WO1999043448A8 - Methods of wet processing electronic components using process liquids with controlled levels of gases - Google Patents

Methods of wet processing electronic components using process liquids with controlled levels of gases

Info

Publication number
WO1999043448A8
WO1999043448A8 PCT/US1999/003880 US9903880W WO9943448A8 WO 1999043448 A8 WO1999043448 A8 WO 1999043448A8 US 9903880 W US9903880 W US 9903880W WO 9943448 A8 WO9943448 A8 WO 9943448A8
Authority
WO
WIPO (PCT)
Prior art keywords
wet processing
methods
gases
electronic components
process liquids
Prior art date
Application number
PCT/US1999/003880
Other languages
French (fr)
Other versions
WO1999043448A1 (en
Inventor
Steven T Bay
Kevin R Durr
Christopher F Mcconnell
Steven Verhaverbeke
Original Assignee
Cfmt Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cfmt Inc filed Critical Cfmt Inc
Priority to AU27817/99A priority Critical patent/AU2781799A/en
Priority to KR1020007009475A priority patent/KR20010041359A/en
Priority to EP99908366A priority patent/EP1087848A1/en
Priority to JP2000533236A priority patent/JP2002535829A/en
Publication of WO1999043448A1 publication Critical patent/WO1999043448A1/en
Publication of WO1999043448A8 publication Critical patent/WO1999043448A8/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations

Abstract

The present invention is related to wet processing methods for electronic components using process liquids having controlled levels (i.e., amounts) of gases. The present invention provides methods of wet processing where at least two process liquids used during a wet processing procedure contain different levels of gases. Sonic energy may optionally be used in one or more wet process steps of a wet processing procedure to enhance results. The methods of the present invention can result in, for example, improved cleaning or reduced particle contamination during a wet processing procedure.
PCT/US1999/003880 1998-02-27 1999-02-23 Methods of wet processing electronic components using process liquids with controlled levels of gases WO1999043448A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU27817/99A AU2781799A (en) 1998-02-27 1999-02-23 Methods of wet processing electronic components using process liquids with controlled levels of gases
KR1020007009475A KR20010041359A (en) 1998-02-27 1999-02-23 Methods of Wet Processing Electronic Components Using Process Liquids with Controlled Levels of Gases
EP99908366A EP1087848A1 (en) 1998-02-27 1999-02-23 Methods of wet processing electronic components using process liquids with controlled levels of gases
JP2000533236A JP2002535829A (en) 1998-02-27 1999-02-23 Wet processing of electronic components using a process fluid containing controlled gas levels

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US7617598P 1998-02-27 1998-02-27
US25315799A 1999-02-19 1999-02-19
US09/253,157 1999-02-19
US60/076,175 1999-02-19

Publications (2)

Publication Number Publication Date
WO1999043448A1 WO1999043448A1 (en) 1999-09-02
WO1999043448A8 true WO1999043448A8 (en) 2001-02-08

Family

ID=26757750

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/003880 WO1999043448A1 (en) 1998-02-27 1999-02-23 Methods of wet processing electronic components using process liquids with controlled levels of gases

Country Status (6)

Country Link
EP (1) EP1087848A1 (en)
JP (1) JP2002535829A (en)
KR (1) KR20010041359A (en)
CN (1) CN1291921A (en)
AU (1) AU2781799A (en)
WO (1) WO1999043448A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100672933B1 (en) 2003-06-04 2007-01-23 삼성전자주식회사 Cleaning solution and cleaning method in a semiconductor device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5811358A (en) * 1997-01-03 1998-09-22 Mosel Vitelic Inc. Low temperature dry process for stripping photoresist after high dose ion implantation
US5800626A (en) * 1997-02-18 1998-09-01 International Business Machines Corporation Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates

Also Published As

Publication number Publication date
WO1999043448A1 (en) 1999-09-02
CN1291921A (en) 2001-04-18
KR20010041359A (en) 2001-05-15
JP2002535829A (en) 2002-10-22
EP1087848A1 (en) 2001-04-04
AU2781799A (en) 1999-09-15

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