WO2001041963A3 - Systems and methods for application of atmospheric plasma surface treatment to various electronic component packaging and assembly methods - Google Patents
Systems and methods for application of atmospheric plasma surface treatment to various electronic component packaging and assembly methods Download PDFInfo
- Publication number
- WO2001041963A3 WO2001041963A3 PCT/US2000/042454 US0042454W WO0141963A3 WO 2001041963 A3 WO2001041963 A3 WO 2001041963A3 US 0042454 W US0042454 W US 0042454W WO 0141963 A3 WO0141963 A3 WO 0141963A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- methods
- electronic component
- systems
- application
- surface treatment
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/0556—Disposition
- H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
- H01L2224/05572—Disposition the external layer being disposed in a recess of the surface the external layer extending out of an opening
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Wire Bonding (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU45111/01A AU4511101A (en) | 1999-12-01 | 2000-12-01 | Systems and methods for application of atmospheric plasma surface treatment to various electronic component packaging and assembly methods |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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US16833399P | 1999-12-01 | 1999-12-01 | |
US60/168,333 | 1999-12-01 | ||
US71806600A | 2000-11-21 | 2000-11-21 | |
US09/718,066 | 2000-11-21 |
Publications (4)
Publication Number | Publication Date |
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WO2001041963A2 WO2001041963A2 (en) | 2001-06-14 |
WO2001041963A8 WO2001041963A8 (en) | 2001-11-15 |
WO2001041963A3 true WO2001041963A3 (en) | 2002-02-28 |
WO2001041963A9 WO2001041963A9 (en) | 2002-08-01 |
Family
ID=26864008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/042454 WO2001041963A2 (en) | 1999-12-01 | 2000-12-01 | Systems and methods for application of atmospheric plasma surface treatment to various electronic component packaging and assembly methods |
Country Status (1)
Country | Link |
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WO (1) | WO2001041963A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8361340B2 (en) | 2003-04-28 | 2013-01-29 | Air Products And Chemicals, Inc. | Removal of surface oxides by electron attachment |
US7387738B2 (en) | 2003-04-28 | 2008-06-17 | Air Products And Chemicals, Inc. | Removal of surface oxides by electron attachment for wafer bumping applications |
US7897029B2 (en) | 2008-03-04 | 2011-03-01 | Air Products And Chemicals, Inc. | Removal of surface oxides by electron attachment |
US7434719B2 (en) | 2005-12-09 | 2008-10-14 | Air Products And Chemicals, Inc. | Addition of D2 to H2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment |
US8454850B2 (en) | 2009-09-02 | 2013-06-04 | Air Products And Chemicals, Inc. | Method for the removal of surface oxides by electron attachment |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0349095A2 (en) * | 1982-03-10 | 1990-01-03 | Hitachi, Ltd. | Method of making a metal wire for use in integrated circuits. |
DE4404931A1 (en) * | 1993-02-16 | 1994-08-18 | Nippon Denso Co | Method and device for direct connection of two bodies |
US5941448A (en) * | 1996-06-07 | 1999-08-24 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Method for dry fluxing of metallic surfaces, before soldering or tinning, using an atmosphere which includes water vapor |
US6074895A (en) * | 1997-09-23 | 2000-06-13 | International Business Machines Corporation | Method of forming a flip chip assembly |
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2000
- 2000-12-01 WO PCT/US2000/042454 patent/WO2001041963A2/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0349095A2 (en) * | 1982-03-10 | 1990-01-03 | Hitachi, Ltd. | Method of making a metal wire for use in integrated circuits. |
DE4404931A1 (en) * | 1993-02-16 | 1994-08-18 | Nippon Denso Co | Method and device for direct connection of two bodies |
US5941448A (en) * | 1996-06-07 | 1999-08-24 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Method for dry fluxing of metallic surfaces, before soldering or tinning, using an atmosphere which includes water vapor |
US6074895A (en) * | 1997-09-23 | 2000-06-13 | International Business Machines Corporation | Method of forming a flip chip assembly |
Non-Patent Citations (3)
Title |
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"Fluxless soldering under ambient pressure plasma cleaning", ELECTRONIC PACKAGING & PRODUCTION, vol. 35, no. 11, October 1995 (1995-10-01), Newton ( USA ), pages 32, XP000538164 * |
NISHIKAWA ET AL.: "Fluxless soldering process technology", PROCEEDINGS 44TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 16 November 1994 (1994-11-16), washington d.c. ( USA ), pages 286 - 292, XP000479158 * |
TAKYI ET AL.: "solderability testing in nitrogen atmosphere of plasma treated HASL finish PCBs for fluxless soldering", IEEE/CPMT ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 19 October 1998 (1998-10-19), pages 172 - 186, XP000849781 * |
Also Published As
Publication number | Publication date |
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WO2001041963A9 (en) | 2002-08-01 |
WO2001041963A2 (en) | 2001-06-14 |
WO2001041963A8 (en) | 2001-11-15 |
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