MULTILAYER BARRIER STRUCTURES AND PROCESS FOR PREPARING THE SAME
This invention relates to a multilayer structure, and more particularly to a multilayer structure comprising a layer of a vinylidene chloride polymer.
While a vinylidene chloride polymer film or sheet provides high gas and water barrier properties in packaging materials or other containers, it does not provide such desirable mechanical properties as good abrasion resistance, high tensile strength and high impact strength. One approach in solving this problem is to provide a multilayer structure wherein one layer comprises a vinylidene chloride polymer and another layer comprises a polymer which provides the requisite good mechanical properties in the multilayer structure. Although many types of thermoplastic polymers possess excellent mechanical properties, they do not readily bond to other types of polymers. For example, high density polyethylene, polypropylene and nylon are typical resins used for toughness, but they are incompatible with vinylidene chloride polymer resins and, therefore, film layers made from these resins do not readily bond to the vinylidene chloride polymer layer. It is known that incompatible polymer layers can be joined together by using a tie layer or adhesive layer between the two layers. However, a tie layer can be compatible with one of the two incompatible layers but not with the other layer. For example, a tie layer of EVA (9 percent VA content, 7 melt index) bonds well to an HDPE layer but not to a vinylidene chloride polymer layer. It would be desirable to provide adhesives that work especially effectively for a given combination of incompatible or dissimilar film layers in a multilayer film.
In a first aspect, the present invention is a three-layer barrier structure comprising a first layer comprising a vinylidene chloride polymer (PVDC), a second layer comprising a dissimilar high melting point polymer (HMPP) and a tie layer disposed between the first and second layers, the tie layer comprising an adhesive which bonds well to both the first layer and the second layer and effectively ties the two layers together.
In a second aspect, the present invention is a multilayer structure comprising the three-layer structure of the first aspect and other polymer layers added to the three-layer structure. Such other polymers include polyolefins, polyamides, polymers based on aromatic monomers, and chlorinated polyolefins.
In a third aspect, the present invention is a process for preparing the multilayer structure of the first aspect comprising providing a first layer comprising a vinylidene chloride polymer (PVDC), adhering to the first layer a second layer comprising a dissimilar high melting point polymer (HMPP) by using a tie layer comprising an adhesive which bonds well to both the first layer and the second layer and effectively ties the two layers together.
In a fourth aspect, the present invention is a process for preparing the multilayer structure of the first aspect comprising coextruding a first layer comprising a vinylidene chloride polymer (PVDC), a second layer comprising a dissimilar high melting point polymer (HMPP) and a tie layer disposed between the first and second layers, the tie layer comprising an adhesive which bonds well to both the first layer and the second layer and effectively ties the two layers together.
The multilayer structures of the present invention are particularly suited for fabrication into flexible and rigid containers used for the preservation of food, drink, medicine and other perishables. Such containers should have good mechanical properties, as well as low gas permeabilities too, for example, oxygen, carbon dioxide, water vapor, odor bodies or flavor bodies, hydrocarbons or agricultural chemicals.
Adhesives which can be employed in the practice of the present invention for preparing the multilayer structures include, in general, ethylene vinyl acetate copolymers, ethylene/ethyl acrylic acid ester copolymers, ionomers, modified polyolefins as described in U.S. Patent 5,443,874, acrylic-based terpolymer adhesives as described in U.S. Patent 3,753,769 and adhesives formed by reacting an epoxy resin and an acidified aminoethylated vinyl polymer as described in U.S. Patent 4,447,494.
