WO2000077896A1 - Semi conducteur laser with temperature independant performances - Google Patents
Semi conducteur laser with temperature independant performances Download PDFInfo
- Publication number
- WO2000077896A1 WO2000077896A1 PCT/US2000/016042 US0016042W WO0077896A1 WO 2000077896 A1 WO2000077896 A1 WO 2000077896A1 US 0016042 W US0016042 W US 0016042W WO 0077896 A1 WO0077896 A1 WO 0077896A1
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- WIPO (PCT)
- Prior art keywords
- temperature
- mirror
- distributed bragg
- bragg reflector
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 claims description 44
- 239000000463 material Substances 0.000 claims description 22
- 239000003989 dielectric material Substances 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000002310 reflectometry Methods 0.000 description 7
- 230000007423 decrease Effects 0.000 description 6
- 239000011149 active material Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 3
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- FTWRSWRBSVXQPI-UHFFFAOYSA-N alumanylidynearsane;gallanylidynearsane Chemical compound [As]#[Al].[As]#[Ga] FTWRSWRBSVXQPI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- MDPILPRLPQYEEN-UHFFFAOYSA-N aluminium arsenide Chemical compound [As]#[Al] MDPILPRLPQYEEN-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18361—Structure of the reflectors, e.g. hybrid mirrors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0284—Coatings with a temperature dependent reflectivity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
- H01S5/1221—Detuning between Bragg wavelength and gain maximum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18361—Structure of the reflectors, e.g. hybrid mirrors
- H01S5/18369—Structure of the reflectors, e.g. hybrid mirrors based on dielectric materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18361—Structure of the reflectors, e.g. hybrid mirrors
- H01S5/18377—Structure of the reflectors, e.g. hybrid mirrors comprising layers of different kind of materials, e.g. combinations of semiconducting with dielectric or metallic layers
Definitions
- the invention relates generally to a method of fabricating diode lasers whose performance is essentially unchanged over designed temperature and bias ranges, and more particularly to a diode laser of which the threshold
- Diode lasers are a mature technology and are used in many commercial applications.
- the cost of diode laser modules varies according to the specifications required by the application. If specifications are tight, the yield of the lasers may be low, or the laser modules may require thermal management (such as thermoelectric cooling). Both of these lead to high cost.
- the laser is considered an electro-optic device where electrons are exchanged for photons (i.e., light).
- photons i.e., light
- the same amount of input current (electrons) will always produce the same amount of light (photons).
- the invention provides an improved vertical cavity surface emitting laser (VCSEL) that includes an output mirror stack having a semiconductor distributed Bragg reflector and a dielectric distributed Bragg reflector, where a center wavelength of the semiconductor distributed Bragg reflector is different than a center wavelength of the dielectric distributed Bragg reflector.
- the center wavelength of the dielectric distributed Bragg reflector is less than the center wavelength of the semiconductor distributed Bragg reflector and less than the lasing wavelength of the VCSEL.
- the semiconductor distributed Bragg reflector (DBR) is made up of materials with high and low index of refractions. The reflection at any optical interface is equal to the difference between the high and low indexes of refraction divided by the sum of the same indexes.
- the semiconductor distributed Bragg reflector has an index contrast ratio that changes with temperature.
- the dielectric distributed Bragg reflector has an index contrast ratio that changes less with temperature than that of the semiconductor distributed Bragg reflector. As the temperature increases, the lasing wavelength of the VCSEL increases and shifts away from the center wavelength of the dielectric distributed Bragg reflector such that the dielectric distributed Bragg reflector becomes less reflective.
- FIG. 1 illustrates the reflectance of a semiconductor distributed
- FIG. 2 illustrates the reflectance of a dielectric DBR as a function of wavelength.
- FIG. 3 illustrates the estimated change in external efficiency as a function of temperature for conventional vertical cavity surface emitting lasers
- VCSELs VCSELs
- VCSELs VCSELs
- VCSELs VCSELs
- FIG. 4 illustrates a VCSEL designed in accordance with the principles of the invention.
