WO2001016484A2 - A magnetically-assisted shape memory alloy actuator - Google Patents
A magnetically-assisted shape memory alloy actuator Download PDFInfo
- Publication number
- WO2001016484A2 WO2001016484A2 PCT/IB2000/001729 IB0001729W WO0116484A2 WO 2001016484 A2 WO2001016484 A2 WO 2001016484A2 IB 0001729 W IB0001729 W IB 0001729W WO 0116484 A2 WO0116484 A2 WO 0116484A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sma
- sma member
- magnet
- actuator
- magnetically
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F03—MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
- F03G—SPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
- F03G7/00—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
- F03G7/06—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
- F03G7/065—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like using a shape memory element
Definitions
- the present invention is directed to an actuator and, more particularly, to a
- a shape memory alloy is a material which has the ability to transition
- SMA is cold, that is, when the SMA is below its phase transition temperature, it has a very low yield strength and can be deformed into a new shape, which the SMA will retain when below the phase transition temperature.
- the material is heated through its phase transition temperature, it undergoes a change in crystal structure which
- SMA materials are advantageous for use in micromachined actuators, also called
- SMA actuating devices can provide an energy
- SMA actuators provide a
- microactuators provide the potential to be fabricated using microelectromechanical
- MEMS manufactores
- SMA actuators may be incorporated on a substrate with electronic
- circuitry to share the same power supply as the circuitry.
- SMA microactuators typically use electrical current or heat resistors
- microactuators employ a biasing spring to bias the SMA in its deformed shape when the
- biasing springs and fluids must be incorporated into the microactuators on an individual
- the present invention is directed to an actuator.
- the actuator includes an SMA
- the actuator includes a second magnet in magnetic communication with the magnetic material portion.
- the present invention is directed to a relay.
- the relay
- magnetically-assisted SMA actuator is in one of an actuated position and a non-actuated
- actuator is in another of the actuated position and the non-actuated position.
- the present invention is directed to a valve.
- the present invention is directed to a method of biasing an SMA actuator.
- the method includes cooling the SMA member to a martensitic phase
- the present invention is directed to a method of switching
- the method includes connecting the
- the present invention is directed to a method of operating
- the method includes transitioning an
- the present invention represents an advancement over relevant actuators in that an actuator according to the present invention may be formed using batch fabrication techniques.
- Fig. 1 is a combination cross-sectional side-view and block diagram illustrating a
- Fig. 2 is a combination cross-sectional side-view and block diagram illustrating
- Fig. 3 is a cross-sectional side-view of a microactuator according to another
- Fig. 4 is a cross-sectional side-view of the microactuator of Fig. 3 in the "ON"
- Fig. 5 is a combination cross-sectional side-view and block diagram illustrating a
- Fig. 6 is a combination cross-sectional side-view and block diagram illustrating
- Fig. 7 is a cross-sectional side-view of a microrelay according to the present invention in the "CLOSED" position;
- Fig. 8 is a cross-sectional side-view of the microrelay of Fig. 7 in the "OPEN"
- Fig. 9 is a cross-sectional side-view of a microrelay according to another
- Fig. 10 is a cross-sectional side-view of the microrelay of Fig. 9 in the "OPEN"
- Fig. 11 is a cross-sectional side-view of a microrelay according to another
- Fig. 12 is a cross-sectional side-view of the microrelay of Fig. 11 in the "OPEN"
- Fig. 13 is a cross-sectional side-view of a microvalve according to the present
- Fig. 14 is a cross-sectional side-view of the microvalve of Fig. 13 in the "OPEN"
- Fig. 15 is a cross-sectional side-view of a microvalve according to another
- Fig. 16 is a cross-sectional side-view of the microvalve of Fig. 15 in the "OPEN"
- Fig. 17 is a cross-sectional side-view of a microvalve according to another
- Fig. 18 is a top-view of the microvalve of Fig. 17.
- Figs. 1 and 2 illustrate a microactuator 10 according to the present invention in the
- microactuator 10 includes a member 12, a magnetic material portion 14, a first magnet
- microactuator 10 of the present invention may be used in any device requiring remote
- actuation such as, for example, relays, valves, and pumps.
- the present invention will be
- the member 12 is constructed of a shape memory alloy (SMA) such as, for example, titanium nickel (TiNi) or any other joule-effect alloy.
