WO2000019788A1 - Connector device for an unwired electronic component with an overlying and underlying electrode - Google Patents

Connector device for an unwired electronic component with an overlying and underlying electrode Download PDF

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Publication number
WO2000019788A1
WO2000019788A1 PCT/DE1999/002629 DE9902629W WO0019788A1 WO 2000019788 A1 WO2000019788 A1 WO 2000019788A1 DE 9902629 W DE9902629 W DE 9902629W WO 0019788 A1 WO0019788 A1 WO 0019788A1
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WO
WIPO (PCT)
Prior art keywords
soldering
circuit board
electrode
connection device
fork
Prior art date
Application number
PCT/DE1999/002629
Other languages
German (de)
French (fr)
Inventor
Karl-Gerd Drekmeier
Frank Templin
Original Assignee
Tyco Electronics Logistics Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Logistics Ag filed Critical Tyco Electronics Logistics Ag
Publication of WO2000019788A1 publication Critical patent/WO2000019788A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • Connection device for a non-wired electronic component with an upper and a lower electrode
  • the invention relates to a connection device for a non-wired electronic component, in particular a cylindrical thermistor, which is to be soldered to a circuit board with a top and a bottom electrode m surface mounting.
  • non-wired components such as hot or PTC thermistor plates
  • PTC thermistor plates that is to say non-linear ceramic components or in the case of cuboid-shaped, installed chip capacitors
  • the problem arises of contacting the top electrode downward on the circuit level. So far, the electrode on top has been contacted by hand with a wire or a ribbon, which means that there was no possibility of integrating m an automatic placement process or m an automatic reflow soldering process.
  • Such components are therefore currently often provided with relatively complex customer-specific connections.
  • the invention is based on the object of providing a connecting device of the type mentioned at the outset which is flexible in terms of dimensions or tolerances with regard to different components and which permits an automatic assembly and soldering process.
  • connection strip which can be fitted and soldered to the circuit board or the component using automatic methods, the first end of which is designed as a soldering fork to be soldered on the electrode located above, and the other end of which can at the same time be positioned m a solder deposit on the circuit board, the shape and contour of the terminal strip bending out so ⁇ leads are that varying level differences between the level of the overhead electrode and the level of the circuit board are compensated.
  • FIGS. 1 and 2 show a first exemplary embodiment of the invention, each schematically in a side view, FIG. 3 not yet isolated connecting strips of the exemplary embodiment according to FIGS. 1 and 2,
  • FIGS. 7 and 8 different details of the embodiment according to FIGS. 4 to 6.
  • the invention provides to automatically populate unwired components, i.e. the electrode at the bottom of the component either makes direct contact with the intended installation location on the circuit board, cf. Figures 1, 2 and 6, or indirectly, cf. Figure 4 and 5. Then, using a separating station of the automatic placement machine, SMD-capable connecting strips are separated from a useful tape, for example picked up and placed, and positioned correctly on the component and the circuit board so that the soldering fork of the connecting strip is on the top lying electrode of the component comes to rest and there in particular, cf. Figures 1 to 3, m immersed a prepared solder depot.
  • the level differences to be compensated for between the level of the above-lying electrode and the circuit board are caused by different component heights or due to component height tolerances.
  • the invention enables all soldering points occurring on the upper side of the component, between the connecting strip and the circuit board and between the electrode and the circuit board located below or an additional flat contact part arranged therebetween at the same time, for example using one of the known reflow soldering methods can be soldered.
