WO1999038200A1 - Wafer cassette load station - Google Patents
Wafer cassette load station Download PDFInfo
- Publication number
- WO1999038200A1 WO1999038200A1 PCT/US1998/027497 US9827497W WO9938200A1 WO 1999038200 A1 WO1999038200 A1 WO 1999038200A1 US 9827497 W US9827497 W US 9827497W WO 9938200 A1 WO9938200 A1 WO 9938200A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pod
- door
- opening
- wafer
- pod door
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020007008068A KR20010034336A (en) | 1998-01-23 | 1998-12-22 | Wafer cassette load station |
EP98966079A EP1050068A1 (en) | 1998-01-23 | 1998-12-22 | Wafer cassette load station |
JP2000529001A JP2002502113A (en) | 1998-01-23 | 1998-12-22 | Wafer cassette loading station |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/012,323 US6082951A (en) | 1998-01-23 | 1998-01-23 | Wafer cassette load station |
US09/012,323 | 1998-01-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1999038200A1 true WO1999038200A1 (en) | 1999-07-29 |
Family
ID=21754424
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1998/027497 WO1999038200A1 (en) | 1998-01-23 | 1998-12-22 | Wafer cassette load station |
Country Status (6)
Country | Link |
---|---|
US (1) | US6082951A (en) |
EP (1) | EP1050068A1 (en) |
JP (1) | JP2002502113A (en) |
KR (1) | KR20010034336A (en) |
TW (1) | TW447067B (en) |
WO (1) | WO1999038200A1 (en) |
Cited By (7)
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---|---|---|---|---|
EP1121672A1 (en) * | 1998-10-15 | 2001-08-08 | Asyst Technologies, Inc. | Wafer mapping system |
EP1132947A2 (en) * | 2000-03-02 | 2001-09-12 | Applied Materials, Inc. | Fabrication system with extensible equipment sets |
EP1165412A1 (en) * | 1998-02-27 | 2002-01-02 | Pri Automation, Inc. | Door assembly for semiconductor wafer manufacturing |
WO2002003431A2 (en) * | 2000-06-30 | 2002-01-10 | Ajs Automation, Inc. | Apparatus and methods for semiconductor wafer processing equipment |
DE10144955A1 (en) * | 2001-09-12 | 2003-03-27 | Asys Gmbh | Arrangement for supplying microsystems has transport container with removable lid for connection to transition station lock gate and for movement with gate to open position |
WO2004008505A2 (en) * | 2002-07-17 | 2004-01-22 | Applied Materials, Inc. | Semiconductor substrate damage protection system |
JP2012009876A (en) * | 2000-07-10 | 2012-01-12 | Newport Corp | Pod load interface equipment adapted for implementation in fims system |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6390754B2 (en) * | 1997-05-21 | 2002-05-21 | Tokyo Electron Limited | Wafer processing apparatus, method of operating the same and wafer detecting system |
NL1009327C2 (en) * | 1998-06-05 | 1999-12-10 | Asm Int | Method and device for transferring wafers. |
US20040075822A1 (en) * | 1998-07-03 | 2004-04-22 | Nikon Corporation | Exposure apparatus and its making method, substrate carrying method, device manufacturing method and device |
US6322312B1 (en) | 1999-03-18 | 2001-11-27 | Applied Materials, Inc. | Mechanical gripper for wafer handling robots |
US6883770B1 (en) * | 1999-05-18 | 2005-04-26 | Tdk Corporation | Load port mounting mechanism |
JP3954287B2 (en) | 1999-06-28 | 2007-08-08 | 東京エレクトロン株式会社 | Wafer carrier lid attachment / detachment device |
JP4260298B2 (en) * | 1999-07-27 | 2009-04-30 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor parts |
US8348583B2 (en) * | 1999-10-19 | 2013-01-08 | Rorze Corporation | Container and loader for substrate |
JP3559213B2 (en) * | 2000-03-03 | 2004-08-25 | 株式会社半導体先端テクノロジーズ | Load port and production method using it |
US20020006322A1 (en) * | 2000-03-06 | 2002-01-17 | Applied Materials, Inc. | Pod door opener |
