WO1999053111A1 - Processes for the production of zintl compounds, intermetallic compounds and electronic components including intermetallic compounds - Google Patents
Processes for the production of zintl compounds, intermetallic compounds and electronic components including intermetallic compounds Download PDFInfo
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- WO1999053111A1 WO1999053111A1 PCT/GB1999/001078 GB9901078W WO9953111A1 WO 1999053111 A1 WO1999053111 A1 WO 1999053111A1 GB 9901078 W GB9901078 W GB 9901078W WO 9953111 A1 WO9953111 A1 WO 9953111A1
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- phosphinidene
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/047—Making non-ferrous alloys by powder metallurgy comprising intermetallic compounds
Definitions
- This invention relates to processes for the production of Zintl compounds, processes for the production of intermetallic compounds and processes for manufacturing electronic components including intermetallic compounds.
- this invention relates to the application of intermetallic compounds in the manufacture of electronic components. More specifically, this invention relates to a method of applying intermetallic compositions onto the surface of electronic components.
- Zintl compounds are binary compounds formed between alkali or alkaline earth elements and post transition elements [(see for example, "Chemistry, Structure, and Bonding of Zintl Phases and Ions” , Ed . Susan M . Kauzlarich, VCH Publishers, ( 1 996)] .
- One of the earliest examples of Zintl ions were those formed by the reaction of sodium in liquid ammonia with a variety of Group 1 4 metals, such as lead, to form, e.g . 4[Na(NH 3 ) n + ][Pb 9 ] 4" .
- These complexes are unstable due to the facile liberation of NH 3 , which can occur at low temperatures to form intermetallic compositions of the type NaPb x .
- Macrocyclic ligands such as 2,2,2-crypt have been used in place of ammonia or ethylenediamine due to their effective sequestering capabilities .
- the stability of these cryptate complexes an example of which includes [2(2,2,2-crypt-K) + [Pb 5 ] 2 + , have enabled extensive characterisation of their crystal structures.
- Zintl compounds have been cumbersome, especially where it is desired to produce Zintl compounds with predetermined stoichiometries.
- the majority of these compounds have been obtained by dissolving pre-formed stoichiometric alloys of metals in ammonia.
- This route which is required to obtain stoichiometric control of the product, involves high-temperature methods and highly specialised techniques.
- Zintl compounds, particularly of the heaviest (most metallic) post-transition elements have generally only been prepared in very small scale ( 1 0-50 mg) and have therefore not been broadly accessible to the majority of synthetic chemists or useful in industrial processes.
- Intermetallic compounds which may be defined as mixed metal compounds of the type M 1 x M 2 y ...M 3 2 , possess properties that do not necessarily resemble the respective alloys and often exhibit properties which are intermediate between their component elements.
- intermetallic alloys behave as semi-conductors and have thus found extensive applications in the electronics industry. Some intermetallic compounds display photoactive properties and these have been employed in photodetector components. The properties of the intermetallic layer are dependent upon the stoichiometry of the metal components. Thus the stoichiometric control of the metal components is important in order to achieve the desired electrical properties of the intermetallic layers.
- the existing process for the manufacture of electronic components such as vacuum photodiodes having intermetallic layers based on antimony and alkali metals, involve the high temperature formation of antimony/alkali metal intermetallic layers using metal vapours.
- This deposition process typically involves predepositing an antimony layer onto the surface of the electronic component, followed by the addition of an alkali metal in vapour form.
- This process is highly -3- labour intensive and the characteristics of the intermetallic films deposited are often variable as a consequence of inherently poor control of their stoichiometry.
- Another object of the present invention is to provide a method of producing intermetallic layers in which the stoichiometry can be controlled to furnish films with essentially consistent characteristics.
- the present invention in all its aspects followed from the development of a novel procedure for producing Zintl compounds from stable precursors.
- This procedure enabled for the first time the production of Zintl compounds by a convenient route in a manner which permitted the Zintl compounds to be produced with preselected stoichiometries between the metal components thereof.
- the use of a stable precursor to generate a Zintl compound that may be subsequently converted to an intermetallic alloy according to the present invention allows the possibility for the deposition of the intermetallic alloy from solution at low temperature.
- Such a method provides a substantial improvement over existing vapour phase deposition techniques.
- the method of the present invention provides a convenient route to the formation of Zintl compounds on a gram or multi-gram scale.
- the invention provides a novel application of Zintl compounds, especially when produced in accordance with the first aspect of the invention, in the manufacture of electronic components having surface coatings formed from intermetallic compounds.
