WO2001001517A1

WO2001001517A1 - Phased-array antenna

Info

Publication number: WO2001001517A1
Application number: PCT/JP2000/003727
Authority: WO
Inventors: Tsunehisa Marumoto; Ryuichi Iwata; Youichi Ara; Hideki Kusamitsu; Kenichiro Suzuki
Original assignee: Nec Corporation
Priority date: 1999-06-25
Filing date: 2000-06-08
Publication date: 2001-01-04
Also published as: JP2001007628A; TW480775B

Abstract

A phased-array antenna comprises a plurality of radiating elements, a plurality of modules (110) including phase units for changing the phase of a high-frequency signal to be fed to the radiation elements according to a control signal, and a first substrate (120) that holds the modules uniformly arranged on its surface and supplies a high-frequency signal to the modules. This structure facilitates the manufacture of phased-array antennas.

Description

Phase Technical Field

The present invention relates to a phased array antenna for transmitting high-frequency signals, such as a phased antenna used for transmitting and receiving high-frequency signals such as microwaves.

Akira Background technology

book

Hitherto, for example, a phased array antenna used for a satellite tracking on-vehicle antenna or a satellite-mounted antenna and having a large number of radiating elements has been proposed (for example, IEICE Technical Report AP 90-7). 5 ゃ See JP-A-1-290301, etc.).

This type of phased array antenna has a function of arbitrarily changing the direction of a beam by changing the phase fed to each radiating element.

A digital phase shifter composed of a plurality of phase shift circuits, each having a fixed and different phase shift amount, is generally used as a means for changing the phase to be fed (hereinafter, a digital phase shifter is referred to as a digital phase shifter). Simply called a phase shifter).

In a phased array antenna, each of these phase shift circuits is turned on / off by a 1-bit digital control signal, and the phase shift amounts of the respective phase shift circuits are combined to form the entire phase shifter. Thus, a feed phase of 0 to 360 ° can be obtained.

In particular, in the conventional phased array antenna, as a switching element in each phase shift circuit, a semiconductor element such as a PIN diode and a GaAs FET, and a large number of drive circuit components for driving these elements are used. Then, the phase shifter applies a DC current or DC voltage to these switching elements to turn on and off, and changes a transmission path length, a susceptance, a reflection coefficient, and the like to generate a predetermined phase shift amount. It has a configuration. On the other hand, in recent years, in the field of low-Earth-orbit satellite communications, expansion of the use of the Internet and the spread of multimedia communications have demanded communication at high data rates. It has become. In addition, transmission bandwidth must be increased in order to achieve communication at high data rates. In addition, due to the lack of frequency resources in low frequency bands, Ka-band (20 GHz or higher) The realization of an antenna that can be applied in is urgent.

Specifically, as an antenna for a low earth orbit satellite tracking terminal (ground station), for example, frequency: 3 OGHz,

Antenna gain: 36 dBi,

Beam scanning range: Beam tilt angle 50 ° from the front

Technical performance is required.

To realize this with a phased array antenna, an aperture area of about 0.13 m ² (36 OmmX 36 Omm) is first required. Furthermore, in order to suppress sidelobes, radiating elements must be arranged at intervals of about 1Z2 wavelength (approximately 5mm at 3OGHz) to avoid grating aperture.

In order to make the beam scanning step finer and to suppress the side lobe degradation due to the quantization error of the digital phase shifter, the phase shift circuit used for each phase shifter must have 4 bits (minimum bit shift). Phaser 22.5 °)

The total number of radiating elements and the number of phase shift circuit bits used for the phased array antenna satisfying the above conditions are

Number of phase shift circuit elements: 72 X 72 = about 5000

Number of phase shift circuit bits: 7 2 X 7 2 X 4 = about 20000 bits

Becomes

Here, a phased array antenna having such a high gain and applicable to a high frequency band will be realized by the above-described conventional technique, for example, the phased array antenna described in Japanese Patent Application Laid-Open No. 1-1290301 shown in FIG. However, there were the following problems.

In other words, in such a conventional phased array antenna, as shown in FIG. 19, a single driver circuit formed on a drive circuit board is used to separate individual phase shifters in each phase shifter. Since the circuit is configured to be controlled, it is necessary to connect this driver circuit and all phase shift circuits individually. Therefore, the number of wires required for the connection is equal to the number of radiating elements x the number of bits of the phase shift circuit.If the above-mentioned numerical values are applied, in the array arrangement of 72 radiating elements x 7 2 The number of wires to each phase shift circuit (4 bits) of (two radiating elements) is 72 x 4 = 288.

When such wirings are formed on the same plane, the width of the wiring bundle for one row (for seven radiating elements) is equal to that of the wiring width Z wiring spacing (L / S) = 550 μππι. 0. 1 mm X 2 8 8 = 2 8. the S mm _c

On the other hand, as described above, in a phased array antenna applicable to a frequency of 3 OGHz, it is necessary to arrange the radiating elements around 5 mm, but in the conventional technology, as described above, The width of the wiring bundle is 28.8 mm, which is too large to be physically arranged. Here, not only the radiating element ^ formed layer (radiating element substrate or parasitic element substrate), but also If the phase shifter and the phase shifter are formed in different layers, only the phase shifters can be arranged in the layers forming the phase shifter, so that the above-mentioned arrangement problem can be solved. . In this way, by adopting a multilayer structure, a phased antenna that can be applied to a higher frequency band can be realized. In the case of a multi-layer structure, the thickness of each layer is as small as several millimeters, so it does not become too thick and can be made smaller, which is particularly advantageous when mounted on a satellite. .

