WO1999049455A2 - Integrated micro-optical systems - Google Patents

Integrated micro-optical systems Download PDF

Info

Publication number
WO1999049455A2
WO1999049455A2 PCT/US1999/006661 US9906661W WO9949455A2 WO 1999049455 A2 WO1999049455 A2 WO 1999049455A2 US 9906661 W US9906661 W US 9906661W WO 9949455 A2 WO9949455 A2 WO 9949455A2
Authority
WO
WIPO (PCT)
Prior art keywords
die
wafer
optical
refractive
integrated
Prior art date
Application number
PCT/US1999/006661
Other languages
French (fr)
Other versions
WO1999049455A3 (en
Inventor
Michael R. Feldman
Alan D. Kathman
William Hudson Welch
Original Assignee
Digital Optics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Digital Optics Corporation filed Critical Digital Optics Corporation
Priority to EP99915050A priority Critical patent/EP1064650B1/en
Priority to AT99915050T priority patent/ATE241811T1/en
Priority to JP2000538348A priority patent/JP2003524849A/en
Priority to AU33656/99A priority patent/AU3365699A/en
Priority to CA002324600A priority patent/CA2324600C/en
Priority to DE69908325T priority patent/DE69908325T2/en
Publication of WO1999049455A2 publication Critical patent/WO1999049455A2/en
Publication of WO1999049455A3 publication Critical patent/WO1999049455A3/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0025—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration
    • G02B27/0037—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration with diffracting elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • G02B27/4233—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application
    • G02B27/4238—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application in optical recording or readout devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • G02B27/4272—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having plural diffractive elements positioned sequentially along the optical path
    • G02B27/4277—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having plural diffractive elements positioned sequentially along the optical path being separated by an air space
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B11/00—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor
    • G11B11/10—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field
    • G11B11/105—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field using a beam of light or a magnetic field for recording by change of magnetisation and a beam of light for reproducing, i.e. magneto-optical, e.g. light-induced thermomagnetic recording, spin magnetisation recording, Kerr or Faraday effect reproducing
    • G11B11/10532—Heads
    • G11B11/10534—Heads for recording by magnetising, demagnetising or transfer of magnetisation, by radiation, e.g. for thermomagnetic recording
    • G11B11/10536—Heads for recording by magnetising, demagnetising or transfer of magnetisation, by radiation, e.g. for thermomagnetic recording using thermic beams, e.g. lasers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B11/00—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor
    • G11B11/10—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field
    • G11B11/105—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field using a beam of light or a magnetic field for recording by change of magnetisation and a beam of light for reproducing, i.e. magneto-optical, e.g. light-induced thermomagnetic recording, spin magnetisation recording, Kerr or Faraday effect reproducing
    • G11B11/10532—Heads
    • G11B11/10541—Heads for reproducing
    • G11B11/10543—Heads for reproducing using optical beam of radiation
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B11/00—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor
    • G11B11/10—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field
    • G11B11/105—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field using a beam of light or a magnetic field for recording by change of magnetisation and a beam of light for reproducing, i.e. magneto-optical, e.g. light-induced thermomagnetic recording, spin magnetisation recording, Kerr or Faraday effect reproducing
    • G11B11/1055—Disposition or mounting of transducers relative to record carriers
    • G11B11/10552—Arrangements of transducers relative to each other, e.g. coupled heads, optical and magnetic head on the same base
    • G11B11/10554—Arrangements of transducers relative to each other, e.g. coupled heads, optical and magnetic head on the same base the transducers being disposed on the same side of the carrier
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/122—Flying-type heads, e.g. analogous to Winchester type in magnetic recording
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/123—Integrated head arrangements, e.g. with source and detectors mounted on the same substrate
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/135—Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
    • G11B7/1353—Diffractive elements, e.g. holograms or gratings
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/135—Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
    • G11B7/1372—Lenses
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/135—Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
    • G11B7/1372—Lenses
    • G11B7/1374—Objective lenses
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/135—Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
    • G11B7/1372—Lenses
    • G11B7/1378—Separate aberration correction lenses; Cylindrical lenses to generate astigmatism; Beam expanders
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/135—Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
    • G11B7/139—Numerical aperture control means
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/135—Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
    • G11B7/1392—Means for controlling the beam wavefront, e.g. for correction of aberration
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/135—Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
    • G11B7/1392—Means for controlling the beam wavefront, e.g. for correction of aberration
    • G11B7/13922—Means for controlling the beam wavefront, e.g. for correction of aberration passive
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/22—Apparatus or processes for the manufacture of optical heads, e.g. assembly
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083—Constructional arrangements
    • G02B2006/12104—Mirror; Reflectors or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B11/00—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor
    • G11B11/10—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field
    • G11B11/105—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field using a beam of light or a magnetic field for recording by change of magnetisation and a beam of light for reproducing, i.e. magneto-optical, e.g. light-induced thermomagnetic recording, spin magnetisation recording, Kerr or Faraday effect reproducing
    • G11B11/10532—Heads
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B11/00—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor
    • G11B11/10—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field
    • G11B11/105—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field using a beam of light or a magnetic field for recording by change of magnetisation and a beam of light for reproducing, i.e. magneto-optical, e.g. light-induced thermomagnetic recording, spin magnetisation recording, Kerr or Faraday effect reproducing
    • G11B11/1055—Disposition or mounting of transducers relative to record carriers
    • G11B11/1058—Flying heads
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/08—Disposition or mounting of heads or light sources relatively to record carriers
    • G11B7/085—Disposition or mounting of heads or light sources relatively to record carriers with provision for moving the light beam into, or out of, its operative position or across tracks, otherwise than during the transducing operation, e.g. for adjustment or preliminary positioning or track change or selection
    • G11B7/08547—Arrangements for positioning the light beam only without moving the head, e.g. using static electro-optical elements
    • G11B7/08564—Arrangements for positioning the light beam only without moving the head, e.g. using static electro-optical elements using galvanomirrors