EP1139390A1 (en) * | 2000-03-28 | 2001-10-04 | Infineon Technologies AG | Semiconductor wafer pod |
US6652212B2 (en) * | 2000-05-02 | 2003-11-25 | Ckd Corporation | Cylinder, load port using it, and production system |
KR100500230B1 (en) * | 2000-07-26 | 2005-07-11 | 삼성전자주식회사 | Automatic carrying system and controlling method |
TW484750U (en) * | 2000-09-08 | 2002-04-21 | Ind Tech Res Inst | Opening/closing device for front-opened type wafer box |
TW460035U (en) * | 2000-09-08 | 2001-10-11 | Ind Tech Res Inst | Automatic front-opening load-in device for wafer box |
US6676356B2 (en) | 2000-09-18 | 2004-01-13 | Tokyo Electron Limited | Device for attaching target substrate transfer container to semiconductor processing apparatus |
US6572321B1 (en) | 2000-10-05 | 2003-06-03 | Applied Materials, Inc. | Loader conveyor for substrate processing system |
US6690993B2 (en) * | 2000-10-12 | 2004-02-10 | R. Foulke Development Company, Llc | Reticle storage system |
JP3699348B2 (en) * | 2000-11-30 | 2005-09-28 | 平田機工株式会社 | Drive unit isolation FOUP opener |
US7021882B2 (en) | 2000-11-30 | 2006-04-04 | Hirata Corporation | Drive-section-isolated FOUP opener |
US6533521B1 (en) * | 2001-03-29 | 2003-03-18 | Genmark Automation, Inc. | Integrated substrate handler having pre-aligner and storage pod access mechanism |
WO2002080232A2 (en) * | 2001-03-29 | 2002-10-10 | Genmark Automation, Inc. | Substrate storage pod access device |
US6585470B2 (en) | 2001-06-19 | 2003-07-01 | Brooks Automation, Inc. | System for transporting substrates |
KR100756999B1 (en) * | 2001-06-27 | 2007-09-11 | 주식회사 신성이엔지 | Pod fixing apparatus |
US6573522B2 (en) | 2001-06-27 | 2003-06-03 | Applied Matrials, Inc. | Locator pin integrated with sensor for detecting semiconductor substrate carrier |
US20030031538A1 (en) * | 2001-06-30 | 2003-02-13 | Applied Materials, Inc. | Datum plate for use in installations of substrate handling systems |
US6745908B2 (en) * | 2001-06-30 | 2004-06-08 | Applied Materials, Inc. | Shelf module adapted to store substrate carriers |
KR100757001B1 (en) * | 2001-07-14 | 2007-09-11 | 주식회사 신성이엔지 | Lifter of fOUP opener |
CN100435269C (en) | 2001-07-15 | 2008-11-19 | 应用材料有限公司 | Processing system |
EP1315198B1 (en) | 2001-11-21 | 2006-08-30 | RIGHT MFG. Co. Ltd. | Pod cover removing-installing apparatus |
US20080206028A1 (en) * | 2001-11-30 | 2008-08-28 | Tatsuhiko Nagata | Pod cover removing-installing apparatus |
US7344349B2 (en) * | 2001-11-30 | 2008-03-18 | Right Mfg. Co., Ltd. | Pod cover removing-installing apparatus |
US7360985B2 (en) * | 2002-12-30 | 2008-04-22 | Tdk Corporation | Wafer processing apparatus including clean box stopping mechanism |
US7074000B2 (en) * | 2002-12-31 | 2006-07-11 | Applied Materials, Inc. | Method and apparatus for undocking substrate pod with door status check |
US7578647B2 (en) * | 2003-01-27 | 2009-08-25 | Applied Materials, Inc. | Load port configurations for small lot size substrate carriers |
US20090308030A1 (en) * | 2003-01-27 | 2009-12-17 | Applied Materials, Inc. | Load port configurations for small lot size substrate carriers |
US7611318B2 (en) * | 2003-01-27 | 2009-11-03 | Applied Materials, Inc. | Overhead transfer flange and support for suspending a substrate carrier |
KR200319645Y1 (en) * | 2003-04-28 | 2003-07-12 | 이규옥 | Wafer carrier locker device |
US20050069399A1 (en) * | 2003-08-12 | 2005-03-31 | Chih-Ming Hsieh | Apparatus and method for dry-loading of substrates in scrubber cleaner |
US7264331B2 (en) * | 2003-10-29 | 2007-09-04 | Konica Minolta Medical & Graphic, Inc. | Ink jet recording apparatus |
