WO2000055873A1 - Inductor coil structure and method for making same - Google Patents

Inductor coil structure and method for making same Download PDF

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Publication number
WO2000055873A1
WO2000055873A1 PCT/US2000/006793 US0006793W WO0055873A1 WO 2000055873 A1 WO2000055873 A1 WO 2000055873A1 US 0006793 W US0006793 W US 0006793W WO 0055873 A1 WO0055873 A1 WO 0055873A1
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WO
WIPO (PCT)
Prior art keywords
coil
segments
conductor
high current
low profile
Prior art date
Application number
PCT/US2000/006793
Other languages
French (fr)
Inventor
Timothy M. Shafer
Original Assignee
Vishay Dale Electronics, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23036908&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2000055873(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Vishay Dale Electronics, Inc. filed Critical Vishay Dale Electronics, Inc.
Priority to EP00916363A priority Critical patent/EP1080477B1/en
Priority to DE60040442T priority patent/DE60040442D1/en
Priority to JP2000606022A priority patent/JP4443773B2/en
Priority to CA002328166A priority patent/CA2328166C/en
Priority to AU37477/00A priority patent/AU3747700A/en
Publication of WO2000055873A1 publication Critical patent/WO2000055873A1/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2847Sheets; Strips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2303/00Use of resin-bonded materials as reinforcement
    • B29K2303/04Inorganic materials
    • B29K2303/06Metal powders, metal carbides or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/04Fixed inductances of the signal type  with magnetic core
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2847Sheets; Strips
    • H01F2027/2861Coil formed by folding a blank
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • H01F27/292Surface mounted devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • Y10T29/49071Electromagnet, transformer or inductor by winding or coiling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49135Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Definitions