Definitions

  • the present invention is directed to integrating optics on the wafer level
  • Magneto-optical heads are used to read current high-density magneto-optic
  • a magnetic coil is used to apply a magnetic field to the media
  • the light is then also delivered to the media to write to the media.
  • the light is also
  • optical fiber 8 delivers light to the head.
  • the head includes a slider block 10
  • a magnetic coil 14, aligned with the lens 12, is also mounted on the side of the slider block 10. The head sits on top of an air bearing
  • the height of the slider block 10 is limited, typically to between 500-1500
  • the number of lenses is desirably as small as possible. Therefore, the number of lenses
  • the optics or overall optical system of the head need to have
  • a high numerical aperture preferably greater than .6. This is difficult to achieve
  • Such elements include a magnetic coil, a light source, a detector, etc.
  • each wafer having a top surface and a bottom
  • optical elements being formed on more than one
  • the active element may be a thin film conductor whose magnetic properties
  • the active element may be integrated
  • the die may be formed from two wafers and optical elements are formed
  • the die may include a high numerical aperture optical system.
  • the bottom wafer of the more than one wafer may have a higher index of
  • the bottom surface of the die may further include features for
  • bottom wafer of the die may have a refractive element formed in a material of high
  • Metal portions serving as apertures may be integrated on at
  • An optical element may be formed
  • the layer has a refractive index
  • the layer may be any material that is different from the refractive index of the bottom wafer.
  • the layer may be any material that is different from the refractive index of the bottom wafer.
  • a monitoring optical system may be formed on each surface of the wafer
  • the spacing between wafers may be varied in
  • a top surface of the die may be etched and coated with a reflective coating
  • a further substrate may be mounted on
  • An insertion point may
  • the system may be on a side of the die and the system further includes a reflector for
  • a refractive element in the die may be a spherical lens and the die further
  • the compensating element may be on a surface immediately
  • the compensating element may be a diffractive
  • the refractive element may be an aspheric lens.
  • the die may include at least one additional refractive element, all refractive elements of the die being
  • an integrated micro-optical apparatus including a die formed from more
  • each wafer having a top surface and a bottom
  • bonded wafers being diced to yield multiple die, at least two optical
  • each die having a high numerical aperture.
  • the refractive element may be a spherical lens and the die further includes
  • the compensating element may be on a surface immediately
  • the compensating element may be a diffractive
  • the refractive element may be an aspheric lens.
  • the die may include at least one additional refractive element, all refractive
  • elements of the die being formed in material having a high numerical aperture.
  • the refractive element may be on a bottom wafer and of a material having a higher
  • Figure 1 illustrates a configuration of a high-density flying head magneto-
  • optical read/write device
  • Figure 2 A illustrates one configuration for the optics to be used in forming a
  • Figure 2B illustrates the spread function of the optical system shown in Figure
  • Figure 3 A illustrates a second embodiment of the optics for use in sliding
  • Figure 3B illustrates the spread function of the optical system shown in Figure
  • Figure 4A illustrates a third embodiment of an optical system to be used in the
  • Figure 4B illustrates the spread function of the optical system shown in Figure
  • Figure 5 is a side view of an embodiment of a slider block in accordance with
  • Figure 6 is a side view of another embodiment of a slider block in accordance
  • Figure 7 is a side view of another embodiment of a slider block in accordance
  • Figure 8A is a side view of another embodiment of a slider block in
  • Figure 8B is a bottom view of the embodiment in Figure 8 A.
  • more than one surface may be
  • Each wafer surface can have optics integrated thereon photolithographically, either
  • Each wafer contains an array of the same
  • a die product is called a die.
  • the side views of Figs. 2A, 3 A, and 4A illustrate such dies
  • a diffractive surface 20 is followed by a
  • a refractive surface 26 In the example shown in Figure 3A, a refractive surface 30
  • a refractive surface 40 is followed by a diffractive surface 42 which is
  • optical elements may be formed using any technique, to achieve the
  • the refractive lenses remain in
  • bottom substrate i.e., the substrate closest to the media, has a high index of refraction
  • this index is at least .3 greater
  • One example candidate material, SF56A, has a refractive
  • the bottom substrate is in very close proximity to the media, e.g.,
  • the use of a high index substrate allows a smaller spot size to
  • the numerical aperture N.A. is defined by the following:
  • N.A. n sin ⁇
  • n is the refractive index of the image space and ⁇ is the half-angle of the
  • invention includes a die composed of a plurality of chips, each surface of which is
  • the die is formed from wafers
  • the individual optical elements may be either diffractive, refractive
  • Bonding material 25 is placed at strategic locations on either
  • the wafers being bonded include fiducial marks somewhere else
  • fiducial marks may be used to facilitate the alignment and creation of mechanical
  • the fiducial marks and/or alignment features may be used to align the wafers.
  • the fiducial marks and/or alignment features are also useful in registering and placing the active elements and any attendant
  • active elements could be integrated either before or after dicing the wafers.
  • a magnetic head 63 including thin film conductors and/or a magnetic coil
  • pads for the magnetic coil are also preferably provided on this bottom surface.
  • additional wafers also may be provided thereby providing a total of seven surfaces.
  • the surface 54 would correspond to surface 24 or 34, respectively.
  • the surface 56 would correspond to surface 26 or 36, respectively.
  • Each of these wafer levels can be made very thin, for example, on the order of
  • the use of the wafer scale assembly allows accurate alignment
  • This wafer scale assembly also allows use of passive
  • the other dimensions of the slider block 61 are determined by
  • the size of the pads for the magnetic coil which is typically 1500 microns, on the
  • 67 may also include etch features thereon which facilitate the sliding of the slider
  • an optical element can be provided on the bottom surface 67 of
  • difference in refractive index between the layer 65 and the wafer should be at least
  • metal portions 69 may be provided to serve as
  • the aperture may also serve as the aperture stop, typically somewhere in the
  • the depth of focus is approximately 1
  • the thicknesses of the wafers can be controlled to within
  • the system is less sensitive to a variation from a design thickness for a particular
  • the position of the fiber or source location can be adjusted to correct for
  • the design of a diffractive element may be altered in accordance with a measured thickness of the
  • the entire system may be designed to focus the light at a position deeper
  • layer 65 may be deposited to provide the remaining required thickness to deliver the
  • the deposition of the layer 65 may be more precisely
  • the layer 65 does not have to be of
  • refractive index of the layer 65 does not need to be different from that of the wafer.
  • Figure 7 is a side view of another embodiment of the slider block. As shown
  • the top wafer preferably at a 45-degree angle.
  • Light reflected by the mirror 9 is
  • a diffractive element 75 followed by a refractive element 77, and delivered through
  • the top surface 50 is no longer available for
  • the mirror 9 may be
  • MEMS micro-electro-mechanical system
  • a tilt angle of the MEMS is controlled by application
  • the default position will preferably by 45
  • optical system consisting of, for example, diffractive elements 87, 89, used for
  • monitoring optical elements 81, 83 are
  • the monitoring optical elements 81, 83 are of the same design as the
  • optical elements are designed to focus at a same distance as that of the optical system.
  • the monitoring optical elements 81, 83 are larger than the optical
  • the monitoring optical elements 81 , 83 are
  • Figure 8B does
  • light is directed to the monitoring optical system to insure that light is being delivered to the aperture at the desired location.
  • the magnitude of light passing through the aperture will indicate if the optical system is sufficiently accurate, i.e., that the light is sufficiently focused at the aperture to allow a predetermined amount of light through. If the light is not sufficiently focused, the aperture will block too much of the light.
  • the optical system of the slider block may be tested prior to its insertion into the remaining device, even after being integrated with the active element 63.
  • the dimension requirement imposed by the contact pads for the magnetic coil 63 and the coil itself result in sufficient room available on the wafers for the inclusion of such a monitoring system, so the size of the slider block is unaffected by the incorporation of the monitoring system.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Head (AREA)
  • Lenses (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Semiconductor Lasers (AREA)
  • Micromachines (AREA)
  • Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)

