la description qui suit, est atteint grâce à un procédé selon lequel on relie les éléments conducteurs à interconnecter avec une matière non conductrice, apte à être rendue conductrice de l'électricité, et on utilise un moyen énergétique pour induire dans ladite matière une électroconductivité localisée selon un trajet reliant lesdits éléments conducteurs à connecter.This object, as well as others which will appear on reading the description which follows, is achieved by a process according to which the conductive elements to be interconnected are connected with a non-conductive material, capable of being made conductive of electricity, and an energetic means is used to induce in said material an electrically conductive localized along a path connecting said conductive elements to be connected.
L'invention propose à cet effet un procédé pour la réalisation de connexions é_ectriques entre au moins deux éléments conducteurs, dans lequel: a) on place entre au moins deux des dits éléments à connecter une masse de matière non-conductrice, apte à être dotée d'une conductivité électrique, b) on durcit et/ou on polymérise et/ou on fixe ladite matière, et c) on active au moins une fraction de ladite matière, localisée selon un trajet reliant au moins deux des dits éléments conducteurs à connecter, avec un moyen énergétique pour y induire une conductivité électrique. La conductivité électrique induite ou créée par le procédé selon l'invention peut être permanente ou non. Ladite matière est une matière distribuable ou applicable, qui de préférence durcit et/ou polymérise et/ou se fixe au moins partiellement, selon sa nature et/ou sa composition, comme on le décrira plus loin. On entend ici par "fixation" l'opération optionnelle consistant à faire adhérer et/ou durcir au moins partiellement ladite matière pour lui donner une consistance permettant qu'elle reste en place.To this end, the invention provides a method for making electrical connections between at least two conductive elements, in which: a) a mass of non-conductive material, capable of being provided, is placed between at least two of said elements to be connected with an electrical conductivity, b) it hardens and / or is polymerized and / or fixed said material, and c) it activates at least a fraction of said material, located along a path connecting at least two of said conductive elements to be connected , with an energetic means to induce an electrical conductivity. The electrical conductivity induced or created by the process according to the invention can be permanent or not. Said material is a distributable or applicable material, which preferably hardens and / or polymerizes and / or is fixed at least partially, according to its nature and / or its composition, as will be described below. The term “fixing” is understood here to mean the optional operation consisting in adhering and / or at least partially hardening said material to give it a consistency allowing it to remain in place.
Par "activation" d'au '.ncins une partie de ladite matière, on entend l' activation et/ou l'excitation de celle-ci avant et/ou après, de préférence après, un durcissement optionnel au moins partiel de ladite matière .By "activation" of at least part of said material is meant the activation and / or excitation thereof before and / or after, preferably after, an optional at least partial hardening of said material. .
Dans les formes de réalisation dans lesquelles on place ladite matière sous forme continue entre plus de deux des dits éléments conducteurs, il convient en pratique que le moyen utilisé pour la création de la conductivité électrique soit directif.In the embodiments in which said material is placed in continuous form between more than two of said conductive elements, it should in practice that the means used for the creation of electrical conductivity is directive.
Dans une forme de mise en oeuvre du dit procédé pour la fabrication d'un dispositif électronique à circuit intégré sur support, comprenant au moins un microcircuit qui comporte des plots d'entrée et de sortie destinés à être reliés chacun par connexion électrique à un élément d'interface de communication, ou éventuellement à un point de connexion ou une piste de liaison associés, on réalise lesditeε connexions électriques par dépôt, en recouvrement sur tout ou partie de la face active du microcircuit et des dits éléments d'interface de communication ou points de connexion ou pistes de liaison associés, d'une matière non-conductrice, apte à être dotée d'une conductivité électrique, avantageusement fixable sur le microcircuit ou le support de celui-ci et/ou polymérisable, on durcit et/ou on polymérise et/ou on fixe ladite matière, et on traite ladite matière avec un moyen énergétique apte à induire une conductivité électrique localisée selon un trajet reliant chaque plot d'entrée ou de sortie à un élément d'interface de communication et/ou à un point de connexion et/ou à une piste de liaison associés.In one form of implementation of said method for the manufacture of an electronic device with integrated circuit on a support, comprising at least one microcircuit which comprises input and output pads intended to be each connected by electrical connection to an element communication interface, or possibly at a connection point or associated connection track, the said electrical connections are made by deposition, overlapping over all or part of the active face of the microcircuit and of said communication interface elements or connection points or associated connection tracks, of a non-conductive material, capable of being provided with an electrical conductivity, advantageously fixable on the microcircuit or the support thereof and / or polymerizable, it hardens and / or polymerizes and / or fixes said material, and treats said material with an energetic means capable of inducing a localized electrical conductivity at a t Rajet connecting each input or output terminal to a communication interface element and / or to a connection point and / or to an associated connection track.
D'autres caractéristiques et avantages de la présente invention apparaîtront à la lecture de la description détaillée qui suit, en référence aux dessins annexés, dans lesquels:,Other characteristics and advantages of the present invention will appear on reading the detailed description which follows, with reference to the appended drawings, in which:
Fig. 1 représente une vue latérale en coupe schématique d'une connexion entre une puce et une interface de communication selon la technique filaire connue .Fig. 1 shows a schematic sectional side view of a connection between a chip and a communication interface according to the known wire technique.
Fig. 2 représente une vue latérale en coupe schématique d'une connexion selon la technique dite flip-chip . - Fig. 3 représente une vue latérale en coupe schématique d'une connexion entre une puce et une interface de communication par dépôt d'une substance électriquement conductrice.Fig. 2 shows a schematic sectional side view of a connection according to the so-called flip-chip technique. - Fig. 3 shows a schematic sectional side view of a connection between a chip and a communication interface by deposition of an electrically conductive substance.
Fig. 4 représente une vue de dessus d'une puce sur support (à gauche) et d'une première forme de connexion de ladite puce par le procédé selon l'invention (à droite) .Fig. 4 shows a top view of a chip on a support (on the left) and of a first form of connection of said chip by the method according to the invention (on the right).
Fig. 5 représente une vue de dessus d'une puce sur support (à gauche) et d'une deuxième forme de connexion de ladite puce par une variante du procédé selon l'invention (à droite) .Fig. 5 shows a top view of a chip on a support (on the left) and of a second form of connection of said chip by a variant of the method according to the invention (on the right).
Fig. 6 représente une vue latérale en coupe schématique d'une autre forme de connexion entre puce et interface de communication par le procédé selon l'invention.Fig. 6 shows a schematic sectional side view of another form of connection between chip and communication interface by the method according to the invention.
Ainsi, un microcircuit ou puce I, comportant des plots d'entrée ou de sortie 3, est connecté à des éléments d'interface de communication 4 au moyen, selon la technique antérieure, d'une connexion filaire 5 (voir Fig. 1) , d'une connexion de type flip-chip 6 (voir Fig. 2) ou d'une connexion avec une substance conductrice de l'électricité 7. (voir Fig. 3;Thus, a microcircuit or chip I, comprising input or output pads 3, is connected to communication interface elements 4 by means, according to the prior art, of a wired connection 5 (see Fig. 1) , of a flip-chip 6 connection (see Fig. 2) or a connection with an electrically conductive substance 7. (see Fig. 3;
Dans sa forme de réalisation la plus simple (non représentée), une connexion selon l'invention comporte un dépôt sous forme de cordon entre deux éléments conducteurs d'une matière telle que définie plus haut, qui, une fois durcie, fixée et/ou polymérisée et soumise à un rayonnement approprié révélant le conductivité électrique de ladite matière, présente dans sa totalité ou sa quasi-totalité la conductivité électrique recherchée .In its simplest embodiment (not shown), a connection according to the invention comprises a deposit in the form of a bead between two conductive elements of a material as defined above, which, once hardened, fixed and / or polymerized and subjected to appropriate radiation revealing the electrical conductivity of said material, has all or almost all of the desired electrical conductivity.