  • the present invention relates to an inductor coil structure and method for making same.
  • the coil structure of the present invention is preferably for use in a high current low profile inductor commonly referred to by the designation IHLP.
  • IHLP high current low profile inductor
  • the particular coil structure may be used in other types of inductors.
  • Inductor coils have in the prior art been constructed from various shapes of materials formed into various helical shapes. However, there is a need for an improved inductor coil structure which is simple to manufacture and which provides an efficient and reliable inductance coil.
  • a primary object of the present invention is the provision of an improved inductor coil structure and method for making same.
  • a further object of the present invention is the provision of an inductor coil structure which can be used in a high current low profile inductor having no air spaces in the inductor, and which includes a magnetic material completely surrounding the coil.
  • a further object of the present invention is the provision of an inductor coil structure which includes a closed magnetic system which has self-shielding capability.
  • a further object of the present invention is the provision of an inductor coil structure which maximizes the utilization of space needed for a given inductance performance so that the inductor can be of a minimum size.
  • a further object of the present invention is the provision of an improved inductor coil structure which is smaller, less expensive to manufacture, and is capable of accepting more current without saturation than previous inductor coil structures.
  • a further object of the present invention is the provision of an inductor coil structure which lowers the series resistance of the inductor.
  • a high current low profile inductor comprising a conductor coil having first and second coil ends.
  • a magnetic material surrounds the conductor coil to form an inductor body.
  • the inductor coil comprises a plurality of coil turns extending around a longitudinal coil axis in an approximately helical path which progresses axially along the coil axis.
  • the coil turns are formed from a flat plate having first and second opposite flat surfaces, at least a portion of each of the flat surfaces of the coil turns facing in a axial direction with respect to the coil axis.
  • the method for making the inductor includes taking an elongated plate conductor having a first end, a second end, opposite side edges, opposite flat surfaces, and a longitudinal plate axis.
  • a plurality of slots are cut in each of the opposite side edges of the plate conductor so as to form the plate conductor into a plurality of cross segments extending transversely with respect to the plate axis and a plurality of connecting segments extending approximately axially with respect to the plate axis.
  • the connecting segments connect the cross segments together into a continuous conductor which extends in a sine shaped path.
  • sine shaped refers to any shape which generally conforms to a sine curve, but which is not limited to a continuous curve and may include apexes, squared off corners or other various shapes.
  • the connecting segments After cutting the slots in the opposite side edges of the plate conductor the connecting segments are bent along one or more bend axes extending transversely with respect to the plate axis so as to form the plate conductor into a plurality of accordion folds, each of which comprise one of the cross segments and a portion of one of the connecting segments.
  • the cross segments and the connecting segments form a continuous conductor coil of approximate helical shape having first and second opposite ends.
  • Figure 1 is a perspective view of the inductor constructed in accordance with the present invention and mounted upon a circuit board.
  • Figure 2 is a pictorial view of the coil of the inductor before the molding process.
  • Figure 3 is a pictorial view of the inductor of the present invention after the molding process is complete, but before the leads have been formed.
  • Figure 4 is an end elevational view taken along line 4-4 of Figure 2.
  • Figure 5 is an elevational view taken along lines 5-5 of Figure 4.
  • Figure 6 is a perspective view of an elongated conductor blank from which the inductor coil is formed.
  • Figure 7 shows the blank of Figure 6 after the formation of slots extending inwardly from the opposite edges thereof.
  • Figure 8 is a view similar to Figure 7, showing the first folding step in the formation of the inductor coil of the present invention.
  • Figure 9 is a side elevational view showing the same folding step shown in Figure 8.
  • Figure 10 is a view similar to 8 and showing a second folding step in the process for making the inductor coil of the present invention.
  • Figure 11 is an inverted pictorial view of the inductor after it has been pressed, but before the leads have been formed.
  • Figure 12 is a view similar to figure 11 showing the inductor after partial forming of the leads.
  • Figure 13 is a view similar to Figures 11 and 12 showing the final forming of the leads.
  • Inductor 10 generally designates an inductor of the present invention mounted upon a circuit board 12.
  • Inductor 10 includes an inductor body 14 having a first lead 16 and a second lead 18 extending therefrom and being folded over the opposite ends of body 14. Leads 16, 18 are soldered or otherwise electrically connected on the circuit board 12.
  • the inductor coil of the present invention is generally designated by the numeral 20.