By the way, as described above, when applied to a frequency of 30 GHz, the layer in which the radiator 2 is formed has a size almost equal to the opening area (36 O mm X 360 mm), even if it has a multilayer structure. Formed on the S plate. For this reason, it is difficult to mount a large number of high-frequency circuits on a large multi-layer substrate, even if the distributor / synthesizer and the phase shifter are on other layers. Especially when the quantity is reduced, the production equipment for mounting the high-frequency circuit on such a large-sized substrate requires a small number of special equipment.

In addition, when a large number of radiators were mounted on a single substrate, the entire radiator was replaced due to a defective radiator, so there was a problem in maintenance.

The present invention has been made in order to solve such a problem. The objective is to provide a phased array antenna with excellent reliability and maintainability, while facilitating the production of teners. Disclosure of the invention

In order to achieve such an object, a phased array antenna according to the present invention includes a plurality of radiating elements and a plurality of phase units in which a phase of a high-frequency signal supplied to these radiating elements is switched based on a control signal. It is characterized by comprising a module and a first substrate on which the modules are uniformly arranged on the upper surface and which supplies a high-frequency signal to the module. By adopting such a configuration, for example, even if a certain radiating element fails, the entire phased array antenna does not fail, but only the module on which the defective radiating element is mounted fails. Become. That is, for example, if the module is replaced, the phased array antenna need not be defective. Thus, according to the present invention, there is an effect that the manufacture of the phased array antenna becomes easier. In the event of a failure, repairs can be performed on a module-by-module basis, so a phased array antenna with excellent reliability and maintainability can be obtained.

In the phased array antenna, the radiating element may be formed in a module together with a corresponding phase unit. At this time, the module may have a multilayer structure in which the radiation element and the phase unit are formed in different layers. Alternatively, the radiating elements may be arranged in a monolithic layer across multiple modules.

Further, the phased array antenna may further include a distribution unit that distributes a high-frequency signal supplied from the first substrate to each phase unit. Here, the distribution means may be formed in a module together with the corresponding phase unit. At this time, the module may have a multilayer structure in which the distribution means and the phase unit are formed in different layers. Alternatively, the distribution means may be formed on the first substrate. At this time, the first substrate may have a multilayer structure.

Further, the above-described phased array antenna is connected to a high-frequency signal line in the first substrate. It may be provided with a coupling means disposed between the phase unit of the module and coupling the high-frequency signal. As a coupling means, a coupling slot can be used.

Further, in the above-described fused array antenna, the modules may be interconnected via interconnecting means formed on the first substrate. For example, a recess is formed in the interconnecting means, and a protrusion is formed in a portion of the module facing the interconnecting means, and the module is interconnected by fitting the protrusion into the recess. Anyway.

Further, in the above-described phased array antenna, the modules are provided with a connection region at an end thereof, and the modules are interconnected via interconnection means arranged over the opposing connection regions between adjacent modules. Is also good. When the interconnecting means is formed of a panel-like conductive member, both ends of the conductive member are connected to connection terminals formed on opposing connection regions between adjacent modules. In the case where the interconnecting means is composed of conductive particles dispersed in an insulating film and wiring crimped on the film, the connection formed on the facing connection area between adjacent modules. Each terminal is connected via conductive particles and wiring.

In the above-described phased array antenna, the module may be detachably disposed on the first substrate.

Further, in the phased array antenna, the phase unit includes a waveguide formed on the second substrate for transmitting a high-frequency signal, and a switch formed on the second substrate for switching a connection state of the waveguide. A configured phase shifter may be included. Here, when the switch included in the phase unit includes a movable portion that switches the connection state of the waveguide, a structure that is disposed on the second substrate and that forms a space above the formation region of the switch may be provided. .

In the phased array antenna, the first substrate may supply a control signal to the phase unit of the module.

The shape of the module is not limited to a square, but may be another polygon. As described above, according to the present invention, since a plurality of modules are used, the conventional manufacturing It can be manufactured using manufacturing equipment. As a result, it can be easily manufactured and has excellent maintainability, since module replacement and handling are simple. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a perspective view showing a configuration of a phased array antenna according to Embodiment 1 of the present invention.

FIG. 2A is a block diagram of the module shown in FIG. 1, and FIG. 2B is a block diagram showing the entire configuration of the phased array antenna according to the first embodiment. FIG. 3 is a perspective view and a sectional view showing a layer configuration of the module shown in FIG. FIG. 4 is a cross-sectional view of the phased array antenna according to the first embodiment. FIG. 5 is a circuit diagram of the phase unit shown in FIG. 2A.

FIG. 6 is a timing chart showing an example of the operation of the phase control unit shown in FIG.

FIG. 7 is a timing chart showing another example of the operation of the phase control unit shown in FIG.

FIG. 8 is a perspective view showing a configuration example of the switch shown in FIG.

FIG. 9 is a plan view showing a state of one cell of the phased array antenna according to the first embodiment.

FIG. 10A is a plan view showing a configuration of the phased array antenna according to Embodiment 1, and FIGS. 10B and 10C are cross-sectional views thereof.

FIGS. 11A and 11B are perspective views showing the configuration of the connection socket shown in FIG. 10C.