Abstract

An integrated micro-optical system (61) includes at least two wafers with at least two optical elements (71, 73, 75, 77) provided on respective surfaces (50, 52, 54, 56, 58) of the at least two wafers. An active element (63) having a characteristic which changes in response to an applied field may be integrated on a bottom surface (67) of the wafers. The resulting optical system may present a high numerical aperture. Preferably, one of the optical elements is a refractive element formed in a material having a high index of refraction.

Description

INTEGRATED MICRO-OPTICAL SYSTEMS
Cross-references to Related Applications
The present application claims priority under 35 U.S.C. § 119 to U.S.
Provisional Application No. 60/079,378 filed on March 26, 1998, the entire
contents of which are hereby incorporated by reference.
BACKGROUND OF THE INVENTION
Field of the Invention
The present invention is directed to integrating optics on the wafer level
with an active element, particularly for use with magneto-optic heads.
Description of Related Art
Magneto-optical heads are used to read current high-density magneto-optic
media. In particular, a magnetic coil is used to apply a magnetic field to the media
and light is then also delivered to the media to write to the media. The light is also
used to read from the media in accordance with the altered characteristics of the
media from the application of the magnetic field and light.
An example of such a configuration is shown in Figure 1. In Figure 1 , an
optical fiber 8 delivers light to the head. The head includes a slider block 10
which has an objective lens 12 mounted on a side thereof. A mirror 9, also
mounted on the side of the slider block 10, directs light from the optical fiber 8
onto the objective lens 12. A magnetic coil 14, aligned with the lens 12, is also mounted on the side of the slider block 10. The head sits on top of an air bearing
sandwich 16 which is between the head and the media 18. The slider block 10
allows the head to slide across the media 18 and read from or write to the media
18.
The height of the slider block 10 is limited, typically to between 500-1500
microns, and is desirably as small as possible. Therefore, the number of lenses
which could be mounted on the slider block is also limited. Additionally,
alignment of more than one lens on the slider block is difficult. Further, due to the
small spot required, the optics or overall optical system of the head need to have
a high numerical aperture, preferably greater than .6. This is difficult to achieve
in a single objective lens due to the large sag associated therewith. The overall
head is thus difficult to assemble and not readily suited to mass production.
SUMMARY OF THE INVENTION
Therefore, it is an object of the present invention to provide a slider block
having an active element, i.e., an element having a characteristic which changes
in response to an applied field, integrated thereon which substantially overcomes
one or more of the problems due to the limitations and disadvantages of the related
art. Such elements include a magnetic coil, a light source, a detector, etc.
It is a further object of the present invention to integrate multiple optical
elements and a slider block having the active element integrated thereon as well.
It is a further object of the present invention to manufacture the objects on a wafer level, bond a plurality of wafers together and provide the active element on a
bottom surface of a bottom wafer.
At least one of the above and other advantages may be realized by
providing an integrated micro-optical system including a die formed from more
than one wafer bonded together, each wafer having a top surface and a bottom
surface, bonded wafers being diced to yield multiple dies and an active element
having a characteristic which changes in response to an applied field, integrated
on a bottom surface of the die, optical elements being formed on more than one
surface of the die.
The active element may be a thin film conductor whose magnetic properties
changes when a current is applied thereto. The active element may be integrated
as an array of active elements on the bottom wafer before the bonded wafers are
diced. The die may be formed from two wafers and optical elements are formed
on a top surface and a bottom surface of a top wafer and a top surface of the
bottom wafer. The die may include a high numerical aperture optical system.
The bottom wafer of the more than one wafer may have a higher index of
refraction than other wafers. There may be no optical elements on a bottom wafer
of the die. The bottom surface of the die may further include features for
facilitating sliding of the integrated micro-optical system etched thereon. The
bottom wafer of the die may have a refractive element formed in a material of high
numerical aperture. Metal portions serving as apertures may be integrated on at
least on one the surfaces of the die. A layer of material deposited on the bottom surface of the bottom wafer
before the active element is integrated thereon. An optical element may be formed
on the bottom surface of the bottom wafer, wherein the layer has a refractive index
that is different from the refractive index of the bottom wafer. The layer may be
deposited in accordance with a difference between a desired thickness and a
measured thickness.
A monitoring optical system may be formed on each surface of the wafer
containing an optical element. The spacing between wafers may be varied in
accordance with a difference between a measured thickness of a wafer and a
desired thickness of a wafer.
A top surface of the die may be etched and coated with a reflective coating
to direct light onto the optical elements. A further substrate may be mounted on
top of the top of the die having a MEMS mirror therein. An insertion point may
be provided on the die for receiving an optical fiber therein. The insertion point
may be on a side of the die and the system further includes a reflector for
redirecting light output by the fiber.
A refractive element in the die may be a spherical lens and the die further
includes a compensating element which compensates for aberrations exhibited by
the spherical lens. The compensating element may be on a surface immediately
adjacent the spherical lens. The compensating element may be a diffractive
element. The refractive element may be an aspheric lens. The die may include at least one additional refractive element, all refractive elements of the die being
formed in material having a high numerical aperture.
At least one of the above and other advantages may be realized by
providing an integrated micro-optical apparatus including a die formed from more
than one wafer bonded together, each wafer having a top surface and a bottom
surface, bonded wafers being diced to yield multiple die, at least two optical
elements being formed on respective surfaces of each die, at least one of the at
least two optical elements being a refractive element, a resulting optical system of
each die having a high numerical aperture.
The refractive element may be a spherical lens and the die further includes
a compensating element which compensates for aberrations exhibited by the
spherical lens. The compensating element may be on a surface immediately
adjacent the spherical lens. The compensating element may be a diffractive
element. The refractive element may be an aspheric lens.
The die may include at least one additional refractive element, all refractive
elements of the die being formed in material having a high numerical aperture.
The refractive element may be on a bottom wafer and of a material having a higher
refractive index than that of the bottom wafer.
Further scope of applicability of the present invention will become apparent
from the detailed description given hereinafter. However, it should be understood that
the detailed description and specific examples, while indicating preferred
embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become
apparent to those skilled in the art from this detailed description.
BRIEF DESCRIPTION OF THE DRAWINGS The present invention will become more fully understood from the detailed
description given herein below and the accompanying drawings which are given by
way of illustration only, and thus are not limitative of the present invention, and