Un avantage de cette forme de réalisation est d'économiser de la matière, puisqu'on ne dépose alors celle-ci qu'aux points de connexion. Les figures 4, 5 et 6 annexées illustrent trois formes de réalisation de connexions selon l'invention, dans lesquelles on dépose entre au moins deux points à connecter, respectivement constitués par un plot 3 d'une puce 1 et une interface de communication 4 ou des points de connexion sur support 2, une matière 8 qui est non- conductrice de l'électricité, mais est apte à le devenir sous rayonnement .An advantage of this embodiment is to save material, since it is then only deposited at the connection points. Figures 4, 5 and 6 attached illustrate three embodiments of connections according to the invention, in which there is deposited between at least two points to be connected, respectively constituted by a pad 3 of a chip 1 and a communication interface 4 or connection points on support 2, a material 8 which is non-conductive of electricity, but is capable of becoming so under radiation.
La matière 8 peut ainsi être déposée sur un ensemble de plus de deux points à connecter, comme illustré sur les Figs . 4 et 5 annexées.The material 8 can thus be deposited on a set of more than two points to be connected, as illustrated in Figs. 4 and 5 appended.
Dans la forme de réalisation de la Fig. 4, le dépôt de matière 8 ne recouvre qv.r partiellement la puce 1, mais cela suffit pour protéger ladite puce. Dans cette forme de réalisation, la matière est répartie sur deux zones distinctes, couvrant des zones séparées, à cheval sur au moins deux arêtes de la puce, et s ' étendant sur au moins deux paires de points à connecter, en l'occurrence une paire et trois paires respectivement.In the embodiment of FIG. 4, the material deposition 8 does not partially cover the chip 1, but this is enough to protect said chip. In this embodiment, the material is distributed over two distinct zones, covering separate zones, straddling at least two edges of the chip, and extending over at least two pairs of points to be connected, in this case a pair and three pairs respectively.
Dans la forme de réalisation illustrée sur la Fig. 5, la matière 8 recouvre l'ensemble des points à connecter et la puce en totalité, et assure donc une protection complète de celle-ci.In the embodiment illustrated in FIG. 5, the material 8 covers all of the points to connect and the chip in full, and therefore provides complete protection thereof.
Dans ces deux cas, I≤ connexions sont réalisées grâce à un moyen énergétic... =: directif approprié, par exemple un rayonnement laser, pour ne rendre conductrices de 1 ' électricité que des portions 9 de la matière 8 joignant deux points respectifs à connecter.In these two cases, I≤ connections are made using an energetic means ... =: appropriate directive, for example laser radiation, to make conductive of electricity only portions 9 of the material 8 joining two respective points at connect.
Les portions de plan conductrices 9 peuvent s'étendre du plan de dépôt de la matière 8 jusqu'à la surface externe de celle-ci.The conductive plane portions 9 can extend from the material deposition plane 8 to the external surface of the latter.
Dans une forme de réalisation préférée, représentée sur la Fig. 6, la couche ae matière déposée couvre l'ensemble des points de connexion 3,4 et de la puce 1, elle-même fixée par un adhésif sur un support 2, tandis que l'action du moyen énergétique est rendue non seulement directive, mais également focalisée par des moyens appropriés, connus de l'homme du métier. Lesdites portions de la matière 8 rendues conductrices peuvent alors se situer entièrement : l'intérieur de la masse de matière 8, qui protège donc _.msi mécaniquement et isole électriquement la zone rendue conductrice 9. Au surplus, comme le montre la Fig. 6, les zones 9 rendues conductrices peuvent ainsi être distantes des flancs de la puce 1, c'est-à-dire ne pas les toucher. Cela présente un intérêt tout particulier pour des puces ayant des flancs conducteurs de l'électricité.In a preferred embodiment, shown in FIG. 6, the layer of deposited material covers all of the connection points 3, 4 and of the chip 1, itself fixed by an adhesive on a support 2, while the action of the energy means is made not only directive, but also focused by appropriate means, known to those skilled in the art. Said portions of the material 8 made conductive can then be located entirely: the interior of the mass of material 8, which therefore protects _.msi mechanically and electrically isolates the area made conductive 9. Furthermore, as shown in FIG. 6, the zones 9 made conductive can thus be distant from the sides of the chip 1, that is to say do not touch them. This is of particular interest for chips having flanks that conduct electricity.
L'invention est tout p rticulièrement appropriée pour la fabrication de carte- à puce selon les procédés utilisant un micromodule. On utilise alors un matériau avantageusement diélectrique comme support 2 du micromodule qui, muni d'au .r.oins une puce de circuits intégrés 1 et de ses connexions avec des points 3,4 respectifs à connecter par la technique conforme à l'invention, est encarté dans un corps de carte. Ce support est en pratique mis en oeuvre sous la forme d'un film dans lequel sont ensuite découpés les micromodules à reporter dans Ledit corps de carte.The invention is p rticulièrement suitable for the manufacture of smart card- according to the methods using a micromodule. An advantageously dielectric material is then used as support 2 for the micromodule which, provided with at least a chip of integrated circuits 1 and its connections with respective points 3,4 to be connected by the technique according to the invention, is embedded in a card body. This support is in practice implemented in the form of a film from which the micromodules to be transferred to said card body are then cut.
Divers modes de mise en oeuvre du procédé conforme à l'invention sont envisaα.
Figure imgf000011_0001
. En particulier, le support 2 sur lequel est fine le microcircuit peut être un substrat, une feuille polymère, ou analogue.Various modes of implementing the method according to the invention are envisaged.
Figure imgf000011_0001
. In particular, the support 2 on which the microcircuit is thin can be a substrate, a polymer sheet, or the like.
La matière 8 est avantageusement une matière fixable . On entend ici par "matière fixable" toute matière apte à être retenue par liaison mécanique et/ou physique et/ou chimique sur les matériaux sur lesquels elle est déposée, notamment sur _e microcircuit, et en particulier par adhésion ou accrochage, par adsorption et/ou par polymérisation. Cette fixation peut s'opérer soit directement, soit indirectement au moyen d'un agent de fixation approprié.The material 8 is advantageously a fixable material. The term “fixable material” is understood here to mean any material capable of being retained by mechanical and / or physical and / or chemical bonding on the materials on which it is deposited, in particular on a microcircuit, and in particular by adhesion or attachment, by adsorption and / or by polymerization. This fixation can take place either directly or indirectly by means of an appropriate fixing agent.
Selon l'invention, cette matière 8 doit être apte à présenter localement une conductivité électrique, permanente ou non, après incuction de celle-ci par des moyens appropriés .According to the invention, this material 8 must be capable of locally presenting an electrical conductivity, permanent or not, after induction of the latter by appropriate means.
Dans une forme de réalisation avantageuse, la matière 8 fixable est une matière présentant des propriétés d'adhésivité ou d'accrochage vis-à-vis du microcircuit et/ou du support de celui-ci. Cette propriété préférée permet de s'exempter d'un moyen de fixation, tel qu'un adhésif, pour la goutte de matière déposée, qui se suffit alors à elle-même pour rester en place, assurer la conduct vi e électrique recherchée et protéger la face active du microcircuit.In an advantageous embodiment, the fixable material 8 is a material having adhesive or bonding properties with respect to the microcircuit and / or the support thereof. This preferred property makes it possible to dispense with a fixing means, such as an adhesive, for the drop of material deposited, which then suffices in itself to remain in place, provide the desired electrical conduct and protect the active face of mi c rocircuit.
