WO2001018567A8 - Optoelectronic connector system - Google Patents

Optoelectronic connector system

Info

Publication number
WO2001018567A8
WO2001018567A8 PCT/US2000/024134 US0024134W WO0118567A8 WO 2001018567 A8 WO2001018567 A8 WO 2001018567A8 US 0024134 W US0024134 W US 0024134W WO 0118567 A8 WO0118567 A8 WO 0118567A8
Authority
WO
WIPO (PCT)
Prior art keywords
focal plane
light
detectors
lens
collimator
Prior art date
Application number
PCT/US2000/024134
Other languages
French (fr)
Other versions
WO2001018567A2 (en
WO2001018567A3 (en
WO2001018567A9 (en
Inventor
John A Trezza
Original Assignee
Teraconnect Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teraconnect Inc filed Critical Teraconnect Inc
Priority to AU22467/01A priority Critical patent/AU2246701A/en
Publication of WO2001018567A2 publication Critical patent/WO2001018567A2/en
Publication of WO2001018567A3 publication Critical patent/WO2001018567A3/en
Publication of WO2001018567A8 publication Critical patent/WO2001018567A8/en
Publication of WO2001018567A9 publication Critical patent/WO2001018567A9/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

An optical transceiver system including a plurality of transceiver nodes with at least one two-dimensional integrated circuit array of optical emitters (42) and detectors (44) mounted on an ASIC drive circuit and forming a focal plane; a lens or light collimator (46) located adjacent for directing light to and from the emitter and detectors (42, 44); an epoxy stand off located peripherally around each focal plane to prevent contact between the focal plane and the lens or collimator and to prevent entry of contaminants therebetween; and at least one fiber optic bundle (40) to convey light between each of the transceiver nodes through the perspective lenses or collimators.
PCT/US2000/024134 1999-09-03 2000-09-01 Optoelectronic connector system WO2001018567A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU22467/01A AU2246701A (en) 1999-09-03 2000-09-01 Optoelectronic connector system

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US15224499P 1999-09-03 1999-09-03
US15221399P 1999-09-03 1999-09-03
US60/152,244 1999-09-03
US60/152,213 1999-09-03
US15916599P 1999-10-13 1999-10-13
US60/159,165 1999-10-13
US22907300P 2000-08-30 2000-08-30
US60/229,073 2000-08-30

Publications (4)

Publication Number Publication Date
WO2001018567A2 WO2001018567A2 (en) 2001-03-15
WO2001018567A3 WO2001018567A3 (en) 2002-01-24
WO2001018567A8 true WO2001018567A8 (en) 2002-05-30
WO2001018567A9 WO2001018567A9 (en) 2002-09-12

Family

ID=27496008

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/024134 WO2001018567A2 (en) 1999-09-03 2000-09-01 Optoelectronic connector system

Country Status (2)

Country Link
AU (1) AU2246701A (en)
WO (1) WO2001018567A2 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862231A (en) * 1983-11-18 1989-08-29 Harris Corporation Non-contact I/O signal transmission in integrated circuit packaging
DE3910710A1 (en) * 1989-04-03 1990-10-04 Standard Elektrik Lorenz Ag OPTICAL-ELECTRICAL MULTIPLE CONNECTION
US5119451A (en) * 1990-12-31 1992-06-02 Texas Instruments Incorporated Optical waveguides as interconnects from integrated circuit to integrated circuit and packaging method using same
JPH0588028A (en) * 1991-09-27 1993-04-09 Fujikura Ltd Surface mount type optical integrated circuit and its manufacture
US5605856A (en) * 1995-03-14 1997-02-25 University Of North Carolina Method for designing an electronic integrated circuit with optical inputs and outputs
US6052498A (en) * 1997-12-19 2000-04-18 Intel Corporation Method and apparatus providing an optical input/output bus through the back side of an integrated circuit die

Also Published As

Publication number Publication date
WO2001018567A2 (en) 2001-03-15
AU2246701A (en) 2001-04-10
WO2001018567A3 (en) 2002-01-24
WO2001018567A9 (en) 2002-09-12

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