FIG. 12A is a block diagram of a module of a phased array antenna according to Embodiment 2 of the present invention, and FIG. 12B is a block diagram showing the entire configuration of the phased array antenna. C is a cross-sectional view of the phased array antenna.

FIG. 13A is a block diagram of a module of a phased array antenna according to Embodiment 3 of the present invention, and FIG. 13B is a block diagram showing an entire configuration of the phased array antenna. 13 C is the phased array antenna It is sectional drawing.

FIG. 14A is a plan view of a module of a phased array antenna according to Embodiment 4 of the present invention, and FIGS. 14B and 14C are cross-sectional views showing a method of connecting the module.

FIG. 15A is a plan view of a module of the phased array antenna according to the fifth embodiment of the present invention, and FIGS. 15B to 15D are plan views showing enlarged adjacent portions of adjacent modules. Yes, Fig. 15E to Fig. 15G are cross-sectional views corresponding to Fig. 15B to Fig. 15D, respectively, and Fig. 15H describes the connection method using an anisotropic conductive film. FIG.

FIG. 16A is a block diagram of a module of a phased array antenna according to Embodiment 6 of the present invention, and FIG. 16B is a block diagram showing an overall configuration of the phased array antenna.

FIG. 17 is a block diagram of the drive unit mounted in the module shown in FIG. 16A.

FIG. 18 is a circuit diagram of the phase unit shown in FIG. 16A.

FIG. 19 is a perspective view showing a simple configuration of a conventional phased array antenna. BEST MODE FOR CARRYING OUT THE INVENTION

An embodiment of the present invention will be described below with reference to the drawings.

Embodiment 1

FIG. 1 is a schematic diagram of a phased array antenna according to a first embodiment of the present invention. In the following, a case where the phased array antenna 1 is used as a transmitting antenna for a high-frequency signal will be described as an example.However, the present invention is not limited to this. It can also be used as an antenna.

In the first embodiment, for example, as shown in FIG. 1, a multi-layer module 110 having 4 × 4 radiating elements is formed on the same plane as a distribution layer 120 serving as a substrate (first substrate). By placing 3 x 3 on the door, a fuse door with 1 2 x 12 radiating elements Rayantena 1 is configured.

The circuit block diagram of the module 110 is shown in FIG. 2A. High-frequency signal is supplied to each 4 X 4 phase units 1 13 a by the 1 1 4 a by the distributing / combining unit (distribution means), and a phase change amount set individually for each phase unit 1 13 a is given. As a result, a high-frequency signal is radiated from the radiating element 111a. Also, in this module 110, control signal lines for setting the phase amount are wired in a grid pattern on each phase unit 113a, and the ends of these signal lines will be described later. Connection pins 715 are provided for connection between modules, or to a signal line selection unit or a scanning line selection unit. Each radiating element 112a is provided with a parasitic element 111a.

Next, the configuration of the phased array antenna 1 will be described. FIG. 2B is a block diagram of the phased array antenna 1. The high-frequency signal supplied from the power supply unit 11 is supplied to each module 110 by the distribution / combination unit 12. Further, connection pins 715 arranged at the ends of the control signal lines are formed around the modules 110, and the control signal lines between the modules are electrically connected by the connection means 21. Connected. In the same way, the module located at the end of the phased array antenna 1 is connected to the scanning line selector 13 that generates control signals, the signal line driver 14 and the signal line terminal of the trigger T rg ′. are doing. By doing so, it becomes possible to give an arbitrary amount of phase to the specific phase unit 113a disposed in each module by the control means described later.

Next, the configuration of the module 110 will be described. FIG. 3 schematically shows the layer configuration of the module 110. First, the parasitic element layer 111 is composed of a dielectric plate 111b on which a predetermined number of parasitic elements 111a are arranged. Similarly, the radiation element layer 112 is composed of a dielectric plate 112b on which a predetermined number of radiation elements 112a are arranged. The phase control layer 113 is composed of a dielectric plate (second substrate) 113 b on which a phase unit 113 a composed of a phase shift circuit, which is a microwave circuit to be described later, is disposed. I have. Further, the distribution / combination layer 114 includes a distribution / combination unit 114a configured to be able to supply power to each of the phase units 113a.

In addition, a coupling slot 201a is formed on the back surface of the dielectric plate 1 1 2b. The slot layer 201 is shaped and configured such that each phase unit 113a on the phase control layer 113 can be coupled to the corresponding radiating element 112a.

Further, a coupling slot layer 202 b having a coupling slot 202 a formed on a dielectric plate 202 b is disposed between the phase control layer 113 and the distribution / combination layer 114. The high frequency signal from the distribution / combination layer 114 is coupled to each phase unit 113a on the phase control layer 113.

Then, the modules 110 are arranged at predetermined intervals on the distribution layer 120 that supplies a high-frequency signal to each module, as shown in the cross-sectional view of FIG. In the distributing / synthesizing layer 120, coupling slots 121 are formed in accordance with the arrangement positions of the modules 110. For example, microstrip lines (high-frequency signal lines) 122 and lines not shown It is configured so that power can be supplied to each module 110 via the power supply. Each of these modules is fixed on the distribution layer 120 by using fixing means such as an adhesive or a screw.

Note that the stacking letters of each layer are not necessarily limited to the form shown in Fig. 4.Electrical: When the stacking order is deleted or added or the stacking order is partially changed due to mechanical requirements. In addition, the present invention is effective.