More specifically, if it is desired to prepare a three-layer structure having a first layer of a vinylidene chloride polymer tied to a second layer of a high density polyethylene, the adhesives which can be employed in the practice of the present invention to effectively tie the two layers together include (1) an ethylene vinyl acetate copolymer (EVA) having a vinyl acetate content of from 9 to 28 weight percent and a melt index of from 2 to 8; (2) an ethylene acrylic ester copolymer having an acrylic ester content of from 23 to 30 weight percent and a melt index of from 6 to 8; (3) an ethylene methyl acrylate having a methyl acrylate content of 24 weight percent and a melt index of 10; (4) an anhydride- modified ethylene vinyl acetate copolymer having a melt index of from 4.5 to 5; (5) a blend of from 60 to 70 weight percent ethylene vinyl acetate copolymer having a vinyl acetate content
WO 01/12436 PCT/US0O/2O2O5
of 28 weight percent and a melt index of from 6 to 7 and from 30 to 40 weight percent polypropylene copolymer having a melt flow ratio of 6.5; and (6) a blend of 50 weight percent anhydride-modified ethylene n-butyl acrylate having an n-butyl content of 17.7 weight percent, an anhydride content of 3.1 weight percent, an acid index of 19, and a melt index of 5, and 50 weight percent ethylene acrylic ester having an acrylic ester content of from 26 to 30 weight percent and a melt index of 7.
If it is desired to prepare a three-layer structure having a layer of a vinylidene chloride polymer tied to a layer of a polypropylene or polypropylene copolymer, the adhesives which can be employed to effectively tie the two layers together include (1) an ethylene vinyl acetate copolymer (EVA) having a vinyl acetate content of from 9 to 28 weight percent and a melt index of from 2 to 8; (2) an ethylene acrylic ester copolymer having an acrylic ester content of from 12 to 30 weight percent and a melt index of from 6 to 8; (3) an ethylene methyl acrylate having a methyl acrylate content of 24 weight percent and a melt index of 10; (4) an anhydride-modified ethylene vinyl acetate copolymer having a melt index of from 2 to 5.7; (5) a blend of from 50 to 70 weight percent ethylene vinyl acetate copolymer having a vinyl acetate content of 28 weight percent and a melt index of from 6 to 7 and from 30 to 50 weight percent polypropylene copolymer having a melt flow ratio of 6.5; (6) a blend of 50 weight percent anhydride-modified ethylene n-butyl acrylate having an n-butyl content of 17.7 weight percent, an anhydride content of 3.1 weight percent, an acid index of 19 and a melt index of 5, and 50 weight percent ethylene acrylic ester having an acrylic ester content of from 26 to 30 weight percent and a melt index of 7; and (7) a blend of 50 weight percent anhydride-modified polypropylene having a melt index of 4, and 50 weight percent anhydride-modified ethylene vinyl acetate copolymer having a melt index of 3.7 to 4.6.
If it is desired to prepare a three-layer structure having a layer of a vinylidene chloride polymer tied to a layer of a high melting point polyamide, the adhesives which can be employed in the practice of the present invention to effectively tie the two layers together include (1) a thermoplastic polyurethane; (2) an anhydride-modified ethylene vinyl acetate copolymer having a melt index of from 4.5 to 5; (3) a blend of 50 weight percent ethylene vinyl acetate copolymer having a vinyl acetate content of 28 weight percent and a melt index of 6, and 50 weight percent ethylene acrylic acid having an acrylic acid content of 6 weight percent and a melt index of 5.5; (4) a blend of 50 weight percent anhydride-modified ethylene n-butyl acrylate having an n-butyl content of 17.7 weight percent, an anhydride content of 3.1 weight percent, an acid index of 19 and a melt index of 5 and 50 weight percent ethylene acrylic ester having an acrylic ester content of from 26 to 30 weight percent
and a melt index of 7; (5) a blend of from 30 to 40 weight percent ethylene acrylic acid having an acrylic acid content of 6 weight percent and a melt index of 7 and from 60 to 70 weight percent anhydride-modified EVA having a melt index of 5.7; (6) a blend of 50 weight percent anhydride-modified ethylene n-butyl acrylate having an n-butyl content of 17.7 weight percent, an anhydride content of 3.1 weight percent, an acid index of 19 and a melt index of 5, and 50 weight percent ethylene acrylic ester having an acrylic ester content of from 26 to 30 weight percent and a melt index of 7; (7) an ethylene vinyl acetate carbon monoxide terpolymer; (8) a blend of from 40 to 70 weight percent EVA having a vinyl acetate content of 28 weight percent and a melt index of 7, and 30 to 60 weight percent ethylene acrylic acid having an acrylic acid content of 6.5 weight percent and a melt index of 5.5; and (9) a blend of 50 weight percent anhydride-modified polypropylene having a melt index of 4, and 50 weight percent anhydride-modified ethylene vinyl acetate copolymer having a melt index of 3.7 to 4.6.