  • Leads 16, 18 form the ends of coil 22.
  • Between leads 16, 18 are a plurality of L-shaped coil segments 26 each comprising a horizontal leg 28 and a vertical leg 30.
  • Vertical leg 30 terminates at a connecting segment 32 which is folded over at approximately 180° so as to create an accordion like configuration for inductor coil 20.
  • the L-shaped coil segments are connected together to form a helical coil having an open coil center 34 extending along a longitudinal coil axis 36.
  • Figures 6-10 show the process for making the coil 20.
  • a blank flat conductor plate 50 formed of copper or other electrically conductive material includes: first and second ends 52, 54; a pair of opposite flat surfaces 56; and a pair of opposite side edges 58, 60.
  • Figure 7 shows the first step in forming the coil 20. In this step a plurality of slots
  • 62, 64 are cut in the opposite edges 58, 60 respectively of the blank flat plate 50.
  • Various cutting methods may be used such as stamping or actual cutting by laser or other cutting tools known in the art.
  • the blank 50 Upon completion of the cutting operation, the blank 50 is transformed into an elongated sine shaped body formed from a plurality of cross segments 66 extending transversely to the longitudinal axis of plate 50 and a plurality of connecting segments 67 extending axially with respect to the longitudinal axis of plate 50.
  • the segments 66, 67 form a continuous sine shaped configuration as shown in Figure 7.
  • Figure 8 shows the next step in forming the coil 20.
  • the end 52 is folded over at an angle of 180° to form the 180° angle bend 63 in the first connecting segment 67.
  • Figure 10 shows a second bend 65 which is in the next connecting segment 67. Bends 63, 65 are in opposite directions, and are repeated until an accordion like structure is provided similar to that shown in Figure 5.
  • the coil 20 includes opposite ends 16, 18 which are formed from the opposite ends 52, 54 of blank 50.
  • the cross segments 66 of blank 50 form the first horizontal legs 28 of coil 20, and the connecting segments 67 of blank 50 form the second vertical legs 30 and the connecting segments 32 of coil 20.
  • An example of a preferred material for coil 20 is a copper flat plate made from OFHC copper 102, 99.95% pure.
  • the magnetic molding material of body 14 is comprised of a powdered iron, a filler, a resin, and a lubricant.
  • the preferred powdered material is manufactured by BASF Corporation, 100 Cherryhill Road, Parsippany, New Jersey under the trade designation Carbonyl Iron, Grade SQ. This SQ material is insulated with 0.875% mass fraction with 75% H 3 P04.
  • An epoxy resin is also added to the mixture, and the preferred resin for this purpose is manufactured by Morton International, Post Office Box 15240, Reading, Pennsylvania under the trade designation Corvel Black, Number 10-7086.
  • the lubricant is a zinc stearate manufactured by Witco Corporation, Box 45296, Huston Texas under the product designation Lubrazinc W.
  • the above materials are mixed together and then acetone is added to wet the material to a mud-like consistency. The material is then permitted to dry and is screened to a particle size of -50 mesh. The lubricant is then added to complete the material 82. The material 82 is then ready for pressure molding.
  • the next step in the process involves compressing the material completely around the coil 20 so that it has a density produced by exposure to pressure of from 15 to 25 tons per square inch. This causes the powdered material 82 to be compressed and molded tightly completely around the coil so as to form the inductor body 14 shown in Figure 1 and in Figures 11-13.
  • the molded assembly is in the form which is shown in Figure 11.
  • the leads 16, 18 are formed or bent as shown in Figures 12 and 13.
  • the molded assemblies are then baked at 325°F for one hour and forty-five minutes to set the resin.
  • the IHLP inductor of the present invention has several unique attributes.
  • the conductive coil, lead frame, magnetic core material, and protective enclosure are molded as a single integral low profile unitized body that has termination leads suitable for surface mounting.
  • the construction allows for maximum utilization of available space for magnetic performance and is magnetically self- shielding.
  • the unitary construction eliminates the need for two core halves as was the case with prior art E cores or other core shapes, and also eliminates the associated assembly labor.
  • the unique conductor winding of the present invention allows for high current operation and also optimizes magnetic parameters within the inductor's footprint.
  • the manufacturing process of the present invention provides a low cost, high performance package without the dependence on expensive, tight tolerance core materials and special winding techniques.
  • the magnetic core material has high resistivity (exceeding 3 mega ohms) that enables the inductor as it is manufactured to perform without a conductive path between the surface mount leads.
  • the magnetic material also allows efficient operation up to 1 MHz.
  • the inductor package performance yields a low DC resistance to inductance ratio of two milliOhms per microHenry. A ratio of 5 or below is considered very good.
  • Coil 20 reduces its cost of manufacture. Coil 20 may be used in various inductor configurations other than IHLP inductors.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Insulating Of Coils (AREA)
  • General Induction Heating (AREA)
  • Regulation Of General Use Transformers (AREA)
  • Filters And Equalizers (AREA)