- the diode laser must have a temperature insensitive threshold current. In other words, it is desirable that the
- I t h is referred to as the threshold current (which is the amount of current required to bring the laser into a lasing condition) and is typically given in units of A or mA. That the
- the threshold current (I th ) is dependent on a number of factors such as the gain medium in the diode laser, the amount of internal losses (such as free carrier loss) and the amount of feedback provided by the mirrors. Over temperature, the internal losses may change, the amount of feedback may change and the amount of gain provided by the gain medium will change.
- a typical edge-emitting diode laser numerous longitudinal modes are present, and as a result, the dominant longitudinal mode is the one whose wavelength corresponds to the position of peak gain from the gain medium.
- the diode laser operates over temperature with a fixed current, the peak amount of gain decreases, and the threshold current of the diode laser increases. This is considered an inherent property of an edge-emitting laser. Thus, temperature control is often utilized to ensure constant threshold current.
- numerous longitudinal modes are not supported. These types include vertical cavity surface emitting lasers (VCSELs) and distributed feedback lasers (DFBs).
- a vertical cavity surface emitting laser is a semiconductor diode laser including a semiconductor layer of optically active material, such as gallium arsenide or indium gallium arsenide, sandwiched between mirror stacks formed of highly-reflective layers of metallic material, dielectric material or epitaxially-grown semiconductor material. Lasers require optical confinement in an optical cavity and carrier confinement to efficiently convert pumping electrons into stimulated photons through population inversion.
- the standing wave of reflected electromagnetic energy in the optical cavity has a characteristic cross-section giving rise to an electromagnetic mode.
- a desirable electromagnetic mode is the single fundamental mode, for example, the HE ⁇ mode of a cylindrical waveguide.
- VCSELs and DFBs are designed such that there is only one dominant longitudinal mode.
- the wavelength of the lasing mode may not correspond to the position of the peak gain.
- the semiconductor gain spectra shifts toward longer wavelength with increasing temperature.
- the index of refraction of semiconductors increases with increasing temperature, and the physical lattice constant increases with increasing temperature. Both of these last two parameters cause an increase in the optical path length of the material (defined as the index of refraction times the physical length).
- An increase in the optical path length results in a wavelength shift toward longer wavelength in the lasing mode of both VCSELs and DFBs.
- the gain peak has been
- the threshold current will be at a minimum and will increase as the temperature is changed in either direction. If the temperature of minimum threshold current is in the middle of the desired temperature range, the laser will have optimum temperature performance (in terms of threshold current) for this type of structure.
- This design has fundamental limitations. Over very small temperature ranges the threshold current may be nearly constant. For larger temperature ranges, such as those required for commercial communication products the threshold current changes are noticeable. The principles of the invention can be used to design lasers that give much more constant performance over temperature.
- the gain medium itself can be engineered to its inherent temperature sensitivity. For example, if one looks at a VCSEL designed with different gain offsets (that is, where the gain and lasing modes are aligned at different temperatures), the minimum threshold current can be engineered over a wide range of temperatures. If one uses different types of gain offsets (typically produced by quantum wells with different composition and/or thickness), the gain profile can be designed to have multiple peaks or purely a broad peak. This technique can be used to ensure that as the temperature changes the threshold current remains nearly constant since the amount of gain that is aligned with the lasing mode also remains constant. Thus, choosing the correct combination of gain elements can compensate for gain variability over temperature for fixed longitudinal wavelength types of lasers (e.g., VCSELs and DFBs).
- the external efficiency ( ⁇ ext ) of a device depends on the amount
- the index of refraction changes with temperature.
- this fact means that the reflectance of the mirrors changes.
- the reflectance difference changes the amount of transmitted light which in turn changes the external efficiency.
- the index contrast ratio of the mirrors will change with temperature, thus changing the external efficiency.
- the index contrast ratio of semiconductor DBRs increases with temperature, such that the VCSEL DBRs become more reflective, and the external efficiency is reduced.
- the final effect is based on different material systems.
- the DBRs and the gain (i.e., active) region are both composed of the same type of material (i.e., semiconductors). Therefore, as the index contrast ratio changes with temperature, so does the lasing wavelength of the VCSEL.
- the center wavelength of the DBR (as illustrated in FIG. 1) also shifts with the device temperature such that the lasing mode retains the same alignment with the DBRs. Thus, only the index contrast ratio shift is important.