  • an elongated connecting strip 1 is used.
  • FIG. 3 shows connection strips 1 in the delivery state which has not yet been separated.
  • the connecting strips are connected in a rung-like manner to the outer webs 2 and 3 and can be delivered wound up on a roll while maintaining an orderly position.
  • the separation from the benefit strips takes place, as indicated in FIG. 3, in zones "a" and "b". This creates U-shaped solder forks 4, 5 for good solder wetting when soldering the connecting strips 1.
  • the roof-shaped contour 8 also enables a level difference of ⁇ 30% of a nominal height "h" to be bridged.
  • the outside 6 of, for example, an embossed dome 7 has a spacing “d” which is matched to the spring behavior of the connecting strip 1 and which is selected such that a stop occurs temporarily when the connecting strip 1 is printed through.
  • the connecting strip 1 can also plastically deform in a defined manner by reducing the cross-section 8.
  • the calotte 7 maintains a defined, stable and closed region 9 for receiving a pick and place suction nozzle 10.
  • the connecting connector 1 is accordingly per Vacuum picked up from an orderly position and automatically transported to the installation location, positioned and m a solder paste layer 11 printed.
  • the dome 7 maintains the stop on the circuit board 12.
  • the resulting reaction force is advantageous for the assembly head to function properly.
  • the vacuum switches off, the nozzle 10 moves upwards, the stop of the spherical cap 7 on the substrate 12 is canceled by springback and the soldering areas of the connecting strip 1 take their defined position for reliable reflow soldering both on the component 13 and on the Circuit board 12 on.
  • the connecting strip is shaped as an angular connecting bracket 14, that a first section 16 is formed between the soldering fork 4 and the protrusion 15, which section rises slightly in relation to the level of the above-lying electrode 17, and that behind the Abwmkelung 15 a second section 18 is provided, which forms a single, slightly oblique to the vertical on the circuit board 12 standing plumb bob 19, so that there is a defined three-point contact between the connecting bracket 14 and component 13 and circuit board 12. This defined three-point contact can therefore compensate for component tolerances and, to a certain extent, component variations.
  • the connecting bracket 14 is recognizably designed so that it basically has a positive tolerance m in height with respect to the component 13.
  • the center of gravity of the connecting bend 14 is such that the connecting bend 14 tilts forward at any time and contacts the component 13.
  • the angle between the essential sections 16 and 18 of the connecting bend 14 is, for example, approximately 100 °.
  • the connection bracket 14 is soldered to the circuit board 12 and the component 13 by melting the solder.
  • the solder foot 19 can also be provided with its own solder depot instead of that on the circuit board 12, it is then simply positioned on the intended solder support point on the circuit board 12.
  • the prongs of the soldering fork 4 and the lower end of the soldering foot 19 are each curved, cf.
  • Figure 4 wherein the bulges 21 of the soldering fork 4 and 90 ° are offset from the curvature 22 of the solder base 19.
  • the stability of a three-point position is provided even when the bracket 14 is tilted or displaced.
  • connection bend 14 can be fed on the punching belt 23, cf. FIG. 7.
  • the individual connecting bow 14 is then separated from the assembly directly before the assembly.
  • the length according to FIG. 7 allows the length of the bow egg 14 to be determined directly when punching out.
  • an underside contact of the component 13 can also be carried out if necessary, cf. FIGS. 4, 5 and 8.
  • the electrode 24 of the component 13 lying at the bottom is thereby by means of a flaky contact part 25, the upper side of which can be soldered to the electrode 24 by means of a solder deposit and the underside of which is a soldering die integrally formed 26, indirectly and at a distance from the circuit board 12 can be connected to the latter.
  • the field of application of the invention is in particular hybrids or other assemblies with PTC fuses against touching the network.

