WO2001030929A1 - Method and means for improving bonding between polymer materials, in particular for chip card - Google Patents

Method and means for improving bonding between polymer materials, in particular for chip card Download PDF

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Publication number
WO2001030929A1
WO2001030929A1 PCT/FR2000/002749 FR0002749W WO0130929A1 WO 2001030929 A1 WO2001030929 A1 WO 2001030929A1 FR 0002749 W FR0002749 W FR 0002749W WO 0130929 A1 WO0130929 A1 WO 0130929A1
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WO
WIPO (PCT)
Prior art keywords
type
adhesive
compatibilization
compatibility
chosen
Prior art date
Application number
PCT/FR2000/002749
Other languages
French (fr)
Inventor
Lucile Dossetto
Didier Elbaz
Jean-Christophe Fidalgo
Bernard Calvas
Original Assignee
Gemplus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus filed Critical Gemplus
Priority to AU76723/00A priority Critical patent/AU7672300A/en
Publication of WO2001030929A1 publication Critical patent/WO2001030929A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/484—Moisture curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/026—Chemical pre-treatments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B29C66/712—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined the composition of one of the parts to be joined being different from the composition of the other part
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/028—Non-mechanical surface pre-treatments, i.e. by flame treatment, electric discharge treatment, plasma treatment, wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
    • B29C66/7316—Surface properties
    • B29C66/73161—Roughness or rugosity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/006—Memory cards, chip cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • a dielectric material is used as support for the micromodule which, provided with at least one integrated circuit chip and its connections with communication interfaces, is inserted in a card body.
  • This dielectric support is implemented in the form of a film from which the micromodules to be transferred are then cut out from a card body.
  • polymeric materials which are used today for the manufacture of the film are a polyimide, such as for example the polyimide commercially known
  • thermoactivatable is understood here to mean a heat activated adhesive, which includes adhesives more commonly known as hot melt and also included in the concept of hot melt adhesives.
  • a polyimide such as Kapton is not suitable for bonding with heat-activatable adhesives, because its surface is very smooth and has a low bonding power. On the other hand, it adheres well with cyanoacrylate adhesives.
  • Untreated epoxy glass sticks well with cyanoacrylate type adhesives, but sandblasting of the epoxy glass is necessary for bonding with a heat-activated adhesive.
  • the invention provides a method and means for making a lamination of different polymer materials, both by gluing with a cyanoacrylate and by gluing of the heat-activated type, said method and said means using a compatibilization material intended to constitute an intermediate layer between the one of the polymer materials concerned and an adhesive of cyanoacrylate type or of thermoactivable type applied to the other polymer material.
  • the first object of the invention is therefore such a method, comprising the intercalation, between two different polymer materials to be laminated, of a compatibilization material constituting an intermediate layer between a first polymer material and an adhesive material of cyanoacrylate type or thermoactivable applied on a second polymeric material for the lamination to the first.
  • the invention relates to a process as mentioned above for the lamination of two different polymer materials, one of which may be bonded with an adhesive of cyanoacrylate type or with a heat-activated adhesive while the other does not adhere not well with the same adhesive.
  • said compatibilization material is preferably applied preferably by coating on the face of the first polymer material to be adhered to the second while the adhesive of the chosen type is applied to the face to be laminated with the second plastic material or, as a variant , on said coating layer.
  • the operation of one coating can be performed by any means appropriate known in the art.
  • the compatibilization material used in this process aims to increase the adhesiveness of a material with low surface energy, constituting one of the materials to be laminated. To this end, it is advantageous that it provides both mechanical anchoring sites and active sites chosen in particular from the groups
  • the expression "capable of providing mechanical anchoring sites” means the ability to increase the roughness of the material thus coated. Such sites are present in a compatibilization material whose physical structure comprises at the molecular level ramifications conferring on the macroscopic scale a three-dimensional deployment with mdentations, giving a layer of compatibilization material thus constituted a roughness and / or a power interpenetration facilitating its anchoring with an adjacent material.
  • By the expression “capable of providing active sites” is meant the ability to increase the surface energy of the material thus coated, by increasing the number of active sites constituting bridging sites.
  • the compatibilization material used according to the invention is preferably chosen from polymers or copolymers of which at least one monomer has a functionality strictly greater than 2.
  • the polymers or copolymers thus formed have free functions and / or functions protected and releasable, able to intervene in the crosslinking of the polymer chains forming such a compatibilization material
  • the compatibilization materials have the role of increasing the adhesiveness of a material with low surface energy, by increasing this surface energy of said polymer material, so as to make it more wettable. In itself, this could lead to the use of any adhesive, for which the material concerned would have an affinity, alone or via a specific primer for said material.
  • thermoplastic or crosslinked compatibilization materials would generate a tacky state (in English "tac" during a rise in temperature. Consequently, thermosetting compatibilization materials are preferred, and among them preferably thermally crosslinkable and / or photocrosslinkable materials.
  • said compatibilization material can be chosen in particular, but not necessarily, from amide-type resins, phenolic resins, epoxy resins, which are heat-crosslinkable, and acrylamide, acrylate and polymethylmethacrylate type resins, which are photo-crosslinkable alone or in the presence of UV activator, the crosslinked phenolic resins and the compositions acrylonitrile-butadiene-styrene (ABS) in solvent phase, as well as their mixtures.
  • amide-type resins amide-type resins
  • phenolic resins epoxy resins, which are heat-crosslinkable
  • acrylamide, acrylate and polymethylmethacrylate type resins which are photo-crosslinkable alone or in the presence of UV activator
  • the crosslinked phenolic resins and the compositions acrylonitrile-butadiene-styrene (ABS) in solvent phase as well as their mixtures.
  • one or more other materials having other functions such as ABS in the solvent phase, can be combined with another compatibilization material of the aforementioned type, allowing good compatibility with a card body which would be read even in ABS.
  • the amount or proportion of compatibilization material to be used is not critical and depends on each specific application case. It can be determined by a person skilled in the art by means of preliminary tests carried out according to known methodologies and making it possible to define an effective range and advantageous ranges, both in terms of efficiency and in terms of cost.
  • the layer of compatibilization material applied according to the invention has a thickness of approximately 1 to 5 ⁇ m, preferably a thickness of approximately 1 ⁇ m, in the illustrative application considered here.
  • said compatibilization material is crosslinked. This avoids possible adhesion problems in particular during the various assembly operations of the electronics of the smart cards, which for the most part require a temperature rise of the assembly.
  • This crosslinking can be carried out in a known manner, either by thermal activation or by photonic activation, for example by means of UV or other radiation. Such activation induces a chemical bridging between several polymer chains, by condensation or complexation involving the groups present on the aforementioned active sites.
  • the compatibilization material can be applied on both sides to laminate, in non-crosslinked form on one, and in noncrosslinked form or preferably crosslinked on the other, while the adhesive of the chosen type is then applied to one of the surfaces thus treated.
  • that of plastic materials which is intended to directly receive the compatibilization material can be subjected to a treatment by corona effect before its coating with said material. This further improves the adhesion of said material on the plastic material concerned, which allows for example treatment according to one invention surfaces more difficult to subject to the proposed lamination, such as untreated PET.
  • said coating of the compatibilization material is carried out in coordination with a coating as mentioned above of another face of said material.
  • the invention also makes it possible to keep a polyimide type material, such as the product called Kapton, for the base film to be bonded to another plastic material.
  • a polyimide type material such as the product called Kapton
  • said polyimide or alternatively an epoxy glass
  • compatibilization material according to the invention makes its poor contribution to this set and allows a reduction in the thickness of the base film.
  • This reduction in thickness of one of the polymer materials can be compensated for by the layer of compatibilization material, and this makes it possible to achieve a substantial saving on said polymer material, which in this case is an expensive material.
  • the technique according to the invention thus provides an economical solution for laminating two different plastic materials, at least one of which has a low surface energy, respectively with an adhesive of cyanoacrylate type or with an adhesive of heat-activated type.
  • the invention makes it possible to achieve an unusual efficiency and quality of bonding, with such an inexpensive treatment and even with materials, in particular support materials for the chip card module, inexpensive.
  • this corona treatment is taken full advantage of, since it can be carried out immediately before the coating of compatibilization material and then allows the treatment of surfaces which are more difficult to treat.
  • the surface treatment thus produced is stable over time, unlike the surface treatment by simple conventional corona effect, which is not and whose effect decreases over time.