La matière non- conductrice mise en oeuvre selon l'invention peut par exemple comporter: une matière minérale, telle que des sels d'argent, notamment du carbonate ou au chlorure d'argent, qui sous l'influence d'un rayonnement appliqué, par exemple une irradiation aux UV, et en p: sence d'un agent réducteur ±0The non-conductive material used according to the invention may for example comprise: an inorganic material, such as silver salts, in particular carbonate or silver chloride, which under the influence of an applied radiation, for example UV irradiation, and in the presence of a reducing agent ± 0
tel qu'une a iné ou autres, se transforment en argent métal; une matière mixte minérale/organique, comme par exemple des sels d'argent clioisis parmi le citrate ou son hydrate, le cyclohexane utyrate, le thiocarbamate, le lactate, 1 ' acétylacétona- e , les acrylates ou les méthacrylates , cette matιèr_ mixte pouvant également donner lieu à un dépôt d'aryent métal sous l'influence d'un rayonnement appliqué, par exemple une irradiation aux UV, en présence d'un agent réducteur tel que par exemple une aminé, entre autres; et/ou une matière organique, notamment choisie parmi: des monomères précurseurs de polymères intrinsèquement conducteurs comme par exemple du polyacétylène, du polyphénylèneacétylène, dont la polymérisation peut s'effectuer de préférence en présence de catalyseurs adaptés et sous irradiation, par des moyens connus de l'homme du métier, et des oligomères appropriés, notamment des oligomères spécifiques constitués par des poly (bis (alkylthio) acétylènes , de préférence de masses molaires moyennes en poids c environ 500 à 10000, aptes à acquérir une électroconauctivité permanente sous irradiation, en particulier par laser aux longueurs d'onde connues de l'homme du métier.such as an inn or others, transform into metallic silver; a mixed mineral / organic material, such as for example silver salts selected from citrate or its hydrate, cyclohexane utyrate, thiocarbamate, lactate, acetylacetonate, acrylates or methacrylates, this mixed material also being able give rise to a deposit of ary metal under the influence of applied radiation, for example UV irradiation, in the presence of a reducing agent such as for example an amine, among others; and / or an organic material, in particular chosen from: precursor monomers of intrinsically conductive polymers such as, for example, polyacetylene, polyphenylene acetylene, the polymerization of which can preferably be carried out in the presence of suitable catalysts and under irradiation, by known means of a person skilled in the art, and suitable oligomers, in particular specific oligomers constituted by poly (bis (alkylthio) acetylenes, preferably of average molar masses by weight c approximately 500 to 10,000, capable of acquiring permanent electroconauctivity under irradiation, particularly by laser at wavelengths known to those skilled in the art.
Dans une forme de réalisation constituant une variante, on utilise au moins une matière minérale et/ou minérale/organique susdite comme charge d'au moins un monomère polymérisable par voie cationique ou radicalaire, pour rendre ex* insèquement conducteur de l'électricité le polymère formé à partir du dit monomère .In an embodiment constituting a variant, at least one mineral and / or mineral / organic material mentioned above is used as the filler of at least one monomer which can be polymerized by cationic or radical means, in order to render the polymer ex * fully electrically conductive. formed from said monomer.
Les matières des catégories susdites peuvent être mises en oeuvre soit individuellement, soit selon des mélanges quelconques. L'homme du métier est à même de déterminer, au besoin au mc**en d'essais itératifs, le meilleur choix de matières et de proportions respectives de celles-ci pour réaliser ces mélanges. Dans le cas de tels mélanges, il peut être recommandé de combiner des moyens d'irradiation qui, chacun, conviennent plus spécialement à l'un des composants du dit mélange.The materials of the abovementioned categories can be used either individually or according to any mixtures. A person skilled in the art is able to determine, if necessary at mc * * in iterative tests, the better choice of materials and respective proportions of them to make these mixtures. In the case of such mixtures, it may be recommended to combine irradiation means which, each one, are more particularly suitable for one of the components of said mixture.
Naturellement, les matières susmentionnées ou leurs mélanges peuvent en option être combinées avec d'autres matières également non-conductrices, mais non susceptibles d'apporter en elles-mêmes une conductivité électrique.Naturally, the abovementioned materials or their mixtures can optionally be combined with other materials which are also non-conductive, but which are not capable of providing electrical conductivity in themselves.
Structurellement , la matière 8 selon l'invention peut être hétérogène, si elle a été formée par une précipitation donnant des grains . Les portions de matière non conductrice et les portions conductrices représentent cependant un ensemble constituant une structure homogène ou sensiblement homogène, ou un même réseau et, notamment dans le cas des matières polymères, le réseau constitue alors une matrice de base identique pour les portions de matière 8 et 9. Parmi les matières indiquées plus haut, on préfère les combinaisons de monomères polymérisables respectivement par voie cationiquε et par voie radicalaire, en option en mélange avec des monomères polymérisables par polycondensation. A titre d'exemples des oliαomères de type poly (bis (alkylthio) acétylène) indiqués plus haut, on peut citer les composés fournis par la société Aldrich Chemical Co . sous les références 44600-9 et 44601-7 respectivement pour un poly (bis (méthylthioj acétylène) et pour un poly (bis (éthylthio. acétylène) .Structurally, the material 8 according to the invention can be heterogeneous, if it has been formed by a precipitation giving grains. The portions of non-conductive material and the conductive portions however represent an assembly constituting a homogeneous or substantially homogeneous structure, or the same network and, in particular in the case of polymeric materials, the network then constitutes an identical basic matrix for the portions of material. 8 and 9. Among the materials indicated above, preference is given to combinations of monomers which can be polymerized respectively by cationic and radical means, optionally in admixture with monomers which can be polymerized by polycondensation. As examples of the oliomers of poly (bis (alkylthio) acetylene) type indicated above, mention may be made of the compounds supplied by the company Aldrich Chemical Co. under the references 44600-9 and 44601-7 respectively for a poly (bis (methylthioj acetylene) and for a poly (bis (ethylthioj acetylene).
Le produit référencé 44600-9 présente une masse molaire moyenne en poids d'environ 4000 et son analyse élémentaire donne les pourcentages suivants : carbone 40,38%, hydrogène 4,95%, azote 0,02%, soufre 55,16%. Le produit référencé 44601-7 présente une masse molaire moyenne en poids d'environ 1200 et son analyse élémentaire donne les pourcentages suivants : carbone 49,47%, hydrogène 7,05%, soufre 45,31%The product referenced 44600-9 has a weight average molar mass of approximately 4000 and its elemental analysis gives the following percentages: carbon 40.38%, hydrogen 4.95%, nitrogen 0.02%, sulfur 55.16%. The product referenced 44601-7 has a weight average molar mass of approximately 1200 and its analysis elementary gives the following percentages: carbon 49.47%, hydrogen 7.05%, sulfur 45.31%
A titre indicatif, les bandes d'absorption correspondant à 1 ' "excitation" du polyacétylène se situent à des longueurs d'onde respectivement d'environ 300 nm pour une masse moléculaire moyenne en poids de 500 et à environ 600 nm pour une masse moléculaire moyenne en poids de 12000.As an indication, the absorption bands corresponding to the "excitation" of polyacetylene are at wavelengths respectively of about 300 nm for a weight average molecular weight of 500 and to about 600 nm for a molecular weight weight average of 12,000.