Abstract

The invention relates to a connector strip (1) comprising a first end that is configured as a hard-solderable soldering fork (4) on an overlying electrode (17) and a second end that can be simultaneously positioned in a soldering terminal on the circuit board (12). The shape and bending contour of the connector strip (1) are designed in such a way that it is possible to compensate for differences in level between the overlying electrode (17) and the circuit board (12).

Description

Beschreibungdescription
Anschlußvorrichtung für ein unbedrahtetes elektronisches Bauelement mit einer oben liegenden und einer unten liegenden ElektrodeConnection device for a non-wired electronic component with an upper and a lower electrode
Die Erfindung betrifft eine Anschlußvorrichtung für ein unbedrahtetes elektronisches Bauelement, insbesondere einen zylindrischen Heißleiter, das m Oberflachenmontage mit einer oben liegenden und einer unten liegenden Elektrode auf eine Schaltungsplatine zu verlöten ist.The invention relates to a connection device for a non-wired electronic component, in particular a cylindrical thermistor, which is to be soldered to a circuit board with a top and a bottom electrode m surface mounting.
Bei unbedrahteten Bauelementen, wie beispielsweise Heiß- oder Kaltleiterplattchen, also nichtlinearen keramischen Bauele- menten oder bei quaderformigen, aufgestellten Chip- Kondensatoren stellt sich das Problem, die oben liegende Elektrode nach unten auf die Schaltungsebene zu kontaktieren. Bisher wurde die oben liegende Elektrode von Hand mit einem Draht oder einem Bandchen kontaktiert, wodurch keine Moglich- keit der Integration m ein automatisches Bestuck-Verfahren bzw. m ein automatisches Reflow-Lotverfahren gegeben war. Derartige Bauelemente sind deshalb derzeit häufig mit relativ aufwendigen kundenspezifischen Anschlüssen versehen.In the case of non-wired components, such as hot or PTC thermistor plates, that is to say non-linear ceramic components or in the case of cuboid-shaped, installed chip capacitors, the problem arises of contacting the top electrode downward on the circuit level. So far, the electrode on top has been contacted by hand with a wire or a ribbon, which means that there was no possibility of integrating m an automatic placement process or m an automatic reflow soldering process. Such components are therefore currently often provided with relatively complex customer-specific connections.
Der Erfindung liegt αie Aufgabe zugrunde, eine Anschlußvorrichtung der eingangs genannten Art zu schaffen, die flexibel hinsichtlich variierender Bauele enteabmessungen bzw. -toleranzen ist, und die einen automatischen Bestück- und Lotprozeß erlaubt.The invention is based on the object of providing a connecting device of the type mentioned at the outset which is flexible in terms of dimensions or tolerances with regard to different components and which permits an automatic assembly and soldering process.
Diese Aufgabe wird bei einer Anschlußvorrichtung der eingangs genannten Art gelost durch einen Anschlußstreifen, der mit automatischen Verfahren auf die Schaltungsplatine bzw. das Bauelement bestück- und dort verlotbar ist, dessen erstes En- de als auf der oben liegenden Elektrode zu verlotende Lotgabel ausgebildet ist, und dessen anderes Ende gleichzeitig m ein Lotαepot auf der Schaltungsplatine positionierbar ist, wobei Form und Biegekontur des Anschlußstreifens so ausge¬ führt sind, daß variierende Niveauunterschiede zwischen dem Niveau der oben liegenden Elektrode und dem Niveau der Schaltungsplatine ausgleichbar sind.This object is achieved in a connection device of the type mentioned at the outset by a connection strip which can be fitted and soldered to the circuit board or the component using automatic methods, the first end of which is designed as a soldering fork to be soldered on the electrode located above, and the other end of which can at the same time be positioned m a solder deposit on the circuit board, the shape and contour of the terminal strip bending out so ¬ leads are that varying level differences between the level of the overhead electrode and the level of the circuit board are compensated.
Weiterbildungen der Erfindung sind m Unteranspruchen gekennzeichnet .Developments of the invention are characterized in m subclaims.
Im folgenden werden mehrere Ausfuhrungsformen der Erfindung anhand der Figuren der Zeichnung naher erläutert. Dabei zeigt Figur 1 und 2 ein erstes Ausfuhrungsbeispiel der Erfindung, jeweils schematisch m Seitenansicht, Figur 3 noch nicht vereinzelte Anschlußstreifen der Ausfuhrung gemäß Figur 1 und 2,In the following, several embodiments of the invention are explained in more detail with reference to the figures of the drawing. 1 and 2 show a first exemplary embodiment of the invention, each schematically in a side view, FIG. 3 not yet isolated connecting strips of the exemplary embodiment according to FIGS. 1 and 2,