- a process for the production of a Zintl compound comprising subjecting a heterometallic phosphinidene complex to thermal decomposition.
- the heterometallic phosphinidene complex typically comprises at least two metals.
- one of the metals may be a metal of Group 13, 14 or 15 of the Periodic Table.
- Particularly preferred metals are those from Group 15 of the Periodic Table, including As, Sb and Bi.
- the second of the metals is preferably a metal of Group 1 of the Periodic Table, e,g, Li, Na, K, Rb or Cs.
- the heterometallic phosphinidene complex used in the process of the invention preferably contains one or more phosphinidene ligands [PR], which may be the same or different.
- the phosphorus atom of each phosphinidene ligand is covalently linked to a substituted or unsubstituted hydrocarbyl group, R.
- the unsubstituted or substituted hydrocarbyl group, R typically contains 1 to 15, preferably 4 to 10 carbon atoms, and may be selected from alkyl, alkenyl, alkynyl, cycloalkyl, aryl, aralkyl, and alkaryl. Typical substituents include F and alkylsilyl groups.
- Other examples of possible substituents include 'Bu [tertiary butyl, (CH 3 ) 3 C-], 'Pr [isopropyl, (CH 3 ) 2 CH-], bis(trimethylsilyl) methyl [(CH 3 Si) 2 CH-L -5- tris(trimethylsilyl)methyl ⁇ [(CHg ⁇ Si ⁇ C- ⁇ . trimethylsilyl [(CH 3 ) 3 Si] and fluorinated groups such as pentafluorophenyl (C 6 F 5 ).
- each phosphinidene ligand in the heterometallic phosphinidene complex is generally coordinated to four metal atoms. It is preferred that the phosphorus atom is coordinated to three Group I metal atoms and one metal atom of Groups 1 3, 1 4 or 1 5.
- the heterometallic phosphinidene complex may further comprise an additional ligand or ligands which may be Lewis bases.
- additional ligand or ligands which may be Lewis bases.
- the structure of the complex will depend upon the identities of the metals and ligands.
- the preferred phosphinidene complexes referred to above can have various structures depending on the Group 1 3, 1 4 or 1 5 metal(s) present and on the alkali metal(s) and Lewis base ligand(s) .
- the phosphinidene ligands (PR) are bridged between the Group 1 3, 1 4 or 1 5 metals and the alkali metals (i.e.
- the Group 1 3, 1 4 and 1 5 metals will usually be in their + 3, + 2 and + 3 oxidation states respectively.
- the heterometallic phosphinidene complex may further comprise an additional' Lewis base ligand coordinated to one or more of the metal atoms.
- Preferred Lewis base ligands are primary, secondary or tertiary amines of formula R 1 R 2 R 3 N, wherein each of R ⁇ R 2 and R 3 represent hydrogen, a C C 10 alkyl or C 6 -C 10 aryl group.
- other Lewis bases such as poiyamines [e.g .
- ethylenediamine (H 2 NCH 2 ) 2 ] permethylated poiyamines
- permethylated poiyamines for example TMEDA ⁇ [(CH 3 ) 2 NCH 2 ] 2 ⁇ and PMDETA ⁇ [(CH 3 ) 2 NCH 2 CH 2 ] 2 NCH 3 ⁇
- Oxygen donors such as ethers (e.g. tetrahydrofuran THF) may also be used.
- the thermal decomposition process of the invention may result in the co- production of a phosphorus compound having at least one P-P bond, e.g . a cyclic phosphinidene.
- the thermal decomposition typically involves a so-called "reductive phosphinidene coupling " or “reductive elimination” in the conversion of the phosphinidene intermediate into the Zintl complex.
- the formation of phosphorus-phosphorus bonds which have the highest bond energy between any Group 1 5 elements, provides the necessary thermodynamic driving force for the reaction to take place.
- a cyclic phosphinidene compound may be formed as a by-product and as will be appreciated, such a byproduct will contain more than one P-P bond .
- the present invention comprises subjecting a heterometallic phosphinidene complex to a thermal decomposition reaction, wherein the heterometallic phosphinidene comprises:
- each R which may be the same or different, is selected from substituted or unsubstituted C, - C 1 5 alkyl, alkenyl, alkynyl, cycloalkyl, aryl, aralkyl, and alkaryl, wherein the substituents may be F or alkylsilyl groups,
- a particularly preferred process according to the invention comprises subjecting a heterometallic phosphinidene complex to a thermal decomposition reaction, wherein the heterometallic phosphinidene complex comprises: -7-
- each R which may be the same or different, is selected from substituted or unsubstituted C, - C 15 alkyl, alkenyl, alkynyl, cycloalkyl, aryl, aralkyl, and alkaryl, wherein the substituents may be F or alkylsilyl groups, (ii) at least one metal selected from Ge, Sn, Pb, As, Sb and Bi.