A partir de ces données, l'homme du métier est apte à déterminer des énergies efficaces pour aboutir à l'excitation des poly (bis (thioalkyi ; acétylènes) , en tenant compte de 1 ' effet bathochrome inhérent aux groupes thioalkyle supplémentaires .From these data, a person skilled in the art is able to determine effective energies to result in the excitation of poly (bis (thioalkyi; acetylenes), taking into account the bathochromic effect inherent in additional thioalkyl groups.
Ces produits sont avantageusement mis en oeuvre comme suit: On soumet le polythioacetylene sélectionné à un broyage cryogénique jusqu'à obtenir une poudre ayant une granulométrie adéquate et on disperse cette poudre dans une formulation polymérisable de type acrylique monomérique à polymérisation radicalaire . La proportion de la poudre est de préférence d'environ 30 à 80%, avantageusement d'environ 30 à 50% en poids de la formulation de type acrylique. Après dépôt sur un support de circuit électronique entre au moins deux points de contact respectivement du dit circuit et d'une interface de communication à connecter, une polymérisation radicalaire est accomplie en présence d'un catalyseur de type époxyde, avantageusement entre 50 et 80°C environ. On irradie ensuite les zones que l'on veut rendre conductrices de l'électricité, avec des niveaux d'énergie appropriés et on obtient des connexions électriques selon l'invention.These products are advantageously used as follows: The selected polythioacetylene is subjected to cryogenic grinding until a powder having an adequate particle size is obtained and this powder is dispersed in a polymerizable formulation of monomeric acrylic type with radical polymerization. The proportion of the powder is preferably about 30 to 80%, advantageously about 30 to 50% by weight of the acrylic type formulation. After depositing on an electronic circuit support between at least two contact points respectively of said circuit and of a communication interface to be connected, a radical polymerization is accomplished in the presence of an epoxy catalyst, advantageously between 50 and 80 °. C approx. The areas that we want to make electrically conductive are then irradiated with appropriate energy levels and electrical connections are obtained according to the invention.
L'ouvrage de Johan Lia intitulé "Conductive Adhesiveε for Electronics Packaging" , publié par Electrochemical Publication, Ltd. en 1999, décrit des adhésifs conducteurs, mais souligne que, s'ils comportent des charges comme par exemple Ag, ils peuvent être opaques et ne conviennent pas pour des systèmes à durcissement sous irradiation. D'autre part l'aptitude des particules d'argent à s'oxyder contribue à un effet tunnel, qui induit des perturbations électriques. Par ailleurs, l'homme de l'art pourra également se référer utilement aux documents FR 2.212.461 et FR 2.743.336, qui comportent des détails concernant des polymères entrant dans les catégories générales indiquées plus haut, ainsi que des indications sur les monomères et les conditions opératoires pour leur élaboration. On notera cependant que αans ces documents on vise la fabrication de cartes électroniques dont le corps de carte comporte une couche plastique polymérisée et qu'il est alors recommandé que la polymérisation mise en oeuvre ne conduise pas à un retrait de la matière plastique, tandis qu'il est indiqué qu'un rapport polymère/ (monomère + polymère) supérieur au seuil déclenchant l'effet de gel conférerait à la matière plastique une viscosité trop élevée, ce qui n'est pas souhaité. Selon la présente invention, en revanche, d'une part le retrait de polymérisation est au contraire un atout pour fiabiliser les connexions ainsi réalisées et il est donc recherché, et d'autre part la viscosité de la matière mise en oeuvre ne doit pas être trop basse et une certaine viscosité est même recherchée, pour limiter l'écoulement de la matière au cours du traitement .Johan Lia's book "Conductive Adhesiveε for Electronics Packaging", published by Electrochemical Publication, Ltd. in 1999 describes conductive adhesives, but points out that, if they contain fillers such as Ag, they can be opaque and not suitable for radiation curing systems. On the other hand the ability of silver particles to oxidize contributes to a tunnel effect, which induces electrical disturbances. Furthermore, those skilled in the art may also usefully refer to the documents FR 2,212,461 and FR 2,743,336, which contain details concerning polymers falling into the general categories indicated above, as well as indications on the monomers. and the operating conditions for their preparation. It should be noted, however, that in these documents the aim is the manufacture of electronic cards, the card body of which comprises a polymerized plastic layer and that it is then recommended that the polymerization implemented does not lead to shrinkage of the plastic material, while 'It is indicated that a polymer / (monomer + polymer) ratio greater than the threshold triggering the gel effect would give the plastic a too high viscosity, which is not desired. According to the present invention, on the other hand, on the one hand, the polymerization shrinkage is on the contrary an advantage for making the connections thus made reliable and it is therefore sought after, and on the other hand the viscosity of the material used must not be too low and a certain viscosity is even sought, to limit the flow of the material during the treatment.
Selon une variante de mise en oeuvre, la matière 8 peut être sous une forme déjà au moins partiellement polymérisée avant son dépôt et appliquée selon une procédure de type "holt melt".According to an implementation variant, the material 8 can be in a form already at least partially polymerized before its deposition and applied according to a "holt melt" type procedure.
L'homme du métier peut également se référer à l'article de H. Bayer intitulé "Cationic Cure of Epoxy Resins and UV Options for Conductive Adhesives" (op. cité, chapitre 2, pages 1^-30), pour une illustration de la polymérisation par voie cationique des résines époxy, et de sa combinaison possible avec une polymérisation radicalaire .A person skilled in the art can also refer to the article by H. Bayer entitled "Cationic Cure of Epoxy Resins and UV Options for Conductive Adhesives" (op. City, chapter 2, pages 1 ^ -30), for an illustration of cationic polymerization of epoxy resins, and of its possible combination with radical polymerization.
Dans une forme de réalisation particulière du procédé selon la présente invention, la matière mise en oeuvre est thermoplastique et est rendue thermodurcissable par post-réticulation, selon des modes opératoires tels que décrits dans le document FR 2.743.336.In a particular embodiment of the method according to the present invention, the material used is thermoplastic and is made thermosetting by post-crosslinking, according to procedures as described in document FR 2,743,336.