wherein:
Figure 1 illustrates a configuration of a high-density flying head magneto-
optical read/write device;
Figure 2 A illustrates one configuration for the optics to be used in forming a
slider block;
Figure 2B illustrates the spread function of the optical system shown in Figure
2A;
Figure 3 A illustrates a second embodiment of the optics for use in sliding
block of the present invention;
Figure 3B illustrates the spread function of the optical system shown in Figure
3A;
Figure 4A illustrates a third embodiment of an optical system to be used in the
slider block of the present invention;
Figure 4B illustrates the spread function of the optical system shown in Figure
4A; Figure 5 is a side view of an embodiment of a slider block in accordance with
the present invention;
Figure 6 is a side view of another embodiment of a slider block in accordance
with the present invention;
Figure 7 is a side view of another embodiment of a slider block in accordance
with the present invention;
Figure 8A is a side view of another embodiment of a slider block in
accordance with the present invention; and
Figure 8B is a bottom view of the embodiment in Figure 8 A.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
All of the optical systems shown in Figures 2A-4B provide satisfactory results,
i.e., a high numerical aperture with good optical performance. The key element in
these optical systems is the distribution of the optical power over multiple available
surfaces. Preferably this distribution is even over the multiple surfaces. Sufficient
distribution for the high numerical aperture required is realized over more than one
surface. Due to the high numerical aperture required, this distribution of optical power
reduces the aberrations from the refractive surfaces and increases the diffractive
efficiency of the diffractive surfaces by reducing the deflection angle required from
each surface.
Further, a single refractive surface having a high numerical aperture would be
difficult to incorporate on a wafer, since the increased curvature required for affecting such a refractive surface would result in very thin portions of a typical wafer, leading
to concerns about fragility, or would require a thick wafer, which is not desirable in
many applications where size is a major constraint. Further, the precise shape control
required in the manufacture of a single refractive surface having high NA would
present a significant challenge. Finally, the surfaces having the optical power
distributed are easier to manufacture, have better reproducibility , and maintain a better
quality wavefront.
In accordance with the present invention, more than one surface may be
integrated with an active element such as a magnetic coil by bonding wafers together.
Each wafer surface can have optics integrated thereon photolithographically, either
directly or through molding or embossing. Each wafer contains an array of the same
optical elements. When more than two surfaces are desired, wafers are bonded
together. When the wafers are diced into individually apparatuses, the resulting
product is called a die. The side views of Figs. 2A, 3 A, and 4A illustrate such dies
which consist of two or three chips bonded together by a bonding material 25.
In the example shown in Figure 2A, a diffractive surface 20 is followed by a
refractive surface 22, which is followed by a diffractive surface 24, and then finally
a refractive surface 26. In the example shown in Figure 3A, a refractive surface 30
is followed by a diffractive surface 32, which is followed by a refractive surface 34
which is finally followed a diffractive surface 36. In the optical system shown in
Figure 4A, a refractive surface 40 is followed by a diffractive surface 42 which is
followed by a refractive surface 44 which is followed by a diffractive surface 46, which is followed by a refractive surface 48 and finally a diffractive surface 50. The
corresponding performance of each of these designs is shown in the corresponding
intensity spread function of Figs. 2B, 3B, and 4B.
When using spherical refractive elements as shown in Figures 2 A, 3 A and 4A,
it is convenient to follow these spherical refractive elements with a closely spaced
diffractive element to compensate for the attendant spherical aberration. An
aspherical refractive does not exhibit such aberrations, so the alternating arrangement
of refractives and diffractives will not necessarily be the preferred one.
While the optical elements may be formed using any technique, to achieve the
required high numerical aperture, it is preferable that the refractive lenses remain in
photoresist, rather than being transferred to the substrate. It is also preferable that the
bottom substrate, i.e., the substrate closest to the media, has a high index of refraction
relative of fused silica, for which n=1.36. Preferably, this index is at least .3 greater
than that of the substrate. One example candidate material, SF56A, has a refractive
index of 1.785. If the bottom substrate is in very close proximity to the media, e.g.,
less than 0.5 microns, the use of a high index substrate allows a smaller spot size to
be realized. The numerical aperture N.A. is defined by the following:
N.A. = n sin θ
where n is the refractive index of the image space and θ is the half-angle of the
maximum cone of light accepted by the lens. Thus, if the bottom substrate is in very
close proximity to the media, the higher the index of refraction of the bottom substrate, the smaller the acceptance half-angle for the same performance. This
reduction in angle increases the efficiency of the system.
As shown in Figure 5, the slider block 61 in accordance with the present
invention includes a die composed of a plurality of chips, each surface of which is
available for imparting optical structures thereon. The die is formed from wafers
having an array of respective optical elements formed thereon on either one or both
surfaces thereof. The individual optical elements may be either diffractive, refractive
or a hybrid thereof. Bonding material 25 is placed at strategic locations on either
substrate in order to facilitate the attachment thereof. By surrounding the optical
elements which are to form the final integrated die, the bonding material or adhesive
25 forms a seal between the wafers at these critical junctions. During dicing, the seal
prevents dicing slurry from entering between the elements, which would result in
contamination thereof. Since the elements remain bonded together, it is nearly
impossible to remove any dicing slurry trapped there between. The dicing slurry
presents even more problems when diffractive elements are being bonded, since the
structures of diffractive elements tend to trap the slurry.
Advantageously, the wafers being bonded include fiducial marks somewhere
thereon, most likely at an outer edge thereof, to ensure alignment of the wafers so that
all the individual elements thereon are aligned simultaneously. Alternatively, the
fiducial marks may be used to facilitate the alignment and creation of mechanical
alignment features on the wafers. One or both of the fiducial marks and the alignment
features may be used to align the wafers. The fiducial marks and/or alignment features are also useful in registering and placing the active elements and any attendant
structure, e.g., a metallic coil and contact pads therefor, on a bottom surface. These
active elements could be integrated either before or after dicing the wafers.
On a bottom surface 67 of the slider block 61 in accordance with the present
invention, a magnetic head 63 including thin film conductors and/or a magnetic coil
is integrated using thin film techniques, as disclosed, for example, in U.S. Patent No.
5,314,596 to Shukovsky et al. Entitled "Process for Fabricating Magnetic Film
Recording Head for use with a Magnetic Recording Media." The required contact
pads for the magnetic coil are also preferably provided on this bottom surface.
Since the magnetic coil 63 is integrated on the bottom surface 67, and the light
beam is to pass through the center of the magnetic coil, it is typically not practical to
also provide optical structures on this bottom surface. This leaves the remaining five
surfaces 50-58 available for modification in designing an optical system. Further,