Next, the configuration of the phase unit 113a mounted in the module 10 will be described. FIG. 5 is a block diagram showing a circuit configuration of the two-phase unit 113a. Each radiating element 1 1 2 ε is provided with a phase shifter 17 and a phase controller 18 for controlling the phase shifter 17. In the following, the phase shifter 17 provided for each radiating element 112a, a part of the stripline connected to this phase shifter 7 and the phase controller 18 are summarized. ίRadio unit 1 1 3a.

Hereinafter, the phase unit 113a provided for each radiating element 112a will be described. In this case, the phase shifts from the four phase shift circuits 17 A to 17 D having different phase shift amounts of 22.5 ° 45 °, 90 °, and 180 °, respectively. The case where the phaser 17 is configured will be described as an example.

Each of the phase shift circuits 17 A to 17 D is connected to a lip line (waveguide) 24 for transmitting a high-frequency signal from the distribution / combination unit 12 to the radiating element 112 a. In particular, each of the phase shift circuits 17A to 17L: 'This has a switch 17S. This By switching each switch in the switch 17S, a predetermined power supply phase shift amount is given as described later.

The phase control unit 18 that individually controls the switches 17S of the phase shift circuits 17A to 17D includes a drive circuit 19A to 19D provided for each of the phase shift circuits 17A to 17D. It is composed of Each of the drive circuits 19A to 19D is provided with two latches 191, 192 connected in series. Among them, the latch 1 9 1, the signal line connected X, scan lines the level of the X _{i 2} is connected to the input C LK Y i ₁ to the input _D; latched at the rising edge of Yj _2. The latch 192 latches the output Q of the latch 191 at the rising edge of the trigger signal Trg 'connected to the input CLK, and outputs the output Q to the corresponding switch 17S of the phase shift circuit. I do. In Figure 5, two signal lines X i 1 for one phase controller 1 8, X i ₂ and 2 Tsunohashi査線Y, and Y _{J 2} provided, four drive circuits 1 9 A to 1 9 D sets ON / OFF data of each switch individually. That is, the signal line Xi, and controls the operation of the phase shift circuits 1 7 Alpha scanning line, Gyoshi control the operation of the phase shift circuit 1 7 B and signal lines in the scanning line Y _{i 2,} and the signal lines Xi ₂ The operation of the phase shift circuit 17 C is controlled by the scanning line Y, and the operation of the phase shift circuit 17 D is controlled by the signal line X _{i 2} and the scanning line Υ ” ₂ .

FIG. 6 is a timing chart showing the operation of these phase control units, and shows a drive circuit 19A corresponding to the phase shift circuit 17A as an example. In FIG. 2B, the signal line driving unit 14 includes a signal line X i! In addition to the signal for the drive circuit 19A as the drive signal applied to the other, the other drive circuits connected to the signal line Xi !, that is, the drive circuit 19B of the same phase controller 18 and other phase controllers Signals for 18 drive circuits are also flowing. Therefore, the signal line X is constantly changing.

On the other hand, the scanning line selection unit 13 supplies the scanning lines Y 1:! Since Y n2 is sequentially selected one by one, a pulse is applied to the scanning line Y j 1 only once during the period T 1 (t l in FIG. 6).

Here, when the scanning line voltage Y j 1 ′ changes to the high level at the time t 1 of the cycle T 1, the state is maintained even after the signal line voltage X i 1 ′ returns to the low level. Then, at time t2, when the trigger signal T rg, changes to the high level, the output Q of the latch 1911 is output from the output Q of the latch 192. _n is, the trigger signal T i: g, but its state is maintained even after returning to the low level.

As a result, the switch 17S of the phase shift circuit 17A is kept on from the moment of t2 until T4 (the moment when the trigger signal Trg 'is added), during which the strip line 24 Is supplied with a feed phase of + 22.5 °. In the subsequent cycle T2, the level of the signal line voltage Xi1 'is held in the latch 191 at the time t3, and is held in the latch 192 at the subsequent time t4. As a result, the switch 17S of the phase shift circuit 17A is maintained in the off state, and the amount of phase shift of the power supply to the high-frequency signal propagating through the stripline 24 is returned to 0 °.

As shown in FIG. 7, the trigger signal T rg ′ may be always kept at a high level. In this case, the latch output Q of the latch 191 is immediately transferred to the latch 192. Output to switch 17S.

In this way, by sequentially switching the switches 17S, instantaneous interruption of the radiation beam due to the switch switching time can be avoided, and stable operation can always be ensured. When the output voltage or current of the latch 192 is not enough to drive the switch 17S, a voltage amplifier or a current amplifier may be provided on the output side of the latch 192.

Next, a configuration example of the switch 17S will be described. The switch shown in Fig. 8 is composed of a micromachine switch that short-circuits / opens striplines (waveguides) 62 and 63 with microcontacts (movable parts) 64. The strip lines 62 and 83 having a thickness of about 1 μm are formed on the substrate (second substrate) 61 with a small gap. On the upper part of the gap, a small contact portion 64 having a thickness of about 2 μm is provided so that the contact member can be freely contacted with and separated from the strip lines 62 and 63. Is indicated by

Here, the distance between the lower surface of the minute contact portion 64 and the upper surfaces of the strip lines 62 and 63 is about 4 μπα, and the upper surface of the contact 64 with reference to the upper surface of the substrate 61 The height of the micromachine switch is about 7 / m.