For the purposes of the present invention, an adhesive is considered to bond well to a polymer layer if it has a peel strength of at least 1.5 pounds per inch, as determined by a 90 degree peel technique. The 90 degree peel technique comprises coextruding a 0.003 to 0.004-inch tie layer onto a one-inch PVDC film which is approximately 0.055 to 0.080 inches thick and then pulling the tie layer at a 90 degree angle and at a speed of 10 inches/minute away from the PVDC film. The force needed to pull the tie layer away from the PVDC film is recorded as the peel strength of the tie layer in pounds per inch. For the purposes of the present invention, two polymer layers are considered "effectively tied together" if they do not delaminate or readily separate during processing or shipping and handling of the multilayer structure.
As used herein, the term "dissimilar high melting point polymer" refers to polymers which are not chemically similar or identical to polyvinylidene chloride polymers or copolymers and have a melting point of at least 380°C.
As used herein, the term "barrier polymer" refers to polymers displaying the ability to restrict the passage of gases, such as oxygen, carbon dioxide or moisture vapors. A polymer is considered to be a good oxygen barrier if its oxygen transmission rate is below 70 cc/m7mil thickness/per 24 hours/atm, as measured according to the procedures of ASTM
Method D-1434. As used herein, the term "vinylidene chloride polymer" encompasses homopolymers of vinylidene chloride and also copolymers, and terpolymers thereof, wherein the major component is vinylidene chloride and the remainder is one or more monoethylenically unsaturated comonomer copolymerizable therewith.
Monoethylenically unsaturated monomers which can be employed in the practice of the present invention for preparing the vinylidene chloride polymers and vinyl chloride polymers include vinyl chloride, vinylidene chloride, alkyl acrylates, alkyl methacrylates, acrylic acid, methacrylic acid, itaconic acid, acrylonitrile, and methacrylonitrile. Preferred monoethylenically unsaturated monomers include acrylonitrile, methacrylonitrile, alkyl acrylates, and alkyl methacrylates. More preferred monoethylenically unsaturated monomers include acrylonitrile, methacrylonitrile, and the alkyl acrylates and alkyl methacrylates having from 1 to 8 carbon atoms per alkyl group. Most preferably, the alkyl acrylates and alkyl methacrylates are methyl acrylates, ethyl acrylates, and methyl methacrylates. The most preferred monoethylenically unsaturated monomer is methyl acrylate.
Most preferred vinylidene chloride polymers include polymers formed from 91 to 94 weight percent vinylidene chloride and from 6 to 9 weight percent of methyl acrylate and polymers formed from 80 to 85 weight percent vinylidene chloride and from 15 to 20 weight percent vinyl chloride.
Vinylidene chloride polymers are known and are commercially available. Processes for preparing them, such as by emulsion or suspension polymerization process, are also familiar to persons of ordinary skill in the art. See, for example, U.S. Patents 2,558,728; 3,007,903 and 3,879,359 In general, the high density polyethylene (HDPE) which can be employed in the practice of the present invention for preparing the three-layer structure has a density of at least about 0.94 grams per cubic centimeter (g/cc) (ASTM Test Method D-1505). HDPE is commonly produced using techniques similar to the preparation of linear low density polyethylenes. Such techniques are described in U.S. Patents 2,825,721 ; 2,993,876; 3,250,825 and 4,204,050. The preferred HDPE employed in the practice of the present invention has a density of from 0.94 to 0.99 g/cc and a melt index of from 0.01 to 35 grams per 10 minutes as determined by ASTM Test Method
D-1238.