- VCSELs have been made with DBRs made up of different material systems which are commonly referred to as dielectric mirrors.
- the semiconductor materials typically used to make VCSELs, such as AlGaAs are dielectric materials.
- optically transparent dielectric materials can also be used to form the distributed Bragg reflectors used in VCSELs. Many of these dielectric materials have indexes of refraction that change much less than the semiconductor dielectrics when the temperature changes.
- dielectric will be used to describe dielectric materials whose index of refraction changes much less with temperature than the semiconductor materials. Examples of these dielectric materials are TiO , Si0 , ZnO, etc. Using those materials, the center wavelength of the DBRs no longer shifts with temperature at the same rate as the lasing mode. This characteristic creates a new ability to tailor the performance of the device according to the principles of the invention.
- the definition of the external efficiency is complicated by the effect of threshold current changes. For a device with constant threshold current, the external efficiency is the same whether measured CW (continuous wave) or pulsed. If the threshold current is not constant, the CW and pulsed threshold currents are not identical. This effect can be seen clearly in edge- emitting lasers. Typically the threshold currents increase with increasing temperature. At a certain temperature, a nearly exponential increase of threshold current occurs. Near this regime, a CW measurement of the external efficiency will be quite different from a pulsed measurement. At much cooler temperatures the external efficiency will appear to be nearly constant regardless of the measurement technique. Communication applications utilize a 50% modulation of the current. Therefore, the working definition of external efficiency assumes that it is measured at 50% duty cycle.
- a standard edge-emitting laser cannot be made with a constant threshold current over temperature, whereas a diode laser with a controlled longitudinal mode (such as a VCSEL or DFB) can be so designed.
- a diode laser with a controlled longitudinal mode such as a VCSEL or DFB
- the change in the DBR index contrast ratio forces the external efficiency to change, even if the threshold current is constant. It is possible to design a VCSEL in such a way to achieve an external efficiency that is constant over temperature.
- the VCSEL has already been engineered to have a constant threshold current over temperature, but the technique can still be used, however, if the threshold current is not constant.
- a DBR made up of different materials can be used to counteract the effect of a semiconductor DBR. If at least a partial semiconductor DBR is desired, its effects on external efficiency can be countered by using a partial DBR of another material system. Starting with a VCSEL whose first semiconductor DBR has an index contrast ratio that increases with temperature and whose internal losses may increase with temperature such that the external efficiency decreases with temperature, compensation is required. One can then choose a DBR made up of a material system (such as a dielectric mirror) whose index changes less with temperature than the semiconductor, and align this second DBR such that its center wavelength is at a shorter wavelength than the
- FIG. 3 includes curves for a conventional all-semiconductor VCSEL and VCSELs designed in accordance with the principles of the invention.
- a VCSEL includes a bottom mirror stack 24.
- the bottom mirror stack 24 is organized as a system of alternating layers of high- refractive index and low-refractive index semiconductor materials forming a semiconductor distributed Bragg reflector (DBR).
- An active region 26 including an active material for photon generation is disposed above the bottom mirror stack 24.
- An output mirror stack 28 is disposed above the active region 26.
- the output mirror stack 28 includes a first top mirror 30 and a second top mirror 32.
- the first top mirror 30 is a system of alternating high-refractive index and low-refractive index semiconductor materials forming a semiconductor distributed Bragg reflector (DBR).
- DBR semiconductor distributed Bragg reflector
- the second top mirror 32 is a system of alternating high-refractive index and low-refractive index dielectric materials forming a DBR.
- the first top mirror 30 is disposed above the active region 26.
- the second top mirror 32 is disposed above the first top mirror 30.
- the output mirror stack 28 is organized as two systems of alternating layers of high and low-refractive index materials (a first system of semiconductor materials and a second system of dielectric materials) forming a multiple distributed Bragg reflector (DBR) system.
- the bottom mirror stack 24, the active region 26, and the output mirror stack 28 form an optical resonating cavity having a central vertical axis 34.
- the first top mirror DBR 30 in the output mirror stack 28 is a semiconductor mirror that has an index contrast ratio that changes with temperature.
- the second top mirror DBR 32 in the output mirror stack is a dielectric mirror selected to have an index contrast ratio that changes less with temperature than the semiconductor mirror.