additional wafers also may be provided thereby providing a total of seven surfaces.
With the examples shown in Figs. 2 A and 3 A the surface 50 would correspond to
surface 20 or 40, respectively, the surface 52 would correspond to surface 22 or 32,
respectively, the surface 54 would correspond to surface 24 or 34, respectively, and
the surface 56 would correspond to surface 26 or 36, respectively.
Each of these wafer levels can be made very thin, for example, on the order of
125 microns, so up to four wafers could be used even under the most constrained
conditions. If size and heat limitations permit, a light source could be integrated on the
top of the slider block, rather than using the fiber for delivery of light thereto. In addition to being thin, the use of the wafer scale assembly allows accurate alignment
of numerous objects, thereby increasing the number of surfaces containing optical
power, which can be used. This wafer scale assembly also allows use of passive
alignment techniques. The other dimensions of the slider block 61 are determined by
the size of the pads for the magnetic coil, which is typically 1500 microns, on the
surface 67, which is going to be much larger than any of the optics on the remaining
surfaces, and any size needed for stability of the slider block 61. The bottom surface
67 may also include etch features thereon which facilitate the sliding of the slider
block 61.
Many configurations of optical surfaces may be incorporated into the slider
block 61. The bonding, processing, and passive alignment of wafers is disclosed in
co-pending, commonly assigned U. S. Application No.08/727,837 entitled "Integrated
Optical Head for Disk Drives and Method of Forming Same" and U. S. Application
No. 08/943,274 entitled "Wafer Level Integration of Multiple Optical Heads" which
are both hereby incorporated by reference in their entirety.
Additionally, an optical element can be provided on the bottom surface 67 of
the bottom wafer as shown in Figure 6. When providing an optical element on this
bottom surface 67, a transparent layer 65, having a different refractive index than that
of the wafer itself is provided between the bottom surface 67 and the coil 63. The
difference in refractive index between the layer 65 and the wafer should be at least
approximately 0.3 in order to insure that the optical effect of the optical element
provided on the bottom surface 67 is discernable. Also as shown in Figure 6, a single wafer may be used if sufficient performance can be obtained from one or two optical
elements.
Further as shown in Figure 6, metal portions 69 may be provided to serve as
an aperture for the system. These apertures may be integrated on any of the wafer
surfaces. The aperture may also serve as the aperture stop, typically somewhere in the
optical system prior to the bottom surface thereof. When such metal portions 69
serving as an aperture are provided on the bottom surface 67, it is advantageous to
insure the metal portions 69 do not interfere with the operation of the metal coil 63.
A problem that arises when using a system with a high numerical aperture for
a very precise application is that the depth of focus of the system is very small.
Therefore, the distance from the optical system to the media must be very precisely
controlled to insure that the beam is focused at the appropriate position of the media.
For the high numerical apertures noted above, the depth of focus is approximately 1
micron or less. The thicknesses of the wafers can be controlled to within
approximately 1-5 microns, depending on the thickness and diameter of the wafer.
The thinner and smaller the wafer, the better the control. When multiple wafers are
used, the system is less sensitive to a variation from a design thickness for a particular
wafer, since the power is distributed through all the elements.
When using multiple wafers, the actual thickness of each wafer can be
measured and the spacing between the wafers can be adjusted to account for any
deviation. The position of the fiber or source location can be adjusted to correct for
thickness variations within the wafer assembly. Alternatively, the design of a diffractive element may be altered in accordance with a measured thickness of the
slider block in order to compensate for a variation from the desired thickness.
Alternatively, the entire system may be designed to focus the light at a position deeper
than the desired position assuming the thicknesses are precisely realized. Then, the
layer 65 may be deposited to provide the remaining required thickness to deliver the
spot at the desired position. The deposition of the layer 65 may be more precisely
controlled than the formation of the wafers, and may be varied to account for any
thickness variation within the system itself, i.e., the layer 65 does not have to be of
uniform thickness. If no optical element is provided on the bottom surface 67, then the
refractive index of the layer 65 does not need to be different from that of the wafer.
Figure 7 is a side view of another embodiment of the slider block. As shown
in Figure 7, the fiber 8 is inserted into the top wafer and the mirror 9 is integrated into
the top wafer, preferably at a 45-degree angle. Light reflected by the mirror 9 is
directed to a diffractive element 71 , followed by a refractive element 73, followed by
a diffractive element 75, followed by a refractive element 77, and delivered through
the coil 63. For such a configuration, the top surface 50 is no longer available for
providing an optical element.
Additionally, for fine scanning control of the light, the mirror 9 may be
replaced with a micro-electro-mechanical system (MEMS) mirror mounted on a
substrate on top of the top chip. A tilt angle of the MEMS is controlled by application
of a voltage on a surface on which the reflector is mounted, and is varied in accordance with the desired scanning. The default position will preferably by 45
degrees so the configuration will be the same as providing the mirror 9.
An additional feature for monitoring the spot of light output from the slider
block is shown in Figures 8 A and 8B. As shown in Figure 8 A, in addition to the
optical system, consisting of, for example, diffractive elements 87, 89, used for
delivering light through the magnetic coil 63, monitoring optical elements 81, 83 are
provided. The monitoring optical elements 81, 83 are of the same design as the
elements of the optical system 87, 89, respectively. In other words, the monitoring
optical elements are designed to focus at a same distance as that of the optical system.
Advantageously, the monitoring optical elements 81, 83 are larger than the optical
system elements for ease of construction and alignment of the test beam. In the
configuration shown in Figures 8 A and 8B, the monitoring optical elements 81 , 83 are
approximately twice the size of the element 87, 89. The monitoring system also
includes an aperture 85, preferably formed by metal. It is noted that Figure 8B does
not show the magnetic coil 63.
During testing, light is directed to the monitoring optical system to insure that light is being delivered to the aperture at the desired location. The magnitude of light passing through the aperture will indicate if the optical system is sufficiently accurate, i.e., that the light is sufficiently focused at the aperture to allow a predetermined amount of light through. If the light is not sufficiently focused, the aperture will block too much of the light.
Thus, by using the monitoring system shown in Figures 8A and 8B, the optical system of the slider block may be tested prior to its insertion into the remaining device, even after being integrated with the active element 63. The dimension requirement imposed by the contact pads for the magnetic coil 63 and the coil itself result in sufficient room available on the wafers for the inclusion of such a monitoring system, so the size of the slider block is unaffected by the incorporation of the monitoring system.
The invention being thus described, it will be obvious that the same may be
varied in many ways. Such variations are not to be regarded as a departure from the
spirit and scope of the invention, and all such modifications as would be obvious to
one skilled in the art are intended to be included within the scope of the following
claims.