Abstract

A high current, low profile inductor includes a conductor coil surrounded by magnetic material to form an inductor body. The inductor coil is formed from a flat plate which is cut into a sine-shaped configuration and then is folded in accordion fashion to create a helical coil.

Description

TITLE: Inductor Coil Structure -And Method For Making Same
BACKGROUND OF THE INVENTION
The present invention relates to an inductor coil structure and method for making same. The coil structure of the present invention is preferably for use in a high current low profile inductor commonly referred to by the designation IHLP. However, the particular coil structure may be used in other types of inductors.
Inductor coils have in the prior art been constructed from various shapes of materials formed into various helical shapes. However, there is a need for an improved inductor coil structure which is simple to manufacture and which provides an efficient and reliable inductance coil.
Therefore, a primary object of the present invention is the provision of an improved inductor coil structure and method for making same.
A further object of the present invention is the provision of an inductor coil structure which can be used in a high current low profile inductor having no air spaces in the inductor, and which includes a magnetic material completely surrounding the coil.
A further object of the present invention is the provision of an inductor coil structure which includes a closed magnetic system which has self-shielding capability. A further object of the present invention is the provision of an inductor coil structure which maximizes the utilization of space needed for a given inductance performance so that the inductor can be of a minimum size.
A further object of the present invention is the provision of an improved inductor coil structure which is smaller, less expensive to manufacture, and is capable of accepting more current without saturation than previous inductor coil structures. A further object of the present invention is the provision of an inductor coil structure which lowers the series resistance of the inductor.
SUMMARY OF THE INVENTION
The foregoing objects may be achieved by a high current low profile inductor comprising a conductor coil having first and second coil ends. A magnetic material surrounds the conductor coil to form an inductor body. The inductor coil comprises a plurality of coil turns extending around a longitudinal coil axis in an approximately helical path which progresses axially along the coil axis. The coil turns are formed from a flat plate having first and second opposite flat surfaces, at least a portion of each of the flat surfaces of the coil turns facing in a axial direction with respect to the coil axis. The method for making the inductor includes taking an elongated plate conductor having a first end, a second end, opposite side edges, opposite flat surfaces, and a longitudinal plate axis. A plurality of slots are cut in each of the opposite side edges of the plate conductor so as to form the plate conductor into a plurality of cross segments extending transversely with respect to the plate axis and a plurality of connecting segments extending approximately axially with respect to the plate axis. The connecting segments connect the cross segments together into a continuous conductor which extends in a sine shaped path. As used herein the term "sine shaped" refers to any shape which generally conforms to a sine curve, but which is not limited to a continuous curve and may include apexes, squared off corners or other various shapes. After cutting the slots in the opposite side edges of the plate conductor the connecting segments are bent along one or more bend axes extending transversely with respect to the plate axis so as to form the plate conductor into a plurality of accordion folds, each of which comprise one of the cross segments and a portion of one of the connecting segments. In the resulting structure, the cross segments and the connecting segments form a continuous conductor coil of approximate helical shape having first and second opposite ends.
BRIEF DESCRIPTION OF THE FIGURES OF THE DRAWINGS
Figure 1 is a perspective view of the inductor constructed in accordance with the present invention and mounted upon a circuit board.
Figure 2 is a pictorial view of the coil of the inductor before the molding process. Figure 3 is a pictorial view of the inductor of the present invention after the molding process is complete, but before the leads have been formed.
Figure 4 is an end elevational view taken along line 4-4 of Figure 2. Figure 5 is an elevational view taken along lines 5-5 of Figure 4. Figure 6 is a perspective view of an elongated conductor blank from which the inductor coil is formed.
Figure 7 shows the blank of Figure 6 after the formation of slots extending inwardly from the opposite edges thereof. Figure 8 is a view similar to Figure 7, showing the first folding step in the formation of the inductor coil of the present invention.
Figure 9 is a side elevational view showing the same folding step shown in Figure 8.
Figure 10 is a view similar to 8 and showing a second folding step in the process for making the inductor coil of the present invention.
Figure 11 is an inverted pictorial view of the inductor after it has been pressed, but before the leads have been formed.
Figure 12 is a view similar to figure 11 showing the inductor after partial forming of the leads. Figure 13 is a view similar to Figures 11 and 12 showing the final forming of the leads.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Referring to the drawings the numeral 10 generally designates an inductor of the present invention mounted upon a circuit board 12. Inductor 10 includes an inductor body 14 having a first lead 16 and a second lead 18 extending therefrom and being folded over the opposite ends of body 14. Leads 16, 18 are soldered or otherwise electrically connected on the circuit board 12.
