WO2000017690A1 - Device for connecting optical waveguides to an electric circuit - Google Patents

Device for connecting optical waveguides to an electric circuit Download PDF

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Publication number
WO2000017690A1
WO2000017690A1 PCT/DE1999/002648 DE9902648W WO0017690A1 WO 2000017690 A1 WO2000017690 A1 WO 2000017690A1 DE 9902648 W DE9902648 W DE 9902648W WO 0017690 A1 WO0017690 A1 WO 0017690A1
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WO
WIPO (PCT)
Prior art keywords
converter
transducer
adjustment
chip
adjusting
Prior art date
Application number
PCT/DE1999/002648
Other languages
German (de)
French (fr)
Inventor
Jürgen Bauer
Roland Birnbaum
Original Assignee
Tyco Electronics Logistics Ag
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Filing date
Publication date
Application filed by Tyco Electronics Logistics Ag filed Critical Tyco Electronics Logistics Ag
Publication of WO2000017690A1 publication Critical patent/WO2000017690A1/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4226—Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G02B6/4259—Details of housings having a supporting carrier or a mounting substrate or a mounting plate of the transparent type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
    • G02B6/4261—Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors

Definitions

  • the invention relates to a device for connecting optical waveguides to an electrical circuit with a support structure carrying at least one converter and provided with connection contacts.
  • Such devices are generally known. Usually, these are converter modules that have a lead frame as the support structure, which also forms the connecting pins of the converter module. Optoelectronic converter chips and control chips with gold wires are connected to the lead frame. The lead frame and the optoelectronic converter chips and control chips attached to it are cast in a cast resin body which protects the lead frame and the optoelectronic converter chips and control chips attached to it from mechanical damage.
  • the known optical converter modules are usually introduced into pin headers, to which socket headers can be connected, which carry the optical fibers.
  • socket headers can be connected, which carry the optical fibers.
  • a very precise adjustment of the optical converter chip to the optical axis of the optical waveguide is required. This in turn requires precise adjustment of the optoelectronic converter module in the pin header.
  • a disadvantage of the known converter modules is that the position of the converter chips with respect to the outer edges of the cast resin body is subject to relatively large manufacturing tolerances, since the cast resin body generally warps somewhat during curing.
  • the consequence of this fact is that when assembling the conventional converter modules technically complex and expensive adjustment step must be gene conditions to align the position of the transducer chips on the optical axis of the optical fiber.
  • the invention has for its object to provide a transducer module, the transducer sen can be aligned by a simple joining process to the associated optical fiber.
  • the object is achieved in that at least one adjustment section is formed on at least one connection contact, by means of which the position of each transducer can be aligned with the associated optical waveguide.
  • the support structure can be inserted into a holder which is complementary to the adjustment sections in order to fasten the transducer to the support structure, so that the transducer attached to the support structure has a position with high accuracy defined after assembly de adopts adjustment sections.
  • the adjustment sections can also be used to align the transducer module during assembly in the pin header, because by inserting the adjustment sections into a complementary holder of the pin header, it is possible to align the transducer with high accuracy to the optical axis of the optical waveguide. No active adjustment is required when installing the converter module in a pin header. As a result, the cycle times when installing the converter module according to the invention in a pin header can be significantly reduced compared to the cycle times when installing conventional converter modules in the pin header.
  • FIG. 1 shows a partially broken side view of a converter module provided with adjusting tabs on the connecting pins
  • FIG. 2 shows a cross-sectional view of the converter module from FIG. 1 along the section line II-II;
  • FIG. 3 shows a partially broken perspective view of the converter module from FIGS. 1 and 2;
  • FIG. 4 shows a partially broken top view of a further exemplary embodiment of the converter module;
  • FIG. 5 shows a cross-sectional view of the converter module from FIG. 4 along the section line V-V; and
  • FIG. 6 to FIG. 12 further embodiments of the adjustment flap.
  • the optoelectronic converter module 1 has a converter chip 2, which is, for example, a light-emitting diode or a photodiode.