- R preferably contains 4 to 1 0 carbon atoms.
- the phosphinidene compound has the formula (M 1 ) n (M 2 ) m (Lg) p (PR) r , wherein M 1 is a metal of Group 1 3, 1 4 or 1 5 of the Periodic Table, M 2 is a metal of Group 1 of the Periodic Table, PR is a phosphinidene ligand, Lg is a Lewis base ligand and each of n, m, p and r are in the range 1 to 1 0.
- M 1 is preferably As, Sb and Bi and M 2 is preferably Li, Na, K or Rb.
- the group "R" in the phosphinidene ligand (PR) is preferably as defined above.
- Lg is a Lewis base ligand which may be a primary, secondary or tertiary amine of formula R 1 R 2 R 3 N, wherein each of R 1 , R 2 and R 3 represent hydrogen, C,-C 10 alkyl or C 6 -C 10 aryl group .
- Lewis bases such as poiyamines [e.g .
- permethylated poiyamines for example TM EDA ⁇ [ (CH 3 ) 2 N CH 2 ] 2 ⁇ and PM DETA ⁇ [(CH 3 ) 2 NCH 2 CH 2 ] 2 NCH 3 ⁇
- pyridines (C 5 H 5 N) or polypyridines (such as 2,2'- bipyridine, (C 5 H 4 N) 2 may be employed .
- Oxygen donors such as ethers (e.g . tetrahydrofuran, THF) may also be used.
- the ratios of m:n may vary from 4: 1 to 1 :4.
- m and n are 1 , 2, 3 or 4, thus in phosphinidene compounds which are especially useful as starting materials, m may be 1 and n may be 3.
- m is 1 and n is 2, or m and n are both 1 .
- the integers p and r are typically in the range 4 to 8 and in exemplary compounds, both p and r are 6.
- Especially preferred heterometallic phosphinidene compounds suitable for use in the process of the invention may be represented by the formula [Sb(PCy) 3 ] 2 ⁇ 6 .6Me 2 NH.2C 6 H 5 CH 3 (I) , ⁇ [cyclo-(CyP) 4 Sb]Na.Me 2 NH .TMEDA ⁇ 2 (IV) and ⁇ [cyclo-( t BuP) 3 As] ⁇ .TMEDA.THF ⁇ (VI) .
- the thermal decomposition process is carried out at a temperature of greater than 20 °C, and preferably at a temperature range of between 25-1 00 °C.
- the decomposition is preferably carried out with the phosphinidene compound in solution in an organic solvent such as a hydrocarbon (e.g . an n-alkane, such as n-hexane) , an aromatic hydrocarbon (e.g . toluene) or tetrahydrofuran (THF) .
- a hydrocarbon e.g . an n-alkane, such as n-hexane
- an aromatic hydrocarbon e.g . toluene
- THF tetrahydrofuran
- heterometallic phosphinidene complexes of the invention either contain stabilising Lewis base ligands, or stabilising Lewis base ligands which are aprotic (e.g . TMEDA, PMDETA, pyridines, polypyridines and oxygen donors such as ethers)
- the decomposition process may require activation .
- the activation procedure typically comprises subjecting the heterometallic phosphinidene complex to thermal decomposition as described above, in the presence of a primary or secondary amine (e.g . Me 2 NH) added separately to the complex.
- the thermal decomposition process results in the' formation of a Zintl compound comprising a polymetallic anion consisting of atoms of one or more metals.
- the polymetallic anion is coordinated with metal cations, and the metal cations are coordinated with Lewis base ligands.
- the Zintl compounds formed typically comprise a polymetallic anion consisting of atoms of a metal M 1 , wherein said polymetallic anion may or may not be coordinated with cations of a metal M 2 , and the cations of a metal M 2 are coordinated with Lewis base ligands Lg .
- the cation may be separated from the polymetallic anion .
- the Zintl compound has the formula (M 1 ) n -(M 2 ) m .(Lg) p ., wherein M 1 , M 2 and Lg are as defined above and each of n', m' and p' are in the range 1 to 1 0.
- M 1 is preferably a metal of Group 1 3, 1 4 or 1 5 of the Periodic Table.