Referring to Figure 2, the inductor coil of the present invention is generally designated by the numeral 20. Leads 16, 18 form the ends of coil 22. Between leads 16, 18 are a plurality of L-shaped coil segments 26 each comprising a horizontal leg 28 and a vertical leg 30. Vertical leg 30 terminates at a connecting segment 32 which is folded over at approximately 180° so as to create an accordion like configuration for inductor coil 20. The L-shaped coil segments are connected together to form a helical coil having an open coil center 34 extending along a longitudinal coil axis 36. Figures 6-10 show the process for making the coil 20. Initially as shown in Figure 6 a blank flat conductor plate 50 formed of copper or other electrically conductive material includes: first and second ends 52, 54; a pair of opposite flat surfaces 56; and a pair of opposite side edges 58, 60. Figure 7 shows the first step in forming the coil 20. In this step a plurality of slots
62, 64 are cut in the opposite edges 58, 60 respectively of the blank flat plate 50. Various cutting methods may be used such as stamping or actual cutting by laser or other cutting tools known in the art.
Upon completion of the cutting operation, the blank 50 is transformed into an elongated sine shaped body formed from a plurality of cross segments 66 extending transversely to the longitudinal axis of plate 50 and a plurality of connecting segments 67 extending axially with respect to the longitudinal axis of plate 50. The segments 66, 67 form a continuous sine shaped configuration as shown in Figure 7.
Figure 8 shows the next step in forming the coil 20. The end 52 is folded over at an angle of 180° to form the 180° angle bend 63 in the first connecting segment 67. Figure 10 shows a second bend 65 which is in the next connecting segment 67. Bends 63, 65 are in opposite directions, and are repeated until an accordion like structure is provided similar to that shown in Figure 5.
In Figure 5 the coil 20 includes opposite ends 16, 18 which are formed from the opposite ends 52, 54 of blank 50. The cross segments 66 of blank 50 form the first horizontal legs 28 of coil 20, and the connecting segments 67 of blank 50 form the second vertical legs 30 and the connecting segments 32 of coil 20.
An example of a preferred material for coil 20 is a copper flat plate made from OFHC copper 102, 99.95% pure. The magnetic molding material of body 14 is comprised of a powdered iron, a filler, a resin, and a lubricant. The preferred powdered material is manufactured by BASF Corporation, 100 Cherryhill Road, Parsippany, New Jersey under the trade designation Carbonyl Iron, Grade SQ. This SQ material is insulated with 0.875% mass fraction with 75% H3P04. An epoxy resin is also added to the mixture, and the preferred resin for this purpose is manufactured by Morton International, Post Office Box 15240, Reading, Pennsylvania under the trade designation Corvel Black, Number 10-7086.
In addition a lubricant is added to the mixture. The lubricant is a zinc stearate manufactured by Witco Corporation, Box 45296, Huston Texas under the product designation Lubrazinc W.
Various combinations of the above ingredients may be mixed together, but the preferred mixture is as follows:
1,000 grams of the powdered iron. 3.3% by weight of the resin.
0.3% by weight of the lubricant. The above materials (other than the lubricant) are mixed together and then acetone is added to wet the material to a mud-like consistency. The material is then permitted to dry and is screened to a particle size of -50 mesh. The lubricant is then added to complete the material 82. The material 82 is then ready for pressure molding.
The next step in the process involves compressing the material completely around the coil 20 so that it has a density produced by exposure to pressure of from 15 to 25 tons per square inch. This causes the powdered material 82 to be compressed and molded tightly completely around the coil so as to form the inductor body 14 shown in Figure 1 and in Figures 11-13.
At this stage of the production the molded assembly is in the form which is shown in Figure 11. After baking, the leads 16, 18 are formed or bent as shown in Figures 12 and 13. The molded assemblies are then baked at 325°F for one hour and forty-five minutes to set the resin. When compared to other inductive components the IHLP inductor of the present invention has several unique attributes. The conductive coil, lead frame, magnetic core material, and protective enclosure are molded as a single integral low profile unitized body that has termination leads suitable for surface mounting. The construction allows for maximum utilization of available space for magnetic performance and is magnetically self- shielding. The unitary construction eliminates the need for two core halves as was the case with prior art E cores or other core shapes, and also eliminates the associated assembly labor.
The unique conductor winding of the present invention allows for high current operation and also optimizes magnetic parameters within the inductor's footprint.
The manufacturing process of the present invention provides a low cost, high performance package without the dependence on expensive, tight tolerance core materials and special winding techniques.
The magnetic core material has high resistivity (exceeding 3 mega ohms) that enables the inductor as it is manufactured to perform without a conductive path between the surface mount leads. The magnetic material also allows efficient operation up to 1 MHz. The inductor package performance yields a low DC resistance to inductance ratio of two milliOhms per microHenry. A ratio of 5 or below is considered very good.
The unique configuration of the coil 20 reduces its cost of manufacture. Coil 20 may be used in various inductor configurations other than IHLP inductors.
In the drawings and specification there has been set forth a preferred embodiment of the invention, and although specific terms are employed these are used in a generic and descriptive sense only and not for purposes of limitation. Changes in the form and the proportion of parts as well as in the substitution of equivalents are contemplated as circumstances may suggest or render expedient without departing from the spirit or scope of the invention as further defined in the following claims.