On the other hand, a conductor electrode 66 having a thickness of about 0.2 μm is formed in the gap between the strip lines 62 and 63 on the substrate 61, and the height (thickness) of this electrode 66 is ) Is lower (thinner) than the height (thickness) of the strip lines 62, 63. The operation of the switch will be described below. The output voltages of the drive circuits 19 A to 19 D, for example, about 10 to 100 V, are individually supplied to the electrodes 66. Here, when a positive output voltage is applied to the electrode 66, an electrostatic load is generated on the surface of the electrode 66, and a negative voltage is applied to the opposing surface of the minute contact portion 64 by electrostatic induction. The load appears, and is attracted to the strip lines 62 and 63 by the attractive force between them. At this time, since the length of contact 64 is longer than the gap between strip lines 62 and 63, contact 64 comes into contact with both strip lines 62 and 63. As a result, for example, a high-frequency signal that has propagated to the strip line 62 is propagated to the strip line 63.

When the application of the output voltage to the electrode 66 is stopped, the attractive force is lost and the support member 65 restores the minute contact portion 64 to the original separated position, and the strip line 62 is removed. The space between the strip lines 63 is opened.

In the above description, the case where the output voltage is applied to the electrode 66 without applying the voltage to the minute contact portion 64 has been described, but the reverse may be applied. In other words, the output voltage of the drive circuit may be applied to the minute contact portion 64 via the support member 65 made of a conductor without applying a voltage to the electrode 66. Is obtained.

In addition, even if the contact 64 has at least the lower surface formed of a conductor and is in intimate contact with the strip lines 62 and 63, the contact thin film is formed by forming an insulating thin film on the lower surface of the conductive member. , 63 and the capacitor may be combined. Here, in the micromachine switch, since the microcontact portion 64 is a movable portion, when the phase control layer 35 is provided in a multilayer substrate like a phased array antenna, the microcontact portion 64 can move freely. It is necessary to provide a comfortable space.

FIG. 9 shows a plan view in the case where the phase unit 113 a is mounted on the phase control layer 113. As described above, the phase unit 113a is configured to be switched by a plurality of switches 302b with microstrip lines (waveguides) 302a having different line lengths. The signal lines X i 1 and X i 2 from the signal line selection unit (not shown), the scanning lines Y j 1 and Y j 2 from the scanning line selection unit (not shown) Trigger signal line T rg from control device (not shown) and drive of switch A dynamic power line V drv is provided.

The switch 302b is driven by a drive circuit (control means) 302c connected to the signal lines. Also, inside these signal lines, the microstrip line 302a is configured to connect from the upper position of the coupling slot 308 to the lower position of the coupling slot 303.

In the middle of the microstrip line 302a, for example, phase shift circuits of 22.5 °, 45 °, 90 °, and 180 ° are formed, and these are switched by the switch 302 It is switched by b so that the phase of the guided high frequency is shifted to the desired value. In addition, a spacer (structure) 313 made of a dielectric material is arranged, and a space is provided on a region where the switch 302b is formed. The spacer 3 13 secures the movable space of the switch 302 b and sets the distance so that the high frequency wave guided through the microstrip line 302 a does not affect the upper layer. Secured.

Next, means for mounting the module 110 on the distribution layer 120 will be described with reference to FIGS. 10A to 10C. As shown in Fig. 10C, the distribution layer 120 has a microstrip line 122 formed on one side, and a ground plane 724 on which the module 110 is mounted on the other side, and a high-frequency signal. A coupling slot 122 for coupling is formed at a predetermined location. The connection pins (protrusions) to which the control signal lines of the module 110 are connected are connected to each other, and the connection sockets are provided at both ends of the connection wires. A recessed portion formed by embedding the substrate forming the distribution layer 120 at a predetermined position is arranged.

Further, as shown in FIG. 10B, the module 110 has connection pins 715 connected to each control signal line mounted on the back surface thereof.

As shown in FIG. 10C, each module 110 is fixed on the board 120 by inserting the connection pins 715 into the connection socket 723. Further, the control signal lines of each module can be electrically connected to each other via the wirings 723a. Here, as shown in FIG. 11A, for example, the connection socket 7 23 may be formed by forming a cantilever panel 8 0 1 a on one side surface of a rectangular parallelepiped conductive member 8 0 1 open at one side. Good. The cantilever panel 800a is formed by deforming a part of one side of the conductive member 8001 inward. It can be formed by applying heat treatment to give it spring properties. Then, if the connection pins 7 15 projecting from the module are press-fitted into the connection sockets 7 2 3 and fitted, the panel portion of the socket comes into pressure contact with the side surfaces of the connection pins by its own spring force. An electrically connected state is obtained.

Further, for example, as shown in FIG. 11B, a slot portion 800a is formed at the open portion of the cylindrical conductive member 8002 having one open side, and the slot portion 800a is formed inside. It may be configured to have a paneling property by applying a heat treatment. Also when using this connection socket 7 23, if the connection pin 7 15 protruding from the module 110 from the slot part side is press-fitted and fitted, the slot part will be The connection pins 7 15 are brought into pressure contact with the side surfaces, and a state of electrical connection is obtained. As described above, according to the first embodiment, 4 × 4 phase units are arranged in one module, and 3 × 3 modules are uniformly arranged to form one structure. As a result, the phased array antenna of the first embodiment is more stable than a conventional case where a 12.times.12 cell is arranged at a time and a phased array antenna is manufactured in an integrated structure. Can be manufactured.