  • a subject of the invention is also a compatibilization material as defined above, for improving the lamination of two different plastic materials, consisting of a compatibilization material capable of forming an adherent intermediate layer between a first plastic material and an adhesive material of cyanoacrylate type or thermoactivable type applied to the second plastic material to adhere to the first.
  • said compatibilization material is crosslinked so as not to have its own adhesion under the conditions of the assembly of the two plastic materials one against 1 other.
  • the crosslinking of this material can be carried out by example by thermal input or by UV layering.
  • thermal input or by UV layering it is envisaged to simplify two different materials to be laminated.
  • more than two materials it is clear to those skilled in the art that the case of more than two materials is also possible. It then suffices to apply the treatment according to the invention to one or more of the pairs of materials constituting such multiple materials.
  • the invention thus also relates to an integrated circuit module comprising a dielectric film and an integrated circuit integral with the dielectric film, intended to be fixed by bonding with a polymer support, said module being provided with a layer of compatibilization material suitable to adhere to at least one adhesive chosen from an adhesive of cyanoacrylate type and an adhesive of thermoactivable type, while said compatibilization material is preferably as defined above.
  • said compatibilization material is crosslinked, so as not to have its own adhesion under the conditions of assembly against one another, by means of an adhesive of the two polymer materials respectively of the module and of the polymer support forming the card body.
  • smart cards have been produced by inserting an electronic module comprising a polyimide support with the commercial name Kapton, with an adhesive of cyanoacrylate type and thermoactivatable, in a thermostabilized PET card body (product marketed by the company Autotype under the name Autotex, by using according to the invention a compatibilization material of photocrosslinkable acrylate type, over a thickness of approximately 1 ⁇ m.
  • a compatibilization material of photocrosslinkable acrylate type over a thickness of approximately 1 ⁇ m.
  • the process can also be applied according to
  • PA poly (vinyl alcohol) 'PVA
  • COC cyclo-olefin copolymers

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention concerns a method for producing a thermo-bonding of different polymer materials with a cyanoacrylate or a heat-activated adhesive, which consists in using a compatibility substance designed to form an intermediate layer between one said polymer materials and the cyanoacrylate or heat-activated adhesive applied for thermo-bonding on the other polymer material. The invention is applicable for thermo-bonding of a chip card electronic module in a card body.

Description

PROCEDE ET MOYENS POUR L'AMELIORATION DU COLLAGE ENTRE MATÉRIAUX POLYMÈRES, NOTAMMENT POUR CARTE À PUCEPROCESS AND MEANS FOR IMPROVING THE BONDING BETWEEN POLYMERIC MATERIALS, IN PARTICULAR FOR A CHIP CARD
La présente invention concerne le collage de matériaux polymères entre eux, en particulier pour une application dans le domaine des cartes électroniques plus communément dénommées cartes à puce avec contacts affleurants et/ou sans contact.The present invention relates to the bonding of polymeric materials together, in particular for an application in the field of electronic cards more commonly known as smart cards with flush and / or contactless contacts.
Bien qu'elle concerne de manière générale le collage entre eux de matériaux tels qu'envisagés plus loin la présente invention sera décrite ci-après, pour simplifier en référence à son application dans le secteur des cartes à puce .Although it generally relates to the bonding between them of materials as envisaged below, the present invention will be described below, to simplify with reference to its application in the sector of smart cards.
Pour la fabrication des cartes à puce avec micromodule, on utilise un matériau diélectrique comme support du micromodule qui, muni d'au moins une puce de circuits intégrés et de ses connexions avec des interfaces de communication, est encarté dans un corps de carte . Ce support diélectrique est mis en oeuvre sous la forme d'un film dans lequel sont ensuite découpés les micromodules à reporter dans un corps de carte.For the manufacture of chip cards with micromodule, a dielectric material is used as support for the micromodule which, provided with at least one integrated circuit chip and its connections with communication interfaces, is inserted in a card body. This dielectric support is implemented in the form of a film from which the micromodules to be transferred are then cut out from a card body.
Les matériaux polymères que l'on utilise de nos jours pour la fabrication du film sont un polyimide, tel que par exemple le polyimide commercialement dénomméThe polymeric materials which are used today for the manufacture of the film are a polyimide, such as for example the polyimide commercially known
Kapton, et du verre époxy . Ces matériaux sont enduits d'un adhésif pour être laminés avec un film de cuivre, découpé mécaniquement ou chimiquement et sur lequel sont crées les contacts ISO de la carte à puce. Leur face opposée sert à l'application, après découpe au format d'un micromodule, d'un adhésif de type cyanoacrylate ou de type thermoactivable légalement dénommé "hot rnelt"! pour 1 ' encartage dudit micromodule. Il faut noter qu'on entend ici par "thermoactivable" un adhésif activé par la chaleur, ce qui inclut les adhésifs plus communément dits thermofusibles et eux aussi englobés dans le concept d'adhésifs hot melt.Kapton, and epoxy glass. These materials are coated with an adhesive to be laminated with a copper film, cut mechanically or chemically and on which are created the ISO contacts of the smart card. Their opposite face is used for the application, after cutting in the format of a micromodule, of an adhesive of cyanoacrylate type or of thermoactivable type legally called "hot rnelt"! for inserting said micromodule. It should be noted that the term "thermoactivatable" is understood here to mean a heat activated adhesive, which includes adhesives more commonly known as hot melt and also included in the concept of hot melt adhesives.
Or, un polyimide tel que le Kapton n'est pas adapté au collage avec des adhésifs thermoactivables , car sa surface est très lisse et possède un faible pouvoir d'accrochage. Il adhère en revanche bien avec des colles à base de cyanoacrylate .However, a polyimide such as Kapton is not suitable for bonding with heat-activatable adhesives, because its surface is very smooth and has a low bonding power. On the other hand, it adheres well with cyanoacrylate adhesives.
Le verre époxy non traité colle bien avec des adhésifs de type cyanoacrylate, mais un sablage du verre époxy est nécessaire pour un collage avec un adhésif thermoactivable .Untreated epoxy glass sticks well with cyanoacrylate type adhesives, but sandblasting of the epoxy glass is necessary for bonding with a heat-activated adhesive.
Les matériaux susdits étant chers , on a alors envisagé de leur substituer des matériaux moins onéreux, comme par exemple un polyéthylènetéréphtalate ^PET) ou un polyéthylenenaphtenate (PENj . Mais, malgré la grande tenue des traitements de surface disponibles sur le marché, ces matériaux alternatifs n'offrent pas de surface universelle pouvant être traitée par un adhésif aussi bien de type cyanoacrylate que de type thermoactivable.The aforementioned materials being expensive, it was then considered to replace them with less expensive materials, such as for example a polyethylene terephthalate ( PET) or a polyethylenenaphtenate (PENj. But, despite the great resistance of the surface treatments available on the market, these alternative materials do not offer a universal surface which can be treated with an adhesive both of cyanoacrylate type and of thermoactivable type.
L'invention propose un procédé et des moyens pour réaliser un contrecollage de matériaux polymères différents, aussi bien par collage avec un cyanoacrylate que par collage de type thermoactivable, ledit procédé et lesdits moyens utilisant une matière de compatibilisation destinée à constituer une couche intermédiaire entre l'un des matériaux polymères concernés et un adhésif de type cyanoacrylate ou de type thermoactivable appliqué sur l'autre matériau polymère. L'invention a ainsi pour premier objet un tel procédé, comprenant 1 ' intercalation, entre deux matériaux polymères différents à contrecoller, d'une matière de compatibilisation constituant une couche intermédiaire entre un premier matériau polymère et une matière adhesive de type cyanoacrylate ou de type thermoactivable appliquée sur un deuxième matériau polymère pour le contrecollage au premier.The invention provides a method and means for making a lamination of different polymer materials, both by gluing with a cyanoacrylate and by gluing of the heat-activated type, said method and said means using a compatibilization material intended to constitute an intermediate layer between the one of the polymer materials concerned and an adhesive of cyanoacrylate type or of thermoactivable type applied to the other polymer material. The first object of the invention is therefore such a method, comprising the intercalation, between two different polymer materials to be laminated, of a compatibilization material constituting an intermediate layer between a first polymer material and an adhesive material of cyanoacrylate type or thermoactivable applied on a second polymeric material for the lamination to the first.