- M 2 may be a metal of Group 1 of the Periodic Table, preferably Li, Na, K or Rb.
- Lg is preferably a Lewis base ligand which may be a primary, secondary or tertiary amine of formula R 1 R 2 R 3 N, wherein each of R 1 , R 2 and R 3 represent hydrogen, C r C 10 alkyl or C 6 -C 10 aryl group.
- Lewis bases such as poiyamines [e.g.
- ethylenediamine (H 2 NCH 2 ) 2 ] permethylated poiyamines
- permethylated poiyamines for example TMEDA ⁇ [(CH 3 ) 2 NCH 2 ] 2 ⁇ and PMDETA ⁇ [(CH 3 ) 2 NCH 2 CH 2 ] 2 NCH 3 ⁇
- pyridines (C 5 H 5 N) or polypyridines (such as 2,2'-bipyridine, (C 5 H 4 N) 2 may be employed .
- Oxygen donors such as ethers (e.g . tetrahydrofuran, THF) may also be used .
- the ratios of m' :n' may vary from 5: 1 to 1 :5.
- m' and n' are 4-9, thus in the Zintl compound of formula (II) n' is 7 and m' is 3.
- the integer p' depends on the metal M 2 and the number of donor atoms in Lg and may be 1 -8.
- the precise stoichiometry of the Zintl compound will depend on the nature and identity of the phosphinidene compound used as starting material (or where more than one phosphinidene compound is used, also on the ratio of different phosphinidene compounds used) and also on the identity of the Lewis acid base.
- Zintl compounds may be produced .
- -10- ln accordance with a second aspect of the invention there is provided the use of a stable heterometallic phosphinidene complex as described above as a precursor for the deposition of a film containing an intermetallic compound .
- Zintl compound (a) forming a Zintl compound by a method described above, the Zintl compound comprising a polymetallic anion consisting of atoms of a metal M 1 , and cations of a metal M 2 which are coordinated with stabilising ligands Lg, and
- the stabilising ligand is a Lewis base, for example, one of the preferred Lewis bases referred to above.
- the stabilising ligands may be removed under reduced pressure or by evaporation at atmospheric pressure.
- a preferred process for the production of an intermetallic alloy comprises:
- Zintl compound by subjecting a heterometallic phosphinidene complex as described above to thermal decomposition, said Zintl compound comprising a polymetallic anion consisting of atoms of a metal M 1 , and cations of a metal M 2 which are coordinated with stabilising ligands Lg, and
- a further embodiment of the invention provides a method for forming an intermetallic layer on a surface or surface portion of an electronic device, which method comprises:
- Zintl compound comprising a polymetallic anion consisting of atoms of a metal M 1 , - ⁇ - and cations of a metal M 2 which are coordinated with stabilising ligands Lg, and (b) subsequently removing the stabilising ligands.
- Another embodiment of the invention provides a method for forming an intermetallic layer on a surface or surface portion of an electronic device, which method comprises:
- Zintl compound comprising a polymetallic anion consisting of atoms of a metal M 1 and cation of a metal M 2 which are coordinated with stabilising ligands, and that the stabilising ligands will subsequently be lost.
- the formation of the Zintl compound and the subsequent loss therefrom of the stabilising ligands may be a single or a two step process. Where the formation of the Zintl compound and removal of the stabilising ligand occurs in two steps, this embodiment of the invention may be defined in terms of a method for forming an intermetallic layer on a surface or surface portion of an electronic device, which method comprises:
- Zintl compound comprising a polymetallic anion consisting of atoms of a metal M 1 and cation of a metal M 2 which are coordinated with stabilising ligands, and
- a still further embodiment of the invention provides a method of manufacturing an electronic device having an intermetallic layer on a surface portion thereof, which comprises:
- Zintl compound comprising a polymetallic anion consisting of atoms of a metal M 1 and cation of a metal M 2 which are coordinated with stabilising ligands Lg, and
- the application of a Zintl compound or a heterometallic phosphinidene compound to such a surface is preferably carried out by a technique such as spin coating, dip coating, vacuum evaporation or electrospray.
- the precise manner in which the polymetallic anion and the metal M 2 are arranged will depend on the identities of M 1 and M 2 and the identities of the ligand(s) . In many instances, the polymetallic anion will be coordinated with cations of metal M 2 .
- the ratio of metals in the heterometallic phosphinidene compound can be varied depending upon the ratio of starting materials and conditions in which they are synthesised .