Dans une forme de réalisation préférée, la matière mise en oeuvre selon l'invention peut comporter une formulation mixte apte à une polymérisation cationique et à une polymérisation radicalaire respectivement. La matière 8 peut ainsi comprendre, par exemple, des monomères à polymérisation cationique aptes à produire un polymère soluble, et des monomères à polymérisation radicalaire, avec catalyse par exemple époxydique entre 50 et 100°C en phase solvant (notamment méthyléthylcétone) , avec en option un agent antisédimentation. Si la température de transition vitreuse est inférieure à 130°C, un dépôt selon la technique dite hot-melt est préconisé, sinon le dépôt peut s'effectuer en solution. L'irradiation est alors focalisée sur les zones de la matière polymère à rendre conductrices . L'invention a ainsi également pour objet une composition de matière non-conductrice, apte à être rendue conductrice de l'électricité sous l'action d'un moyen énergétique, ladite composition de matière comportant une combinaison d'au moins un monomère à polymérisation cationique et d'au moins un monomère à polymérisation radicalaire, ainsi qu'éventuellement une charge apte à rendre conducteur de 1 ' électricité le polymère formé à partir d'au moins l'un des dits monomères . Cette charge optionnelle est de préférence un sel d'argent, avantageusement combiné avec un agent réducteur. Parmi les avantages que procure l'utilisation d'un tel système combinant polymérisation cationique et polymérisation radicalaire, .insi qu'en option une polymérisation par poiycondenεation, en peut citer: - l'obtention d'une meilleure conductivité, due à la présence d'éléments cationiqueε . l'obtention d'une meilleure fiabilité des connexions, en raison du retrait ou rétraction que procure un système combinant une polymérisation cationique et, sous irradiation, une polymérisation radicalaire qui induit une réticuiation au moins partielle de la matière.In a preferred embodiment, the material used according to the invention may comprise a mixed formulation suitable for cationic polymerization and for radical polymerization respectively. The material 8 can thus comprise, for example, monomers with cationic polymerization capable of producing a soluble polymer, and monomers with radical polymerization, with for example epoxy catalysis between 50 and 100 ° C. in the solvent phase (in particular methyl ethyl ketone), with in option an anti-sedimentation agent. If the glass transition temperature is lower than 130 ° C., a deposition according to the so-called hot-melt technique is recommended, otherwise the deposition can be carried out in solution. The irradiation is then focused on the areas of the polymeric material to be made conductive. The invention therefore also relates to a composition of non-conductive material, capable of being made electrically conductive under the action of an energetic means, said composition of material comprising a combination of at least one polymerization monomer. cationic and of at least one monomer with radical polymerization, as well as optionally a filler capable of rendering electrically conductive the polymer formed from at least one of said monomers. This optional filler is preferably a silver salt, advantageously combined with a reducing agent. Among the advantages obtained by the use of such a system combining cationic polymerization and radical polymerization, as well as optionally a polymerization by polycondensation, may be cited: - obtaining better conductivity, due to the presence of 'cationic elements. obtaining better reliability of the connections, due to the shrinkage or retraction provided by a system combining cationic polymerization and, under irradiation, radical polymerization which induces at least partial crosslinking of the material.
Dans les cas où la matière n'est pas intrinsèquement apte à devenir électroconductrice par le procédé selon l'invention, on adjoint à ladite matière une charge appropriée pour conférer à celle-ci une conductivité électrique extrinsèque .In cases where the material is not intrinsically capable of becoming electrically conductive by the method according to the invention, said material is added to an appropriate charge to confer on it an extrinsic electrical conductivity.
Quant aux sels d'argent, des indications utiles les concernant se trouvent dans l'article de M.R.V. Sahyun, "Récent Developmentε in Photographie Development", CHEMTECH, Juillet 1992, 22, 413-424. Les sels d'argent, aussi bien organiques que minéraux, sont sensibles à la lumière et pas εeulement aux rayonnementε U.V., et l'énergie reçue détermine la proportion plus ou moins grande de leur conversion en argent métal . Par exemple avec les εels acryliques c ' argent , on peut alors utiliser des rayonnements U.V. pour polymériser la double liaison deε moiéculeε et la lumière visible pour précipiter/former l'argent métal conducteur. Pour le choix des agents développeurs/révélateurs qui peuvent être miε en oeuvre en option, l'homme du métier peut se référer à l'article suεdit, ainsi qu'à la littérature qui y est citée.As for silver salts, useful indications concerning them can be found in the article by M.R.V. Sahyun, "Recent Development in Photography Development", CHEMTECH, July 1992, 22, 413-424. Silver salts, both organic and inorganic, are sensitive to light and not only to UV radiation, and the energy received determines the greater or lesser proportion of their conversion to silver metal. For example, with silver acrylic salts, UV rays can then be used to polymerize the double bond of visible molecules and visible light to precipitate / form the conductive metal silver. For the choice of developer / developer agents which can be used as an option, the skilled person can refer to the above article, as well as to the literature cited therein.
La quantité et les proportions respectives des matières entrant dans la compositien dεε mélanges à mettre en oeuvre, ainsi que celles des solvants ou des agents dispersants éventuellement employés, ne sont pas critiques et dépendent de chaque cas concret d'application. Elles peuvent être déterminées par l'homme du métier au moyen d'essais préalables, réalisés selon des méthodologies connues et permettant de définir une gamme efficace et des gammes avantageuses, tant en terme d'efficacité qu'en terme de coût.The respective quantity and proportions of the materials used in the composition of the mixtures to be used, as well as those of the solvents or dispersing agents, if used, are not critical and depend on each specific application. They can be determined by a person skilled in the art by means of preliminary tests, carried out according to known methodologies and making it possible to define an effective range and advantageous ranges, both in terms of efficiency and in terms of cost.
A titre d'exemple non limitatif, la proportion de matière apte à être rendue électriquement conductrice dans de tels mélanges peut varier entre environ 15 et 100% en poidε de la matière 8 totale, 100- représentant le cas de produits purs, ~ar exemple d'oligomères pouvant être polymérisés et ι_ adiés pour présenter en eux-mêmes une électroconducti".*rté induite. La proportion de sel d'argent ou de toute autre charge propre à conférer une conductivité électrique extrinsèque est avantageusement de 20-50 % en poids par rapport au poids de la matière non-conductrice utilisée.By way of nonlimiting example, the proportion of material capable of being made electrically conductive in such mixtures can vary between approximately 15 and 100% by weight of the total material 8, 100- representing the case of pure products, ~ ar example oligomers which can be polymerized and ι_ adiees to present in themselves an electroconducti ". * rté induced. The proportion of silver salt or any other charge capable of imparting an extrinsic electrical conductivity is advantageously 20-50% in weight relative to the weight of the non-conductive material used.
Selon la nature des matières mises en oeuvre, ainsi qu'en fonction des préférences technologiques retenues, lesdites matières peuvent être utilisées en phase aqueuse, en phase solvatée dans deε solvants non réactifs ou réactifs, ou à l'état fondu si leur stabilité à la chaleur le permet. Dans ces milieux, la matière mise en oeuvre peut être en solution, en dispersion ou en émulsion.Depending on the nature of the materials used, as well as according to the technological preferences adopted, said materials can be used in the aqueous phase, in the solvated phase in non-reactive or reactive solvents, or in the molten state if their stability to heat allows it. In these environments, the material used can be in solution, in dispersion or in emulsion.
En pratique, ladite matière est déposée conformément à l'invention, par exemple par une technique de distribution de matière lie aide ou visqueuse dite "technique de dispense" connue de l'homme du métier, sous la forme d'une ou plusieurs gouttes de taille convenable, déposées au moyen d'équipements classiques, comme par exemple un ajutage adapté ou une seringue.In practice, said material is deposited in accordance with the invention, for example by a technique for dispensing aid or viscous matter called "dispensing technique" known to those skilled in the art, in the form of one or more drops of suitable size, deposited using conventional equipment, such as a suitable nozzle or syringe.
Une fois que ladite matière est dépoεée, soit on la laisse sécher naturellement à l'air si ce séchage est assez rapide, soit on en élimine l'eau et. les solvants par un séchage forcé appropria, soit encore on laisse s'effectuer ou on effectue une polymérisation de ladite matière, qui peut alors emprisonner le solvant ou autre agent d'incluεion. Les techniques d ' évaporatr en et/ou de oolymérisation ainsi mises en oeuvre for appe___ a des moyens clasεiqueε. En option, on pe*. t utiliser des amorceurs et/ou des accélérateurs conventionnels, pour la polymérisation ou pour une prépolymériεation éventuelle. II convient toutefois de veiller à ce que les conditions opératoires εoient compatibles avec les matières sélectionnées, ainsi qu'avec le microcircuit et son support .Once the said material has been deposited, it is either left to dry naturally in air if this drying is fast enough, or the water is removed and. solvents by appropriate forced drying, either it is left to take place or a polymerization of said material is carried out, which can then trap the solvent or other inclusion agent. The techniques of evaporating into and / or oolymerization thus implemented for appe___ a conventional means. Optionally, we pe * . t use conventional initiators and / or accelerators, for polymerization or for any prepolymerization. However, care should be taken to ensure that the operating conditions are compatible with the materials selected, as well as with the microcircuit and its support.