Figur 4 bis 6 verschiedene perspektivische Draufsichten auf ein zweites Ausfuhrungsbeispiel der Erfindung, Figur 7 und 8 verschiedene Details der Ausfuhrungsform gemäß Figur 4 bis 6.4 to 6 different perspective top views of a second exemplary embodiment of the invention, FIGS. 7 and 8 different details of the embodiment according to FIGS. 4 to 6.
Die Erfindung sieht vor, unbedrahtete Bauelemente automatisch zu bestucken, d.h. die unten liegende Elektrode des Bauelements kontaktiert den dafür vorgesehenen Einbauplatz auf der Scnaltungsplatme entweder unmittelbar, vgl. Figur 1,2 und 6, oder indirekt, vgl. Figur 4 und 5. Danach werden mittels einer Trennstation des Bestuckautomaten SMD-fahige Anschlußstreifen von einem Nutzenband abgetrennt, beispielsweise per Pick- und Place-Verfahren abgeholt, und lagerichtig auf dem Bauelement und der Schaltungsplatine so positioniert, daß die Lotgabel des Anschlußstreifens auf der oben liegenden Elektrode des Bauelements zu liegen kommt und dort insbesondere, vgl. Figuren 1 bis 3, m ein vorbereitetes Lotdepot eintaucht.The invention provides to automatically populate unwired components, i.e. the electrode at the bottom of the component either makes direct contact with the intended installation location on the circuit board, cf. Figures 1, 2 and 6, or indirectly, cf. Figure 4 and 5. Then, using a separating station of the automatic placement machine, SMD-capable connecting strips are separated from a useful tape, for example picked up and placed, and positioned correctly on the component and the circuit board so that the soldering fork of the connecting strip is on the top lying electrode of the component comes to rest and there in particular, cf. Figures 1 to 3, m immersed a prepared solder depot.
Die zwischen dem Niveau der oben liegenden Elektrode und dem αer Schaltungsplatine auszugleichenden Niveauunterschiede kennen bedingt sein durch unterschiedliche Bauteilhohen oder durch Bauteilhohen-Toleranzen. Die Erfindung ermöglicht, daß alle auftretenden Lotstellen an der Oberseite des Bauelements, zwischen dem Anschlußstreifen und der Schaltungsplatine und zwischen der unten liegenden Elektrode und der Schal- tungsplatme bzw. einem dazwischen angeordneten, zusätzlichen flächigen Kontaktteil gleichzeitig, beispielsweise mit einem der bekannten Reflow-Lotverfahren gelotet werden können.The level differences to be compensated for between the level of the above-lying electrode and the circuit board are caused by different component heights or due to component height tolerances. The invention enables all soldering points occurring on the upper side of the component, between the connecting strip and the circuit board and between the electrode and the circuit board located below or an additional flat contact part arranged therebetween at the same time, for example using one of the known reflow soldering methods can be soldered.
Bei der Ausführung gem ß Figuren 1 bis 3 wird ein länglicher Anschlußstreifen 1 verwendet. Die Biegekontur des Anschlußstreifens 1 aus beispielsweise 0,15 mm dickem, lotbaren Fe- dermaterial ist so ausgelegt, daß, insbesondere mit Hilfe der vorgesehenen dachförmigen Konturδ , Niveauunterschiede von ± 30° eines Nennmaßes sicher kontaktiert werden können.In the embodiment according to FIGS. 1 to 3, an elongated connecting strip 1 is used. The bending contour of the connecting strip 1, made, for example, of 0.15 mm thick, solderable spring material, is designed such that, in particular with the aid of the roof-shaped contour δ provided, level differences of ± 30 ° of a nominal dimension can be reliably contacted.
Figur 3 zeigt Anschlußstreifen 1 im noch nicht vereinzelten Anlieferzustand. Die Anschlußstreifen sind sprossenartig mit den Außenstegen 2 und 3 verbunden und können aufgespult auf eine Rolle angeliefert werden unter Beibehaltung einer geord- neten Lage. Das Vereinzeln aus dem Nutzenstreifen erfolgt, wie m Figur 3 angedeutet, m den Zonen "a" und "b" . Dabei entstehen U-formige Lotgabeln 4, 5 für eine gute Lotbenetzung beim Loten der Anschlußstreifen 1.FIG. 3 shows connection strips 1 in the delivery state which has not yet been separated. The connecting strips are connected in a rung-like manner to the outer webs 2 and 3 and can be delivered wound up on a roll while maintaining an orderly position. The separation from the benefit strips takes place, as indicated in FIG. 3, in zones "a" and "b". This creates U-shaped solder forks 4, 5 for good solder wetting when soldering the connecting strips 1.