Dans une forme de réalisation 1 ' invention a pour objet un procède tel que susdit pour le contrecollage de deux matériaux polymères différents dont l'un peut être collé avec un adhésif de type cyanoacrylate ou avec un adhésif thermoactivable alors que l'autre n'adhère pas bien au même adhésif .In one embodiment, the invention relates to a process as mentioned above for the lamination of two different polymer materials, one of which may be bonded with an adhesive of cyanoacrylate type or with a heat-activated adhesive while the other does not adhere not well with the same adhesive.
Selon 1 ' invention on applique avantageusement ladite matière de compatibilisation de préférence par enduction sur la face du premier matériau polymère à faire adhérer au deuxième tandis que l'adhésif du type choisi est appliqué sur la face a contrecoller du deuxième matériau plastique ou, en variante, sur ladite couche d' enduction. L'opération d1 enduction peut être réalisée par tout moyen approprié connu de l'homme du métier .According to the invention, said compatibilization material is preferably applied preferably by coating on the face of the first polymer material to be adhered to the second while the adhesive of the chosen type is applied to the face to be laminated with the second plastic material or, as a variant , on said coating layer. The operation of one coating can be performed by any means appropriate known in the art.
La matière de compatibilisation mise en oeuvre dans ce procédé vise à augmenter 1 ' adhésivité d'un matériau à faible énergie de surface, constituant l'un des matériaux à contrecoller. A cette fin, il est avantageux qu'elle apporte aussi bien des sites d'ancrage mécanique que des sites actifs choisis notamment parmi les groupesThe compatibilization material used in this process aims to increase the adhesiveness of a material with low surface energy, constituting one of the materials to be laminated. To this end, it is advantageous that it provides both mechanical anchoring sites and active sites chosen in particular from the groups
C=0, -COOR, =NH et -NH2 • Par l'expression "apte à apporter des sites d'ancrage mécanique", on entend l'aptitude à augmenter la rugosité du matériau ainsi enduit. De tels sites sont présents dans une matière de compatibilisation dont la structure physique comprend au niveau moléculaire des ramifications lui conférant a l'échelle macroscopique un déploiement tridimensionnel avec mdentations , donnant à une couche de matière de compatibilisation ainsi constituée une rugosité et/ou un pouvoir d'interpénétration facilitant son ancrage avec un matériau adjacent. Par l'expression "apte à apporter des sites actifs", on entend l'aptitude à augmenter l'énergie de surface du matériau ainsi enduit, en augmentant le nombre de sites actifs constituant des sites de pontage . La matièie de compatibilisation mise en oeuvre selon l'invention est de préférence choisie parmi les polymères ou les copolymeres dont au moins un monomère a une fonctionnalité strictement supérieure à 2. Les polymères ou les copolymeres ainsi constitués ont des fonctions libres et/ou des fonctions protégées et libérables, aptes a intervenu dans la réticulation des chaînes polymères formant une telle matière de compatibilisationC = 0, -COOR, = NH and -NH2 • The expression "capable of providing mechanical anchoring sites" means the ability to increase the roughness of the material thus coated. Such sites are present in a compatibilization material whose physical structure comprises at the molecular level ramifications conferring on the macroscopic scale a three-dimensional deployment with mdentations, giving a layer of compatibilization material thus constituted a roughness and / or a power interpenetration facilitating its anchoring with an adjacent material. By the expression "capable of providing active sites" is meant the ability to increase the surface energy of the material thus coated, by increasing the number of active sites constituting bridging sites. The compatibilization material used according to the invention is preferably chosen from polymers or copolymers of which at least one monomer has a functionality strictly greater than 2. The polymers or copolymers thus formed have free functions and / or functions protected and releasable, able to intervene in the crosslinking of the polymer chains forming such a compatibilization material
Sans vouloir être lie pai une quelconque théorie on estime que les matières de compatibilisation ont pour rôle d'augmenter l'adhésivité d'un matériau à faible énergie de surface, en augmentant cette énergie de surface du dit matériau polymère, de manière à le rendre plus mouillable. En soi, cela pourrait conduire à utiliser un adhésif quelconque, pour lequel le matériau concerné aurait une affinité, seul ou via un primaire spécifique pour ledit matériau. Il s'est cependant avéré que les matières de compatibilisation tnermoplastiques ou à phase réticulée généreraient un état poisseux (en anglais "tac " lors d'une élévation de température. On préfère par conséquent les matières de compatibilisation thermodurcissables , et parmi elles de préférence des matières thermoréticulables et/ou photoréticulables .Without wishing to be bound by any theory, it is believed that the compatibilization materials have the role of increasing the adhesiveness of a material with low surface energy, by increasing this surface energy of said polymer material, so as to make it more wettable. In itself, this could lead to the use of any adhesive, for which the material concerned would have an affinity, alone or via a specific primer for said material. However, it has been found that the thermoplastic or crosslinked compatibilization materials would generate a tacky state (in English "tac" during a rise in temperature. Consequently, thermosetting compatibilization materials are preferred, and among them preferably thermally crosslinkable and / or photocrosslinkable materials.
En pratique ladite matière de compatibilisation peut être choisie notamment mais non nmitativement parmi les résines de type amide, les résines phénoliques, les résines époxy, qui sont thermoréticulables, et les résines de type acrylamide, acrylate et polyméthylméthacrylate , qui sont photo- reticulables seules ou en présence d'activateur UV, les résines phénoliques réticulées et les compositions d ' acrylonitπle-butadiène-styrène (ABS) en phase solvant, ainsi que leurs mélanges.In practice, said compatibilization material can be chosen in particular, but not necessarily, from amide-type resins, phenolic resins, epoxy resins, which are heat-crosslinkable, and acrylamide, acrylate and polymethylmethacrylate type resins, which are photo-crosslinkable alone or in the presence of UV activator, the crosslinked phenolic resins and the compositions acrylonitrile-butadiene-styrene (ABS) in solvent phase, as well as their mixtures.
En variante, on peut comoiner avec une autre matière de compatibilisation d'un type susdit une ou plusieurs autres matières ayant d'autres fonctions, telles que pai exemple de l'ABS en phase solvant, permettant une bonne compatibilité avec un corps de carte qui serait lu même en ABS .As a variant, one or more other materials having other functions, such as ABS in the solvent phase, can be combined with another compatibilization material of the aforementioned type, allowing good compatibility with a card body which would be read even in ABS.
La quantité ou la proportion de matière de compatibilisation à mettre en oeuvre n'est pas critique et dépend de chaque cas concret d application. Elle peut être déterminée par l'homme du métier au moyen d'essais préalables réalisés selon des méthodologies connues et permettant de définir une gamme efficace et des gammes avantageuses, tant en terme d'efficacité qu'en terme de coûtThe amount or proportion of compatibilization material to be used is not critical and depends on each specific application case. It can be determined by a person skilled in the art by means of preliminary tests carried out according to known methodologies and making it possible to define an effective range and advantageous ranges, both in terms of efficiency and in terms of cost.
En pratique, il est recommandé que la couche de matière de compatibilisation appliquée selon l'invention ait une épaisseur d'environ 1 à 5 μm, de préférence une épaisseur d'environ 1 μm, dans l'application îllustrative considérée ici.In practice, it is recommended that the layer of compatibilization material applied according to the invention has a thickness of approximately 1 to 5 μm, preferably a thickness of approximately 1 μm, in the illustrative application considered here.
Dans une forme de mise en oeuvre préférée, ladite matière de compatibilisation est réticulée. On évite ainsi d'éventuels problèmes d'adhérence notamment lors des différentes opérations d'assemblage de l'électronique des cartes à puce, qui nécessitent pour la plupart une mise en température de 1 ' ensemble . Cette réticulation peut être effectuée de façon connue, soit par activation thermique, soit par activation photonique, par exemple au moyen d'un rayonnement UV ou autre. Une telle activation induit un pontage chimique entre plusieurs chaînes de polymère, par condensation ou complexation faisant intervenir les groupes présents sur les sites actifs susdits . Dans une variante de réalisation, la matière de compatibilisation peut être appliquée sur les deux faces a contrecoller, sous forme non-reticulée sur l'une, et sous forme non réticulée ou de préférence réticulée sur l'autre, tandis que l'adhésif du type choisi est ensuite appliqué sur l'une des surfaces ainsi traitées. En variante, on peut également utiliser une telle matière non réticulable, mais ne présentant pas d'adhésivité ou caractère collant aux températures auxquelles est mis en oeuvre le processus d'assemblage pour contrecollage.In a preferred embodiment, said compatibilization material is crosslinked. This avoids possible adhesion problems in particular during the various assembly operations of the electronics of the smart cards, which for the most part require a temperature rise of the assembly. This crosslinking can be carried out in a known manner, either by thermal activation or by photonic activation, for example by means of UV or other radiation. Such activation induces a chemical bridging between several polymer chains, by condensation or complexation involving the groups present on the aforementioned active sites. In an alternative embodiment, the compatibilization material can be applied on both sides to laminate, in non-crosslinked form on one, and in noncrosslinked form or preferably crosslinked on the other, while the adhesive of the chosen type is then applied to one of the surfaces thus treated. As a variant, it is also possible to use such a material which cannot be crosslinked, but which does not exhibit adhesiveness or stickiness at the temperatures at which the assembly process for laminating is carried out.
