WO1999053528A8 - Surface treatment process and system - Google Patents

Surface treatment process and system

Info

Publication number
WO1999053528A8
WO1999053528A8 PCT/US1999/007875 US9907875W WO9953528A8 WO 1999053528 A8 WO1999053528 A8 WO 1999053528A8 US 9907875 W US9907875 W US 9907875W WO 9953528 A8 WO9953528 A8 WO 9953528A8
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
polishing pad
surface treatment
treatment process
rotated
Prior art date
Application number
PCT/US1999/007875
Other languages
French (fr)
Other versions
WO1999053528A2 (en
WO1999053528A3 (en
Inventor
Igor J Malik
Original Assignee
Silicon Genesis Corp
Igor J Malik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/286,259 external-priority patent/US6221774B1/en
Application filed by Silicon Genesis Corp, Igor J Malik filed Critical Silicon Genesis Corp
Priority to AU34886/99A priority Critical patent/AU3488699A/en
Publication of WO1999053528A2 publication Critical patent/WO1999053528A2/en
Publication of WO1999053528A8 publication Critical patent/WO1999053528A8/en
Publication of WO1999053528A3 publication Critical patent/WO1999053528A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/006—Machines or devices using grinding or polishing belts; Accessories therefor for special purposes, e.g. for television tubes, car bumpers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/12—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a contact wheel or roller pressing the belt against the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45232—CMP chemical mechanical polishing of wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A wafer finishing system and method. A polishing pad (24) is rotated about an axis parallel to a surface (10) of a semiconductor wafer (12). The polishing pad (24) is supported by a roller (22) that receives fluid (38) and distributes the fluid through the polishing pad (24) across the surface of the wafer. The surface (10) of the wafer is moved in relation to the polishing pad so that the wafer surface is smoothed, or touch-polished, with or without the use of abrasive slurry. In one embodiment the wafer is rotated between an upper roller assembly (20) and a lower roller assembly (14).
PCT/US1999/007875 1998-04-10 1999-04-09 Surface treatment process and system WO1999053528A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU34886/99A AU3488699A (en) 1998-04-10 1999-04-09 Surface treatment process and system

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US8140898P 1998-04-10 1998-04-10
US60/081,408 1998-04-10
US28626999A 1999-04-05 1999-04-05
US28653299A 1999-04-05 1999-04-05
US09/286,259 US6221774B1 (en) 1998-04-10 1999-04-05 Method for surface treatment of substrates
US09/286,259 1999-04-05
US09/286,269 1999-04-05
US09/286,532 1999-04-05

Publications (3)

Publication Number Publication Date
WO1999053528A2 WO1999053528A2 (en) 1999-10-21
WO1999053528A8 true WO1999053528A8 (en) 2000-01-13
WO1999053528A3 WO1999053528A3 (en) 2002-01-10

Family

ID=27491619

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/007875 WO1999053528A2 (en) 1998-04-10 1999-04-09 Surface treatment process and system

Country Status (1)

Country Link
WO (1) WO1999053528A2 (en)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62162466A (en) * 1986-01-09 1987-07-18 Rohm Co Ltd Lapping device for wafer
JPS62162467A (en) * 1986-01-10 1987-07-18 Rohm Co Ltd Polishing device for wafer
JPH0596468A (en) * 1991-03-12 1993-04-20 Yuzo Mori Superprecision mirror surface work method
FR2681472B1 (en) * 1991-09-18 1993-10-29 Commissariat Energie Atomique PROCESS FOR PRODUCING THIN FILMS OF SEMICONDUCTOR MATERIAL.
US5486134A (en) * 1992-02-27 1996-01-23 Oliver Design, Inc. System and method for texturing magnetic data storage disks
JP3566417B2 (en) * 1994-10-31 2004-09-15 株式会社荏原製作所 Polishing equipment
TW344695B (en) * 1995-08-24 1998-11-11 Matsushita Electric Ind Co Ltd Method for polishing semiconductor substrate
KR100202659B1 (en) * 1996-07-09 1999-06-15 구본준 Apparatus for chemical mechanical polishing semiconductor wafer
US5725414A (en) * 1996-12-30 1998-03-10 Intel Corporation Apparatus for cleaning the side-edge and top-edge of a semiconductor wafer
US6159825A (en) * 1997-05-12 2000-12-12 Silicon Genesis Corporation Controlled cleavage thin film separation process using a reusable substrate
US5967881A (en) * 1997-05-29 1999-10-19 Tucker; Thomas N. Chemical mechanical planarization tool having a linear polishing roller

Also Published As

Publication number Publication date
WO1999053528A2 (en) 1999-10-21
WO1999053528A3 (en) 2002-01-10

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