  • the converter chip 2 is attached to a lead frame 4 via a base 3.
  • a control chip 5 is also attached to the lead frame 4, which contains the control logic required to control the converter chip 2.
  • the lead frame 4 merges outside of a synthetic resin housing 6, which surrounds the converter chip 2 and the control chip 5, into a row of connecting pins 7 arranged next to one another.
  • An adjusting tab 8 is formed on each of the outer connecting pins 7. The outer edges of the adjustment tabs 8 are in a position, which is defined with high accuracy, with respect to the transducer chip 2. This is indicated in FIG. 1 by the double arrows 9 and 10.
  • the lead frame 4 is first punched out of a sheet metal.
  • the lead frame 4 is then introduced into a holder which is complementary to the adjustment tabs 8 and then the transducer chip 2 is fastened to the lead frame 4 via the base 3.
  • the transducer chip 2 is applied to the lead frame 4 in such a way that the converter chip 2 assumes a position defined with high accuracy with respect to the outer edges of the adjusting tabs 8.
  • the outer edges of the adjustment tabs 8 are used for insertion into a complementary holder, so that the transducer chip 2 arrives in a well-defined position with respect to the assigned optical fibers, which are arranged in a socket connector that can be plugged onto the pin header.
  • Transducer module 1 in a pin header only needs to be adjusted passively by inserting the converter module into a complementary holder.
  • the cycle times when installing the converter module 1 in the pin header can be significantly reduced compared to the assembly of conventional converter modules in a pin header.
  • the converter module 1 is also suitable for mass production in that stamped sheets can be inexpensively produced in large quantities.
  • FIG. 4 shows a further exemplary embodiment of the converter module 1.
  • 8 recesses 11 are made in the adjustment tabs.
  • the center points and thus also the inner surface of the circular recesses 11 are in one position defined with high accuracy with respect to the converter chip 2.
  • the exemplary embodiment shown in FIGS. 4 and 5 has the advantage that the inner surface of the recess 11 used as a reference is not freely accessible and is therefore better protected from damage than the outer edges of the adjusting flaps 8 of the off shown in FIGS. 1 to 3 - example of leadership.
  • FIGS. 6 to 12 show further embodiments of the adjustment tab 8.
  • the adjustment tabs 8 are preferably arranged in the vicinity of the location at which the connecting pins 7 emerge from the plastic resin housing 6 in order to achieve a high strength of the adjustment tabs 8 and to prevent the adjustment tabs 8 from bending or opening another way to be damaged.
  • adjustment tabs 8 can be used which, as shown in FIGS. 9 and 12, have a notch 14.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

A converter component (1) is provided with adjusting lugs (8) on connector pins (7), whereby the outer edge thereof can be positioned in a highly accurate and defined manner in relation to a converter chip (2). By inserting a stamped grid (4) into a complimentary fixture to said adjusting lugs (8), the converter chip can be placed in a precisely defined position in relation to the reference surfaces of the adjusting lugs (8). The adjusting lugs (8) can also be used to align the converter chip (2) with an associated waveguide when the converter components are assembled in a plug connector.

Description

Beschreibungdescription
Vorrichtung für den Anschluß von Lichtwellenleitern an eine elektrische SchaltungDevice for connecting optical fibers to an electrical circuit
Die Erfindung betrifft eine Vorrichtung für den Anschluß von Lichtwellenleitern an eine elektrische Schaltung mit einer wenigstens einen Wandler tragenden und mit Anschlußkontakten versehenen Trägerstruktur.The invention relates to a device for connecting optical waveguides to an electrical circuit with a support structure carrying at least one converter and provided with connection contacts.