Dans une forme de réalisation avantageuse on peut soumettre celui des matériaux plastiques qui est destiné a recevoir directement la matière de compatibilisation à un traitement par effet corona avant son enduction avec ladite matière. On améliore ainsi encore l'adhérence de ladite matière sur le matériau plastique concerné, ce qui permet par exemple de traitei selon 1 ' invention des surfaces plus difficiles à soumettre au contrecollage envisagé, comme par exemple du PET non traité.In an advantageous embodiment, that of plastic materials which is intended to directly receive the compatibilization material can be subjected to a treatment by corona effect before its coating with said material. This further improves the adhesion of said material on the plastic material concerned, which allows for example treatment according to one invention surfaces more difficult to subject to the proposed lamination, such as untreated PET.
Selon une autre variante, on peut soumettre à une attaque chimique la surface destinée à recevoir la matière de compatibilisation selon l'invention.According to another variant, the surface intended to receive the compatibilization material according to the invention can be subjected to a chemical attack.
Dans une forme préférée de réalisation du procédé selon l'invention, on effectue ladite enduction de la matière de compatibilisation en coordination avec une enduction telle que susmentionnée de 1 autre face du dit matériau.In a preferred embodiment of the method according to the invention, said coating of the compatibilization material is carried out in coordination with a coating as mentioned above of another face of said material.
L'invention permet en outre de conserver un matériau de type polyimide, tel que le produit dénommé Kapton, pour le film de base à coller sur un autre matériau plastique. Dans l'application envisagée à titre îllustratif, ledit polyimide, ou en alternative un verre epoxy, est en pratique le matériau d'un film diélectrique destiné à constituer le support d'un module a encarter pa collage sur un corps de carte à puce qui, lui, peut êtie en ABS, PVC composites ABS-PVC, polycarbonate, composites ABS polycarbonate, ou autres. Si une technique conforme a l'invention avait été envisagée, on aurait raisonnablement pu s'attendre à ce qu'il en résulte un coût supplémentaire et des contraintes techniques rendant 1 ' nsemble du procédé moins économique .The invention also makes it possible to keep a polyimide type material, such as the product called Kapton, for the base film to be bonded to another plastic material. In the application envisaged by way of illustration, said polyimide, or alternatively an epoxy glass, is in practice the material of a dielectric film intended to constitute the support of a module to be inserted by bonding on a smart card body which , it can be ABS, PVC ABS-PVC composites, polycarbonate, ABS polycarbonate composites, or others. If a technique in accordance with the invention had been envisaged, it could reasonably have been expected to result in additional cost and technical constraints making the whole process less economical.
Au contraire il s'est avéré que l'ajout de matière de compatibilisation selon 1 ' invention apporte sa contribution piopre à cet ensemble et autorise une réduction de l'épaisseur du film de base. Cette diminution d'épaisseur d'un des matériaux polymères peut être compensée par la couche de matière de compatibilisation, et cela permet de réaliser une économie substantielle sur ledit matériau polymère, qui est dans ce cas un matériau coûteux. La technique selon l'invention procure ainsi une solution économique pour contrecoller deux matériaux plastiques différents, dont l'un au moins possède une faible énergie de surface, respectivement avec un adhésif de type cyanoacrylate ou avec un adhésif de type thermoactivable. Plus particulièrement, pour ce qui est de l'application aux cartes à puce avec micromodule, on peut ainsi obtenir selon 1 ' invention une surface du support de module pouvant être collée correctement aussi bien avec une colle liquide au cyanoacrylate qu'avec un adhésif thermoactivable. De façon plus avantageuse encore, l'invention permet d'atteindre une efficacité et une qualité de collage inhabituelles, avec un tel traitement peu coûteux et même avec des matériaux, notamment des matériaux de support du module de carte à puce, bon marché.On the contrary, it turned out that the addition of compatibilization material according to the invention makes its poor contribution to this set and allows a reduction in the thickness of the base film. This reduction in thickness of one of the polymer materials can be compensated for by the layer of compatibilization material, and this makes it possible to achieve a substantial saving on said polymer material, which in this case is an expensive material. The technique according to the invention thus provides an economical solution for laminating two different plastic materials, at least one of which has a low surface energy, respectively with an adhesive of cyanoacrylate type or with an adhesive of heat-activated type. More particularly, with regard to the application to chip cards with micromodule, it is thus possible according to the invention a surface of the module support which can be correctly bonded both with a liquid cyanoacrylate adhesive and with a heat-activated adhesive. . Even more advantageously, the invention makes it possible to achieve an unusual efficiency and quality of bonding, with such an inexpensive treatment and even with materials, in particular support materials for the chip card module, inexpensive.
De plus, pour la mise en oeuvre du procédé selonIn addition, for the implementation of the method according to
1 ' invention poui 1 ' encartage de modules de cartes à puce avec ou sans contacts affleurants, on peut utiliser une ligne d' enduction classiquement employée pour ces produits . Dans tous les cas, l' enduction d'une matière de compatibilisation selon l'invention peut être faite en même temps que le traitement classique éventuel de 1 ' utre face du matériau sur lequel cette matière est appliquée, à savoir 1 ' enduction de cette autre face avec un adhésif non-réticulé avant lamination avec un film de cuivre dans le cas de la fabrication des modules de cartes à puce avec contacts affleurants .1 invention poui 1 inserting smart card modules with or without flush contacts, one can use a coating line conventionally used for these products. In all cases, the coating of a compatibilization material according to the invention can be done at the same time as the possible conventional treatment of the other side of the material on which this material is applied, namely the coating of this material. other side with a non-crosslinked adhesive before lamination with a copper film in the case of the manufacture of smart card modules with flush contacts.
Dans la variante évoquée plus haut mettant en oeuvre un traitement par effet corona, on profite pleinement de ce traitement corona, puisqu'il peut être réalisé immédiatement avant l' enduction de matière de compatibilisation et permet alors le traitement de surfaces plus difficiles à traiter. Le traitement de surface ainsi réalisé est stable dans le temps, contrairement au traitement de surface par simple effet corona classique, qui ne l'est pas et dont l'effet diminue avec le temps .In the variant mentioned above implementing a corona treatment, this corona treatment is taken full advantage of, since it can be carried out immediately before the coating of compatibilization material and then allows the treatment of surfaces which are more difficult to treat. The surface treatment thus produced is stable over time, unlike the surface treatment by simple conventional corona effect, which is not and whose effect decreases over time.
Le traitement de surface avant contrecollage selon l'invention est économique, puisqu'il peut être effectué en ligne, comme on l'a indiqué plus haut, contrairement aux traitements classiques par sablage ou avec un plasma, qui nécessitent une étape et un équipement spécifiques . L'invention a également pour objet une matière de compatibilisation telle que définie plus haut, pour améliorer le contrecollage de deux matériaux plastiques différents, consistant en une matière de compatibilisation apte à former une couche intermédiaire adhérente entre un premier matériau plastique et une matière adhesive de type cyanoacrylate ou de type thermoactivable appliquée sur le deuxième matériau plastique à faire adhérer au premier.The surface treatment before laminating according to the invention is economical, since it can be carried out online, as indicated above, unlike conventional treatments by sandblasting or with a plasma, which require a specific step and equipment. . A subject of the invention is also a compatibilization material as defined above, for improving the lamination of two different plastic materials, consisting of a compatibilization material capable of forming an adherent intermediate layer between a first plastic material and an adhesive material of cyanoacrylate type or thermoactivable type applied to the second plastic material to adhere to the first.