- the thermal decomposition process of the invention will therefore produce a Zintl compound whose ratio of M 1 and M 2 (if not necessarily the same as that present in the phosphinidene compound) will be 'dictated by the individual chemical pathway of the decomposition.
- intermetallic layer may be adapted ⁇ to confer desired electrical properties depending upon the electronic device for which it is to be applied to.
- intermetallic layers with different proportions of metals may be formed.
- Intermetallic layers in particular, those comprising an alkali metal and one or more metals selected from those of Group 1 3, Group 1 4 or Group 1 5 of the Periodic Table (especially in stoichiometric quantities) are particularly useful in such applications, as they possess highly desirable photoactive characteristics.
- Particularly useful is the application of intermetallic layers having electron emitter properties, such as those required by photoelectric devices.
- intermetallic alkali metal antimonide films have wide applications as batteries and photoactive materials in photomultipliers which are used e.g . ( 1 ) medical scanners, (2) scientific instruments, and (3) particle physics.
- Figure 8 Plot of the quantum efficiency values which are corrected for vacuum envelope transmission function, as a function of the wavelength.
- the suspension was stirred and gradually allowed to warm towards 0 ° C at which stage a yellow precipitate was observed. This was dissolved by the addition of chilled toluene (8 cm 3 ) and THF (1 cm 3 ). The red solution produced was stored at -35 °C for 48 hr over which period crystals suitable for X-ray diffraction studies grew.
- the structure was solved using direct methods and refined by full matrix least squares based on 2 (SHELXL93), with all non-hydrogen atoms assigned anisotropic displacement parameters; cyclohexyl, toluene and amine H atoms were fixed in idealised positions and allowed to ride on the relevant C or N atoms.
- Neat liquid Me 2 NH was added to a dilute THF solution of [Sb(PCy) 3 ]Li 6 ⁇ [I*] at a temperature of 25 °C or below. Decomposition of [I*] to Zintl compound (II) occurs immediately.
- Zintl compounds [Sb 7 Li 3 .6HNMe 2 ] (II) or ⁇ [TMEDA]Li] 3 Sb 7 ⁇ (IID at room temperature over a period of time leads to a slow loss of amine ligand to form a lustrous intermetallic phase, comprising LiSb and Sb.
- the loss of amine ligand occurs more rapidly (ca. 1 5 min, at 1 0 '3 atm.) .
- Example 5 was repeated using the same method and volumes of solvent, but the quantities of reagents were doubled and the solution was briefly brought to reflux prior to storage at -35 °C (24 hrs) to obtain complex (V). Yield 3.5 g (96% on the basis of the Sb supplied). The complex is stable at 25 °C.
- a photoelectric device in the form of a LiSb photodiode test cell was constructed from a hollow glass cylinder 1 0, which has a constriction to allow the application of a vacuum at one end (shown sealed after evacuation in Figure 7) 1 2, and a flat glass deposition surface 1 4 at the other end.
- the inside surface of the glass cylinder was aluminised to form a thin film 1 6 in contact with the deposition surface 1 4.
- a LiSb intermetallic layer 1 8 was formed on the deposition surface 1 4 in accordance with any of the Methods A-C described below.
- the test cell was further equipped with a cathode contact 20 to the aluminised film 1 6 and a central anode ring 22.
- the intermetallic layer was formed on the test cell in accordance with one of the following methods A-C:
- a solution of II in THF (ca. 0.01 mol dm '3 ) was carefully introduced onto the deposition surface through the constriction 1 2 (shown sealed in Figure 7) using a syringe so as to produce a solution surface of about 2 mm thick.
- the solvent was evaporated under vacuum from the deposition surface under argon to produce a golden-brown metallic film 1 8 on the deposition surface 1 4.
- a solution of II suitable for use in accordance with the procedure described in Method A was formed from a THF solution of the unsolvated complex [Sb(PCy) 3 ] Li 6 ⁇ [I*] by the method described in Example 2A.
- test cell After construction of the test cell and formation of the intermetallic layer as described above, the test cell was evacuated to 1 0 ⁇ 6 torr and the constriction 1 2 was flame sealed .
- the photoelectric spectral response of the intermetallic layer was measured between 270 and 450 nm.
- Table 1 shows the quantum efficiency (expressed as a percentage) of the LiSb intermetallic compound after correction for the variation in optical transmission of the glass cylinder.
- Figure 8 shows the corrected quantum efficiency of the LiSb test cell against wavelength after the transmission function of the vacuum envelope has been taken into account.
- the graph shows the onset of spectral response to be around 3.2 eV (for 390 nm), demonstrating the formation of a photosensitive LiSb intermetallic layer.