- SMA shape memory alloy
- TiNi titanium nickel
- phase change temperature range over which the phase transition occurs is defined as
- the SMA Secure Digital
- member 12 is biased in its deformed shape by the magnetic attraction between the
- the magnetic material portion 14 and the first magnet 16.
- the magnetic material portion 14 is
- the SMA member 12 is attached to a surface of the SMA member 12, and may be, for example, a "soft"
- the magnetic material portion 14 may also be soft ferrites such as, for example, nickel- zinc or manganese-zinc ferrites. As described hereinbelow in conjunctioawith other embodiments of the present invention, the magnetic material portion 14 may also be a
- hard or permanent, magnetic material such as, for example, AlNiCo, NdFeB, SmCo,
- hard ferrites such as, for example, strontium ferrite, or hard magnetic polymer
- material portion 14 may also include an electromagnet.
- the SMA member 12 is formed from a magnetic material
- the first magnet 16 and the first magnet 16 are identical to one embodiment of the present invention.
- a hard, or permanent, magnet or an electromagnet may be, for example, a hard, or permanent, magnet or an electromagnet.
- the first magnet 16 is a permanent magnet
- the first magnet 16 may
- strontium ferrite or hard magnetic polymer composites.
- the SMA member 12 may be heated, for example, using electrical current or
- Figs, land 2 illustrate an embodiment of the present invention using electrical current to heat the SMA member 12.
- the power control 18 modulates the
- the switch 22 controls whether electrical power is supplied to the SMA member 12.
- the switch 22 may be eliminated if its function is, for example, performed by the power controller 18.
- FIGs. 3 and 4 illustrate another embodiment of the present invention in which the
- SMA member 12 is heated by resistive heaters 24. According to one embodiment of the present disclosure
- microactuator 10 illustrated in Figs. 3 and 4 are in the "OFF" (i.e.,
- SMA member 12 is in its martensitic phase and in its deformed shape, and in Fig. 4 the
- SMA member 12 is in its parent austenitic phase and in its memory shape. The illustrated
- an insulating layer 26 constructed of, for example, polymers, such
- the resistive heaters 24 may be patterned on the insulating layer 26 using,
- the heaters 24 may be patterned directly
- the illustrated embodiment includes two resistive
- resistive heaters 24 although more or less resistive heaters 24 may also be employed.
- the switch 22 is open, causing no electrical power to be supplied
- the SMA member 12 is annealed
- Fig. 1 represents the
- the switch 22 is closed in Fig. 1 and open in Fig. 2.
- the SMA member 12 assumes the memory shape illustrated in Fig. 1 when
- phase change temperature range i.e., when the switch 22 is closed.
- the magnetic material portion 14 and the first magnet 16 are both of the magnetic material portion 14 and the first magnet 16
- the present invention may be batch fabricated using conventional MEMS fabrication techniques, such as photolithography, selective etching, and screen printing.
- the present invention may be fabricated by forming thin films on a substrate using conventional microfabrication techniques, including sputtering of an SMA film to form the SMA member 12.
- the first magnet 16 may also be formed using conventional MEMS
- fabrication techniques such as photolithography, selective etching, and screen printing.
- microactuator 10 may be fabricated using
- microactuator 10 of the present invention is designed to be exclusively batch fabrication techniques.
- microactuator 10 of the present invention is designed to be exclusively batch fabrication techniques.
- inventions may be formed using, for example, conventional microelectronic fabrication techniques and laminate-based fabrication techniques.
- the SMA member 12 is heated by the resistive heaters 24
- the SMA member 12 is
- a repulsive force between the magnetic material portion 14 and the first magnet 16 may be realized where the two are
- Figs. 5 and 6 illustrate the microactuator 10 in the "OFF" (i.e., non-actuated) and
- the microactuator 10 illustrated in Figs. 5 and 6 includes a second
- magnet 28 which may be, for example, an electromagnet, such as an electromagnetic
- the second magnet 28 is located below the first
- magnet 16 may be below the second magnet 28 or interleaved with the electromagnetic
- the second magnet 28 may be formed using, for example
- the magnetic flux force of the second magnet 28 may be oriented to aid or oppose
- magnet 16 is not sufficient to deform the SMA member 12 when the member 12 is in its
- the magnetic force of second magnet 28 may be oriented to aid the
- the second magnet 28 may be turned off if the attractive force of the first magnet 16 is sufficiently strong to hold the SMA member 12 at the distance d,. Alternatively, if the attractive force of the first magnet 16 is so great that the SMA member 12 cannot overcome the force of the
- first magnet 16 to revert to its memory shape when heated above its phase change
- the magnetic force of the second magnet 28 may be oriented to oppose
- the second magnet 28 may be turned off.