Claims

What is claimed is:
1. A high current, low profile inductor comprising: a conductor coil having first and second coil ends; said conductor coil comprising a plurality of coil turns extending around a longitudinal coil axis in an approximate helical path which progresses axially along said coil axis; said coil turns being formed from a flat plate having first and second opposite flat surfaces, at least a portion of each of said flat surfaces of said coil turns facing in an axial direction with respect to said coil axis.
2. A high current low profile inductor according to claim 1 wherein each of said coil turns comprise a coil segment and a connecting segment, said flat surfaces of each of said coil segments facing in said axial direction.
3. A high current low profile inductor according to claim 2 wherein each of said connecting segments interconnects adjacent pairs of said coil segments.
4. A high current low profile inductor according to claim 1 wherein each of said coil segments is approximately L-shaped.
5. A high current low profile inductor according to claim 4 wherein each of said connecting segments comprises a flat plate segment bent at 180 degrees.
6. A high current low profile inductor according to claim 1 and further comprising an inductor body comprised of magnetic material surrounding said coil.
7. A high current low profile inductor according to claim 6 wherein said magnetic material comprises a first powdered iron and a second powdered iron uniformly mixed together and compressed to be in contact with said coil.
8. A high current low profile inductor according to claim 7 wherein said magnetic material has a density formed by exposure to compressive forces of from 15 to 25 tons per square inch.
9. -An inductor comprising: a conductor coil having first and second coil ends; said conductor coil being formed from single elongated flat plate conductor bent into a plurality of accordion folds, each of said folds comprising a coil segment and a connecting segment, said connecting segments interconnecting adjacent pairs of said coil segments to form an approximately helically shaped coil.
10. -An inductor according to claim 9 wherein each of said connecting segments is formed into an approximately 180 degree bend.
11. -An inductor according to claim 9 wherein each of said coil segments is L-shaped.
12. A method for making a high current low profile inductor comprising: taking an elongated plate conductor having a first end, a second end, opposite side edges, opposite flat surfaces, and a longitudinal plate axis; cutting a plurality of slots in each of said opposite side edges of said plate conductor so as to form said plate conductor into a plurality of cross segments extending transversely with respect to said plate axis and a plurality of connecting segments extending approximately axially with respect to said plate axis, said connecting segments connecting said cross segments together into a continuous conductor which extends in a sine shaped path; bending said connecting segments along a bend axis extending transversely with respect to said plate axis so as to form said plate conductor into a plurality of accordion folds, each of which comprise one of said cross segments and a portion of one of said connecting segments, whereby said cross segments and said connecting segments form a continuous conductor coil formed into an approximate helical shape and having first and second opposite ends.
PCT/US2000/006793 1999-03-16 2000-03-15 Inductor coil structure and method for making same WO2000055873A1 (en)