For example, in the above case, if nine modules with no defects are prepared, a phased array antenna of almost good quality can be manufactured.

This is for the following reason.

As in the past, if 12 X 12 radiating elements are to be arranged at once, it is assumed that even if the phase unit consisting of one radiating element is defective, the phased array antenna will be defective. In that case, even filed defect rate of one phase unit is 1%, and the fraction defective as Hue one Zudo array ^{antenna, (1- 0. 9 9 1} 4 4) X 1 0 0 = 7 6. It is as large as 5%.

On the other hand, in the case of the above-mentioned module, the defect occurrence rate as a module is as small as (1-0.991 ⁶ ) X 100 15%. In other words, the overall failure rate of the phased array antenna is as small as about 15%. Also, when assembling as a phased array antenna, only good modules can be used, so that the production quality of the phased array antenna can be made uniform. Also, by using the connection pins and the connection sockets, the mechanical and electrical connection between each module and the board can be stably established. For this reason, each module can be easily attached and detached.

Embodiment 2

By the way, in the above-mentioned module, all the parts necessary for one radiating element are provided in one module, but the present invention is not limited to this.

For example, as shown in Fig. 128 to Fig. 122, all the high-frequency signals are distributed and synthesized by the distribution layer 120 and the distribution and synthesis layer 514 provided above it, and the signal distribution function from the module is performed. May be eliminated. In this case, the distributing / combining layer 514 is configured as an integral structure, and each module 51 ◦ is composed of the parasitic element layer 111, the radiating element layer 112, and the phase control layer 113. Is done. The function of each layer is the same as that of the first embodiment, and the description is omitted.

Comparing the failure state in the manufacturing process of the parasitic element, radiating element, phase unit, and the distribution / combination layer for supplying power to each cell, which constitute one cell, the fine elements are aggregated. The phase unit that is running is the most defective.

Therefore, the same effect as in the first embodiment described above can be obtained even when the portion above the phase control layer in which the phase shift circuit is arranged is configured as a module. Further, by adopting the configuration of the second embodiment, the composite distribution layer of the module is not required as compared with the above-described first embodiment, so that the module can be made thinner and smaller.

Embodiment 3

Next, a third embodiment of the present invention will be described.

As described in the second embodiment, it is not necessary to provide all necessary parts for a cell including one radiating element in one module.

For example, as shown in Fig. 13 to Fig. 13C, the distribution / combination unit (distribution means) 514a that performs the distribution / combination of all high-frequency signals, and the distribution / combination layer 514 that forms the 14a, Parasitic element layer 6 1 1 forming parasitic element section 6 11 a corresponding to radiating element section 6 1 1 and radiating element layer 6 1 2 forming radiating element section 6 1 2 a corresponding to all radiating elements You may make it comprise as an integral structure. In this case, module 6 10 _{1 C}

lb It is composed of only the phase control layer 113 provided on the inner layer of the multilayer substrate.

As described above, a phase unit in which fine elements are aggregated is most likely to cause a defect. Therefore, if the phase control layer 6 13 in which the phase unit is formed has a module configuration, the first embodiment described above can be used. , 2 can be obtained. Further, there is an effect that the structure of the module is simplified and the module can be reduced in size.

In the above description, for simplicity, 3 × 3 modules with 4 × 4 radiating elements are arranged, and a phased array antenna of 12 × 12 radiating elements is used. explained. However, the module size and the number of modules according to the present invention are not limited to these. For example, in a phased array antenna having 72 × 72 radiating elements, a module with 12 × 12 radiating elements is required to be 6 It goes without saying that a large-sized phased array antenna may be configured by providing six Xs.

Embodiment 4

Hereinafter, Embodiment 4 of the present invention will be described.

In the first to third embodiments, the connection between the modules is performed by using the wiring formed on the substrate on which the modules are arranged.In the fourth embodiment, the following description will be given. Then, the connection between modules was made using a horizontal leaf spring.

To explain in more detail, first, as shown in FIG. 14A, connection areas 9110a are prepared on four sides of the module 910. Also, a predetermined number of terminals 901 required for connection are formed in the connection region 910a. Then, for example, on two adjacent sides of the connection region 9101a, the plate spring 9102 is formed by connecting to each terminal 9101. The leaf spring 902 has conductivity and spring properties, and one end is connected and fixed to the terminal 901, and the other end is formed so as to be unevenly distributed below the extended surface of the surface of the connected terminal 901. I do.

By configuring each module 910 as described above, a fused array antenna can be configured as described below.

As shown in FIG. 14B, the side of the module 9 10 already fixed on the distribution layer (first substrate) 9 20, where the leaf spring 9 0 2 is not formed, and the leaf spring 9 0 2 A new module 910 is arranged so that the side where is formed faces each other. this As a result, as shown in FIG. 14C, the terminal 9 0 1 force of the side on which the leaf spring 9 0 2 of the module 9 10 that is already fixed is not formed is opposed to the module 9 10 that is newly arranged. The terminal 901 on the other side is electrically connected to the leaf spring 902.

As described above, by disposing each module 910 on the distribution layer 920 serving as a substrate, the modules 910 are connected to each other. At this time, according to the fourth embodiment, it is not necessary to form a wiring for connection between the modules on the distribution layer 920.

Embodiment 5

Hereinafter, a fifth embodiment of the present invention will be described.

In the fifth embodiment, as described below, each module is connected using an anisotropic conductive film.