Derartige Vorrichtungen sind allgemein bekannt. Üblicherweise handelt es sich um Wandlerbausteine, die als Trägerstruktur ein Stanzgitter aufweisen, das auch die Anschlußstifte des Wandlerbausteins bildet. An das Stanzgitter sind optoelektro- nische Wandlerchips sowie Steuerchips mit Golddrähtchen angeschlossen. Das Stanzgitter und die daran angebrachten optoelektronischen Wandlerchips und Steuerchips sind in einen Gießharzkörper eingegossen, der das Stanzgitter sowie die daran befestigten optoelektronischen Wandlerchips und Steuer- chips vor mechanischen Beschädigungen schützt.Such devices are generally known. Usually, these are converter modules that have a lead frame as the support structure, which also forms the connecting pins of the converter module. Optoelectronic converter chips and control chips with gold wires are connected to the lead frame. The lead frame and the optoelectronic converter chips and control chips attached to it are cast in a cast resin body which protects the lead frame and the optoelectronic converter chips and control chips attached to it from mechanical damage.
Die bekannten optischen Wandlerbausteine werden üblicherweise in Stiftleisten eingebracht, an die Buchsenleisten anschließbar sind, die die Lichtwellenleiter tragen. Für eine gute Kopplung zwischen dem jeweiligen Lichtwellenleiter und dem zugeordneten optischen Wandlerchip ist eine sehr genaue Ju- stage des optischen Wandlerchips zu der optischen Achse des Lichtwellenleiters erforderlich. Dies wiederum bedingt eine genaue Justage des optoelektronischen Wandlerbausteins in der Stiftleiste.The known optical converter modules are usually introduced into pin headers, to which socket headers can be connected, which carry the optical fibers. For a good coupling between the respective optical waveguide and the assigned optical converter chip, a very precise adjustment of the optical converter chip to the optical axis of the optical waveguide is required. This in turn requires precise adjustment of the optoelectronic converter module in the pin header.
Ein Nachteil der bekannten Wandlerbausteine ist jedoch, daß die Lage der Wandlerchips bezüglich der Außenkanten des Gießharzkörpers verhältnismäßig großen Fertigungstoleranzen un- terworfen ist, da sich der Gießharzkörper beim Aushärten im allgemeinen etwas verzieht. Die Folge dieser Tatsache ist, daß bei der Montage der herkömmlichen Wandlerbausteine ein technisch aufwendiger und kostspieliger Justierschritt erfol gen muß, um die Lage der Wandlerchips auf die optische Achse der Lichtwellenleiter auszurichten.A disadvantage of the known converter modules, however, is that the position of the converter chips with respect to the outer edges of the cast resin body is subject to relatively large manufacturing tolerances, since the cast resin body generally warps somewhat during curing. The consequence of this fact is that when assembling the conventional converter modules technically complex and expensive adjustment step must be gene conditions to align the position of the transducer chips on the optical axis of the optical fiber.
Ausgehend von diesem Stand der Technik liegt der Erfindung die Aufgabe zugrunde, einen Wandlerbaustein zu schaffen, des sen Wandler durch einen einfachen Fügevorgang auf den zugeordneten Lichtwellenleiter ausrichtbar ist.Based on this prior art, the invention has for its object to provide a transducer module, the transducer sen can be aligned by a simple joining process to the associated optical fiber.
Die Aufgabe wird erfindungsgemäß dadurch gelöst, daß an wenigstens einem Anschlußkontakt wenigstens ein Justierabschnitt ausgebildet ist, durch die die Lage jedes Wandlers zum zugeordneten Lichtwellenleiter ausrichtbar ist.The object is achieved in that at least one adjustment section is formed on at least one connection contact, by means of which the position of each transducer can be aligned with the associated optical waveguide.