Selon une forme de réalisation préférée, ladite matière de compatibilisation est réticulée de façon à ne pas posséder d'adhérence propre dans les conditions de l'assemblage des deux matériaux plastiques l'un contre 1 autre. La réticulation de cette matière peut s ' effectuer pai exemple par apport thermique ou par un layonnement UV . Dans la présente description on envisage pour simplifier deux matériaux différents à contrecoller. Il est cependant clair pour l'homme du métie que le cas de plus de deux matériaux est également envisageable. Il suffit alors d'appliquer le traitement selon l'invention a une ou plusieurs des paires de matériaux constituant de tels matériaux multiples .According to a preferred embodiment, said compatibilization material is crosslinked so as not to have its own adhesion under the conditions of the assembly of the two plastic materials one against 1 other. The crosslinking of this material can be carried out by example by thermal input or by UV layering. In the present description, it is envisaged to simplify two different materials to be laminated. However, it is clear to those skilled in the art that the case of more than two materials is also possible. It then suffices to apply the treatment according to the invention to one or more of the pairs of materials constituting such multiple materials.
L'invention a ainsi également pour objet un module a circuit intégre comportant un film diélectrique et un circuit intégré solidaire du film diélectrique, destiné à être fixé par collage avec un support polymère, ledit module étant muni d'une couche de matière de compatibilisation apte à adhérer à au moins un adhésif choisi parmi un adhésif de type cyanoacrylate et un adhésif de type thermoactivable, tandis que ladite matière de compatibilisation est de préférence telle que définie plus haut.The invention thus also relates to an integrated circuit module comprising a dielectric film and an integrated circuit integral with the dielectric film, intended to be fixed by bonding with a polymer support, said module being provided with a layer of compatibilization material suitable to adhere to at least one adhesive chosen from an adhesive of cyanoacrylate type and an adhesive of thermoactivable type, while said compatibilization material is preferably as defined above.
Dans une forme de réalisation avantageuse du dit module, ladite matière de compatibilisation est réticulée, de façon à ne pas posséder d'adhérence propre dans les conditions de l'assemblage l'un contre 1 autre, pa l'intermédiaire d'un adhésif des deux matériaux polymères respectivement du module et du support polymère formant corps de carte .In an advantageous embodiment of said module, said compatibilization material is crosslinked, so as not to have its own adhesion under the conditions of assembly against one another, by means of an adhesive of the two polymer materials respectively of the module and of the polymer support forming the card body.
L'invention a en outre pour objet une carte à puce comportant un tel module de circuit intégré, fixé par collage au moyen d'un adhésif de type cyanoacrylate ou de type thermoactivable.The invention further relates to a smart card comprising such an integrated circuit module, fixed by bonding by means of an adhesive of cyanoacrylate type or of thermoactivable type.
A titre îllustratif, on a réalisé des cartes à puce par encartage d'un module électronique comportant support en polyimide de dénomination commerciale Kapton, avec un adhésif respectivement de type cyanoacrylate et thermoactivable, dans un corps de carte en PET thermostabilisé (produit commercialisé par la société Autotype sous la dénomination Autotex, , en mettant en oeuvre selon 1 ' invention une matière de compatibilisation de type acrylate photoréticulable , sur une épaisseur d'environ 1 μm. On a obtenu des très bons résultats aussi bien en encartage de type cyanoacrylate (bonne cinétique et force d'arrachement élevée; qu'en encartage thermoactivable. On peut également appliquer le procédé selonBy way of illustration, smart cards have been produced by inserting an electronic module comprising a polyimide support with the commercial name Kapton, with an adhesive of cyanoacrylate type and thermoactivatable, in a thermostabilized PET card body (product marketed by the company Autotype under the name Autotex, by using according to the invention a compatibilization material of photocrosslinkable acrylate type, over a thickness of approximately 1 μm. has obtained very good results both in cyanoacrylate type inserting (good kinetics and high peel strength; as in thermoactivable inserting. The process can also be applied according to
1 ' invention avec de très bons résultats sur des matériaux polymères de type polyétherimide (PEI), polybutyltéréphtalate (PBTj, polyimide (PI), polyamide1 invention with very good results on polymer materials of polyetherimide (PEI), polybutylterephthalate (PBTj, polyimide (PI), polyamide) type
(PA; , poly(alcool vinylique) 'PVA), ou encore des copolymeres de cyclo-oléfines (COC, comme par exemple le produit commercialisé par la société Hoechst sous la dénomination Topas COC), entre autres.(PA;, poly (vinyl alcohol) 'PVA), or alternatively cyclo-olefin copolymers (COC, such as for example the product sold by the company Hoechst under the name Topas COC), among others.
L'invention peut s'appliquer à des cartes à puce avec contacts affleurants, à des cartes avec module d'identification d'abonné pour téléphones portables, dites cartes SIM ("Subscriber Identity Module") et plus communément dénommées "plugs", ainsi qu'à des cartes sans contact ou à des cartes de type hybride. The invention can be applied to smart cards with flush contacts, to cards with subscriber identification module for mobile phones, called SIM cards ("Subscriber Identity Module") and more commonly known as "plugs", as well than contactless cards or hybrid type cards.

Claims

REVENDICATIONS
1. Procédé pour réaliser un contrecollage de matériaux polymères différents avec un adhésif de type cyanoacrylate ou de type thermoactivable, caractérisé en ce qu'on utilise une matière de compatibilisation destinée à constituer une couche intermédiaire entre l'un des matériaux polymères concernés et un adhésif de type cyanoacrylate ou de type thermoactivable appliqué sur l'autre matériau polymère.1. A method for making a lamination of different polymer materials with an adhesive of cyanoacrylate type or of thermoactivable type, characterized in that a compatibilization material is used intended to constitute an intermediate layer between one of the polymer materials concerned and an adhesive cyanoacrylate type or thermoactivable type applied to the other polymeric material.
2. Procédé selon la revendication 1, caractérisé en ce qu'il comprend 1 ' intercalation, entre deux matériaux polymères différents à contrecoller, d'une matière de compatibilisation constituant une couche intermédiaire entre un premier matériau polymère et une matière adhesive de type cyanoacrylate ou de type thermoactivable appliquée sur un deuxième matériau polymère pour le contrecollage au premier.2. Method according to claim 1, characterized in that it comprises the intercalation, between two different polymeric materials to be laminated, of a compatibilization material constituting an intermediate layer between a first polymeric material and an adhesive material of cyanoacrylate type or thermoactivable type applied to a second polymeric material for laminating to the first.
3. Procédé selon l'une des revendications 1 ou 2, caractérisé en ce qu'il est mis en oeuvre pour le contrecollage de deux matériaux polymères différents, dont l'un peut être collé avec un adhésif de type cyanoacrylate ou avec un adhésif thermoactivable, alors que l'autre n'adhère pas bien au même adhésif. 3. Method according to one of claims 1 or 2, characterized in that it is used for the lamination of two different polymer materials, one of which can be bonded with an adhesive of cyanoacrylate type or with a heat-activated adhesive , while the other does not adhere well to the same adhesive.
4. Procédé selon l'une quelconque des revendications 1 à 3, caractérisé en ce qu'on applique ladite matière de compatibilisation par enduction sur la face du premier matériau polymère à faire adhérer au deuxième, tandis que l'adhésif du type choisi est appliqué sur la face à contrecoller du deuxième matériau polymère.4. Method according to any one of claims 1 to 3, characterized in that said compatibilization material is applied by coating on the face of the first polymeric material to be adhered to the second, while the adhesive of the chosen type is applied on the face to be laminated with the second polymer material.
5. Procédé selon l'une quelconque des revendications 1 à5. Method according to any one of claims 1 to
3, caractérisé en ce qu'on applique ladite matière de compatibilisation par enduction sur la face du premier matériau polymère à faire adhérer au deuxième, tandis que l'adhésif du type choisi est appliqué sur cette couche d' enduction. 3, characterized in that said compatibilization material is applied by coating on the face of the first polymeric material to be adhered to the second, while the adhesive of the chosen type is applied to this coating layer.
6. Procédé selon l'une quelconque des revendications 1 à6. Method according to any one of claims 1 to
5, caractérisé en ce qu'on utilise une matière de compatibilisation apte à apporter aussi bien des sites d'ancrage mécanique que des sites actifs choisis parmi les groupes -C=0, COOR, =NH et -NH2, de manière a augmenter 1 ' énergie de surface du matériau polymère . 5, characterized in that a compatibilization material is used which is capable of providing both mechanical anchoring sites and active sites chosen from the groups -C = 0, COOR, = NH and -NH2, so as to increase 1 surface energy of the polymer material.