Claims

What is claimed: 1. An integrated micro-optical system comprising: a die formed from more than one wafer bonded together, each wafer having a top surface and a bottom surface, bonded wafers being diced to yield multiple dies; and an active element having a characteristic which changes in response to an applied field, integrated on a bottom surface of the die, optical elements being formed on more than one surface of said die.
2. The system of claim 1 , wherein the active element comprises a thin film conductor whose magnetic properties changes when a current is applied thereto.
3. The system of claim 1 , wherein said die is formed from two wafers and optical elements are formed on a top surface and a bottom surface of a top wafer and a top surface of the bottom wafer.
4. The system of claim 1, wherein said die includes a high numerical aperture optical system.
5. The system of claim 1 , wherein a bottom wafer of said more than one wafer has a higher index of refraction than other wafers.
6. The system of claim 1, wherein there are no optical elements on a bottom wafer of the die.
7. The system of claim 1, wherein the bottom surface of the die further comprises features for facilitating sliding of tne integrated micro-optical system etched thereon.
8. The system of claim 1, wherein metal portions serving as apertures are integrated on at least on one said surfaces of said die.
9. The system of claim 1 , further comprising a layer of material deposited on the bottom surface of the bottom wafer before the active element is integrated thereon.
10. The system of claim 9, further comprising an optical element formed on the bottom surface of the bottom wafer, wherein the layer has a refractive index that is different from a refractive index of the bottom wafer.
11. The system of claim 9, wherein the layer is deposited in accordance with a difference between a desired thickness and a measured thickness.
12. The system of claim 1 , further comprising a monitoring optical system formed on each surface of said wafer containing an optical element.
13. The system of claim 1 , further comprising means for varying a spacing between wafers in accordance with a difference between a measured thickness of a wafer and a desired thickness of a wafer.
14. The system of claim 1 , wherein the active element is integrated as an array of active elements on the bottom wafer before the bonded wafers are diced.
15. The system of claim 1 , wherein a top surface of the die is etched and coated with a reflective coating to direct light onto the optical elements.
16. The system of claim 1 , further comprising a further substrate mounted on top of the top of the die having a MEMS mirror thereon.
17. The system of claim 1 , further comprising an insertion point on the die for receiving an optical fiber therein.
18. The system of claim 17, wherein the insertion point is on a side of the die and the system further comprises a reflector for redirecting light output by the fiber.
19. The system of claim 1, wherein a bottom wafer of the die has a refractive element formed in a material of high numerical aperture.
20. The system of claim 19, wherein the refractive element is a spherical lens and the die further comprises a compensating element which compensates for aberrations exhibited by the spherical lens.
21. The system of claim 20, wherein the compensating element is on a surface immediately adjacent the spherical lens.
22. The system of claim 20, wherein the compensating element is a diffractive element.
23. The system of claim 19, wherein the refractive element is an aspheric lens.
24. The system of claim 19, wherein the die includes at least one additional refractive element, all refractive elements of the die being formed in material having a high numerical aperture.
25. An integrated micro-optical apparatus comprising a die formed from more than one wafer bonded together, each wafer having a top surface and a bottom surface, bonded wafers being diced to yield multiple die, at least two optical elements being formed on respective surfaces of each die, at least one of said at least two optical elements being a refractive element, a resulting optical system of each die having a high numerical aperture.
26. The integrated micro-optical apparatus of claim 25, wherein the refractive element is a spherical lens and the die further comprises a compensating element which compensates for aberrations exhibited by the spherical lens.
27. The integrated micro-optical apparatus of claim 26, wherein the compensating element is on a surface immediately adjacent the spherical lens.
28. The integrated micro-optical apparatus of claim 26, wherein the compensating element is a diffractive element.
29. The integrated micro-optical apparatus of claim 25, wherein the refractive element is an aspheric lens.
30. The integrated micro-optical apparatus of claim 25, wherein the die includes at least one additional refractive element, all refractive elements of the die being formed in material having a high numerical aperture.
31. The integrated micro-optical apparatus of claim 25, wherein the refractive element is on a bottom wafer and is of a material having a higher refractive index than that of the bottom wafer.
PCT/US1999/006661 1998-03-26 1999-03-26 Integrated micro-optical systems WO1999049455A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP99915050A EP1064650B1 (en) 1998-03-26 1999-03-26 Integrated micro-optical systems
AT99915050T ATE241811T1 (en) 1998-03-26 1999-03-26 INTEGRATED MICROOPTIC SYSTEMS
JP2000538348A JP2003524849A (en) 1998-03-26 1999-03-26 Integrated micro optical system
AU33656/99A AU3365699A (en) 1998-03-26 1999-03-26 Integrated micro-optical systems
CA002324600A CA2324600C (en) 1998-03-26 1999-03-26 Integrated micro-optical systems
DE69908325T DE69908325T2 (en) 1998-03-26 1999-03-26 INTEGRATED MICROOPTIC SYSTEMS