- the second top mirror DBR 32 is aligned such that its center wavelength is at a shorter wavelength than the VCSEL's lasing wavelength.
- the lasing mode shifts toward a longer wavelength, away from the center wavelength of the second top mirror DBR 32.
- the second top mirror DBR 32 becomes less reflective with temperature.
- the high-refractive index layers of the first top mirror DBR 30 are preferably aluminum arsenide, AlAs, or aluminum gallium arsenide, AlGaAs; and the low-refractive index layers of the first top mirror DBR 30 are preferably gallium arsenide, GaAs, or AlGaAs having a lower aluminum content than the high-refractive index layers.
- Other compound semiconductor compositions may be used for other wavelength ranges.
- the high and low-refractive index layers of the second top mirror DBR 32 are selected from dielectric materials, such as TiO , Si0 , and ZnO, such that the center wavelength of the second top mirror 32 DBR does not shift with temperature at the same rate as the lasing mode.
- the reflectivities of the mirror stacks in a VCSEL are defined by adjusting the number of periods (i.e., pairs of alternating layers of high- refractive index and low-refractive index materials) in each mirror stack.
- VCSEL can be either top-emitting or bottom-emitting depending on the reflectivity of the mirror stacks therein.
- the bottom mirror stack preferably has a reflectivity of greater than 99% and the output mirror stack preferably has a reflectivity of about 95-99%.
- the reflectivity of the output mirror stack is reduced to provide light emission from the VCSEL in the vertical direction as shown by arrow 36.
- a metallized top contact 38 is applied to the first top mirror 30 so that the VCSEL can be electrically pumped.
- the top contact 38 has an annular shape circumscribing the second top mirror 32 and is centered about the central vertical axis 34.
- a metallized bottom contact 40 is applied to the bottom mirror stack 24, so that current flows through the output mirror stack 28, the active region 26, and the bottom mirror stack 24.
- the bottom contact 40 has an annular shape circumscribing the active region 26, and is centered about the central vertical axis 34.
- An annular current confinement region 42 of high electrical resistivity is located between the active region 26 and the first top mirror 30, centered about the central vertical axis 34.
- the high- resistivity current confinement region 42 channels injected current into a central portion of the active region 26 for more efficient light generation therein.
- the wavelength of the laser light produced by the VCSEL is determined by the active material used in the active region of the VCSEL.
- a given active material has a characteristic wavelength or wavelengths at which it will lase based on the atomic structure of the material.
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU53325/00A AU5332500A (en) | 1999-06-16 | 2000-06-09 | Semi conducteur laser with temperature independant performances |
CA002376946A CA2376946A1 (en) | 1999-06-16 | 2000-06-09 | Semi conducteur laser with temperature independant performances |
EP00938259A EP1188208A1 (en) | 1999-06-16 | 2000-06-09 | Semiconductor laser with temperature independant performances |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/334,590 | 1999-06-16 | ||
US09/334,590 US6341138B1 (en) | 1999-06-16 | 1999-06-16 | Constant temperature performance laser |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000077896A1 true WO2000077896A1 (en) | 2000-12-21 |
Family
ID=23307910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/016042 WO2000077896A1 (en) | 1999-06-16 | 2000-06-09 | Semi conducteur laser with temperature independant performances |
Country Status (5)
Country | Link |
---|---|
US (1) | US6341138B1 (en) |
EP (1) | EP1188208A1 (en) |
AU (1) | AU5332500A (en) |
CA (1) | CA2376946A1 (en) |
WO (1) | WO2000077896A1 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6556607B1 (en) * | 2000-06-23 | 2003-04-29 | Picolight, Incorporated | Temperature compensated lasers |
US8457346B2 (en) * | 2001-04-24 | 2013-06-04 | Digimarc Corporation | Digital watermarking image signals on-chip |
