WO2001015862A1 - Spindle assembly for force controlled polishing - Google Patents
Spindle assembly for force controlled polishing Download PDFInfo
- Publication number
- WO2001015862A1 WO2001015862A1 PCT/US2000/021843 US0021843W WO0115862A1 WO 2001015862 A1 WO2001015862 A1 WO 2001015862A1 US 0021843 W US0021843 W US 0021843W WO 0115862 A1 WO0115862 A1 WO 0115862A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- spindle
- force
- producing device
- feedback loop
- force producing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/044—Grinding spindles with magnetic or electromagnetic bearings; Features related thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/19—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
- G05B19/39—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path using a combination of the means covered by at least two of the preceding sub-groups G05B19/21, G05B19/27, and G05B19/33
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE60007642T DE60007642T2 (en) | 1999-08-30 | 2000-08-11 | SPINDLE ARRANGEMENT FOR POLISHING DEVICE |
EP00955424A EP1207981B1 (en) | 1999-08-30 | 2000-08-11 | Spindle assembly for force controlled polishing |
JP2001520259A JP4484413B2 (en) | 1999-08-30 | 2000-08-11 | Spindle assembly for force controlled polishing |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/385,769 | 1999-08-30 | ||
US09/385,769 US6083082A (en) | 1999-08-30 | 1999-08-30 | Spindle assembly for force controlled polishing |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001015862A1 true WO2001015862A1 (en) | 2001-03-08 |
Family
ID=23522802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/021843 WO2001015862A1 (en) | 1999-08-30 | 2000-08-11 | Spindle assembly for force controlled polishing |
Country Status (7)
Country | Link |
---|---|
US (1) | US6083082A (en) |
EP (1) | EP1207981B1 (en) |
JP (1) | JP4484413B2 (en) |
KR (1) | KR100717477B1 (en) |
DE (1) | DE60007642T2 (en) |
TW (1) | TW480207B (en) |
WO (1) | WO2001015862A1 (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6705930B2 (en) | 2000-01-28 | 2004-03-16 | Lam Research Corporation | System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques |
US6340326B1 (en) | 2000-01-28 | 2002-01-22 | Lam Research Corporation | System and method for controlled polishing and planarization of semiconductor wafers |
US6646364B1 (en) * | 2000-07-11 | 2003-11-11 | Honeywell International Inc. | MEMS actuator with lower power consumption and lower cost simplified fabrication |
US6755723B1 (en) | 2000-09-29 | 2004-06-29 | Lam Research Corporation | Polishing head assembly |
US20030154923A1 (en) * | 2002-02-19 | 2003-08-21 | Innovative Technology Licensing, Llc | Mechanical translator with ultra low friction ferrofluid bearings |
US7288860B2 (en) * | 2002-02-19 | 2007-10-30 | Teledyne Licensing, Inc. | Magnetic transducer with ferrofluid end bearings |
US6812598B2 (en) | 2002-02-19 | 2004-11-02 | Rockwell Scientific Licensing, Llc | Multiple magnet transducer with differential magnetic strengths |
US6812583B2 (en) | 2002-02-19 | 2004-11-02 | Rockwell Scientific Licensing, Llc | Electrical generator with ferrofluid bearings |
US6768230B2 (en) * | 2002-02-19 | 2004-07-27 | Rockwell Scientific Licensing, Llc | Multiple magnet transducer |
US6766679B1 (en) * | 2002-03-27 | 2004-07-27 | Lam Research Corporation | System and method for spindle drive downforce calibration |
US6798090B2 (en) * | 2002-04-18 | 2004-09-28 | Rockwell Scientific Licensing, Llc | Electrical power generation by coupled magnets |
US6935938B1 (en) | 2004-03-31 | 2005-08-30 | Lam Research Corporation | Multiple-conditioning member device for chemical mechanical planarization conditioning |
US7040955B1 (en) * | 2005-01-28 | 2006-05-09 | Strasbaugh | Chemical-mechanical planarization tool force calibration method and system |
JP2008246628A (en) * | 2007-03-30 | 2008-10-16 | Disco Abrasive Syst Ltd | Chuck table mechanism |
JP4327880B2 (en) * | 2008-01-04 | 2009-09-09 | ファナック株式会社 | Servo motor controller with automatic gain adjustment function |
JP5306065B2 (en) * | 2009-06-04 | 2013-10-02 | 株式会社荏原製作所 | Dressing apparatus and dressing method |
US8408082B2 (en) * | 2009-11-18 | 2013-04-02 | General Electric Company | Apparatus to measure fluids in a conduit |
JP5895154B2 (en) * | 2011-01-21 | 2016-03-30 | パナソニックIpマネジメント株式会社 | Driving method of linear actuator |
US8550876B2 (en) | 2011-08-08 | 2013-10-08 | Apple Inc. | Force-controlled surface finishing through the use of a passive magnetic constant-force device |
CN103586772B (en) * | 2012-08-16 | 2016-01-06 | 鸿富锦精密工业(深圳)有限公司 | Pressure-detecting device |
WO2014120082A1 (en) * | 2013-01-30 | 2014-08-07 | Akribis Systems Pte Ltd | A planar positioning system and method of using the same |
CN110315421B (en) * | 2019-08-20 | 2023-12-26 | 江苏集萃精凯高端装备技术有限公司 | Crystal material homogenizing and polishing device and application method |