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EP00916363A EP1080477B1 (en) 1999-03-16 2000-03-15 Inductor coil structure and method for making same
DE60040442T DE60040442D1 (en) 1999-03-16 2000-03-15 INDUCTION COIL ASSEMBLY AND MANUFACTURING METHOD THEREOF
JP2000606022A JP4443773B2 (en) 1999-03-16 2000-03-15 Inductor coil structure manufacturing method
CA002328166A CA2328166C (en) 1999-03-16 2000-03-15 Inductor coil structure and method for making same
AU37477/00A AU3747700A (en) 1999-03-16 2000-03-15 Inductor coil structure and method for making same

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US09/271,748 US6198375B1 (en) 1999-03-16 1999-03-16 Inductor coil structure

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7921546B2 (en) 1995-07-18 2011-04-12 Vishay Dale Electronics, Inc. Method for making a high current low profile inductor
US10566129B2 (en) 2016-09-30 2020-02-18 Taiyo Yuden Co., Ltd. Electronic component
RU2747580C1 (en) * 2018-06-28 2021-05-11 Гаову Текнолоджи (Шэньчжэнь) Ко., Лтд. Multilayer coil and its manufacturing method
EP3822017A3 (en) * 2013-12-18 2021-07-07 Aster Co., Ltd. Cold pressure welding apparatus, coil manufacturing apparatus, coil and method of manufacturing the same

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6198375B1 (en) * 1999-03-16 2001-03-06 Vishay Dale Electronics, Inc. Inductor coil structure
US7034645B2 (en) * 1999-03-16 2006-04-25 Vishay Dale Electronics, Inc. Inductor coil and method for making same
US7263761B1 (en) * 1995-07-18 2007-09-04 Vishay Dale Electronics, Inc. Method for making a high current low profile inductor
US6366599B1 (en) 1998-03-16 2002-04-02 Trimble Navigation Limited Fast acquisition of spread-spectrum signals by dynamically varying spacing of search bins
US6985062B2 (en) 2002-09-13 2006-01-10 Matsushita Electric Industrial Co., Ltd. Coil component and method of producing the same
US8102233B2 (en) * 2009-08-10 2012-01-24 Volterra Semiconductor Corporation Coupled inductor with improved leakage inductance control
US9013259B2 (en) 2010-05-24 2015-04-21 Volterra Semiconductor Corporation Powder core material coupled inductors and associated methods
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US8237530B2 (en) * 2009-08-10 2012-08-07 Volterra Semiconductor Corporation Coupled inductor with improved leakage inductance control
JP4378956B2 (en) * 2003-01-17 2009-12-09 パナソニック株式会社 Choke coil and electronic device using the same
JP2004296630A (en) * 2003-03-26 2004-10-21 Matsushita Electric Ind Co Ltd Choke coil and electronic apparatus using the same
JP2005005287A (en) * 2003-06-09 2005-01-06 Matsushita Electric Ind Co Ltd Inductance component and electronic apparatus employing it
JP2005354414A (en) * 2004-06-10 2005-12-22 Canon Inc Image processing apparatus and method
USD581118S1 (en) 2005-04-29 2008-11-18 Bercom International, Llc Hand-held container
JP2007287830A (en) * 2006-04-14 2007-11-01 Sumida Corporation Magnetic element
TW200743434A (en) * 2006-05-11 2007-11-16 Delta Electronics Inc Packaged electronic component for shielding electromagnetic interference
US20080036566A1 (en) 2006-08-09 2008-02-14 Andrzej Klesyk Electronic Component And Methods Relating To Same
US9589716B2 (en) 2006-09-12 2017-03-07 Cooper Technologies Company Laminated magnetic component and manufacture with soft magnetic powder polymer composite sheets
US8941457B2 (en) * 2006-09-12 2015-01-27 Cooper Technologies Company Miniature power inductor and methods of manufacture
US7791445B2 (en) * 2006-09-12 2010-09-07 Cooper Technologies Company Low profile layered coil and cores for magnetic components
US8310332B2 (en) * 2008-10-08 2012-11-13 Cooper Technologies Company High current amorphous powder core inductor
US8466764B2 (en) * 2006-09-12 2013-06-18 Cooper Technologies Company Low profile layered coil and cores for magnetic components
US8378777B2 (en) 2008-07-29 2013-02-19 Cooper Technologies Company Magnetic electrical device
US8018310B2 (en) 2006-09-27 2011-09-13 Vishay Dale Electronics, Inc. Inductor with thermally stable resistance
CN101055797B (en) * 2007-02-16 2011-06-29 深圳市浦天利光电技术有限公司 A making method of the transformer coil, transformer coil and transformer
US20090091313A1 (en) * 2007-10-04 2009-04-09 Teeters Dale E Inductive position sensor with integrated led indicators
JP2009105158A (en) * 2007-10-22 2009-05-14 Tokyo Coil Engineering Kk Coil structure for inductor, and the inductor
US7666688B2 (en) * 2008-01-25 2010-02-23 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing a coil inductor
US9001527B2 (en) * 2008-02-18 2015-04-07 Cyntec Co., Ltd. Electronic package structure
TWI355068B (en) * 2008-02-18 2011-12-21 Cyntec Co Ltd Electronic package structure
US8824165B2 (en) 2008-02-18 2014-09-02 Cyntec Co. Ltd Electronic package structure
US8279037B2 (en) * 2008-07-11 2012-10-02 Cooper Technologies Company Magnetic components and methods of manufacturing the same
US9558881B2 (en) 2008-07-11 2017-01-31 Cooper Technologies Company High current power inductor
US8188824B2 (en) * 2008-07-11 2012-05-29 Cooper Technologies Company Surface mount magnetic components and methods of manufacturing the same
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US9859043B2 (en) 2008-07-11 2018-01-02 Cooper Technologies Company Magnetic components and methods of manufacturing the same
CN102077304B (en) * 2009-02-24 2013-01-30 L&P产权管理公司 Inductively coupled shelving and storage containers
US20100277267A1 (en) * 2009-05-04 2010-11-04 Robert James Bogert Magnetic components and methods of manufacturing the same
US8299882B2 (en) 2009-07-22 2012-10-30 Volterra Semiconductor Corporation Low profile inductors for high density circuit boards
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US9019063B2 (en) 2009-08-10 2015-04-28 Volterra Semiconductor Corporation Coupled inductor with improved leakage inductance control
TWI451458B (en) * 2009-08-25 2014-09-01 Access Business Group Int Llc Flux concentrator and method of making a magnetic flux concentrator
US8174348B2 (en) * 2009-12-21 2012-05-08 Volterra Semiconductor Corporation Two-phase coupled inductors which promote improved printed circuit board layout
US8674802B2 (en) 2009-12-21 2014-03-18 Volterra Semiconductor Corporation Multi-turn inductors
US7994888B2 (en) * 2009-12-21 2011-08-09 Volterra Semiconductor Corporation Multi-turn inductors
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DE102011086876A1 (en) 2011-11-22 2013-05-23 Robert Bosch Gmbh Hand tool case holding device
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US10116230B2 (en) 2013-12-30 2018-10-30 Eaton Capital Unlimited Company Methods, circuits and articles of manufacture for configuring DC output filter circuits
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US9984815B2 (en) 2014-12-22 2018-05-29 Eaton Capital Unlimited Company Wireless power transfer apparatus and power supplies including overlapping magnetic cores
US10038324B2 (en) 2015-01-06 2018-07-31 Eaton Intelligent Power Limited Methods, circuits and articles of manufacture for controlling wireless power transfer responsive to controller circuit states
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US11990766B2 (en) 2019-07-02 2024-05-21 Eaton Intelligent Power Limited Wireless power transfer apparatus with radially arrayed magnetic structures
US20210280361A1 (en) 2020-03-03 2021-09-09 Vishay Dale Electronics, Llc Inductor with preformed termination and method and assembly for making the same
CN112509783B (en) * 2020-08-09 2022-04-12 华为数字能源技术有限公司 Power inductor and preparation method thereof, and system-in-package module