- Fig. 5 In another embodiment of the microactuator 10 of the present invention, Fig. 5
- Fig. 6 illustrates the "OFF" (i.e., non-
- magnet 16 and magnetic material portion 14 are like polarized such that a repulsive
- the present invention is also directed to a microrelay employing a magnetically-
- FIGs. 7 and 8 illustrate a microrelay 40 according to one
- microrelay 40 is formed on a substrate 42.
- the substrate 42 which is the lowest layer of
- the substrate 42 may include a semiconductor material such as, for example, silicon, GaAs, or SiGe, or a non ⁇
- the actuating components of the microrelay 40 include the SMA member 12, the magnetic material portion 14, and the first magnet 16.
- the microrelay 40 includes a
- the contacts 44, 46 may be any
- An insulator 48 may be provided between the first magnet 16 and the fixed contacts 46.
- the insulator 48 may be, for example, silicon nitride, silicon dioxide, glass, air, or
- the microrelay 40 further includes a support
- the support 50 is of sufficient mechanical structure
- SMA member 12 to support the SMA member 12, and may be constructed of, for example, metal, ceramic,
- microrelay 40 may be constructed using, for example, conventional
- microfabrication techniques conventional microelectronic fabrication techniques, and laminate-based fabrication techniques.
- SMA member 12 is in its martensitic phase, the attractive magnetic force between the
- first magnet 16 and the magnetic material portion 14 biases the SMA member 12 into its
- the member 12 forcefully reverts to its memory shape, as
- the SMA member 12 may be heated by, for example, electrical current flowing through the member 12 or resistive heaters in close proximity to the member 12, as described hereinbefore with respect to Figs. 1-4.
- Fig. 7 is in its parent austenitic phase and in its martensitic phase in Fig. 8. According
- the SMA member 12 is biased by a
- the magnetic material portion 14 may be fabricated as a
- substrates may be bonded together using conventional wafer bonding techniques to form
- Figs. 9 and 10 illustrate another embodiment of a microrelay 40 according to the
- the microrelay 40 illustrated in Figs. 9 and 10 includes a
- microactuator as described with respect to Figs. 5 and 6, having a second magnet 28 such
- the first magnet 16 may be positioned, for example,
- first magnet 16 may be below the second
- magnet 28 may be oriented to aid or oppose the magnetic force of the first magnet 16, as
- the second magnet 28 may be formed on the substrate 42 using, for example, conventional MEMS fabrication techniques, conventional microelectronic fabrication techniques, or laminate-based fabrication techniques.
- Fig. 9 is in its parent austenitic phase and in its martensitic phase in Fig. 10.
- the SMA member 12 is biased
- an upper moving contact 52 is provided on the upper surface of the SMA member 12, and
- the upper moving contact 52 is in contact with the upper fixed contacts 54
- microrelay 40 In another embodiment of the microrelay 40 according to the present invention,
- the SMA member 12 illustrated in Fig. 11 is in its austenitic phase, and in Fig. 12 it is in
- microrelay 40 In other embodiments of the microrelay 40 according to the present invention,
- moving contacts 44 and fixed contacts 46 may be employed such as,
- embodiments of the present invention contemplate the use of various numbers of upper contacts 52, 54, such as, for example, one upper moving contact 52 and one upper fixed contact 54.
- the moving contacts may be integrated with the SMA member 12.
- the present invention is also directed to a microvalve 60 employing a
- FIGs. 13 and 14 illustrate a microvalve 60 in the "CLOSED" and "OPEN"
- the microvalve 60 is formed on the substrate 42.
- the microvalve 60 is formed on the substrate 42.
- 60 includes a number of ports 62, 63 defining openings in the substrate through which
- gas or fluid may enter and exit the microvalve 60.
- the illustrated embodiment gas or fluid may enter and exit the microvalve 60.
- fluid or gas may enter the microvalve 60 through opening 62 and exit via
- the openings 62 and 63 may be formed using, for example, conventional
- MEMS fabrication techniques including, for example, anisotropic etching of a silicon
- the microvalve 60 may further include a seal 64, to better prevent gases and fluids from
- the seal 64 may be constructed of, for
- the first magnet 16 may be metal or polymer such as, for example, polyimide.