7. Procédé selon l'une quelconque des revendications 1 à7. Method according to any one of claims 1 to
6 , caractérisé en ce que la matière de compatibilisation est choisie parmi les polymères ou les copolymeres dont au moins un monomère a une fonctionnalité strictement supérieure à 2 , de telle sorte que les polymères ou les copolymeres ainsi constitués ont des fonctions libres, et/ou des fonctions protégées et libérables, aptes à intervenir dans la réticulation des chaînes polymères formant une telle matière de compatibilisation. 6, characterized in that the compatibilization material is chosen from polymers or copolymers of which at least one monomer has a functionality strictly greater than 2, so that the polymers or copolymers thus formed have free functions, and / or protected and releasable functions, capable of intervening in the crosslinking of the polymer chains forming such a compatibilization material.
8. Procédé selon l'une quelconque des revendications 1 à8. Method according to any one of claims 1 to
5, caractérisé en ce que la matière de compatibilisation est choisie parmi les résines de type amide, les résines phénoliques, les résines époxy, les résines de type acrylamide, acrylate et polyméthylméthacrylate , les résines phénoliques réticulées et les compositions d ' acrylonitrile- butadiène- styrène (ABS en phase solvant, ainsi que leurs mélanges .5, characterized in that the compatibilization material is chosen from amide type resins, phenolic resins, epoxy resins, acrylamide, acrylate and polymethylmethacrylate type resins, crosslinked phenolic resins and acrylonitrile-butadiene compositions styrene (ABS in solvent phase, as well as their mixtures.
9. Procédé selon la revendication 8, caractérisé en ce que ladite matière de compatibilisation est combinée avec de l'ABS en phase solvant.9. Method according to claim 8, characterized in that said compatibilization material is combined with ABS in the solvent phase.
10. Procédé selon l'une quelconque des revendications 1 à 9, caractérisé en ce que la matière de compatibilisation est appliquée en une épaisseur d'environ 1 μm. 10. Method according to any one of claims 1 to 9, characterized in that the compatibilization material is applied in a thickness of about 1 μm.
11. Procédé selon l'une quelconque des revendications 1 à11. Method according to any one of claims 1 to
9, caractérisé en ce que ladite matière de compatibilisation est réticulée.9, characterized in that said compatibilization material is crosslinked.
12. Procède selon la revendication 11, caractérise en ce que ladite matière de compatibilisation est thermoréticulable et/ou photoréticulable .12. The method of claim 11, characterized in that said compatibilization material is heat-crosslinkable and / or photocrosslinkable.
13. Procédé selon l'une quelconque des revendications 1 à 10 et 12, caractérisé en ce que la matière de compatibilisation est appliquée sur les deux faces à contrecoller sous forme non-réticulée sui l'une et sous forme non-réticulée sur l'autre, tandis que l'adhésif du type choisi est ensuite appliqué sur l'une des surfaces ainsi traitées.13. Method according to any one of claims 1 to 10 and 12, characterized in that the compatibilization material is applied to the two faces to be laminated in non-crosslinked form on one and in non-crosslinked form on the other, while the adhesive of the chosen type is then applied to one of the surfaces thus treated.
14. Procédé selon l'une quelconque des revendications 1 à 12, caractérisé en ce que la matière de compatibilisation est appliquée sur les deux faces à contrecoller, sous forme non réticulée sur l'une et sous forme réticulée sur l'autre, tandis que 1 ' adhésif du type choisi est ensuite appliqué sur l'une des surfaces ainsi traitées.14. Method according to any one of claims 1 to 12, characterized in that the compatibilization material is applied to the two faces to be laminated, in non-crosslinked form on one and in crosslinked form on the other, while The adhesive of the chosen type is then applied to one of the surfaces thus treated.
15. Procédé selon l'une quelconque des revendications 1 à15. Method according to any one of claims 1 to
10, caractérisé en ce qu'on utilise une matière de compatibilisation non-réticulable , mais ne présentant pas d'adhésivité ou caractère collant aux températures auxquelles est mis en oeuvre le processus d'assemblage pour contrecollage.10, characterized in that a non-crosslinkable compatibilization material is used, but having no tackiness or stickiness at the temperatures at which the assembly process for laminating is carried out.
16. Procédé selon l'une quelconque des revendications 1 à 10, caractérisé en ce qu'on soumet celui des matériaux polymères qui est destiné à recevoir directement la matière de compatibilisation à un traitement par effet corona avant son enduction avec ladite matière.16. Method according to any one of claims 1 to 10, characterized in that that of polymeric materials which is intended to directly receive the compatibilization material to a treatment by corona effect before its coating with said material.
17. Procédé selon 1 une quelconque des revendications 1 ou 10, caractérisé en ce qu'on soumet à une attaque chimique la surface destinée à recevoir la matière de compatibilisation. 17. Method according to any one of claims 1 or 10, characterized in that the surface intended to receive the compatibilization material is subjected to a chemical attack.
18. Piocédé selon l'une des revendications 4 ou 5, caractérisé en ce qu'on effectue ladite enduction de la matière de compatibilisation en coordination avec une enduction de l'autre face du dit matériau. 19. Procédé selon l'une des revendications 1 ou 2, caractérisé en ce que le premier matériau polymère est un film diélectrique destiné à constituer le support d'un module à circuit intègre à encarter par collage sur un deuxième matériau constituant le corps d'une carte à puce.18. Piocédé according to one of claims 4 or 5, characterized in that said coating of the compatibilization material is carried out in coordination with a coating of the other face of said material. 19. Method according to one of claims 1 or 2, characterized in that the first polymeric material is a dielectric film intended to constitute the support of an integral circuit module to be inserted by gluing on a second material constituting the body of a smart card.
20. Procédé selon la revendication 19 caractérisé en ce que le premier matériau polymère est du polyimide ou un verre époxy.20. The method of claim 19 characterized in that the first polymeric material is polyimide or an epoxy glass.
21. Procédé selon la revendication 19, caractérisé en ce que le deuxième matériau polymère est de l'ABS, du21. The method of claim 19, characterized in that the second polymeric material is ABS,
PVC, un composite ABS-PVC, du polycarbonate ou un composite ABS-polycarbonate .PVC, an ABS-PVC composite, polycarbonate or an ABS-polycarbonate composite.
22. Matière de compatibilisation pour améliorer le contrecollage de deux matériaux plastiques différents, caractérisée en ce qu'elle est choisie parmi les résines de type amide, les résines phénoliques, les résines époxy, les résines de type acrylamide acrylate et polyméthylméthacrylate , les résines phénoliques réticulées et les compositions d ' acrylonitπle-butadiène- styrène (ABS) en phase solvant, ainsi que leurs mélanges, et est apte à former une couche intermédiaire adhérente entre un premier matériau polymère et une matière adhesive de type cyanocarylate ou de type thermoactivable appliquée sui un deuxième matériau polymère à faire adhérer au premier.22. Compatibility material for improving the lamination of two different plastic materials, characterized in that it is chosen from amide type resins, phenolic resins, epoxy resins, acrylamide acrylate and polymethylmethacrylate type resins, phenolic resins crosslinked and the acrylonitrile-butadiene-styrene (ABS) compositions in solvent phase, as well as their mixtures, and is capable of forming an adherent intermediate layer between a first polymeric material and an adhesive material of cyanocarylate type or of heat-activated type applied sui a second polymeric material to adhere to the first.
23. Matière de compatibilisation selon la revendication 22 caracténsée en ce que ladite matière de compatibilisation est réticulée, de façon à ne pas posséder d'adhérence propre dans les conditions de l'assemblage des deux matériaux polymères l'un contre 1 ' autre .23. compatibilization material according to claim 22 characterized in that said compatibilization material is crosslinked, so as not to have its own adhesion under the conditions of the assembly of the two polymeric materials one against the other.
24. Module à circuit intégré comportant un film diélectrique composé d'un matériau polymère et un circuit intégré solidaire du film diélectrique, destiné à être fixé par collage avec un support polymère, caractérisé en ce qu'il est muni d'une couche de matière de compatibilisation apte à adhérer à un moins un adhésif choisi parmi un adhésif de type cyanoacrylate et un adhésif de type thermoactivable.24. Integrated circuit module comprising a dielectric film composed of a polymer material and an integrated circuit integral with the dielectric film, intended to be fixed by bonding with a polymer support, characterized in that it is provided with a layer of material compatibilization capable of adhering to at least one adhesive chosen from an adhesive of the cyanoacrylate type and an adhesive of the heat-activated type.