US20050230525A1 (en) * | 2004-03-30 | 2005-10-20 | Paterro Von F C | Craft with magnetically curved space |
JP2005340614A (en) * | 2004-05-28 | 2005-12-08 | Tdk Corp | Load port for clean system |
JP4597708B2 (en) * | 2005-02-25 | 2010-12-15 | 平田機工株式会社 | FOUP opener |
US9457442B2 (en) * | 2005-06-18 | 2016-10-04 | Futrfab, Inc. | Method and apparatus to support process tool modules in a cleanspace fabricator |
US9339900B2 (en) * | 2005-08-18 | 2016-05-17 | Futrfab, Inc. | Apparatus to support a cleanspace fabricator |
TW200808628A (en) * | 2006-08-09 | 2008-02-16 | Gudeng Prec Ind Co Ltd | Filling device of conveying box |
JP4713424B2 (en) * | 2006-08-24 | 2011-06-29 | 川崎重工業株式会社 | Opener side door drive mechanism |
WO2008147379A1 (en) * | 2006-09-14 | 2008-12-04 | Brooks Automation Inc. | Carrier gas system and coupling substrate carrier to a loadport |
WO2008097588A1 (en) * | 2007-02-05 | 2008-08-14 | Applied Materials, Inc. | Small lot loadport configurations |
US20080240892A1 (en) * | 2007-03-28 | 2008-10-02 | International Business Machines Corporation | Storage buffer device for automated material handling systems |
TWI475627B (en) | 2007-05-17 | 2015-03-01 | Brooks Automation Inc | Substrate carrier, substrate processing apparatus and system, for reducing particle contamination of substrate during processing and method of interfacing a carrier with a processing tool |
KR100882428B1 (en) * | 2007-06-08 | 2009-02-05 | 주식회사 동부하이텍 | Pod locking system of Standard Mechanical Interface and controlling method thereof |
JP4438966B2 (en) * | 2007-11-29 | 2010-03-24 | Tdk株式会社 | Storage container lid opening / closing system and substrate processing method using the system |
CN100585228C (en) * | 2008-06-18 | 2010-01-27 | 冯辅周 | Transmission device for converting single power source input to multi- freedom degree output |
US8528947B2 (en) * | 2008-09-08 | 2013-09-10 | Tdk Corporation | Closed container and lid opening/closing system therefor |
JP4748816B2 (en) * | 2008-11-28 | 2011-08-17 | Tdk株式会社 | Closed container lid opening and closing system |
CN102315145A (en) * | 2011-09-23 | 2012-01-11 | 北京七星华创电子股份有限公司 | Reaction-chamber cover plate and reaction chamber provided with same |
KR101425860B1 (en) | 2012-09-11 | 2014-07-31 | (주)세미코아 | Stage for loadport |
US20220285193A1 (en) * | 2021-03-04 | 2022-09-08 | Applied Materials, Inc. | Shortened load port for factory interface |
JP2023023465A (en) * | 2021-08-05 | 2023-02-16 | シンフォニアテクノロジー株式会社 | load port |
US11728194B2 (en) * | 2021-12-07 | 2023-08-15 | Nanya Technology Corporation | Wafer handling apparatus and method of operating the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0735573A1 (en) * | 1995-03-28 | 1996-10-02 | JENOPTIK Aktiengesellschaft | Loading and unloading station for semiconductor treatment installations |
US5607276A (en) * | 1995-07-06 | 1997-03-04 | Brooks Automation, Inc. | Batchloader for substrate carrier on load lock |
Family Cites Families (11)
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US4776744A (en) * | 1985-09-09 | 1988-10-11 | Applied Materials, Inc. | Systems and methods for wafer handling in semiconductor process equipment |
US4917556A (en) * | 1986-04-28 | 1990-04-17 | Varian Associates, Inc. | Modular wafer transport and processing system |
US4954721A (en) * | 1988-03-30 | 1990-09-04 | Tel Sagami Limited | Apparatus for detecting an array of wafers |
KR100221983B1 (en) * | 1993-04-13 | 1999-09-15 | 히가시 데쓰로 | A treating apparatus for semiconductor process |
US5525024A (en) * | 1994-08-17 | 1996-06-11 | Applied Materials, Inc. | Cassette loader having compound translational motion |
