WO2001006561A3 - Ferroelectric memory capacitor - Google Patents
Ferroelectric memory capacitor Download PDFInfo
- Publication number
- WO2001006561A3 WO2001006561A3 PCT/DE2000/002184 DE0002184W WO0106561A3 WO 2001006561 A3 WO2001006561 A3 WO 2001006561A3 DE 0002184 W DE0002184 W DE 0002184W WO 0106561 A3 WO0106561 A3 WO 0106561A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- memory capacitor
- ferroelectric memory
- dielectric
- iridium
- ruthenium
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/75—Electrodes comprising two or more layers, e.g. comprising a barrier layer and a metal layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/55—Capacitors with a dielectric comprising a perovskite structure material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
Abstract
The invention relates to a memory capacitor for use in DRAM memories which has electrodes consisting of ruthenium (Ru), ruthenium dioxide (RuO2), iridium (Ir) or iridium dioxide (IrO2) and a dielectric consisting of barium strontium titanate (BST). In order to obtain the smallest possible leakage currents, the dielectric is coated on both sides with the finest possible platinum (Pt) coating. This memory capacitor structure is easily configured by conventional etching processes, such as reactive ionic etching (RIE).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19932844.7 | 1999-07-14 | ||
DE19932844A DE19932844A1 (en) | 1999-07-14 | 1999-07-14 | Storage capacitor |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001006561A2 WO2001006561A2 (en) | 2001-01-25 |
WO2001006561A3 true WO2001006561A3 (en) | 2001-05-17 |
Family
ID=7914712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2000/002184 WO2001006561A2 (en) | 1999-07-14 | 2000-07-04 | Ferroelectric memory capacitor |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE19932844A1 (en) |
WO (1) | WO2001006561A2 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5619393A (en) * | 1994-08-01 | 1997-04-08 | Texas Instruments Incorporated | High-dielectric-constant material electrodes comprising thin ruthenium dioxide layers |
US5824563A (en) * | 1995-05-29 | 1998-10-20 | Samsung Electronics Co., Ltd. | Method for forming lower electrode of capacitor |
US5905278A (en) * | 1996-12-11 | 1999-05-18 | Fujitsu Limited | Semiconductor device having a dielectric film and a fabrication process thereof |
-
1999
- 1999-07-14 DE DE19932844A patent/DE19932844A1/en not_active Ceased
-
2000
- 2000-07-04 WO PCT/DE2000/002184 patent/WO2001006561A2/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5619393A (en) * | 1994-08-01 | 1997-04-08 | Texas Instruments Incorporated | High-dielectric-constant material electrodes comprising thin ruthenium dioxide layers |
US5824563A (en) * | 1995-05-29 | 1998-10-20 | Samsung Electronics Co., Ltd. | Method for forming lower electrode of capacitor |
US5905278A (en) * | 1996-12-11 | 1999-05-18 | Fujitsu Limited | Semiconductor device having a dielectric film and a fabrication process thereof |
Also Published As
Publication number | Publication date |
---|---|
DE19932844A1 (en) | 2001-01-25 |
WO2001006561A2 (en) | 2001-01-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR0147640B1 (en) | Capacitor of semiconductor device & its fabrication method | |
KR960026808A (en) | Pin type capacitors and manufacturing method thereof | |
CA2158165A1 (en) | Hybrid wet-slug and electrochemical electrode capacitor | |
JP2001501375A (en) | Semiconductor device having a protective barrier against staple cells | |
US5861332A (en) | Method for fabricating capacitors of semiconductor devices | |
EP1298730A3 (en) | Ferroelectric memory and method for fabricating the same | |
US6476433B1 (en) | Semiconductor interconnection structure and method | |
WO2001006561A3 (en) | Ferroelectric memory capacitor | |
KR960009189A (en) | Ferroelectric Capacitor Manufacturing Method | |
KR100471163B1 (en) | Methods of forming a semiconductor device having capacitors | |
US6596580B2 (en) | Recess Pt structure for high k stacked capacitor in DRAM and FRAM, and the method to form this structure | |
KR100200753B1 (en) | Ferroelectric capacitor of semiconductor device and manufacturing method thereof | |
US6420267B1 (en) | Method for forming an integrated barrier/plug for a stacked capacitor | |
JPH07235639A (en) | Semiconductor device | |
KR100431744B1 (en) | Method of fabricating capacitor in semiconductor device | |
KR970054183A (en) | Manufacturing method of FRAM cell | |
US6218231B1 (en) | Methods for fabricating high dielectric capacitors of semiconductor devices | |
KR100362198B1 (en) | A method of forming ferroelectric capacitor in semiconductor device | |
Fukushima | Conductive Oxide Electrodes for LSI Memory Capacitors | |
KR100493008B1 (en) | Semiconductor memory device having an electrode formed of conductive oxide | |
KR20030028044A (en) | Ferroelectric memory device and method of fabricating the same | |
KR19990086181A (en) | Capacitor of Semiconductor Device and Manufacturing Method Thereof | |
KR19980077149A (en) | Capacitor of Ferroelectric Memory with Multi-layered Electrode Structure and Manufacturing Method Thereof | |
KR970060494A (en) | Capacitor structure | |
KR19980029365A (en) | Method of manufacturing ferroelectric capacitor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): JP US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
AK | Designated states |
Kind code of ref document: A3 Designated state(s): JP US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
122 | Ep: pct application non-entry in european phase | ||
NENP | Non-entry into the national phase |
Ref country code: JP |