- the first magnet 16 may be any suitable material such as, for example, metal or polymer such as, for example, polyimide.
- a ring of permanent magnet material around the opening 62 include, for example, a ring of permanent magnet material around the opening 62, as
- the first magnet 16 comprises a number of small bar
- the microvalve 60 may be formed on the
- the first magnet 16 biases the SMA member 12 to its deformed state, thereby causing the SMA member 12 to engage the seal 64 and
- the fluid flow is too great when the valve is in the open position, the fluid may cool the
- the SMA member 12 is biased by a repulsive force between the
- the SMA member 12 illustrated in Fig. 13 is in its austenitic phase and in its martensitic
- Figs. 17 and 18 illustrate a microvalve 60 according to another embodiment of the
- microvalve 60 includes one opening 62.
- the SMA member 12 is patterned to include a
- the microvalve 60 illustrated in Figs. 17 and 18 includes four arms 70, although in other embodiments of the present invention a different number of arms 70 may be employed. According to this embodiment, when the SMA member 12 is not engaged with the seal 64, gas may enter the microvalve 60 through the opening 62 and flow, as illustrated by arrow A and A' in Fig. 17, around the
- the first magnet 16 includes a ring of magnetic material
- the first magnet may include,
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Micromachines (AREA)
- Reciprocating, Oscillating Or Vibrating Motors (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU22109/01A AU2210901A (en) | 1999-09-02 | 2000-08-30 | A magnetically-assisted shape memory alloy actuator |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US38927499A | 1999-09-02 | 1999-09-02 | |
US09/389,274 | 1999-09-02 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2001016484A2 true WO2001016484A2 (en) | 2001-03-08 |
WO2001016484A3 WO2001016484A3 (en) | 2002-01-17 |
WO2001016484A9 WO2001016484A9 (en) | 2002-11-14 |
Family
ID=23537578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2000/001729 WO2001016484A2 (en) | 1999-09-02 | 2000-08-30 | A magnetically-assisted shape memory alloy actuator |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2210901A (en) |
WO (1) | WO2001016484A2 (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2828000A1 (en) * | 2001-07-27 | 2003-01-31 | Commissariat Energie Atomique | Microdriver magnetic drive, e.g. for microswitch having fixed/ moving sections and moving magnet attachment zones raising moving magnet attachment zones raising moving magnet when attraction zone active |
WO2003081039A1 (en) * | 2002-03-27 | 2003-10-02 | Forschungszentrum Karlsruhe Gmbh | Actuator for an optical-mechanical scanner and a method using said actuator |
EP1384884A1 (en) * | 2002-07-26 | 2004-01-28 | C.R.F. Società Consortile per Azioni | Electric generator using a shape memory alloy element |
US7186100B2 (en) | 2003-08-14 | 2007-03-06 | Samsung Electronics Co., Ltd. | Variable capacity rotary compressor |
CN101937708A (en) * | 2009-06-29 | 2011-01-05 | 台湾积体电路制造股份有限公司 | Non-volatile memory |
DE102010010801A1 (en) * | 2010-03-09 | 2011-09-15 | Eto Magnetic Gmbh | actuator |
US9897078B2 (en) | 2016-05-24 | 2018-02-20 | The Boeing Company | Bi-directional rotary shape memory alloy element actuator assemblies, and systems and methods including the same |
US10428805B2 (en) | 2016-09-14 | 2019-10-01 | The Boeing Company | Shape memory alloy actuators with heat transfer structures, actuated assemblies including the shape memory alloy actuators, and methods of manufacturing the same |
US10612867B2 (en) | 2018-02-21 | 2020-04-07 | The Boeing Company | Thermal management systems incorporating shape memory alloy actuators and related methods |
US11143170B2 (en) | 2019-06-28 | 2021-10-12 | The Boeing Company | Shape memory alloy lifting tubes and shape memory alloy actuators including the same |
US11168584B2 (en) | 2019-06-28 | 2021-11-09 | The Boeing Company | Thermal management system using shape memory alloy actuator |