Dadurch, daß an den Anschlußkontakten Justierabschnitte ausgebildet sind, kann zum Befestigen des Wandlers auf der Trägerstruktur die Trägerstruktur in eine zu den Justierabschnitten komplementäre Halterung eingelegt werden, so daß der auf der Trägerstruktur angebrachte Wandler nach der Mon- tage eine mit hoher Genauigkeit definierte Lage bezüglich de Justierabschnitten einnimmt. Die Justierabschnitte können außerdem dazu verwendet werden, den Wandlerbaustein bei der Montage in der Stiftleiste auszurichten, denn durch das Einfügen der Justierabschnitte in eine komplementäre Halterung der Stiftleiste ist es möglich, den Wandler mit hoher Genauigkeit zu der optischen Achse des Lichtwellenleiters auszurichten. Bei der Montage des Wandlerbausteins in eine Stiftleiste ist demnach keine aktive Justage erforderlich. Infolge dessen können die Taktzeiten bei der Montage des Wandlerbau- steins gemäß der Erfindung in eine Stiftleiste gegenüber den Taktzeiten bei der Montage herkömmlicher Wandlerbausteine in der Stiftleiste wesentlich verkürzt werden.Due to the fact that adjustment sections are formed on the connection contacts, the support structure can be inserted into a holder which is complementary to the adjustment sections in order to fasten the transducer to the support structure, so that the transducer attached to the support structure has a position with high accuracy defined after assembly de adopts adjustment sections. The adjustment sections can also be used to align the transducer module during assembly in the pin header, because by inserting the adjustment sections into a complementary holder of the pin header, it is possible to align the transducer with high accuracy to the optical axis of the optical waveguide. No active adjustment is required when installing the converter module in a pin header. As a result, the cycle times when installing the converter module according to the invention in a pin header can be significantly reduced compared to the cycle times when installing conventional converter modules in the pin header.
Nachfolgend werden Ausführungsbeispiele der Erfindung anhand der Zeichnungen im einzelnen erläutert. Es zeigen: Figur 1 eine teilweise aufgebrochene Seitenansicht eines mit Justierlappen an den Anschlußstiften versehenen Wandlerbausteins; Figur 2 eine Querschnittsansicht des Wandlerbausteins aus Fi gur 1 entlang der Schnittlinie II-II;Exemplary embodiments of the invention are explained in detail below with reference to the drawings. Show it: FIG. 1 shows a partially broken side view of a converter module provided with adjusting tabs on the connecting pins; FIG. 2 shows a cross-sectional view of the converter module from FIG. 1 along the section line II-II;
Figur 3 eine teilweise aufgebrochene perspektivische Ansicht des Wandlerbausteins aus den Figuren 1 und 2; Figur 4 eine teilweise aufgebrochene Draufsicht auf ein weiteres Ausführungsbeispiel des Wandlerbausteins; Figur 5 eine Querschnittsansicht des Wandlerbausteins aus Fi gur 4 entlang der Schnittlinie V-V; und Figur 6 bis Figur 12 weitere Ausfuhrungsformen des Justierlappens .FIG. 3 shows a partially broken perspective view of the converter module from FIGS. 1 and 2; FIG. 4 shows a partially broken top view of a further exemplary embodiment of the converter module; FIG. 5 shows a cross-sectional view of the converter module from FIG. 4 along the section line V-V; and FIG. 6 to FIG. 12 further embodiments of the adjustment flap.
Ein Wandlerbaustein wird nachfolgend unter Bezugnahme auf di Figuren 1 bis 3 beschrieben. Der optoelektronische Wandlerbaustein 1 verfügt über einen Wandlerchip 2, der beispielsweise eine Leuchtdiode oder eine Fotodiode ist. Der Wandlerchip 2 ist über einen Sockel 3 an einem Stanzgitter 4 ange- bracht. Neben dem Wandlerchip 2 ist weiterhin ein Steuerchip 5 auf dem Stanzgitter 4 befestigt, der die zur Ansteuerung des Wandlerchips 2 erforderliche Steuerlogik enthält. Das Stanzgitter 4 geht außerhalb eines Kunstharzgehäuses 6, das den Wandlerchip 2 und den Steuerchip 5 umgibt, in eine Reihe von nebeneinander angeordneten Anschlußstiften 7 über. An den äußeren Anschlußstiften 7 ist jeweils ein Justierlappen 8 ausgebildet. Die Außenkanten der Justierlappen 8 befinden sich in einer mit hoher Genauigkeit definierten Lage bezüglich des Wandlerchips 2. Dies wird in Figur 1 durch die Dop- pelpfeile 9 und 10 angedeutet.A converter module is described below with reference to Figures 1 to 3. The optoelectronic converter module 1 has a converter chip 2, which is, for example, a light-emitting diode or a photodiode. The converter chip 2 is attached to a lead frame 4 via a base 3. In addition to the converter chip 2, a control chip 5 is also attached to the lead frame 4, which contains the control logic required to control the converter chip 2. The lead frame 4 merges outside of a synthetic resin housing 6, which surrounds the converter chip 2 and the control chip 5, into a row of connecting pins 7 arranged next to one another. An adjusting tab 8 is formed on each of the outer connecting pins 7. The outer edges of the adjustment tabs 8 are in a position, which is defined with high accuracy, with respect to the transducer chip 2. This is indicated in FIG. 1 by the double arrows 9 and 10.