US7135332B2 (en) * | 2001-07-12 | 2006-11-14 | Ouellette Joseph P | Biomass heating system |
US6615562B2 (en) * | 2001-09-13 | 2003-09-09 | Skyline Displays, Inc. | Box frame assembly |
US7901870B1 (en) | 2004-05-12 | 2011-03-08 | Cirrex Systems Llc | Adjusting optical properties of optical thin films |
US7742515B2 (en) * | 2004-06-25 | 2010-06-22 | Finisar Corporation | Vertical cavity surface emitting laser optimized for optical sensitivity |
US7746911B2 (en) * | 2004-06-25 | 2010-06-29 | Finisar Corporation | Geometric optimizations for reducing spontaneous emissions in photodiodes |
US7359419B2 (en) * | 2004-06-25 | 2008-04-15 | Finisar Corporation | Vertical cavity surface emitting laser optimized for thermal sensitivity |
US7565084B1 (en) | 2004-09-15 | 2009-07-21 | Wach Michael L | Robustly stabilizing laser systems |
US7606282B2 (en) * | 2007-12-21 | 2009-10-20 | Finisar Corporation | Optimizing VCSEL mirrors for improving temperature response |
US9124062B2 (en) * | 2012-03-22 | 2015-09-01 | Palo Alto Research Center Incorporated | Optically pumped surface emitting lasers incorporating high reflectivity/bandwidth limited reflector |
US9257814B1 (en) * | 2014-12-11 | 2016-02-09 | Oracle International Corporation | Temperature-insensitive optical component |
US9923335B1 (en) | 2016-09-22 | 2018-03-20 | Oracle International Corporation | Thermally compensating spot-size converter for an athermal laser |
US9871346B1 (en) | 2016-09-22 | 2018-01-16 | Oracle International Corporation | Mode-hop-free hybrid external-cavity laser with passive thermo-optic coefficient compensation |
US9882349B1 (en) | 2017-01-12 | 2018-01-30 | Oracle International Corporation | Externally referenced wavelength-locking technique for hybrid lasers |
CN113125111B (en) * | 2021-04-10 | 2023-03-28 | 中国科学院新疆理化技术研究所 | External quantum efficiency testing method for vertical cavity surface emitting laser |
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US5274655A (en) * | 1992-03-26 | 1993-12-28 | Motorola, Inc. | Temperature insensitive vertical cavity surface emitting laser |
EP0860917A2 (en) * | 1997-02-21 | 1998-08-26 | Sumitomo Electric Industries, Ltd. | Semiconductor laser module |
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US5266794A (en) | 1992-01-21 | 1993-11-30 | Bandgap Technology Corporation | Vertical-cavity surface emitting laser optical interconnect technology |
US5343487A (en) | 1992-10-01 | 1994-08-30 | Optical Concepts, Inc. | Electrical pumping scheme for vertical-cavity surface-emitting lasers |
US5500540A (en) | 1994-04-15 | 1996-03-19 | Photonics Research Incorporated | Wafer scale optoelectronic package |
US5521736A (en) | 1994-09-29 | 1996-05-28 | Vixel Corporation | Control circuits for parallel optical interconnects |
EP0732781B1 (en) | 1995-03-14 | 2002-12-18 | Brown & Sharpe Tesa S.A. | Module comprising a controlled diode laser and electrooptical device using the same |
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US5712865A (en) | 1995-09-28 | 1998-01-27 | Sandia Corporation | Temperature-insensitive vertical-cavity surface-emitting lasers and method for fabrication thereof |
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US6169756B1 (en) * | 1997-12-23 | 2001-01-02 | Lucent Technologies Inc. | Vertical cavity surface-emitting laser with optical guide and current aperture |
US5930276A (en) | 1997-12-29 | 1999-07-27 | Motrola, Inc. | Method and device for providing temperature-stable optical feedback for optical packages |
-
1999
- 1999-06-16 US US09/334,590 patent/US6341138B1/en not_active Expired - Fee Related
-
2000
- 2000-06-09 CA CA002376946A patent/CA2376946A1/en not_active Abandoned
- 2000-06-09 EP EP00938259A patent/EP1188208A1/en not_active Withdrawn
- 2000-06-09 AU AU53325/00A patent/AU5332500A/en not_active Abandoned
- 2000-06-09 WO PCT/US2000/016042 patent/WO2000077896A1/en not_active Application Discontinuation
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US6341138B1 (en) | 2002-01-22 |
AU5332500A (en) | 2001-01-02 |
CA2376946A1 (en) | 2000-12-21 |
EP1188208A1 (en) | 2002-03-20 |
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