JP7431589B2 (en) | 2020-01-17 | 2024-02-15 | 株式会社ディスコ | processing equipment |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2153305A (en) * | 1984-01-27 | 1985-08-21 | Secr Defence | Polishing apparatus |
US4771578A (en) * | 1986-04-18 | 1988-09-20 | Struers A/S | Apparatus for the grinding or polishing of workpieces |
JPH01310859A (en) * | 1988-06-09 | 1989-12-14 | Toyoda Mach Works Ltd | Polishing machining device |
EP0517595A1 (en) * | 1991-06-06 | 1992-12-09 | Commissariat A L'energie Atomique | Polishing machine with pressure control |
US5317837A (en) * | 1988-04-07 | 1994-06-07 | Staehli Arthur W | Device on a double disk lapping machine |
EP0827808A2 (en) * | 1996-08-27 | 1998-03-11 | Speedfam Co., Ltd. | Apparatus for applying an urging force to a wafer |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3631634A (en) * | 1970-01-26 | 1972-01-04 | John L Weber | Polishing machine |
US3691694A (en) * | 1970-11-02 | 1972-09-19 | Ibm | Wafer polishing machine |
US3903653A (en) * | 1973-04-11 | 1975-09-09 | Harold J Imhoff | Lapping machine |
DE2451549A1 (en) * | 1974-10-30 | 1976-08-12 | Mueller Georg Kugellager | LOADING AND UNLOADING DEVICE FOR PLATE-SHAPED SEMI-CONDUCTOR MATERIALS |
US4009539A (en) * | 1975-06-16 | 1977-03-01 | Spitfire Tool & Machine Co., Inc. | Lapping machine with vacuum workholder |
US4020600A (en) * | 1976-08-13 | 1977-05-03 | Spitfire Tool & Machine Co., Inc. | Polishing fixture |
US4141180A (en) * | 1977-09-21 | 1979-02-27 | Kayex Corporation | Polishing apparatus |
US4450652A (en) * | 1981-09-04 | 1984-05-29 | Monsanto Company | Temperature control for wafer polishing |
JPS59161262A (en) * | 1983-03-04 | 1984-09-12 | Masanori Kunieda | Magnetic attraction type method for abrasion |
US4593495A (en) * | 1983-11-25 | 1986-06-10 | Toshiba Machine Co., Ltd. | Polishing machine |
DE3479936D1 (en) * | 1983-12-12 | 1989-11-02 | Unisys Corp | Air bearing for moving webs |
US4680893A (en) * | 1985-09-23 | 1987-07-21 | Motorola, Inc. | Apparatus for polishing semiconductor wafers |
US4934102A (en) * | 1988-10-04 | 1990-06-19 | International Business Machines Corporation | System for mechanical planarization |
JP2827540B2 (en) * | 1991-03-11 | 1998-11-25 | 松下電器産業株式会社 | Polishing spindle |
FR2677292B1 (en) * | 1991-06-04 | 1995-12-08 | Seva | POLISHING MACHINE WITH PNEUMATIC REGULATION OF THE EFFORT OF THE TOOL OF THE POLISHING PIECE. |
US5148632A (en) * | 1991-06-14 | 1992-09-22 | Corning Incorporated | Cavity forming in plastic body |
JP3227199B2 (en) * | 1992-05-18 | 2001-11-12 | 株式会社リコー | Waste toner treatment method |
US5658183A (en) * | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
US5456627A (en) * | 1993-12-20 | 1995-10-10 | Westech Systems, Inc. | Conditioner for a polishing pad and method therefor |
US5643044A (en) * | 1994-11-01 | 1997-07-01 | Lund; Douglas E. | Automatic chemical and mechanical polishing system for semiconductor wafers |
US5618447A (en) * | 1996-02-13 | 1997-04-08 | Micron Technology, Inc. | Polishing pad counter meter and method for real-time control of the polishing rate in chemical-mechanical polishing of semiconductor wafers |
-
1999
- 1999-08-30 US US09/385,769 patent/US6083082A/en not_active Expired - Lifetime
-
2000
- 2000-08-11 KR KR1020027002464A patent/KR100717477B1/en not_active IP Right Cessation
- 2000-08-11 DE DE60007642T patent/DE60007642T2/en not_active Expired - Fee Related
- 2000-08-11 EP EP00955424A patent/EP1207981B1/en not_active Expired - Lifetime
- 2000-08-11 WO PCT/US2000/021843 patent/WO2001015862A1/en active IP Right Grant
- 2000-08-11 JP JP2001520259A patent/JP4484413B2/en not_active Expired - Fee Related
- 2000-08-29 TW TW089117518A patent/TW480207B/en not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2153305A (en) * | 1984-01-27 | 1985-08-21 | Secr Defence | Polishing apparatus |
US4771578A (en) * | 1986-04-18 | 1988-09-20 | Struers A/S | Apparatus for the grinding or polishing of workpieces |
US5317837A (en) * | 1988-04-07 | 1994-06-07 | Staehli Arthur W | Device on a double disk lapping machine |
JPH01310859A (en) * | 1988-06-09 | 1989-12-14 | Toyoda Mach Works Ltd | Polishing machining device |
EP0517595A1 (en) * | 1991-06-06 | 1992-12-09 | Commissariat A L'energie Atomique | Polishing machine with pressure control |
EP0827808A2 (en) * | 1996-08-27 | 1998-03-11 | Speedfam Co., Ltd. | Apparatus for applying an urging force to a wafer |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 014, no. 107 (M - 0942) 27 February 1990 (1990-02-27) * |
Also Published As
Publication number | Publication date |
---|---|
DE60007642D1 (en) | 2004-02-12 |
DE60007642T2 (en) | 2004-10-07 |
KR100717477B1 (en) | 2007-05-14 |
EP1207981A1 (en) | 2002-05-29 |
EP1207981B1 (en) | 2004-01-07 |
JP2003508237A (en) | 2003-03-04 |
JP4484413B2 (en) | 2010-06-16 |
TW480207B (en) | 2002-03-21 |
KR20020027583A (en) | 2002-04-13 |
US6083082A (en) | 2000-07-04 |
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