In Figur 1 und 2 ist erkennbar, daß die dachförmige Kontur 8 onne weiteres eine Uberbruckung einer Niveaudifferenz von ± 30% einer Nennhohe "h" ermöglicht. Die Außenseite 6 einer beispielsweise geprägten Kalotte 7 hat einen auf das Federverhalten des Anschlußstreifens 1 abgestimmten Abstand "d", der so gewählt ist, daß beim Durchdrucken des Anschlußstreifens 1 temporar ein Anschlag entsteht. Dabei kann sich der Anschlußstreifen 1 definiert auch plastisch verformen durch eine Querschnittsreduzierung 8. Die Kalotte 7 gewahrt einen definiert stabilen und m sich geschlossenen Bereich 9 für αie Aufnahme einer Pick- und Place-Saugduse 10. Der Anschluß- s~reιfen 1 wird demnach per Vakuum aus einer geordneten Lage aufgenommen und automatisch zum Einbauplatz transportiert, positioniert und m eine Lotpastenschicht 11 eingedruckt. Den Anschlag auf die Schaltungsplatine 12 gewahrt die Kalotte 7. Die dabei entstehende Reaktionskraft ist für eine einwandfreie Funktion des Bestuckkopfes vorteilhaft. Danach schaltet das Vakuum ab, die Bestuckduse 10 fahrt nach oben, der Anschlag der Kalotte 7 auf dem Substrat 12 wird durch Ruckfederung aufgehoben und die Lotbereiche des Anschlußstreifens 1 nehmen ihre definierte Position für eine sichere Reflow- Lotung sowohl auf dem Bauelement 13 wie auf der Schaltungs- platme 12 ein.It can be seen in FIGS. 1 and 2 that the roof-shaped contour 8 also enables a level difference of ± 30% of a nominal height "h" to be bridged. The outside 6 of, for example, an embossed dome 7 has a spacing “d” which is matched to the spring behavior of the connecting strip 1 and which is selected such that a stop occurs temporarily when the connecting strip 1 is printed through. In this case, the connecting strip 1 can also plastically deform in a defined manner by reducing the cross-section 8. The calotte 7 maintains a defined, stable and closed region 9 for receiving a pick and place suction nozzle 10. The connecting connector 1 is accordingly per Vacuum picked up from an orderly position and automatically transported to the installation location, positioned and m a solder paste layer 11 printed. The dome 7 maintains the stop on the circuit board 12. The resulting reaction force is advantageous for the assembly head to function properly. Then the vacuum switches off, the nozzle 10 moves upwards, the stop of the spherical cap 7 on the substrate 12 is canceled by springback and the soldering areas of the connecting strip 1 take their defined position for reliable reflow soldering both on the component 13 and on the Circuit board 12 on.
In Figur 4 bis 7 ist erkennbar, daß der Anschlußstreifen als winkelartiger Anschlußbugel 14 ausgeformt ist, daß ein erster, zwischen Lotgabel 4 und Abwmkelung 15 liegender Ab- schnitt 16 gebildet ist, der gegenüber dem Niveau der oben liegenden Elektrode 17 leicht ansteigend verlauft, und daß hinter der Abwmkelung 15 ein zweiter Abschnitt 18 vorgesehen ist, der einen einzelnen, leicht schräg zur vertikalen auf der Schaltungsplatine 12 stehenden Lotfuß 19 bildet, so daß sich eine definierte Dreipunktberuhrung zwischen dem Anschlußbugel 14 und Bauelement 13 und Schaltungsplatine 12 ergibt. Durch diese definierte Dreipunktberuhrung können demnach Bauteil-Toleranzen und bis zu einem gewissen Grad auch Bauteilvariationen ausgeglichen werden. Der Anschlußbugel 14 ist erkennbar so ausgeführt, daß er grundsätzlich eine positive Toleranz m der Hohe gegenüber dem Bauelement 13 aufweist. Durch seine Ausformung, vgl. beispielsweise die Quer- schnittsreduzierung des Lotfußes 19 gemäß Figur 5, liegt der Schwerpunkt des Anschlußbugeis 14 so, daß der Anschlußbugel 14 jederzeit nach vorn kippt und das Bauelement 13 kontaktiert. Der Winkel zwischen den wesentlichen Abschnitten 16 und 18 des Anschlußbugeis 14 betragt beispielsweise etwa 100°.It can be seen in FIGS. 4 to 7 that the connecting strip is shaped as an angular connecting bracket 14, that a first section 16 is formed between the soldering fork 4 and the protrusion 15, which section rises slightly in relation to the level of the above-lying electrode 17, and that behind the Abwmkelung 15 a second section 18 is provided, which forms a single, slightly oblique to the vertical on the circuit board 12 standing plumb bob 19, so that there is a defined three-point contact between the connecting bracket 14 and component 13 and circuit board 12. This defined three-point contact can therefore compensate for component tolerances and, to a certain extent, component variations. The connecting bracket 14 is recognizably designed so that it basically has a positive tolerance m in height with respect to the component 13. Due to its shape, cf. For example, the reduction in cross section of the solder foot 19 according to FIG. 5, the center of gravity of the connecting bend 14 is such that the connecting bend 14 tilts forward at any time and contacts the component 13. The angle between the essential sections 16 and 18 of the connecting bend 14 is, for example, approximately 100 °.