First, as shown in FIG. 15A, a connection area 110a is prepared in each module 11010, and a connection terminal 1001 is formed in the connection area 110a. Then, the respective modules 10 10 are arranged at predetermined positions so as to be adjacent to each other. As a result, when the adjoining portions of the adjacent modules 110 are enlarged, as shown in the plan view of FIG. 15B and the cross-sectional view of FIG. 15E, the connection terminals of the adjacent modules 110 1 0 0 1 is in the vicinity.

Next, as shown in the plan view of FIG. 15C and the cross-sectional view of FIG. 15F, an anisotropic conductive film 1002 is arranged on the connection terminal 1001. The arrangement of the anisotropic conductive film 1002 is arranged over all the connection terminals 1001 formed in the connection area 100a of one side of the module 10010. I do.

Next, as shown in the plan view of FIG. 15D and the cross-sectional view of FIG. 15G, the corresponding connection terminal extends over the anisotropic conductive film 1002 between the adjacent modules 110. The resin film 1004 on which the wiring 1003 for connecting the terminals 101 is formed is arranged.

Then, a pressure is applied in a state where the resin film is heated from above a predetermined portion of the resin film 104, and the anisotropic conductive film 100 2 is formed between the corresponding connection terminals 100 1 between the adjacent modules 110. And the connection via the wiring 103 arranged on this You.

To explain this state in more detail, as shown in FIG. 15H, the anisotropic conductive film 1002 is formed of conductive particles 1002a such as metal particles and metal-coated resin particles. It is dispersed in the insulating film 1002b. In the initial state, since the conductive particles 1002a are dispersed in the insulating film 1002b without contacting each other, the front and back surfaces of the anisotropic conductive film 1002 are different. It is insulated.

Therefore, as shown in FIG. 15G, simply arranging the anisotropic conductive film 1002 is equivalent to the state where the connection terminal 1001 and the corresponding wiring 1003 are electrically connected. Hanare, Here, when pressure is applied so that the wiring 1003 approaches the connection terminal 1001, the anisotropic conductive film 1002 is crushed in the region sandwiched between them. If the distance between the wiring 1003 and the connection terminal 1001 is smaller than the diameter of the conductive particles 1002a, a plurality of conductive particles 1002a are sandwiched between them. State. As a result, the wiring 1003 sandwiching the anisotropic conductive film 1002 and the connection terminal 1002 are electrically connected to each other through the conductive particles 1002a sandwiching the anisotropic conductive film 1002. Becomes

As described above, in the fifth embodiment, the respective modules 110 are interconnected using the anisotropic conductive film 102 on the connection area 110a. . As a result, even in the fifth embodiment, it is not necessary to form wiring for connection between the modules on the substrate on which the modules are arranged.

Embodiment 6

By the way, in Embodiments 1 to 5 described above, the drive circuit for driving the switch is mounted in the phase unit, but the drive circuit may be mounted in another unit to constitute a module. FIG. 16A is a block diagram of module 210 in the sixth embodiment. In this module 210, a high-frequency signal is supplied to each phase unit 213a by the distribution / synthesis unit 114a, and the phase shift change amount individually set for each phase unit 213a And a high-frequency signal is radiated from the radiating element 1 1 2a. In addition, this module 210 is equipped with a drive unit 215a described later, and is provided with wiring for supplying a drive signal for moving a switch incorporated in each phase shifter. _The drive unit and each phase shifter are connected individually to each other.

Next, the configuration of phased array antenna 200 according to the sixth embodiment will be described using FIG. 16B. In the phased array antenna 200, the high-frequency signal supplied from the power supply unit 11 is supplied to each module 210 by the distribution / combination unit 12. Further, a control signal line for supplying a control signal for setting a phase shift amount of the phase unit 21a and a trigger signal Trg to the drive unit 215a mounted in the module 210 are provided. A trigger signal line to be supplied is wired, and the module 210 and the control device 222 are electrically connected.

Next, the configuration of the drive unit mounted in the module 210 will be described with reference to FIG. As shown in FIG. 17, each drive unit 2 15 a is composed of a data distribution unit 41 and, for example, q number of phase control units 42 provided for each phase shifter 17. I have. The drive unit 1 2 has q radiating elements 1 1

2 The phase shift amount of a is input serially. The data distribution unit 41 determines the amount of phase shift of the q radiating elements 112 a included in the control signal 111 i by the q phase control units 42 connected to the phase shifters 17 respectively. Distribute to Thereby, the phase shift amount of the corresponding radiating element 112 a is set for each phase control unit 42.

On the other hand, as shown in FIG. 16A, the control device 223 outputs a trigger signal Tgr to each drive unit 215a. This trigger signal T gr is input to each phase control unit 42 of each drive unit 2 15 a as shown in FIG. Note that the trigger signal T gr is a signal that determines the timing of outputting the phase shift amount set in each phase control unit 42 to each phase shifter 17. Therefore, after setting the phase shift amount for each phase control unit 42, the trigger signal T gr is output from the control device 23, whereby the feed phase shift amount to each radiating element 15 is obtained. Can be updated simultaneously, and the beam radiation direction can be changed instantaneously.

Next, referring to FIG. 18, a phase unit 2 1 provided for each radiating element 1 1 2a will be described.