Für die Herstellung des Wandlerbausteins 1 wird zunächst das Stanzgitter 4 aus einem Blech ausgestanzt. Das Stanzgitter 4 wird anschließend in eine zu den Justierlappen 8 komplementä- re Halterung eingebracht und daraufhin der Wandlerchip 2 über den Sockel 3 am Stanzgitter 4 befestigt. Das Aufbringen des Wandlerchips 2 auf dem Stanzgitter 4 erfolgt dabei so, daß der Wandlerchip 2 eine mit hoher Genauigkeit definierte Lage bezüglich der Außenkanten der Justierlappen 8 einnimmt.For the manufacture of the converter module 1, the lead frame 4 is first punched out of a sheet metal. The lead frame 4 is then introduced into a holder which is complementary to the adjustment tabs 8 and then the transducer chip 2 is fastened to the lead frame 4 via the base 3. The transducer chip 2 is applied to the lead frame 4 in such a way that the converter chip 2 assumes a position defined with high accuracy with respect to the outer edges of the adjusting tabs 8.
Bei der Montage des Wandlerbausteins 1 in eine Stiftleiste werden die Außenkanten der Justierlappen 8 zum Einfügen in eine komplementäre Halterung verwendet, so daß der Wandlerchip 2 in eine wohldefinierte Lage bezüglich der zugeordneten Lichtwellenleiter gelangt, die in einer auf die Stiftleiste aufsteckbaren Buchsenleiste angeordnet sind.When assembling the transducer module 1 in a pin header, the outer edges of the adjustment tabs 8 are used for insertion into a complementary holder, so that the transducer chip 2 arrives in a well-defined position with respect to the assigned optical fibers, which are arranged in a socket connector that can be plugged onto the pin header.
Da sich Bleche mit hoher Genauigkeit stanzen lassen, wird durch die Justierlapppen 8 die Lage des Wandlerchips 2 bezüglich eines zugeordneten Lichtwellenleiters mit hoher Genauigkeit festgelegt. Übliche Fertigungstoleranzen liegen im Be- reich von 0,02 mm. Nach dem Absetzen des Wandlerchips 2 mit Hilfe des Sockels 3 auf dem Stanzgitter 4 ist keine weitere aktive Justage bei der weiteren Herstellung und Montage des Wandlerbausteins erforderlich.Since sheets can be punched with high accuracy, the position of the transducer chip 2 with respect to an assigned optical waveguide is determined with high accuracy by the adjusting lugs 8. Usual manufacturing tolerances are in the range of 0.02 mm. After the converter chip 2 has been placed on the lead frame 4 with the aid of the base 3, no further active adjustment is required in the further manufacture and assembly of the converter module.
Dies hat insbesondere zur Folge, daß bei der Montage desThis has the particular consequence that when installing the
Wandlerbausteins 1 in eine Stiftleiste lediglich eine passive Justage durch Einfügen des Wandlerbausteins in eine komplementäre Halterung vorgenommen werden muß. Dadurch lassen sich die Taktzeiten bei der Montage des Wandlerbausteins 1 in die Stiftleiste im Vergleich zur Montage herkömmlicher Wandler- bausteine in eine Stiftleiste wesentlich verkürzen. Schließlich eignet sich der Wandlerbaustein 1 auch insofern für die Massenfertigung, als gestanzte Bleche sich in großer Stückzahl preiswert herstellen lassen.Transducer module 1 in a pin header only needs to be adjusted passively by inserting the converter module into a complementary holder. As a result, the cycle times when installing the converter module 1 in the pin header can be significantly reduced compared to the assembly of conventional converter modules in a pin header. Finally, the converter module 1 is also suitable for mass production in that stamped sheets can be inexpensively produced in large quantities.