25. Module selon la revendication 24, caractérisé en ce qu'il comporte une matière de compatibilisation choisie parmi les résines de type amide, les résines phénoliques, les résines époxy, les résines de type acrylamide, acrylate et polyméthylméthacrylate, les résines phénoliques réticulées et les compositions d' acrylonitrile-butadiène-styrène (ABS) en phase solvant, ainsi que leurs mélanges.25. Module according to claim 24, characterized in that it comprises a compatibilization material chosen from amide type resins, phenolic resins, epoxy resins, acrylamide, acrylate and polymethylmethacrylate type resins, crosslinked phenolic resins and acrylonitrile-butadiene-styrene (ABS) compositions in solvent phase, as well as their mixtures.
26. Module selon l'une des revendications 24 ou 25, caractérisé en ce que ladite matière de compatibilisation est réticulée, de façon à ne pas posséder d'adhérence propre dans les conditions de l'assemblage l'un contre l'autre, par l'intermédiaire d'un adhésif, des deux matériaux polymères respectivement du module et du support polymère formant corps de carte .26. Module according to one of claims 24 or 25, characterized in that said compatibilization material is crosslinked, so as not to have its own adhesion under the conditions of assembly against each other, by by means of an adhesive, of the two polymer materials respectively of the module and of the polymer support forming the card body.
27. Carte à puce comportant un module selon l'une quelconque des revendications 24 à 26, fixé par collage au moyen d'un adhésif de type cyanoacrylate ou de type thermoactivable. REVENDICATIONS MODIFIEES27. Chip card comprising a module according to any one of claims 24 to 26, fixed by bonding by means of an adhesive of cyanoacrylate type or of thermoactivable type. AMENDED CLAIMS
[reçues par le Bureau International le 26 Janvier 2001 (26.01.01); revendications 1-27 remplacées par les revendications 1-26 modifiées (4 pages)][received by the International Bureau on January 26, 2001 (01/26.01); claims 1-27 replaced by amended claims 1-26 (4 pages)]
~rocece αe réalisation d'un contre collage ce matériaux polymères différents avec un adhésif de type cyanoacrylate ou de type thermoactivable, caractérisé en ce qu'on utilise une matière αe compatibilité destinée à constituer une couche intermédiaire entre l'un des matériaux polymères et un adhésif de type cyanoacrylate et/ou thermoactivable appliqué sur l'autre matériau polymère. Procédé selon la revendication 1, caractérisé en ce qu'il comprend l'intercalation, entre deux matériaux polymères différents à contre coller, d'une matière de compatibilité constituant une couche intermédiaire entre un premier matériau polymère et une matière adhesive de type cyanoacrylate ou de thermoactivable appliquée sur un deuxième matériau polymère pour le contre collage au premier. Procédé selon la revendication 1 ou 2, caractérisé en ce qu'il est mis en œuvre pour le contre collage de deux matériaux polymères différents, dont l'un peut être collé avec un adhésif de type cyanoacrylate ou avec un adhésif thermoactivable, alors que l'autre n'adhère pas bien au même adhésif.~ rocece αe making a bonding of this different polymeric material with an adhesive of the cyanoacrylate type or of the thermoactivable type, characterized in that an αe compatibility material is used intended to constitute an intermediate layer between one of the polymeric materials and a cyanoacrylate and / or heat-activated adhesive applied to the other polymeric material. Method according to claim 1, characterized in that it comprises the intercalation, between two different polymeric materials to be bonded, of a compatibility material constituting an intermediate layer between a first polymeric material and an adhesive material of cyanoacrylate type or of thermoactivable applied on a second polymeric material for lamination to the first. Method according to claim 1 or 2, characterized in that it is implemented for the lamination of two different polymer materials, one of which can be bonded with an adhesive of cyanoacrylate type or with a heat-activated adhesive, while the other does not adhere well to the same adhesive.
Procédé selon l'une des revendications 1 à 3, caractérisé en ce qu'on applique la matière de compatibilité par enduction sur la face du premier matériau polymère à faire adhérer au deuxième, tandis que l'adhésif du type choisi est appliqué sur la face à contre coller du deuxième matériau polymère.Method according to one of claims 1 to 3, characterized in that the compatibility material is applied by coating on the face of the first polymer material to be adhered to the second, while the adhesive of the chosen type is applied to the face to counter glue the second polymeric material.
Procédé selon l'une des revendications 1 à 3, caractérisé en ce qu'on applique la matière de compatibilité par enduction sur la face du Dremier matériau polymère à faire adhérer au deuxième, tandis que l'adhésif du type choisi est applique sur cette couche d'enduction. Procédé selon l'une des revendications 1 à 5, caractérisé en ce qu'on utilise une matière de compatibilité apte à apporter aussi bien des sites d'ancrage mécanique que des sites actifs choisis parmi les groupes - C=0, -COOR, =NH et -NH2, αe manière à augmenter l'énergie de surface du matériau polymère. 7 Procédé selon l'une αes revendications 1 à 6, caractérisé en ce que la matière de compatibilité est choisie parmi les polymères ou les copolymeres dont au moins un monomère a une fonctionnalité strictement suoeπeure a 2, αe sorte que les polvmeres ou les 5 copolymeres ainsi constitues ont des fonctions libres, et/ou des fonctions protégées et libérables, aptes a intervenir dans la réticulation des chaînes polymères formant une telle matière de compatibilité. 8. Procédé selon l'une des revendications 1 à 5, caractérisé en ce que laMethod according to one of claims 1 to 3, characterized in that the compatibility material is applied by coating on the face of the Dremier polymer material to be adhered to the second, while the adhesive of the chosen type is applied to this layer coating. Method according to one of claims 1 to 5, characterized in that a compatibility material is used which is capable of providing both mechanical anchoring sites and active sites chosen from the groups - C = 0, -COOR, = NH and -NH2, αe so as to increase the surface energy of the polymer material. 7 Method according to one of claims 1 to 6, characterized in that the compatibility material is chosen from polymers or copolymers of which at least one monomer has a functionality strictly suoeπeure a 2, so that the polymers or the 5 copolymers thus constituted have free functions, and / or protected and releasable functions, capable of intervening in the crosslinking of the polymer chains forming such a compatibility material. 8. Method according to one of claims 1 to 5, characterized in that the
: o matière de compatibilité est choisie parmi les résines de type amide, les résines phénoliques, 'es résines epoxy, les résines de type acrylamide, acrylate et polyméthylméthacrylate, les résines phénoliques réticulées et les compositions d'acrylonitnle-butadièπe- styrène (ABS) en phase solvant, ainsi que leurs mélanges.: o compatibility material is chosen from amide type resins, phenolic resins, epoxy resins, acrylamide, acrylate and polymethylmethacrylate type resins, crosslinked phenolic resins and acrylonitrile-butadiene-styrene (ABS) compositions in solvent phase, as well as their mixtures.
15 9. Procédé selon la revendication 8, caractérisé en ce que la matière de compatibilité est combinée avec de l'ABS en phase solvant.9. Method according to claim 8, characterized in that the compatibility material is combined with ABS in the solvent phase.
10. Procédé selon l'une des revendications 1 à 9, caractérisé en ce qu'une épaisseur d'environ 1 μm de matière de compatibilité est appliquée.10. Method according to one of claims 1 to 9, characterized in that a thickness of approximately 1 μm of compatibility material is applied.
11. Procédé selon l'une des revendications 1 à 9, caractérisé en ce que 20 la matière de compatibilité est réticulée.11. Method according to one of claims 1 to 9, characterized in that the compatibility material is crosslinked.
12. Procédé selon la revendication 11, caractérisé en ce que la matière de compatibilité est thermoréticulable et/ou photoréticulable.12. Method according to claim 11, characterized in that the compatibility material is heat-crosslinkable and / or photocrosslinkable.
13. Procédé selon l'une des revendications 1 a 12, caractérisé en ce que la matière de compatibilité est appliquée sur les deux faces a contre13. Method according to one of claims 1 to 12, characterized in that the compatibility material is applied to the two faces against
25 coller, sous forme non-réticulée suM'une et sous forme noπ-reticulée sur l'autre, tandis que l'adhésif du type choisi est ensuite applique sur l'une des surfaces ainsi traitées.25 sticking, in non-cross-linked form on one and in no-cross-linked form on the other, while the adhesive of the chosen type is then applied to one of the surfaces thus treated.