US11525438B2 (en) | 2019-06-28 | 2022-12-13 | The Boeing Company | Shape memory alloy actuators and thermal management systems including the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4544988A (en) * | 1983-10-27 | 1985-10-01 | Armada Corporation | Bistable shape memory effect thermal transducers |
US5176544A (en) * | 1989-06-21 | 1993-01-05 | Johnson Service Company | Shape memory actuator smart connector |
US5198066A (en) * | 1989-07-07 | 1993-03-30 | Cederstroem Jan | Mounting of the lids of capsules for solid state integrated circuits |
-
2000
- 2000-08-30 WO PCT/IB2000/001729 patent/WO2001016484A2/en active Application Filing
- 2000-08-30 AU AU22109/01A patent/AU2210901A/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4544988A (en) * | 1983-10-27 | 1985-10-01 | Armada Corporation | Bistable shape memory effect thermal transducers |
US5176544A (en) * | 1989-06-21 | 1993-01-05 | Johnson Service Company | Shape memory actuator smart connector |
US5198066A (en) * | 1989-07-07 | 1993-03-30 | Cederstroem Jan | Mounting of the lids of capsules for solid state integrated circuits |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2828000A1 (en) * | 2001-07-27 | 2003-01-31 | Commissariat Energie Atomique | Microdriver magnetic drive, e.g. for microswitch having fixed/ moving sections and moving magnet attachment zones raising moving magnet attachment zones raising moving magnet when attraction zone active |
WO2003012805A2 (en) * | 2001-07-27 | 2003-02-13 | Commissariat A L'energie Atomique | Mobile-magnet actuator |
WO2003012805A3 (en) * | 2001-07-27 | 2003-10-02 | Commissariat Energie Atomique | Mobile-magnet actuator |
US7106159B2 (en) | 2001-07-27 | 2006-09-12 | Commissariat A L'energie Atomique | Mobile magnet actuator |
WO2003081039A1 (en) * | 2002-03-27 | 2003-10-02 | Forschungszentrum Karlsruhe Gmbh | Actuator for an optical-mechanical scanner and a method using said actuator |
US7142341B2 (en) | 2002-03-27 | 2006-11-28 | Forschungszentrum Karlsruhe Gmbh | Actuator for an optical-mechanical scanner and a method of using the actuator |
EP1384884A1 (en) * | 2002-07-26 | 2004-01-28 | C.R.F. Società Consortile per Azioni | Electric generator using a shape memory alloy element |
US7186100B2 (en) | 2003-08-14 | 2007-03-06 | Samsung Electronics Co., Ltd. | Variable capacity rotary compressor |
CN101937708A (en) * | 2009-06-29 | 2011-01-05 | 台湾积体电路制造股份有限公司 | Non-volatile memory |
DE102010010801B4 (en) * | 2010-03-09 | 2013-02-21 | Eto Magnetic Gmbh | actuator |
DE102010010801A1 (en) * | 2010-03-09 | 2011-09-15 | Eto Magnetic Gmbh | actuator |
US8901786B2 (en) | 2010-03-09 | 2014-12-02 | Eto Magnetic Gmbh | Actuator |
US9897078B2 (en) | 2016-05-24 | 2018-02-20 | The Boeing Company | Bi-directional rotary shape memory alloy element actuator assemblies, and systems and methods including the same |
US10364805B2 (en) | 2016-05-24 | 2019-07-30 | The Boeing Company | Bi-directional rotary shape memory alloy element actuator assemblies, and systems and methods including the same |
US10612529B2 (en) | 2016-05-24 | 2020-04-07 | The Boeing Company | Rotary actuator assemblies and methods including the same |
US10428805B2 (en) | 2016-09-14 | 2019-10-01 | The Boeing Company | Shape memory alloy actuators with heat transfer structures, actuated assemblies including the shape memory alloy actuators, and methods of manufacturing the same |
US10612867B2 (en) | 2018-02-21 | 2020-04-07 | The Boeing Company | Thermal management systems incorporating shape memory alloy actuators and related methods |
US11143170B2 (en) | 2019-06-28 | 2021-10-12 | The Boeing Company | Shape memory alloy lifting tubes and shape memory alloy actuators including the same |
US11168584B2 (en) | 2019-06-28 | 2021-11-09 | The Boeing Company | Thermal management system using shape memory alloy actuator |
US11525438B2 (en) | 2019-06-28 | 2022-12-13 | The Boeing Company | Shape memory alloy actuators and thermal management systems including the same |
Also Published As
Publication number | Publication date |
---|---|
WO2001016484A3 (en) | 2002-01-17 |
WO2001016484A9 (en) | 2002-11-14 |
AU2210901A (en) | 2001-03-26 |
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