Danε la pratique, 1 ' i* radiation permettant de conférer la conductivité électrique recherchée, localisée conformément à l'invention selon un trajet reliant chaque plot d'entrée eu de sortie à un élément d'interface de communication ou à un point de connexion ou à la piste de liaison associée, peut être dirigée sur les zones à rendre électroccnductrices de la matière telle que déposée, c'est-à-dire dans son état initial après dispense. Cette irradiât ron est alors suivie, si nécessaire, d'une ou plusieurs des étapes évoquées plus haut d' evaporation et/ou de polymérisation, selon les cas.Danε practice, 1 'i * radiation to impart the desired electrical conductivity, localized according to the invention in a path connecting each input pad been output to a communication interface element or a connection point or to the associated connecting track, can be directed to the areas to be electroconductive of the material as deposited, that is to say in its initial state after dispensation. This irradiation is then followed, if necessary, by one or more of the stages mentioned above of evaporation and / or of polymerization, as the case may be.
En variante, ladite irradiation peut être effectuée, en option avec directivité sur les zones à rendre électroconductrices , après _es étaues de séchage, d' evaporation de solvant et/c*. de polymérisation de la matière 8.As a variant, said irradiation can be carried out, optionally with directivity on the zones to be made electroconductive, after drying, evaporation of solvent and / c * vices. material polymerization 8.
Il est avantageux que la .ratière déposée et rendue conductrice de l'électricité selon la présente invention soit, après traitement éventue^, solide ou semi- solide.It is advantageous that the material deposited and made electrically conductive according to the present invention is, after optional treatment, solid or semi-solid.
Il est préférable qu'elle ait au moins une viscosité qui réduise son écoulement . Le moyen d'induction ou création d'une conductivité électrique localisée peut êtr* choisi en pratique, par exemple, parmi une irraαiation, notamment une irradiation à la lumière visible, une irradiation aux U.V. proches ou lointainε, une irradiation aux rayons X, une irradiation au moyen d'un rayonnement laser approprié, et/ou un traitement par voie thermique, notamment par soufflage dir ctif et localisé d'air chaud. Ces modeε d'induction ne εont cependant pas limitatifs et il est à la portée de l'homme du métier de déterminer par des eεsais quelles peuvent être les longueurs d'ondeε spécifiques préféréeε, relatives à chacun des produits mis en oeuvre selon l'invention. L'homme du métier connaît en particulier, ou peut aiεément déterminer, leε énergies (puissance et durée d'excitation à une longueur d onde déterminée) requises pour aboutir à l'excitation dans chaque cas concret.It is preferable that it has at least one viscosity which reduces its flow. The means of induction or creation of a localized electrical conductivity can be * chosen in practice, for example, from irraαiation, in particular irradiation with visible light, irradiation with near or distant UV, irradiation with X-rays, irradiation by means of appropriate laser radiation, and / or treatment by thermal means, in particular by direct and localized blowing of hot air. These induction modes are not, however, limiting and it is within the reach of those skilled in the art to determine by means of tests which the preferred specific wavelengths can be, relating to each of the products used according to the invention. . Those skilled in the art know in particular, or can easily determine, the energies (power and duration of excitation at a determined wavelength) required to lead to excitation in each concrete case.
L'induction d'une conductrvité électrique peut, si on le souhaite, être rendue directive par tout moyen directif approprié connu, selon un trajet reliant un plot d'entrée ou de sortie à un élément d'interface de communication ou un point de -onnexion ou une piste de liaison associés. Par "trajet' on entend _ci la zone ou le plan moyen de déploiement de la zone conductrice entre un plot du microcircuit et l'élément d'interface correspondant ou la piste de liaison associée, mais également le déplacement éventuel du moyen d'induction ou création de la conductivité électrique, si l'on prévoit de créer cette conductivité électrique par un déplacement relatif du moyen utilisé et/ou du microcircuit l'un par rapport à l'autre.The induction of an electrical conductivity can, if desired, be made directive by any known appropriate directive means, along a path connecting an input or output pad to a communication interface element or a point of - annexation or an associated linking track. By "path" is meant _ci the zone or the mean plane of deployment of the conductive zone between a pad of the microcircuit and the corresponding interface element or the associated connecting track, but also the possible displacement of the induction means or creation of electrical conductivity, if provision is made to create this electrical conductivity by a relative displacement of the means used and / or of the microcircuit with respect to each other.
La technique selon 1 ' invention per e** en outre de décaler dans le temps la réalrsation de ___a totalité ou d'une partie des connexions souhaitées. Elle permet notamment d'effectuer des connexions sur un produit fini, préalablement muni d'au r oins une masse de matière 8 dans laquelle aucune connexien ou seulement une partie des connexions souhaitées a été effectuée.The technique according to 1 the invention per e ** further shift in time of the réalrsation ___a all or part of the desired connections. It allows in particular to make connections on a finished product, previously provided with at least one mass of material 8 in which no connection or only part of the desired connections has been made.
La présente invention a également pour objet un élément de connexion électrique nouveau, comportant une composition de matière telle que définie plus haut, déposée entre au moins deux éléments conducteurs à connecter, au moins une portion 9 de cette même matière étant conductrice de 1 ' électe ecité . Ledit élément de connexion électrique, considér . à un moment donné, est avantageusement composé d'une masse de matière non conductrice de l'électricité, lont au moins une portion est conductrice de l'électricité, tandis que la fraction restante est apte à être rendue conductrice de l'électricité par l'intermédiaire d'un moyen énergétique.The present invention also relates to a new electrical connection element, comprising a composition of material as defined above, deposited between at least two conductive elements to be connected, at least a portion 9 of this same material being conductive of the electric quoted. Said electrical connection element, considered. at a given time, is advantageously composed of a mass of material which is not electrically conductive, at least one portion of which is electrically conductive, while the remaining fraction is capable of being made electrically conductive by l intermediary of an energetic means.
En pratique, la caractér .sation des fractions ou portions respectives susdites α ' un tel élément peut être effectuée par des mesures de conductivité électrique, selon des méthodes connues de l'homme du métier, et/ou au moyen de colorants electrochromes (par exemple des dérivés d'oxazolidine) , qui sont des compoεés ayant la propriété de présenter des longueurs d'onde de coloration/décoloration définies selon qu'ils sont ou non soumiε à un courant électrique, ce qui leε fait changer de couleur en zone conductrice. L'homme du métier peut alors utiliser de tels colorants électrochromeε comme révélateurε, par exemple en les déposant sur la εurface ou sur une coupe longitudinale ou transversale d'une masse de matières 8,9 pour révéler la présence de zoneε de matière conductrice de l'électricité et/ou celle de zoneε non conductrices de l'électricité, ainsi que la conversion e une zone non conductrice en une zone conductrice de 1 ' électricité aprèε l'application d'un moyen énergétique approprié conformément à l'invention. La préεente invention a également tour objet un dispositif électronique comportant au moins un microcircuit (1) sur un εupport (2), muni de plots (3) d'entrée et de sortie, et au moins un élément d'interface de communication (4) et/ou des points et/ou pistes de liaison, ainsi qu'au moins un élément de connexion, dans lequel au moins un élément de connexion reliant ledit microcircuit à ladite interface de communication et/ou à deε pointε et/ou pistes de liaison est un élément de connexion tel que décrit plus haut.In practice, the characterization of the above-mentioned respective fractions or portions of such an element can be carried out by electrical conductivity measurements, according to methods known to those skilled in the art, and / or by means of electrochromic dyes (for example oxazolidine derivatives), which are compounds having the property of having coloring / discoloration wavelengths defined according to whether or not they are subjected to an electric current, which causes the color to change in the conductive zone. Those skilled in the art can then use such electrochromic dyes as a developer, for example by depositing them on the surface or on a longitudinal or transverse section of a mass of material 8.9 to reveal the presence of zones of conductive material of the electricity and / or that of non-electrically conductive zones, as well as the conversion of a non-conductive zone into an electrically conductive zone after the application of an appropriate energy means in accordance with the invention. The present invention also relates to an electronic device comprising at least one microcircuit (1) on a support (2), provided with input and output pads (3), and at least one communication interface element (4 ) and / or connecting points and / or tracks, as well as at least one connection element, in which at least one connection element connecting said microcircuit to said communication interface and / or to points and / or link is a connection element as described above.