Polyamides which can be employed in the practice of the present invention for preparing the three-layer structure include the various grades of nylon having a melting point of at least 380°F, such as nylon 6, nylon 6/66. Nylon 6 and nylon 6/66 are commercially available from BASF as ULTRAMID™ B 36 and ULTRAMID™ C 35, respectively. Cast extrusion grade nylon 6 (lower viscosity) and blown extrusion grade nylon 6 (higher viscosity)
are commercially available from Allied Signal as CAPRON™ B73WP and CAPRON™ B 135 WP, respectively.
Polypropylenes which can be employed in the practice of the present invention for preparing the three-layer structure have a melt flow of from 0.5 to 10 g/10 minutes (as determined in accordance with ASTM D1238).
Polypropylene copolymers which can be employed in the practice of the present invention for preparing the three-layer structure have a melt flow of from 0.5 to 10 g/10 minutes (as determined in accordance with ASTM D1238). Propylene copolymers having a melt index of 6.5 are commercially available from Montell as PROFAX™ SA-861. Ethylene vinyl acetate copolymers (EVA) having a vinyl acetate content of from 18 to 28 weight percent and a melt index of from 6 to 8 are commercially available from E.I. du Pont de Nemours & Co. as ELVAX™ 3174 and ELVAX™ 3175LG.
Ethylene acrylic ester copolymers having an acrylic ester content of from 23 to 30 weight percent and a melt index of from 6 to 8 are commercially available from Elf Atochem as LOTRYL™ 24 MA07 and LOTRYL™ 28 MA07.
Ethylene methyl acrylates having a methyl acrylate content of 24 weight percent and a melt index of 10 are commercially available from Chevron as EMAC™ SP.
Anhydride-grafted EVAs having a melt index of 3.7 are commercially available from Elf Atochem as OREVAC™ 18211. Anhydride-modified ethylene vinyl acetate copolymers having a melt index of from 4.5 to 5.7 are commercially available from Equistar as PLEXAR™ 5298 and from E.I. du Pont de Nemours & Co as BYNEL™ CXA 3860.
Anhydride-modified ethylene n-butyl acrylates having an n-butyl content of 17.7 weight percent, an anhydride content of 3.1 weight percent, an acid index of 19 and a melt index of 5 are commercially available from Elf Atochem as LOTADER™ 3410.
Ethylene vinyl acetate carbon monoxide terpolymers having a melt index of 7.5 are commercially available from E.I. du Pont de Nemours & Co as ELVALOY™ HP-441.
Anhydride-modified polypropylenes having a melt index of 4 are commercially available from Elf Atochem as OREVAC™ 18707.
Ethylene acrylic acids having an acrylic acid content of 6 percent by weight and a melt index of 5.5 are commercially available from The Dow Chemical Company as PRIMACOR™ 3330.
Thermoplastic polyurethanes which can be employed as an adhesive in the practice of the present invention for preparing the three-layer structure are soft thermoplastic polyurethanes having low melting points and are commercially available from B.F. Goodrich as ESTANE™ 58224.
Although the multilayer structures described above have only three layers which are the vinylidene chloride polymer (PVDC) layer (first layer), the dissimilar high melting point polymer layer (second layer) and the tie layer (third layer) which ties the first and second layers together, additional layers formed from other polymers can be included in the three-layer structure, with or without the use of an adhesive, to form a multilayer structure having more than three layers. For example, a five-layer structure can be formed by adding a polymer layer (Layer 4) on top of the first layer and another polymer layer (Layer 5) on top of the second layer, with or without an adhesive layer, and a six- or a seven-layer structure can be formed by further adding another polymer layer (Layer 6) on top of the fourth layer and/or another polymer layer (Layer 7) on top of the fifth layer. Layers 4, 5, 6 and 7 can be formed from the same or different polymers. Such polymers can be polyolefins, polyamides, polymers based on aromatic monomers, and chlorinated polyolefins. Thus, the multilayer structures of the present invention can have the following configurations:
Three-laver structure:
PVDC/Tie Layer/High Melting Point Polymer (HMPP)
Five-layer structure: Layer 4/PVDC/Tie laver/HMPP/Laver 5
Six-laver structure:
Layer 6/Layer 4/PVDC/Tie layer/HMPP/Layer 5
Seven-layer structure:
Layer 6/Layer 4/PVDC/Tie layer/HMPP/Layer 5/Layer 7
Polyolefins which can be employed in the practice of the present invention for forming the fourth, fifth, sixth and/or seventh layer of the multilayer structure of the present invention include, for example, low density polyethylene, linear low density polyethylene, very low density polyethylene, polypropylene (PP), polybutene, ethylene/vinyl acetate copolymers, ethylene/propylene copolymers, ethylene/butene-1 copolymers and polyethylene terephthalates and copolymers thereof.