Auf der Schaltungsplatine 12 wird der Anschluß des Bugeis 14, also das untere Ende des Lotfußes 19, ein Lotpad mit Lotpaste gesetzt. Am anderen Ende, dem Kontakt zum Bauelement 13, verfugt der Anschlußbugel 14 vorteilhaft selbst über ein Lotdepot 20. Dieses kann an den Zinken der Lotgabel 4 an ih¬ rer Unterseite beispielsweise aufgewalzt sein. Beim Durchlaufen durch den Reflow-Ofen wird der Anschlußbugel 14 mit der Schaltungsplatine 12 und dem Bauelement 13 durch Aufschmelzen des Lotes verlotet. Naturlich kann auch der Lotfuß 19 mit einem eigenen Lotdepot anstatt dem auf der Platine 12 versehen werden, er wird dann einfach auf dem vorgesehenen Lotstutzpunkt auf der Platine 12 positioniert.On the circuit board 12, the connection of the Bugeis 14, that is, the lower end of the solder foot 19, a solder pad with solder paste is placed. At the other end, the contact to the component 13, the Anschlußbugel grouted 14 advantageously even over a solder reservoir 20. This can be applied to the tines Lotgabel 4 at ih ¬ rer underside example, be rolled. When passing through the reflow oven, the connection bracket 14 is soldered to the circuit board 12 and the component 13 by melting the solder. Of course, the solder foot 19 can also be provided with its own solder depot instead of that on the circuit board 12, it is then simply positioned on the intended solder support point on the circuit board 12.
Hinsichtlich einer stabilen, toleranzausgleichenden Drei- punktlage ist es vorteilhaft, daß die Zinken der Lotgabel 4 und das untere Ende αes Lotfußes 19 jeweils mit einer Wölbung versehen sind, vgl. beispielsweise Figur 4, wobei die Wolbun- gen 21 der Lotgabel 4 und 90° gegenüber der Wölbung 22 des Lotfußes 19 versetzt sind. Dadurch ist auch bei verkipptem bzw. verschobenem Bügel 14 die Stabilität einer Dreipunktlage gegeben. Durch Einbringung des Lotdepots m den Anschlußbugel 14 ist es möglich, diesen im konventionellen automatischen Bestuckprozeß mit zu bestucken, ohne zusätzlich Lotpaste dis- pensen zu müssen. Daααrch wird es möglich, zylindrische unbe- drahtete Bauelemente ohne zusätzliche manuelle oder dem Auto- matenbestucker atypische Arbeitsgange zu bestucken.With regard to a stable, tolerance-compensating three-point position, it is advantageous that the prongs of the soldering fork 4 and the lower end of the soldering foot 19 are each curved, cf. For example, Figure 4, wherein the bulges 21 of the soldering fork 4 and 90 ° are offset from the curvature 22 of the solder base 19. As a result, the stability of a three-point position is provided even when the bracket 14 is tilted or displaced. By introducing the solder depot into the connection bow 14, it is possible to also populate it in the conventional automatic placement process without having to additionally dispense solder paste. This makes it possible to equip cylindrical, unwired components without additional manual or automatic operations that are atypical for automated systems.
Die Zufuhrung des Anschlußbugeis 14 kann am Stanzband 23 erfolgen, vgl. Figur 7. Der einzelne Anschlußbugel 14 wird dann direkt vor dem Bestucken aus dem Verbund getrennt. Durch die Ausfuhrung gemäß Figur 7 kann die Lange des Bugeis 14 direkt beim Ausstanzen bestimmt werden.The connection bend 14 can be fed on the punching belt 23, cf. FIG. 7. The individual connecting bow 14 is then separated from the assembly directly before the assembly. The length according to FIG. 7 allows the length of the bow egg 14 to be determined directly when punching out.
In ahnlicher Technologie, also Stanzteil mit Lotdepot, kann bei Bedarf auch eine Unterseitenkontaktierung des Bauelements 13 ausgeführt werden, vgl. Figur 4,5 und 8. Wie dargestellt, ist dadurch die unten liegende Elektrode 24 des Bauelements 13 mittels eines flac igen Kontaktteils 25, dessen Oberseite irittels eines Lotdepots mit der Elektrode 24 verlotbar ist und dessen Unterseite ein e stuckig angeformtes Lotdreibem 26 aufweist, indirekt und mit Abstand zur Schaltungsplatine 12 an diese anschließbar.In a similar technology, that is to say a stamped part with a solder depot, an underside contact of the component 13 can also be carried out if necessary, cf. FIGS. 4, 5 and 8. As shown, the electrode 24 of the component 13 lying at the bottom is thereby by means of a flaky contact part 25, the upper side of which can be soldered to the electrode 24 by means of a solder deposit and the underside of which is a soldering die integrally formed 26, indirectly and at a distance from the circuit board 12 can be connected to the latter.
Als Anwendungsgebiet der Erfindung ist insbesondere an Hybri- de oder andere Baugruppen mit PTC-Sicherungen gegen Netzberührungen zu denken. The field of application of the invention is in particular hybrids or other assemblies with PTC fuses against touching the network.