Figur 4 zeigt ein weiteres Ausführungsbeispiel des Wandlerbausteins 1. Bei dem in Figur 4 dargestellten Ausführungsbeispiel des Wandlerbausteins 1 sind in die Justierlappen 8 Ausnehmungen 11 eingebracht. Wie durch die Doppelpfeile 12 und 13 angedeutet, befinden sich die Mittelpunkte und damit auch die Innenfläche der kreisförmigen Ausnehmungen 11 in einer mit hoher Genauigkeit definierten Lage bezuglich des Wandlerchips 2.FIG. 4 shows a further exemplary embodiment of the converter module 1. In the exemplary embodiment of the converter module 1 shown in FIG. 4, 8 recesses 11 are made in the adjustment tabs. As indicated by the double arrows 12 and 13, the center points and thus also the inner surface of the circular recesses 11 are in one position defined with high accuracy with respect to the converter chip 2.
Das m den Figuren 4 und 5 dargestellte Ausfuhrungsbeispiel hat den Vorteil, daß die als Referenz verwendete Innenflache der Ausnehmung 11 nicht frei zugänglich ist und somit vor Beschädigungen besser geschützt ist als die Außenkanten der Ju- stierlappen 8 des m den Figuren 1 bis 3 dargestellten Aus- fuhrungsbeispiels .The exemplary embodiment shown in FIGS. 4 and 5 has the advantage that the inner surface of the recess 11 used as a reference is not freely accessible and is therefore better protected from damage than the outer edges of the adjusting flaps 8 of the off shown in FIGS. 1 to 3 - example of leadership.
In den Figuren 6 bis 12 sind schließlich weitere Ausfuhrungsformen des Justierlappens 8 dargestellt. Grundsatzlich ist zu bemerken, daß die Justierlappen 8 vorzugsweise m der Nahe des Ortes angeordnet sind, an dem die Anschlußstifte 7 aus dem Kunststoffharzgehause 6 austreten, um eine hohe Festigkeit der Justierlappen 8 zu erzielen und um zu verhindern, daß die Justierlappen 8 verbogen oder auf eine andere Weise beschädigt werden. Es sei außerdem darauf hingewiesen, daß Justierlappen 8 verwendbar sind, die, wie m Figur 9 und 12 dargestellt, über eine Auskerbung 14 verfugen. Finally, FIGS. 6 to 12 show further embodiments of the adjustment tab 8. In principle, it should be noted that the adjustment tabs 8 are preferably arranged in the vicinity of the location at which the connecting pins 7 emerge from the plastic resin housing 6 in order to achieve a high strength of the adjustment tabs 8 and to prevent the adjustment tabs 8 from bending or opening another way to be damaged. It should also be pointed out that adjustment tabs 8 can be used which, as shown in FIGS. 9 and 12, have a notch 14.

Claims

Patentansprüche claims
1. Vorrichtung für den Anschluß von Lichtwellenleitern an eine elektrische Schaltung mit einer wenigstens einen Wandler- (2) tragenden und mit Anschlußkontakten (7) versehenen Trä- gerstruktur (4) , d a d u r c h g e k e n n z e i c h n e t , daß an wenigstens einem Anschlußkontakt (7) wenigstens ein Justierabschnitt (8) ausgebildet ist, durch die die Lage jedes Wand- lers (2) zum zugeordneten Lichtwellenleiter ausrichtbar ist.1. Device for connecting optical fibers to an electrical circuit with at least one transducer (2) carrying and with connection contacts (7) provided support structure (4), characterized in that at least one adjustment contact (7) has at least one adjustment section ( 8), by means of which the position of each transducer (2) can be aligned with the associated optical waveguide.