14. Procédé selon l'une des revendications 1 à 10, caractérise en ce qu'on utilise une matière de compatibilité πon-réticulable, mais ne14. Method according to one of claims 1 to 10, characterized in that a πon-crosslinkable compatibility material is used, but does not
: o présentant pas d'adhesivité ou de caractère collant aux températures auxquelles est mis en œuvre le processus d'assemblage pour contre collage. : o having no adhesiveness or stickiness at the temperatures at which the assembly process is implemented for lamination.
15 Procédé selon l'une des revendications 1 à 10, caractérisé en ce qu'on soumet celui des matériaux polymères qui est destiné à recevoir15 Method according to one of claims 1 to 10, characterized in that that of polymeric materials which is intended to receive
J r> directement la matière de compatibilité à un traitement par effet corona avant son enduction avec la matière. J r> directly the material of compatibility to a treatment by corona effect before its coating with the material.
16. Procédé selon l'une ces revendications 1 eu 10, caractérisé en ce cu'on soumet à une attaαue cnimiαue la surface cestinée a recevoir la matière de compatibilité.16. Method according to one of these claims 1 to 10, characterized in that the subject is subjected to an attack on the surface to receive the compatibility material.
17 Proceαé selon l'une αes revencications 4 ou 5, caractérise en ce ςu on 5 effectue la enduction de la matière de compatibilité en coorαination avec une enduction de l'autre face au dit matériau.17 Proceαé according to one aes revencications 4 or 5, characterized in that onu 5 performs the coating of the compatibility material in coorαination with a coating of the other face to said material.
18. Procédé selon l'une des revendications 1 ou 2, caractérisé en ce que le premier matériau polymère est un film diélectrique destiné à constituer le support d'un module à circuit intégré à encarter par18. Method according to one of claims 1 or 2, characterized in that the first polymeric material is a dielectric film intended to constitute the support of an integrated circuit module to be inserted by
13 collage sur un deuxième matériau constituant le corps d'une carte à puce.13 bonding to a second material constituting the body of a smart card.
19. Procédé selon la revendication 18, caractérisé en ce que le premier matériau polymère est du poly imide ou un verre époxy.19. The method of claim 18, characterized in that the first polymeric material is poly imide or an epoxy glass.
20. Procédé selon la revendication 18, caractérisé en ce que le deuxième 15 matériau polymère est de l'ABS, du PVC, un composite ABS-PVC, du polycarbonate ou un composite ABS-polycarbonate.20. The method of claim 18, characterized in that the second polymeric material is ABS, PVC, an ABS-PVC composite, polycarbonate or an ABS-polycarbonate composite.
21. Matière de compatibilité pour améliorer le contre collage de deux matériaux plastiques différents, caractérisée en ce qu'elle est choisie parmi les résines de type amide, les résines phénoliques, les résines21. Compatibility material to improve the bonding of two different plastic materials, characterized in that it is chosen from amide-type resins, phenolic resins, resins
20 époxy, les résines de type acrylamide, acrylate et polyméthylméthacrylate, les résines phénoliques réticulées et les compositions d'acrylonitπle-butadiène-styrèπe (ABS) en phase solvant, ainsi que leurs mélanges, et est apte à former une couche intermédiaire adhérente entre un premier matériau polymère et une20 epoxy, acrylamide, acrylate and polymethylmethacrylate type resins, crosslinked phenolic resins and acrylonitrile-butadiene-styrene (ABS) compositions in solvent phase, as well as their mixtures, and is capable of forming an adherent intermediate layer first polymer material and a
25 matière adhesive de type cyanoacrylate et/ou thermoactivable appliquée sur un deuxième matériau polymère a faire adhérer au premier.25 cyanoacrylate and / or heat-activated adhesive material applied to a second polymeric material to be adhered to the first.
22. Matière de compatibilité selon la revendication 22, caractérisée en ce que la matière de compatibilité est réticulée, de façon à ne pas22. Compatibility material according to claim 22, characterized in that the compatibility material is crosslinked, so as not to
: : posséder d'aαhérence propre αans les conditions αe l'assemblage des deux matériaux polymères l'un contre l'autre.:: have its own adhesion under the conditions of the assembly of the two polymer materials one against the other.
23. Module à circuit intégré comportant un film diélectπαue composé d'un matériau polymère et un circuit intégré solidaire du film diélectrique, destiné à être fixé par collage avec un support polymère, caractérisé23. Integrated circuit module comprising a dielectric film composed of a polymer material and an integrated circuit integral with the dielectric film, intended to be fixed by bonding with a polymer support, characterized
35 en ce qu'il est muni d'une couche de matière de compatibilité apte à adhérer à des adhésifs dont au moins deux sont respectivement choisis parmi les achésifs de type c/anoacrylate et thermoactivable.35 in that it is provided with a layer of compatibility material capable of adhere to adhesives of which at least two are respectively chosen from the c / anoacrylate and thermoactivatable type of achesives.
24. Module selon la revendication 23, caractérisé en ce qu'il comporte une matière de compatibilité choisie parmi les résines de type amide, les s résines phénoliques, les résines époxy, les résines de type acrylamide, acrylate et polyméthylméthacrylate, les résines phénoliques réticulées et les compositions d'acrylonitrile-butadiène-styrène (ABS) en phase solvant, ainsi que leurs mélanges.24. Module according to claim 23, characterized in that it comprises a compatibility material chosen from amide type resins, phenolic resins, epoxy resins, acrylamide, acrylate and polymethylmethacrylate type resins, crosslinked phenolic resins and acrylonitrile-butadiene-styrene (ABS) compositions in solvent phase, as well as their mixtures.
25. Module selon l'une des revendications 23 ou 24, destiné à une carte à 0 puce ou analogues, pourvue d'un corps formant support polymère, caractérisé en ce que la matière de compatibilité est réticulée, de façon à ne pas posséder d'adhérence propre dans les conditions de l'assemblage l'un contre l'autre, par l'intermédiaire d'un adhésif, des deux matériaux polymères respectivement du module et du support 5 polymère formant corps de carte.25. Module according to one of claims 23 or 24, for a 0 chip card or the like, provided with a body forming a polymer support, characterized in that the compatibility material is crosslinked, so as not to have d clean adhesion under the conditions of assembly one against the other, by means of an adhesive, of the two polymer materials respectively of the module and of the polymer support 5 forming card body.
26. Carte à puce comportant un module selon l'une des revendications 23 à 25, fixé par collage au moyen d'un adhésif de type cyanoacrylate ou de type thermoactivable.26. Chip card comprising a module according to one of claims 23 to 25, fixed by bonding by means of an adhesive of cyanoacrylate type or of thermoactivable type.
0 0
PCT/FR2000/002749 1999-10-26 2000-10-04 Method and means for improving bonding between polymer materials, in particular for chip card WO2001030929A1 (en)

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FR9913489A FR2800087A1 (en) 1999-10-26 1999-10-26 Bonding different polymers comprises using compatible material, used for silicon chip cards in mobile phones, as intermediate layer between one polymer and adhesive layer applied to the other polymer

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5135598A (en) * 1987-08-13 1992-08-04 Minnesota Mining And Manufacturing Company Priming polymeric surfaces for cyanoacrylate adhesives
EP0527438A2 (en) * 1991-08-14 1993-02-17 Orga Kartensysteme GmbH Record carrier with adhesively applied circuit carrier
WO1995025138A1 (en) * 1994-03-14 1995-09-21 Henkel Kommanditgesellschaft Auf Aktien Aqueous polyurethane primer
WO1998006062A1 (en) * 1996-08-05 1998-02-12 Gemplus S.C.A. Improvement to a method for making smart cards, and resulting cards

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5135598A (en) * 1987-08-13 1992-08-04 Minnesota Mining And Manufacturing Company Priming polymeric surfaces for cyanoacrylate adhesives
EP0527438A2 (en) * 1991-08-14 1993-02-17 Orga Kartensysteme GmbH Record carrier with adhesively applied circuit carrier
WO1995025138A1 (en) * 1994-03-14 1995-09-21 Henkel Kommanditgesellschaft Auf Aktien Aqueous polyurethane primer
WO1998006062A1 (en) * 1996-08-05 1998-02-12 Gemplus S.C.A. Improvement to a method for making smart cards, and resulting cards

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