Claims

Patentansprüche claims
1. Anschlußvorrichtung für ein unbedrahtetes elektronisches Bauelement, insbesondere einen zylindrischen Heißleiter, das m Oberflachenmontage mit einer oben liegenden und einer unten liegenden Elektrode auf eine Schaltungsplatine zu verlö¬1. Connection device for a non-wired electronic component, in particular a cylindrical thermistor, to be soldered to a circuit board with a top and bottom electrode on the surface mounting
gekennzeic net durch einen Anschlußstreifen (1) , - der mit automatischen Verfahren auf die Schaltungsplatine (12) bzw. das Bauelement (13) bestück- und verlotbar ist,gekennzeic net by a connecting strip (1), - which can be fitted and soldered with automatic methods on the circuit board (12) or the component (13),
- dessen erstes Ende als auf der oben liegenden Elektrode (17) zu verlotende Lotgabel (4) ausgebildet ist, und dessen anderes Ende (5, 19) gleichzeitig m einem Lotstutzpunkt auf der Schaltungsplatine (12) positionierbar ist,the first end of which is designed as a soldering fork (4) to be soldered on the electrode (17) above, and the other end (5, 19) of which can be positioned simultaneously on the circuit board (12) in a soldering support point,
- wobei Form und Biegekontur des Anschlußstreifens (1) so ausgeführt sind, daß variierende Niveauunterschiede zwischen dem Niveau der oben liegenden Elektrode (17) und dem Niveau der Schaltungsplatine (12) ausgleichbar sind.- The shape and bending contour of the connecting strip (1) are designed so that varying level differences between the level of the top electrode (17) and the level of the circuit board (12) can be compensated.
2. Anschlußvorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß der Anschlußstreifen (1) aus d nnem Federblech gebildet ist und einen Abschnitt mit einer dachförmigen Kontur (8) für αen Niveauausgleich aufweist.2. Connection device according to claim 1, characterized in that the connecting strip (1) is formed from thin spring plate and has a section with a roof-shaped contour (8) for αen level compensation.
3. Anschlußvorrichtung nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß der Anschlußstreifen (1) einen Abschnitt aufweist, m dem eine Kalotte (7) als Aufnahmebereich (9) für eine Pick- und Place-Saugduse (10) vorgesehen ist.3. Connection device according to claim 1 or 2, characterized in that the connecting strip (1) has a section m a dome (7) is provided as a receiving area (9) for a pick and place suction nozzle (10).
4. Anschlußvorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß der Anschlußstreifen als winkelartiger Anschlußbugel (14) ausgeformt ist, daß ein erster, zwischen Lotgabel (4) und Abwmkelung (15) liegender Abschnitt (16) gebildet ist, der gegenüber dem Niveau der oben liegenden Elektrode (17) leicht ansteigend verläuft, und daß hinter der Abwmkelung (15) ein zweiter Abschnitt (18) vorgesehen ist, der einen einzelnen, leicht schräg zur Vertikalen auf der Schaltungs- platine (12) stehenden Lötfuß (19) bildet, so daß sich eine definierte Dreipunktberuhrung zwischen dem Anschlußbügel (14) und Bauelement (13) und Schaltungsplatine (12) ergibt.4. Connection device according to claim 1, characterized in that the connection strip is formed as an angular connection bracket (14), that a first, between soldering fork (4) and Abwmkelung (15) lying section (16) is formed, which extends slightly upwards from the level of the upper electrode (17), and that behind the development (15) there is a second section (18) which has a single soldering foot on the circuit board (12) which is slightly oblique to the vertical (19) forms, so that there is a defined three-point contact between the connecting bracket (14) and component (13) and circuit board (12).
5. Anschlußvorrichtung nach Anspruch 4, dadurch gekennzeichnet, daß die Zinken der Lötgabel (4) und das untere Ende des Lötfußes (19) jeweils mit einer Wölbung versehen sind, wobei die Wölbungen (21) der Lötgabel (4) um 90° gegenüber der Wölbung (22) des Lötfußes (19) versetzt sind.5. Connection device according to claim 4, characterized in that the prongs of the soldering fork (4) and the lower end of the soldering foot (19) are each provided with a curvature, the curvatures (21) of the soldering fork (4) by 90 ° compared to the Curvature (22) of the solder foot (19) are offset.
6. Anschlußvorrichtung nach Anspruch 4 oder 5, dadurch gekennzeichnet, daß die Zinken der Lötgabel (4) an ihrer Unterseite jeweils über ein Lotdepot (20) verfügen.6. Connection device according to claim 4 or 5, characterized in that the prongs of the soldering fork (4) each have a solder depot (20) on their underside.
7. Anschlußvorrichtung nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, daß die unten liegende Elektrode (24) des Bauelements (13) mittels eines flächigen Kontaktteils (25) , dessen Oberseite mittels eines Lotdepots (20) mit der Elektrode (24) verlötbar ist, und dessen Unterseite ein einstückig angeformtes Lötdreibein (26) aufweist, indirekt und mit Abstand zur Schaltungsplatine (12) an diese anschließbar ist. 7. Connection device according to one of claims 1 to 6, characterized in that the underlying electrode (24) of the component (13) by means of a flat contact part (25), the top of which can be soldered to the electrode (24) by means of a solder deposit (20) and the underside of which has an integrally formed soldering tripod (26), can be connected indirectly and at a distance to the circuit board (12).
PCT/DE1999/002629 1998-09-30 1999-08-23 Connector device for an unwired electronic component with an overlying and underlying electrode WO2000019788A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19844946 1998-09-30
DE19844946.1 1998-09-30