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Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE69902249T DE69902249T2 (en) | 1998-04-15 | 1999-04-08 | METHOD FOR PRODUCING ZINTL CONNECTIONS, INTERMETALLIC CONNECTIONS AND ELECTRONIC COMPONENTS WITH THESE INTERMETALLIC CONNECTIONS |
EP99915885A EP1073775B1 (en) | 1998-04-15 | 1999-04-08 | Processes for the production of zintl compounds, intermetallic compounds and electronic components including intermetallic compounds |
US09/647,768 US6503342B1 (en) | 1998-04-15 | 1999-04-08 | Processes for the production of zintl compounds, intermetallic compounds and electronic components including intermetallic compounds |
AT99915885T ATE221136T1 (en) | 1998-04-15 | 1999-04-08 | METHOD FOR PRODUCING ZINTL CONNECTIONS, INTERMETALLIC CONNECTIONS AND ELECTRONIC COMPONENTS WITH THESE INTERMETALLIC CONNECTIONS |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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GBGB9808003.9A GB9808003D0 (en) | 1998-04-15 | 1998-04-15 | Process for the production of zintl compounds,intermetallic compounds and electronic components including intermetallic compounds |
GB9808003.9 | 1998-04-15 |
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WO1999053111A1 true WO1999053111A1 (en) | 1999-10-21 |
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PCT/GB1999/001078 WO1999053111A1 (en) | 1998-04-15 | 1999-04-08 | Processes for the production of zintl compounds, intermetallic compounds and electronic components including intermetallic compounds |
Country Status (6)
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US (1) | US6503342B1 (en) |
EP (1) | EP1073775B1 (en) |
AT (1) | ATE221136T1 (en) |
DE (1) | DE69902249T2 (en) |
GB (1) | GB9808003D0 (en) |
WO (1) | WO1999053111A1 (en) |
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US7925172B2 (en) * | 2002-12-03 | 2011-04-12 | Finisar Corporation | High power, low distortion directly modulated laser transmitter |
CN113564382B (en) * | 2021-07-09 | 2022-08-30 | 中南大学 | Method for preparing metal aluminum by reduction at room temperature |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4617204A (en) * | 1983-01-04 | 1986-10-14 | The United States Of America As Represented By The United States Department Of Energy | Chemical synthesis of thin films and supported crystals by oxidation of zintl anions |
US5368701A (en) * | 1993-06-11 | 1994-11-29 | Nec Research Institute, Inc. | Process for forming Zintl phases and the products thereof |
US5705695A (en) * | 1996-12-18 | 1998-01-06 | Nec Research Institute, Inc. | Quaternary Zintl composition (Et4 N)4 Au(Ag1-x Aux)2 Sn2 Te9 ! |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US3438805A (en) * | 1966-04-06 | 1969-04-15 | Du Pont | Chemical metallizing process |
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1998
- 1998-04-15 GB GBGB9808003.9A patent/GB9808003D0/en not_active Ceased
-
1999
- 1999-04-08 DE DE69902249T patent/DE69902249T2/en not_active Expired - Fee Related
- 1999-04-08 US US09/647,768 patent/US6503342B1/en not_active Expired - Fee Related
- 1999-04-08 AT AT99915885T patent/ATE221136T1/en not_active IP Right Cessation
- 1999-04-08 WO PCT/GB1999/001078 patent/WO1999053111A1/en active IP Right Grant
- 1999-04-08 EP EP99915885A patent/EP1073775B1/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4617204A (en) * | 1983-01-04 | 1986-10-14 | The United States Of America As Represented By The United States Department Of Energy | Chemical synthesis of thin films and supported crystals by oxidation of zintl anions |
US5368701A (en) * | 1993-06-11 | 1994-11-29 | Nec Research Institute, Inc. | Process for forming Zintl phases and the products thereof |
US5705695A (en) * | 1996-12-18 | 1998-01-06 | Nec Research Institute, Inc. | Quaternary Zintl composition (Et4 N)4 Au(Ag1-x Aux)2 Sn2 Te9 ! |
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Publication number | Publication date |
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EP1073775A1 (en) | 2001-02-07 |
ATE221136T1 (en) | 2002-08-15 |
DE69902249D1 (en) | 2002-08-29 |
DE69902249T2 (en) | 2003-02-27 |
US6503342B1 (en) | 2003-01-07 |
GB9808003D0 (en) | 1998-06-17 |
EP1073775B1 (en) | 2002-07-24 |
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