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US7937898P 1998-03-26 1998-03-26
US60/079,378 1998-03-26

Publications (2)

Publication Number Publication Date
WO1999049455A2 true WO1999049455A2 (en) 1999-09-30
WO1999049455A3 WO1999049455A3 (en) 1999-12-02

Family

ID=22150176

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/006661 WO1999049455A2 (en) 1998-03-26 1999-03-26 Integrated micro-optical systems

Country Status (9)

Country Link
US (4) US6061169A (en)
EP (1) EP1064650B1 (en)
JP (2) JP2003524849A (en)
CN (1) CN1129023C (en)
AT (1) ATE241811T1 (en)
AU (1) AU3365699A (en)
CA (1) CA2324600C (en)
DE (1) DE69908325T2 (en)
WO (1) WO1999049455A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6914868B1 (en) 1999-12-07 2005-07-05 Dphi Acquisitions, Inc. Low profile optical head

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080128844A1 (en) * 2002-11-18 2008-06-05 Tessera North America Integrated micro-optical systems and cameras including the same
US6426829B1 (en) * 1998-03-26 2002-07-30 Digital Optics Corp. Integrated micro-optical systems
DE69908325T2 (en) * 1998-03-26 2004-04-01 Digital Optics Corp. INTEGRATED MICROOPTIC SYSTEMS
US6351027B1 (en) 2000-02-29 2002-02-26 Agilent Technologies, Inc. Chip-mounted enclosure
US6782596B2 (en) 2001-02-13 2004-08-31 University Of North Carolina At Charlotte Fiducial calibration systems and methods for manufacturing, inspection, and assembly
JP2002243912A (en) * 2001-02-14 2002-08-28 Sony Corp Lens, doublet, manufacturing method, optical pickup device, and optical disk device
US6717254B2 (en) 2001-02-22 2004-04-06 Tru-Si Technologies, Inc. Devices having substrates with opening passing through the substrates and conductors in the openings, and methods of manufacture
US6892002B2 (en) * 2001-03-29 2005-05-10 Ibsen Photonics A/S Stacked planar integrated optics and tool for fabricating same
US6787916B2 (en) 2001-09-13 2004-09-07 Tru-Si Technologies, Inc. Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity
JP2003132567A (en) * 2001-10-23 2003-05-09 Funai Electric Co Ltd Optical disk device
US20040021214A1 (en) * 2002-04-16 2004-02-05 Avner Badehi Electro-optic integrated circuits with connectors and methods for the production thereof
EP1502135A2 (en) * 2002-04-16 2005-02-02 Xloom Photonics Ltd. Electro-optical circuitry having integrated connector and methods for the production thereof
US8059345B2 (en) 2002-07-29 2011-11-15 Digitaloptics Corporation East Integrated micro-optical systems
US7550701B2 (en) * 2003-02-25 2009-06-23 Omnivision Cdm Optics, Inc. Non-linear wavefront coding systems and methods
US7037805B2 (en) * 2003-05-07 2006-05-02 Honeywell International Inc. Methods and apparatus for attaching a die to a substrate
US6927098B2 (en) * 2003-05-07 2005-08-09 Honeywell International Inc. Methods and apparatus for attaching MEMS devices to housing
US7538358B2 (en) 2003-10-15 2009-05-26 Xloom Communications, Ltd. Electro-optical circuitry having integrated connector and methods for the production thereof
JP2008519289A (en) 2004-09-14 2008-06-05 シーディーエム オプティックス， インコーポレイテッド Low-height imaging system and related methods
US20070114643A1 (en) * 2005-11-22 2007-05-24 Honeywell International Inc. Mems flip-chip packaging
US7491567B2 (en) * 2005-11-22 2009-02-17 Honeywell International Inc. MEMS device packaging methods
US20070236591A1 (en) * 2006-04-11 2007-10-11 Tam Samuel W Method for mounting protective covers over image capture devices and devices manufactured thereby
US8456560B2 (en) * 2007-01-26 2013-06-04 Digitaloptics Corporation Wafer level camera module and method of manufacture
JP2010525412A (en) 2007-04-24 2010-07-22 フレックストロニクス エーピー エルエルシー Small form factor module using flip-chip assembly with wafer level optics with cavity at bottom
JP2009031415A (en) * 2007-07-25 2009-02-12 Alps Electric Co Ltd Optical element
US20090093137A1 (en) * 2007-10-08 2009-04-09 Xloom Communications, (Israel) Ltd. Optical communications module
KR101572531B1 (en) * 2008-09-02 2015-11-27 삼성전자주식회사 Part being centered during assembly Wafer level parts assembly and Apparatus and method for manufacturing wafer level parts assembly
US9419032B2 (en) 2009-08-14 2016-08-16 Nanchang O-Film Optoelectronics Technology Ltd Wafer level camera module with molded housing and method of manufacturing
US20110249176A1 (en) * 2010-04-13 2011-10-13 Chuan-Ching Hsueh Wafer level lens module and related method for forming the same
US9733485B2 (en) 2015-10-30 2017-08-15 Himax Technologies Limited Collimating lens
EP3163347B1 (en) * 2015-11-02 2019-10-30 Himax Technologies Limited Collimating lens
US11886000B2 (en) * 2018-04-02 2024-01-30 Magic Leap, Inc. Waveguides having integrated spacers, waveguides having edge absorbers, and methods for making the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5314596A (en) * 1990-06-29 1994-05-24 Digital Equipment Corporation Process for fabricating magnetic film recording head for use with a magnetic recording media
US5361244A (en) * 1991-04-10 1994-11-01 Hitachi, Ltd. Optical head and information recording apparatus
US5422870A (en) * 1991-09-27 1995-06-06 Matsushita Electric Industrial Co., Ltd. Optical pickup for information recording/reproducing apparatus
US5481386A (en) * 1993-02-17 1996-01-02 Hitachi, Ltd. Flying type optical head integrally formed with light source and photodetector and optical disk apparatus with the same
US5771218A (en) * 1996-09-27 1998-06-23 Digital Optics Corporation Passively aligned integrated optical head including light source, detector, and optical element and methods of forming same
US5946281A (en) * 1995-03-08 1999-08-31 Hitachi, Ltd. Laminated proximity field optical head and optical information recording and reproducing device