Publications (1)

Publication Number Publication Date
WO2000019788A1 true WO2000019788A1 (en) 2000-04-06

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006116967A2 (en) * 2005-05-02 2006-11-09 Epcos Ag Power capacitor
US8339767B2 (en) 2005-05-02 2012-12-25 Epcos Ag Power capacitor
WO2017167696A1 (en) * 2016-03-29 2017-10-05 Epcos Ag Electrolytic capacitor
DE102014203755B4 (en) 2013-02-28 2024-02-22 Denso Corporation ELECTRONIC PART AND ELECTRONIC CONTROL UNIT

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5632629A (en) * 1993-09-14 1997-05-27 Zierick Manufacturing Corporation Mount electrical connectors

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5632629A (en) * 1993-09-14 1997-05-27 Zierick Manufacturing Corporation Mount electrical connectors

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006116967A2 (en) * 2005-05-02 2006-11-09 Epcos Ag Power capacitor
WO2006116967A3 (en) * 2005-05-02 2007-05-18 Epcos Ag Power capacitor
EP2264726A1 (en) * 2005-05-02 2010-12-22 Epcos Ag Power capacitor
US8339767B2 (en) 2005-05-02 2012-12-25 Epcos Ag Power capacitor
US8416556B2 (en) 2005-05-02 2013-04-09 Conti Temic Microelectronic Gmbh Power capacitor
DE102014203755B4 (en) 2013-02-28 2024-02-22 Denso Corporation ELECTRONIC PART AND ELECTRONIC CONTROL UNIT
WO2017167696A1 (en) * 2016-03-29 2017-10-05 Epcos Ag Electrolytic capacitor
US10957492B2 (en) 2016-03-29 2021-03-23 Tdk Electronics Ag Electrolytic capacitor

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