2. Vorrichtung nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß die Anschlußkontakte aus einem Gehäuse (6) herausragende Anschluß- stifte (7) sind.2. Device according to claim 1, so that the connecting contacts from a housing (6) are connecting pins (7) which protrude.
3. Vorrichtung nach Anspruch 2, d a d u r c h g e k e n n z e i c h n e t , daß die Justierabschnitte (8) an den beiden äußersten Anschlußstiften (7) ausgebildet sind.3. Apparatus according to claim 2, d a d u r c h g e k e n n z e i c h n e t that the adjusting sections (8) on the two outermost connector pins (7) are formed.
4. Vorrichtung nach Anspruch 2 oder 3, d a d u r c h g e k e n n z e i c h n e t , daß der Justierabschnitt (8) von einer Ausbuchtung gebildet ist.4. Apparatus according to claim 2 or 3, d a d u r c h g e k e n n z e i c h n e t that the adjusting section (8) is formed by a bulge.
5. Vorrichtung nach Anspruch 2 oder 3, d a d u r c h g e k e n n z e i c h n e t , daß der Justierabschnitt (8) von einer Einbuchtung (14) gebildet ist.5. Apparatus according to claim 2 or 3, d a d u r c h g e k e n n z e i c h n e t that the adjusting section (8) is formed by an indentation (14).
6. Vorrichtung nach einem der Ansprüche 2 bis 5, d a d u r c h g e k e n n z e i c h n e t , daß der Justierabschnitt eine Lochung (11) umfaßt.6. Device according to one of claims 2 to 5, d a d u r c h g e k e n n z e i c h n e t that the adjusting section comprises a perforation (11).
7. Vorrichtung nach einem der Ansprüche 2 bis 6, d a d u r c h g e k e n n z e i c h n e t , daß der Justierabschnitt eine Vertiefung umfaßt. 7. Device according to one of claims 2 to 6, characterized in that the adjusting section comprises a recess.
8. Vorrichtung nach einem der Ansprüche 1 bis 7, d a d u r c h g e k e n n z e i c h n e t , daß die Trägerstruktur ein gestanztes Blech (4) ist.8. Device according to one of claims 1 to 7, d a d u r c h g e k e n n z e i c h n e t that the support structure is a stamped sheet (4).
9. Vorrichtung nach einem der vorstehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t , daß jeder Wandler (2) von einem Gießharzkörper (6) umgeben ist. 9. Device according to one of the preceding claims, d a d u r c h g e k e n n z e i c h n e t that each transducer (2) is surrounded by a cast resin body (6).
PCT/DE1999/002648 1998-09-17 1999-08-24 Device for connecting optical waveguides to an electric circuit WO2000017690A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19842686 1998-09-17
DE19842686.0 1998-09-17

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2079966A (en) * 1980-07-07 1982-01-27 Hewlett Packard Co Housing for Interfacing a Semiconductor Device With a Fiber Optic Cable
EP0472755A1 (en) * 1990-08-28 1992-03-04 Sumitomo Electric Industries, Ltd. Optical module
US5352851A (en) * 1992-09-08 1994-10-04 Texas Instruments Incorporated Edge-mounted, surface-mount integrated circuit device
DE4338715A1 (en) * 1993-11-12 1995-05-18 Bosch Gmbh Robert Protective package for semiconductor device, e.g. LED module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2079966A (en) * 1980-07-07 1982-01-27 Hewlett Packard Co Housing for Interfacing a Semiconductor Device With a Fiber Optic Cable
EP0472755A1 (en) * 1990-08-28 1992-03-04 Sumitomo Electric Industries, Ltd. Optical module
US5352851A (en) * 1992-09-08 1994-10-04 Texas Instruments Incorporated Edge-mounted, surface-mount integrated circuit device
DE4338715A1 (en) * 1993-11-12 1995-05-18 Bosch Gmbh Robert Protective package for semiconductor device, e.g. LED module

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