Polyolefins based on aromatic monomers which can be employed in the practice of the present invention for forming the fourth, fifth, sixth and/or seventh layer of the multilayer structure of the present invention include polystyrene, polymethylstyrene, polyethylstyrene, styrene/methylstyrene copolymer, and styrene/chlorostyrene copolymer.
Polyamides which can be employed in the practice of the present invention for forming the fourth, fifth, sixth and/or seventh layer of the multilayer structure of the present invention include the various grades of nylons described previously and also those having a melting point below about 320°F (160°C), such as nylon 6/12 copolymer having about 60 weight percent nylon 6 and 40 weight percent nylon 12 and a melting point of 135°C to 145°C.
The thickness of the multilayer structures of the present invention is variable within wide limits, depending on the contemplated application. In general, the multilayer structure of the present invention has a thickness of from 0.05 to 200 mils, preferably from 1 to 100 mils, most preferably, from 2 to 80 mils, with the PVDC polymer layer having a thickness of from 0.005 to 20 mils, preferably from 0.1 to 10 mils, most preferably, from 0.2 to 1.0 mils.
The multilayer structures of the present invention can be formed using conventional coextrusion techniques such as blown coextrusion, feedblock coextrusion, multimanifold die coextrusion, or combinations of the two; co-injection molding; extrusion molding; casting; blowing; blow molding; and laminating.
The multilayer structures of the present invention are particularly suited for fabrication into rigid and flexible containers used for the preservation of food, drink, medicine and other perishables. Such containers should have good mechanical properties, as well as low gas permeabilities to, for example, oxygen, carbon dioxide, water vapor, odor bodies or flavor bodies, hydrocarbons or agricultural chemicals.
The present invention is illustrated in further detail by the following examples. The examples are for the purposes of illustration only, and are not to be construed as limiting
the scope of the present invention. All parts and percentages are by weight unless otherwise specifically noted.
Example 1
A tie layer (EVA 28 percent, Ml 6), approximately 0.055 to 0.08 inch thick, was coextruded onto a one-inch wide SARAN polymer layer. The process was repeated by coextruding the tie layer onto a layer of nylon 6, a high melting point polymer. The peel strengths of the tie layer to both SARAN and nylon layers were then tested by a 90 degree peel technique. The results of the test are shown in Table I.
Example 2 The procedure of Example 1 was followed except that the tie layer described in Example 1 was coextruded onto a layer of HDPE 4452, a high density polyethylene having a melt index of 8 and manufactured by The Dow Chemical Company. The peel strengths of the tie layer to both SARAN and HDPE layers were then tested by a 90 degree peel technique. The results of the test are shown in Table I. Example 3
Several tie layers were individually coextruded with a SARAN layer. The process was repeated by individually coextruding each tie layer with a high melting point polymer, such as a polyamide, polypropylene or propylene copolymer and a high density polyethylene. The peel strengths of the tie layers are shown in Table I. A peel strength of less than 2 pounds per inch is considered inadequate to bond the tie layer to each of the two layers. The tie layers and the high melting point polymers are described in Table I.
The processing conditions used in the above Examples are shown in Tables II and III. The materials used in the Examples are described in Table IV.
Table I
Table
Table IV