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1764087A1 (en) * 1968-03-30 1971-04-22 Ibm Deutschland Process for the production of folding windings for electrical devices
EP0439389A1 (en) * 1990-01-23 1991-07-31 AEROSPATIALE Société Nationale Industrielle Method of making electromagnetic coils
EP0469609A1 (en) * 1990-08-02 1992-02-05 Bodenseewerk Gerätetechnik GmbH Winding, especially for radiofrequency transformers
JPH04129206A (en) * 1990-09-19 1992-04-30 Toshiba Corp Thin type transformer
JPH04196507A (en) * 1990-11-28 1992-07-16 Tokin Corp Thin type transformer
FR2721431A1 (en) * 1994-06-20 1995-12-22 Ies Automated mfg. process for transformer used in motor vehicle electronics

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2568169A (en) * 1949-05-11 1951-09-18 Zenith Radio Corp Stamped helical coil
JPS4837659A (en) * 1971-09-16 1973-06-02
JPS5638743Y2 (en) * 1976-06-15 1981-09-10
JPS5395136U (en) * 1976-12-29 1978-08-03
DE3104270A1 (en) * 1981-02-07 1982-09-02 Vacuumschmelze Gmbh, 6450 Hanau RADIO INTERFERENCE ARRANGEMENT AND PRODUCTION METHOD
JPS58140104A (en) * 1982-02-16 1983-08-19 Olympus Optical Co Ltd Electric coil
JPS61184806A (en) * 1985-02-12 1986-08-18 Tokyo Kosumosu Denki Kk Spiral coil
JPS6213005A (en) * 1985-07-11 1987-01-21 Toshiba Corp Manufacture of magnetic substance
US4776980A (en) * 1987-03-20 1988-10-11 Ruffini Robert S Inductor insert compositions and methods
JPH0642433B2 (en) * 1987-05-11 1994-06-01 富士電機株式会社 Stationary induction equipment
JPH01266705A (en) * 1988-04-18 1989-10-24 Sony Corp Coil part
ES2079415T3 (en) * 1989-10-26 1996-01-16 Takeshi Ikeda LC NOISE FILTER.
JP2700713B2 (en) * 1990-09-05 1998-01-21 株式会社トーキン Inductor
JPH04215412A (en) * 1990-12-13 1992-08-06 Sony Corp Inductor and molded inductor
JP3108931B2 (en) * 1991-03-15 2000-11-13 株式会社トーキン Inductor and manufacturing method thereof
US5363080A (en) * 1991-12-27 1994-11-08 Avx Corporation High accuracy surface mount inductor
US5414401A (en) * 1992-02-20 1995-05-09 Martin Marietta Corporation High-frequency, low-profile inductor
US5291173A (en) * 1992-02-21 1994-03-01 General Electric Co. Z-foldable secondary winding for a low-profile, multi-pole transformer
JP3160685B2 (en) * 1992-04-14 2001-04-25 株式会社トーキン Inductor
US6198275B1 (en) 1995-06-07 2001-03-06 American Electronic Components Electronic circuit for automatic DC offset compensation for a linear displacement sensor
JPH0661059A (en) * 1992-08-10 1994-03-04 Tdk Corp Inductor and its manufacture
DE69323383T2 (en) * 1992-10-12 1999-06-10 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka Process for the production of an electronic component
US5381124A (en) * 1993-12-29 1995-01-10 General Electric Company Multi-turn z-foldable secondary winding for a low-profile, conductive film transformer
JPH07263234A (en) * 1994-03-25 1995-10-13 Nemitsuku Ramuda Kk Inductance element and its manufacture
US6198375B1 (en) * 1999-03-16 2001-03-06 Vishay Dale Electronics, Inc. Inductor coil structure
CA2180992C (en) 1995-07-18 1999-05-18 Timothy M. Shafer High current, low profile inductor and method for making same
JPH09260126A (en) * 1996-01-16 1997-10-03 Tdk Corp Iron powder for dust core, dust core and manufacture thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1764087A1 (en) * 1968-03-30 1971-04-22 Ibm Deutschland Process for the production of folding windings for electrical devices
EP0439389A1 (en) * 1990-01-23 1991-07-31 AEROSPATIALE Société Nationale Industrielle Method of making electromagnetic coils
EP0469609A1 (en) * 1990-08-02 1992-02-05 Bodenseewerk Gerätetechnik GmbH Winding, especially for radiofrequency transformers
JPH04129206A (en) * 1990-09-19 1992-04-30 Toshiba Corp Thin type transformer
JPH04196507A (en) * 1990-11-28 1992-07-16 Tokin Corp Thin type transformer
FR2721431A1 (en) * 1994-06-20 1995-12-22 Ies Automated mfg. process for transformer used in motor vehicle electronics

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 016, no. 392 (E - 1251) 20 August 1992 (1992-08-20) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 526 (E - 1286) 28 October 1992 (1992-10-28) *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7921546B2 (en) 1995-07-18 2011-04-12 Vishay Dale Electronics, Inc. Method for making a high current low profile inductor
US7986207B2 (en) 1995-07-18 2011-07-26 Vishay Dale Electronics, Inc. Method for making a high current low profile inductor
EP3822017A3 (en) * 2013-12-18 2021-07-07 Aster Co., Ltd. Cold pressure welding apparatus, coil manufacturing apparatus, coil and method of manufacturing the same
US10566129B2 (en) 2016-09-30 2020-02-18 Taiyo Yuden Co., Ltd. Electronic component
US11791086B2 (en) 2016-09-30 2023-10-17 Taiyo Yuden Co., Ltd. Electronic component
RU2747580C1 (en) * 2018-06-28 2021-05-11 Гаову Текнолоджи (Шэньчжэнь) Ко., Лтд. Multilayer coil and its manufacturing method

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US6198375B1 (en) 2001-03-06
ATE410776T1 (en) 2008-10-15
JP4443773B2 (en) 2010-03-31
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KR100408126B1 (en) 2003-12-01
US6449829B1 (en) 2002-09-17
JP5106504B2 (en) 2012-12-26
TW493186B (en) 2002-07-01
US20030016114A1 (en) 2003-01-23
EP1080477B1 (en) 2008-10-08
JP2003526902A (en) 2003-09-09
CA2328166A1 (en) 2000-09-21
JP2009302593A (en) 2009-12-24
JP2012256927A (en) 2012-12-27
US6946944B2 (en) 2005-09-20
KR20010015921A (en) 2001-02-26
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CA2328166C (en) 2003-10-28
CN1296628A (en) 2001-05-23

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