L'invention concerne également un module pour carte à puce comportant des éléments de connexion électrique tels que définis plus haut, ainεi qu'une carte à puce comportant un tel module, encarté dans un corps de carte. The invention also relates to a smart card module comprising electrical connection elements as defined above, as well as a smart card comprising such a module, inserted in a card body.

Claims

REVENDICATIONS
1. Procédé pour la réalisation de connexions électriques entre au moins deux éléments conducteurs, caractérisé en ce que: a) on dépose entre au moins deux des dits éléments à connecter une masεe de matière non- conductrice, apte à être dotée d'une conductivité électrique, b) on durcit et/ou on polymérise et/ou on fixe ladite matière, et c) on active au moins une fraction de ladite matière, localisée selon un trajet reliant lesdits éléments conducteurs, avec un moyen énergétique pour y induire une conductivité électrique .1. Method for making electrical connections between at least two conductive elements, characterized in that: a) between at least two of the said elements to be connected, a mass of non-conductive material, capable of being provided with conductivity, is deposited electric, b) hardening and / or polymerizing and / or fixing said material, and c) activating at least a fraction of said material, located along a path connecting said conductive elements, with an energetic means for inducing a conductivity therein electric.
2. Procédé selon la revendication 1, caractérisé en ce qu'on utilise comme matière non-conductrice une matière minérale, telle que des sels d'argent, notamment du carbonate ou du chlorure d'argent.2. Method according to claim 1, characterized in that a non-conductive material is used a mineral material, such as silver salts, in particular carbonate or silver chloride.
3. Procédé selon la revendication 1, caractérisé en ce qu'on utilise pour la matière non- conductrice une matière mixte minérale/organique, notamment des sels d'argent choisis parmi le citrate ou son hydrate, le cyclohexane butyrate, le thiocarbamate, le lactate, 1 ' acétylacétonate , les acrylates ou les méthacrylates .3. Method according to claim 1, characterized in that a mixed mineral / organic material is used for the non-conductive material, in particular silver salts chosen from citrate or its hydrate, cyclohexane butyrate, thiocarbamate, lactate, acetylacetonate, acrylates or methacrylates.
4. Procédé selon l'une des revendications 2 ou 3, caractérisé en ce qu'on réduit ladite matière au moyen d'un agent réducteur, notamment une aminé.4. Method according to one of claims 2 or 3, characterized in that said material is reduced by means of a reducing agent, in particular an amine.
5. Procédé selon l'une quelconque des revendications 2 à 4, caractérisé en ce qu'on utilise ladite matière comme charge d'au moins un monomère polymérisable par voie cationique ou radicalaire, pour rendre extrinsequement conducteur de 1 ' électricité le polymère formé à partir du dit monomère .5. Method according to any one of claims 2 to 4, characterized in that said material is used as a filler of at least one monomer which can be polymerized by the cationic or radical route, to render the polymer formed from said monomer extrinsically conductive of electricity.
6. Procédé selon l'une quelconque deε revendications 1 à 3, caractérisé en ce qu'on utilise comme matière non-conductrice une matière organique, choisie parmi : - des monomères précurseurε de polymères intrinsèquement conducteurs et des oligomères.6. Method according to any one of claims 1 to 3, characterized in that an organic material, chosen from: - precursor monomers of intrinsically conductive polymers and oligomers, is used as non-conductive material.
7. Procédé selon la revendication 6, caractérisé en ce que ladite matière est du polyacetylene ou du polyphénylèneacétylène .7. Method according to claim 6, characterized in that said material is polyacetylene or polyphenyleneacetylene.
8. Procédé selon la revendication 6, caractérisé en ce que ladite matière comprend deε oligomères constitués par des poly (bis (alkylthio) acétylènes) , de préférence de masses molaires moyennes en poids d'environ 500 à 10000.8. Method according to claim 6, characterized in that said material comprises deε oligomers constituted by poly (bis (alkylthio) acetylenes), preferably of average molar masses by weight of about 500 to 10,000.
9. Procédé selon l'une quelconque des revendications 1 à 8, caractérisé en ce qu'on utilise des mélanges de matières non conductrices, tandis que la proportion de matière apte à être rendue intrinsèquement et/ou extrinsequement conductrice de 1 ' électricité dans de tels mélanges est comprise entre environ 15 et 100% en poids de la matière totale.9. Method according to any one of claims 1 to 8, characterized in that mixtures of non-conductive materials are used, while the proportion of material capable of being made intrinsically and / or extrinsically conductive of electricity in such mixtures is between about 15 and 100% by weight of the total material.
10. Procédé selon l'une quelconque des revendications 1 à 9, caractérisé en ce qu'on irradie des zones (9) de la matière non conductrice (8) telle que déposée, pour les rendre conductrices de l'électricité. 10. Method according to any one of claims 1 to 9, characterized in that areas (9) of the non-conductive material (8) as deposited are irradiated, to make them electrically conductive.
11. Procédé selon la revendication 10, caractérisé en ce qu'on irradie deε zones (9) de la matière (8) après séchage, evaporation et/ou polymérisation de la matière (8 ) .11. Method according to claim 10, characterized in that the zones (9) of the material (8) are irradiated after drying, evaporation and / or polymerization of the material (8).
12. Procédé selon l'une quelconque des revendications 1 à 11, caractérisé en ce que le moyen de création d'une conductivité électrique localisée est choisi parmi une irradiation et un traitement par voie thermique.12. Method according to any one of claims 1 to 11, characterized in that the means for creating a localized electrical conductivity is chosen from irradiation and treatment by thermal means.
13. Procédé selon la revendication 12, caractérisé en ce qu'on utilise pour la création d'une conductivité électrique localisée une irradiation aux UV proches ou lointains ou une irradiation au moyen d'un rayonnement laser .13. The method of claim 12, characterized in that for the creation of a localized electrical conductivity irradiation with near or far UV or irradiation by means of laser radiation.
14. Procédé selon la revendication 12, caractérisé en ce qu'on utilise pour la création d'une conductivité électrique localisée un soufflage directif et localisé d'air chaud.14. The method of claim 12, characterized in that one uses for the creation of a localized electrical conductivity a directive and localized blowing of hot air.