US5713711A (en) * | 1995-01-17 | 1998-02-03 | Bye/Oasis | Multiple interface door for wafer storage and handling container |
US5586585A (en) * | 1995-02-27 | 1996-12-24 | Asyst Technologies, Inc. | Direct loadlock interface |
JP3288200B2 (en) * | 1995-06-09 | 2002-06-04 | 東京エレクトロン株式会社 | Vacuum processing equipment |
US5613821A (en) * | 1995-07-06 | 1997-03-25 | Brooks Automation, Inc. | Cluster tool batchloader of substrate carrier |
US5664926A (en) * | 1995-07-11 | 1997-09-09 | Progressive System Technologies, Inc. | Stage assembly for a substrate processing system |
US5810537A (en) * | 1995-10-18 | 1998-09-22 | Bye/Oasis Engineering Inc. | Isolation chamber transfer apparatus |
-
1998
- 1998-01-23 US US09/012,323 patent/US6082951A/en not_active Expired - Fee Related
- 1998-12-22 KR KR1020007008068A patent/KR20010034336A/en active IP Right Grant
- 1998-12-22 EP EP98966079A patent/EP1050068A1/en not_active Withdrawn
- 1998-12-22 JP JP2000529001A patent/JP2002502113A/en not_active Withdrawn
- 1998-12-22 WO PCT/US1998/027497 patent/WO1999038200A1/en active IP Right Grant
- 1998-12-29 TW TW087121835A patent/TW447067B/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0735573A1 (en) * | 1995-03-28 | 1996-10-02 | JENOPTIK Aktiengesellschaft | Loading and unloading station for semiconductor treatment installations |
US5607276A (en) * | 1995-07-06 | 1997-03-04 | Brooks Automation, Inc. | Batchloader for substrate carrier on load lock |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1165412A1 (en) * | 1998-02-27 | 2002-01-02 | Pri Automation, Inc. | Door assembly for semiconductor wafer manufacturing |
EP1165412A4 (en) * | 1998-02-27 | 2003-03-19 | Pri Automation Inc | Door assembly for semiconductor wafer manufacturing |
EP1121672A1 (en) * | 1998-10-15 | 2001-08-08 | Asyst Technologies, Inc. | Wafer mapping system |
EP1121672A4 (en) * | 1998-10-15 | 2009-05-06 | Asyst Technologies | Wafer mapping system |
EP1132947A3 (en) * | 2000-03-02 | 2006-06-21 | Applied Materials, Inc. | Fabrication system with extensible equipment sets |
EP1132947A2 (en) * | 2000-03-02 | 2001-09-12 | Applied Materials, Inc. | Fabrication system with extensible equipment sets |
WO2002003431A2 (en) * | 2000-06-30 | 2002-01-10 | Ajs Automation, Inc. | Apparatus and methods for semiconductor wafer processing equipment |
WO2002003431A3 (en) * | 2000-06-30 | 2002-09-26 | Ajs Automation Inc | Apparatus and methods for semiconductor wafer processing equipment |
JP2012009876A (en) * | 2000-07-10 | 2012-01-12 | Newport Corp | Pod load interface equipment adapted for implementation in fims system |
JP2014123759A (en) * | 2000-07-10 | 2014-07-03 | Newport Corp | System |
DE10144955A1 (en) * | 2001-09-12 | 2003-03-27 | Asys Gmbh | Arrangement for supplying microsystems has transport container with removable lid for connection to transition station lock gate and for movement with gate to open position |
DE10144955B4 (en) * | 2001-09-12 | 2006-06-29 | Asys Automatic Systems Gmbh & Co. Kg | Device for feeding microsystems |
WO2004008505A2 (en) * | 2002-07-17 | 2004-01-22 | Applied Materials, Inc. | Semiconductor substrate damage protection system |
WO2004008505A3 (en) * | 2002-07-17 | 2004-10-14 | Applied Materials Inc | Semiconductor substrate damage protection system |
US7204669B2 (en) | 2002-07-17 | 2007-04-17 | Applied Materials, Inc. | Semiconductor substrate damage protection system |
Also Published As
Publication number | Publication date |
---|---|
KR20010034336A (en) | 2001-04-25 |
TW447067B (en) | 2001-07-21 |
JP2002502113A (en) | 2002-01-22 |
EP1050068A1 (en) | 2000-11-08 |
US6082951A (en) | 2000-07-04 |
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