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63237491A (en) * 1987-03-25 1988-10-03 Sony Corp Manufacture of optical device
US5105408A (en) * 1988-05-12 1992-04-14 Digital Equipment Corporation Optical head with flying lens
JP2861188B2 (en) * 1990-01-31 1999-02-24 ソニー株式会社 Magneto-optical recording / reproducing device
JPH05250708A (en) * 1992-03-03 1993-09-28 Hitachi Ltd Optical information recorder/reproducer
JP3350789B2 (en) * 1993-02-24 2002-11-25 株式会社日立製作所 Optical head and optical disk device
JPH0786555A (en) * 1993-09-16 1995-03-31 Hitachi Ltd Three-dimensional optoelectronic integrated circuit
US5508849A (en) * 1994-03-28 1996-04-16 Goodell; John B. Lens optical magnifying system and method of magnifying an object
US5911022A (en) * 1994-09-29 1999-06-08 Siemens Aktiengesellschaft Optical coupling arrangement
DE4440976A1 (en) * 1994-11-17 1996-05-23 Ant Nachrichtentech Optical transmitter and receiver with a surface emitting laser
JP3193945B2 (en) * 1995-03-17 2001-07-30 松下電器産業株式会社 Magneto-optical element and optical magnetic field sensor
JP3828179B2 (en) * 1995-05-12 2006-10-04 富士通株式会社 Semiconductor photodetection device and manufacturing method thereof
JP3694943B2 (en) * 1995-12-11 2005-09-14 ソニー株式会社 Optical apparatus and optical pickup
US6167016A (en) 1997-04-11 2000-12-26 Aerial Imaging Corporation Optical head with a diffractive lens for focusing a laser beam
US6162590A (en) 1997-04-11 2000-12-19 Aerial Imaging Corporation Method for making an optical or magneto-optic head and the resulting head
DE69908325T2 (en) * 1998-03-26 2004-04-01 Digital Optics Corp. INTEGRATED MICROOPTIC SYSTEMS
US6049430A (en) 1998-11-12 2000-04-11 Seagate Technology High numerical aperture objective lens manufacturable in wafer form

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5314596A (en) * 1990-06-29 1994-05-24 Digital Equipment Corporation Process for fabricating magnetic film recording head for use with a magnetic recording media
US5361244A (en) * 1991-04-10 1994-11-01 Hitachi, Ltd. Optical head and information recording apparatus
US5422870A (en) * 1991-09-27 1995-06-06 Matsushita Electric Industrial Co., Ltd. Optical pickup for information recording/reproducing apparatus
US5481386A (en) * 1993-02-17 1996-01-02 Hitachi, Ltd. Flying type optical head integrally formed with light source and photodetector and optical disk apparatus with the same
US5946281A (en) * 1995-03-08 1999-08-31 Hitachi, Ltd. Laminated proximity field optical head and optical information recording and reproducing device
US5771218A (en) * 1996-09-27 1998-06-23 Digital Optics Corporation Passively aligned integrated optical head including light source, detector, and optical element and methods of forming same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1064650A2 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6914868B1 (en) 1999-12-07 2005-07-05 Dphi Acquisitions, Inc. Low profile optical head

Also Published As

Publication number Publication date
JP2010044855A (en) 2010-02-25
CN1295678A (en) 2001-05-16
DE69908325T2 (en) 2004-04-01
US6741380B2 (en) 2004-05-25
JP2003524849A (en) 2003-08-19
US20030095343A1 (en) 2003-05-22
CA2324600A1 (en) 1999-09-30
US6061169A (en) 2000-05-09
CA2324600C (en) 2003-12-30
AU3365699A (en) 1999-10-18
US6483627B2 (en) 2002-11-19
US20020012157A1 (en) 2002-01-31
US6295156B1 (en) 2001-09-25
EP1064650A2 (en) 2001-01-03
ATE241811T1 (en) 2003-06-15
WO1999049455A3 (en) 1999-12-02
CN1129023C (en) 2003-11-26
EP1064650B1 (en) 2003-05-28
DE69908325D1 (en) 2003-07-03
EP1064650A4 (en) 2002-05-08

Similar Documents

Publication Publication Date Title
US6061169A (en) Integrated micro-optical systems
US6426829B1 (en) Integrated micro-optical systems
KR100433320B1 (en) Immersion system
EP0944049B1 (en) Optical head, disk apparatus, method for manufacturing optical head and optical element
EP0814468B1 (en) Optical recording and reproducing device
JP2002503011A (en) Integrated optical device for irradiating a separated beam on a detector and related methods
US6236513B1 (en) Integrated objective/solid immersion lens for near field recording
US5946282A (en) Optical recording/reproducing apparatus
EP0863502B1 (en) An optical pickup and an optical pickup objective lens assembling method
US20010046201A1 (en) Objective lens and optical head for optical disc drive
KR100560573B1 (en) Catadioptric lens, optical head, and optical recording/reproducing apparatus
US20050232121A1 (en) Refracting objective optical system and optical recording/reproducing device using the same
US6108135A (en) Planar proximity lens element and disk drive using same
US6151174A (en) Device for optically scanning a record carrier
JPH06195730A (en) Focus error detecting element and optical head using the same
US8059345B2 (en) Integrated micro-optical systems
US6091549A (en) Method and apparatus for adjustable spherical aberration correction and focusing
US20010048548A1 (en) Optical pickup head with micro-mirror
US20120094066A1 (en) Integrated micro-optical systems and cameras including the same
JP2002533860A (en) Optical scanning device
KR100603893B1 (en) Device for optically scanning a record carrier
US6717905B2 (en) Optical head and method of making the same
JP3457982B2 (en) Optical semiconductor device and method of manufacturing the same
JP2001014708A (en) Slider with lens and its manufacture

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 99804499.7

Country of ref document: CN

AK Designated states

Kind code of ref document: A2

Designated state(s): AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GD GE GH GM HR HU ID IL IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT UA UG US UZ VN YU ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW SD SL SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
AK Designated states

Kind code of ref document: A3

Designated state(s): AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GD GE GH GM HR HU ID IL IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT UA UG US UZ VN YU ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW SD SL SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
ENP Entry into the national phase

Ref document number: 2324600

Country of ref document: CA

Ref document number: 2324600

Country of ref document: CA

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 2000 538348

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: KR

WWE Wipo information: entry into national phase

Ref document number: 1999915050

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1999915050

Country of ref document: EP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

WWG Wipo information: grant in national office

Ref document number: 1999915050

Country of ref document: EP