15. Procédé selon l'une quelconque des revendications 1 à 14 pour la fabrication d'un dispositif électronique à circuit intégré (1) sur support (2) , comprenant au moins un microcircuit qui comporte des plots d'entrée et de sortie (3) reliés chacun par connexion électrique à un élément d'interface de communication (4 , ou éventuellement à un point de connexion ou une piste de liaison, caractérisé en ce qu'il comprend la réalisation des dites connexions électriques par: a) dépôt, en recouvrement sur tout ou partie de la face active du microcircuit et des dits éléments d'interface de communication ou points de fixation ou pistes de liaison, d'une matière (8) non-conductrice, apte à être dotée d'une conductivité électrique, b) durcisεement et/ou polymérisation et/ou fixation de ladite matière, et c) activation d'au moins une fraction de ladite matière, localisée selon un trajet (9) reliant chaque plot d'entrée ou de sortie (3) à un élément d'interface de communication (4) ou à un point de connexion ou à une piεte de liaison associés, avec un moyen apte à y induire une conductivité électrique.15. Method according to any one of claims 1 to 14 for the manufacture of an electronic device with integrated circuit (1) on support (2), comprising at least one microcircuit which comprises input and output pads (3 ) each connected by electrical connection to a communication interface element (4, or possibly to a connection point or a connecting track, characterized in that it comprises the making of said electrical connections by: a) deposit, in covering over all or part of the active face of the microcircuit and of said communication interface elements or fixing points or connecting tracks, of a material (8) non-conductive, capable of having an electrical conductivity, b) hardening and / or polymerization and / or fixing of said material, and c) activation of at least a fraction of said material, located along a path (9) connecting each input or output terminal (3) to a communication interface element (4) or to an associated connection point or connection part, with a means capable of inducing an electrical conductivity therein .
16. Procédé selon la revendication 15, caractérisé en ce que le support (2) sur lequel est fixé le microcircuit est un substrat de circuit intégré.16. Method according to claim 15, characterized in that the support (2) on which the microcircuit is fixed is an integrated circuit substrate.
17. Procédé selon la revendication 15, caractérisé en ce que ladite matière (8) est fixable et/ou polymérisable, et est fixée par adhésion ou accrochage, par adsorption et/ou par polymérisation.17. The method of claim 15, characterized in that said material (8) is fixable and / or polymerizable, and is fixed by adhesion or attachment, by adsorption and / or by polymerization.
18. Procédé selon la revendication 17, caractérisé en ce qu'on utilise une matière (8) présentant des propriétés d'adhésivité vis-à-viε du microcircuit et/ou du εupport de celui-ci.18. The method of claim 17, characterized in that a material is used (8) having adhesiveness properties vis-à-vis the microcircuit and / or εupport thereof.
19. Compoεition de matière non-conductrice, apte à être rendue conductrice de l'électricité sous l'action d'un moyen énergétique pour la réalisation de connexions électriques, caractérisée en ce qu'elle comporte une combinaison d'au moins un monomère à polymérisation cationique et d'au moins un monomère à polymérisation radicalaire, ainsi qu'une charge apte à rendre conducteur de l'électricité le polymère formé à partir d'au moinε l'un des dits monomères . 19. Composition of non-conductive material, capable of being made conductive of electricity under the action of an energetic means for making electrical connections, characterized in that it comprises a combination of at least one monomer with cationic polymerization and of at least one monomer with radical polymerization, as well as a filler capable of rendering electrically conductive the polymer formed from at least one of said monomers.
20. Composition de matière selon la revendication 19, caractérisée en ce que ladite charge est composée d'un sel d'Ag et est combinée avec un agent réducteur.20. Composition of matter according to claim 19, characterized in that said filler is composed of an Ag salt and is combined with a reducing agent.
21. Elément de connexion électrique, caractérisé en ce qu'il comporte une composition de matière selon l'une des revendications 19 ou 20 déposée entre au moins deux éléments conducteurs à connecter, et en ce qu'au moins une portion (9) de cette même matière est conductrice de l'électricité.21. Electrical connection element, characterized in that it comprises a composition of matter according to one of claims 19 or 20 deposited between at least two conductive elements to be connected, and in that at least a portion (9) of this same material conducts electricity.
22. Elément de connexion électrique caractérisé en ce qu'il est composé d'une masse de matière non conductrice de l'électricité, dont au moins une portion est conductrice de l'électricité, tandis que la fraction restante est apte à être rendue conductrice de l'électricité par l'intermédiaire d'un moyen énergétique.22. Electrical connection element characterized in that it is composed of a mass of non-electrically conductive material, at least a portion of which is electrically conductive, while the remaining fraction is capable of being made conductive electricity through an energy medium.
23. Elément de connexion électrique selon l'une des revendications 21 ou 22, caractérisé en ce que les portions non conductrices et les portions conductrices constituent une structure homogène ou un même réseau, notamment polymère, ou possèdent une matrice de base identique.23. Electrical connection element according to one of claims 21 or 22, characterized in that the non-conductive portions and the conductive portions constitute a homogeneous structure or the same network, in particular polymer, or have an identical base matrix.
24. Elément de connexion électrique selon l'une quelconque des revendications 21 à 23, caractérisé en ce que les portions de plan conductrices (9) s'étendent du plan de dépôt de la matière (8) jusqu'à la surface externe de celle-ci.24. electrical connection element according to any one of claims 21 to 23, characterized in that the conductive plane portions (9) extend from the material deposition plane (8) to the external surface of that -this.
25. Elément de connexion électrique εelon l'une quelconque des revendications 21 à 22, caractérisé en ce que les portions conductrices ~ ; εe situent entièrement à l'intérieur de la masse de matière ( 8 ) .25. electrical connection element according to any one of claims 21 to 22, characterized in that the conductive portions ~ ; They lie entirely inside the mass of material (8).
26. Elément de connexion électrique selon l'une quelconque des revendications 21 à 25, caractérisé en ce que ledit élément de connexion est constitué de matière conductrice (9) connectant une puce, tandis que ladite matière (9) est diεtante des flancs de ladite puce.26. electrical connection element according to any one of claims 21 to 25, characterized in that said connection element consists of conductive material (9) connecting a chip, while said material (9) is diεtante of the sides of said chip.
27. Dispositif électronique comportant au moins un microcircuit (1) sur un support (2), muni de plots (3) d'entrée et de sortie, et au moins un élément d'interface de communication (4) et/ eu des points et/ou pistes de liaison, ainsi qu'au moins un élément de connexion, caractérisé en ce qu'au moins un élément de connexion reliant ledit microcircuit à ladite interface de communication et/ou à des points et/ou pistes de liaison est un élément de connexion selon l'une quelconque des revendications 21 à 26.27. Electronic device comprising at least one microcircuit (1) on a support (2), provided with input and output pads (3), and at least one element of communication interface (4) and / or points and / or connecting tracks, as well as at least one connection element, characterized in that at least one connection element connecting said microcircuit to said communication interface and / or at points and / or connection tracks is a connection element according to any one of claims 21 to 26.
28. Module pour carte à puce comportant aes éléments de connexion électrique selon l'une deε revendications28. Smart card module comprising aes electrical connection elements according to one of claims
21 à 26.21 to 26.
29. Carte à puce, caractérisée en ce qu'elle comporte, encarté dans le corps de carte, un dispositif électronique selon la revendication 27. 29. Chip card, characterized in that it includes, inserted in the card body, an electronic device according to claim 27.
PCT/FR2001/000332 2000-02-04 2001-02-05 Method for producing electrical connections in particular for an electronic device WO2001057923A1 (en)

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FR0001555A FR2804796B1 (en) 2000-02-04 2000-02-04 METHOD FOR MAKING ELECTRICAL CONNECTIONS IN PARTICULAR FOR AN ELECTRONIC DEVICE
FR00/01555 2000-02-04

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