3a and the phase control unit 42 of the drive unit 2 15a will be described. Here, the different phase shift amounts are 22.5. , 45 °, 90 °, and 180. The phase shifter 17 includes four phase shifters 17A to 17D. Each of the phase shift circuits 17 A to 17 D is a strip that transmits a high-frequency signal from the distribution / combination unit 12 to the radiating element 112 a. Connected to the transmission line (waveguide) 16. In particular, each of the phase shift circuits 17A to 17D is provided with a switch 17S. By switching each switch in the switch 17S, a predetermined power supply phase shift amount, which will be described later, is given.

The phase control unit 42, which individually controls the switches 17S of these phase shift circuits 17A to 17D, includes latches 43A to 17A to 17D provided for each of the phase shift circuits 17A to 17D. It is composed of 4 3D. The data distribution unit 41 of the drive unit 12 outputs control signals 41A to 41D to the latches 4A to 43D constituting the phase control unit 42, respectively. The amount of phase shift of the radiating element 15 is given to the phase control unit 42. Therefore, the control signals 41A to 41D are input to the input terminals D of the latches 43A to 43D, respectively.

The trigger signal Trg output from the controller 223 is input to the input terminal CLK of each of the latches 43A to 43D. Each of the latches 43A to 43D latches the control signal 41A to 41D at the rising or falling edge of the trigger signal Trg, and outputs the output Q to the corresponding phase shift circuit 17A to l Output to 7D switch 17S.

At this time, ON / OFF of the switches 17S of the phase shift circuits 17A to 17D is determined according to the states of the latched control signals 41A to 4ID.

Thus, the phase shift amount of each of the phase shift circuits 17 A to 17 D is set, and the phase shift amount of the entire phase shifter 17 is set, so that the high frequency signal propagating through the strip line 16 is set. Is given a predetermined amount of phase shift.

The trigger signal Tgr may be constantly switched to the high level (or the low level), so that the switches 17S may be sequentially switched. In this case, since the phase shifters 17 are switched one by one without switching at the same time, instantaneous interruption of the radiation beam can be avoided. If the output voltage or current of the latches 43A to 43D is not enough to drive the switch 17S, a voltage amplifier or current amplifier is connected to the output side of the latches 43A to 43D. May be provided.

Industrial applicability

The phased array antenna of the present invention has a high gain and is applicable to a high frequency band. These antennas are particularly useful for on-board satellite tracking antennas used in satellite communications and on-board antennas.

Claims

The scope of the claims

1. Multiple radiating elements,

A plurality of modules formed with a phase unit that switches a phase of a high-frequency signal to be supplied to the radiating element based on a control signal;

A fused array antenna, comprising: a first substrate configured to uniformly dispose these modules on an upper surface and supplying the high-frequency signal to the module.

2. The phase according to claim 1, wherein said radiating element is formed in said module together with a corresponding said phase unit.

3. The fused array antenna according to claim 2, wherein the module has a multilayer structure in which the radiating element and the phase unit are formed in different layers.

4. The phased array antenna according to claim 1, wherein the radiating element is arranged in a layer having an integral structure over the entire area of the plurality of modules.

5. The fuse array according to claim 1, further comprising a distribution unit that distributes a high-frequency signal supplied from the first substrate to each of the phase units.

6. The phased array antenna according to claim 5, wherein the distribution means is formed in the module together with the corresponding phase unit.

7. The phased module according to claim 6, wherein the module has a multilayer structure in which the distribution unit and the phase unit are formed in different layers. Array antenna.

8. The fused array antenna according to claim 5, wherein the distribution means is formed on the first substrate.

9. The phased array antenna according to claim 8, wherein the first substrate has a multilayer structure.

10. The claim according to claim 1, further comprising: coupling means disposed between the high-frequency signal line in the first substrate and a phase unit of the module, for coupling the high-frequency signal. Family door

11. The phased array antenna according to claim 10, wherein said coupling means is a coupling slot.

12. The phased array according to claim 1, wherein the modules are interconnected via interconnecting means formed on the first substrate.

13. A recess is formed in the interconnecting means,

A protrusion is formed at a location of the module facing the interconnecting means,

13. The fused array antenna according to claim 12, wherein the modules are interconnected by fitting the projections into the recesses.

14. The module comprises a connection area at its end,

The phase according to claim 1, wherein the modules are interconnected via interconnecting means arranged over the connection areas facing each other between adjacent modules.

15. The interconnecting means is composed of a panel-like conductive member, and both ends of the conductive member are connected to connection terminals formed on the connection regions facing each other between the adjacent modules. Claims 14 characterized by the following:

16. The interconnecting means is composed of conductive particles dispersed in an insulating film, and wiring crimped on the film,

The connection terminal formed between the adjacent modules and a connection terminal formed on a connection region that is connected to each other, the connection terminals being connected via the conductive particles and the wiring. 14. The phased array antenna according to item 4.

17. The phased array antenna according to claim 1, wherein the module is detachably disposed on the first substrate.

1 8. The phase unit

A phase shifter comprising: a waveguide formed on a second substrate for transmitting the high-frequency signal; and a switch formed on the second substrate and configured to switch a connection state of the waveguide. 2. The phased array antenna according to claim 1, wherein:

19. The switch included in the phase unit includes a movable portion that switches a connection state of the waveguide,

19. The phased array antenna according to claim 18, further comprising a structure disposed on said second substrate and forming a space above a formation region of said switch.

20. The phased array antenna according to claim 1, wherein the first substrate supplies the control signal to a phase unit of the module.