WO1999024207A3 - Arrangement of a shroud for accommodating a protective gas atmosphere for soldering printed circuit modules - Google Patents

Arrangement of a shroud for accommodating a protective gas atmosphere for soldering printed circuit modules Download PDF

Info

Publication number
WO1999024207A3
WO1999024207A3 PCT/EP1998/006963 EP9806963W WO9924207A3 WO 1999024207 A3 WO1999024207 A3 WO 1999024207A3 EP 9806963 W EP9806963 W EP 9806963W WO 9924207 A3 WO9924207 A3 WO 9924207A3
Authority
WO
WIPO (PCT)
Prior art keywords
shroud
printed circuit
arrangement
circuit modules
accommodating
Prior art date
Application number
PCT/EP1998/006963
Other languages
German (de)
French (fr)
Other versions
WO1999024207A2 (en
Inventor
Ralph Schellen
Tilman Schwinn
Jens Tauchmann
Original Assignee
Messer Griesheim Gmbh
Ralph Schellen
Tilman Schwinn
Jens Tauchmann
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Messer Griesheim Gmbh, Ralph Schellen, Tilman Schwinn, Jens Tauchmann filed Critical Messer Griesheim Gmbh
Publication of WO1999024207A2 publication Critical patent/WO1999024207A2/en
Publication of WO1999024207A3 publication Critical patent/WO1999024207A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)

Abstract

The invention relates to an arrangement of a shroud (10, 23, 24) for accommodating a protective gas atmosphere for soldering printed circuit modules on a solder container (21). Said printed circuit modules are brought into contact with at least one solder wave in the container whilst they are being transported through the shroud. The shroud has an inlet for the printed circuit modules on an inlet side and an outlet for the same on an outlet side. The inventive arrangement also has a supply of non-oxidising gas and a device for admitting gas into the shroud. Connecting means (12, 17, 18) are provided at the upper end of the solder container to allow for the contact-free arrangement of the shroud (10, 23, 24) with the solder bath (34). The inventive shroud is therefore easy to assemble and disassemble for use with existing wave soldering installations.
PCT/EP1998/006963 1997-11-07 1998-11-03 Arrangement of a shroud for accommodating a protective gas atmosphere for soldering printed circuit modules WO1999024207A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19749186.3 1997-11-07
DE19749186A DE19749186A1 (en) 1997-11-07 1997-11-07 Arrangement of a jacket for taking up a protective gas atmosphere for soldering flat assemblies

Publications (2)

Publication Number Publication Date
WO1999024207A2 WO1999024207A2 (en) 1999-05-20
WO1999024207A3 true WO1999024207A3 (en) 1999-10-28

Family

ID=7847891

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1998/006963 WO1999024207A2 (en) 1997-11-07 1998-11-03 Arrangement of a shroud for accommodating a protective gas atmosphere for soldering printed circuit modules

Country Status (3)

Country Link
DE (1) DE19749186A1 (en)
WO (1) WO1999024207A2 (en)
ZA (1) ZA9810127B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0500135A2 (en) * 1991-02-22 1992-08-26 Praxair Technology, Inc. Wave soldering in a protective atmosphere enclosure over a solder pot
US5297724A (en) * 1993-05-26 1994-03-29 The Boc Group, Inc. Wave soldering method and apparatus
US5411200A (en) * 1994-02-28 1995-05-02 American Air Liquide, Inc. Process and apparatus for the wave soldering of circuit boards
EP0854001A1 (en) * 1997-01-20 1998-07-22 Nihon Den-Netsu Keiki Co., Ltd. Gas flow controlling device and soldering apparatus using same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4209133A1 (en) * 1992-03-20 1993-09-23 Linde Ag Installation for wave soldering printed circuit boards - includes transport facility having an adjustable angle of inclination

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0500135A2 (en) * 1991-02-22 1992-08-26 Praxair Technology, Inc. Wave soldering in a protective atmosphere enclosure over a solder pot
US5297724A (en) * 1993-05-26 1994-03-29 The Boc Group, Inc. Wave soldering method and apparatus
US5411200A (en) * 1994-02-28 1995-05-02 American Air Liquide, Inc. Process and apparatus for the wave soldering of circuit boards
EP0854001A1 (en) * 1997-01-20 1998-07-22 Nihon Den-Netsu Keiki Co., Ltd. Gas flow controlling device and soldering apparatus using same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN *

Also Published As

Publication number Publication date
ZA9810127B (en) 1999-05-05
WO1999024207A2 (en) 1999-05-20
DE19749186A1 (en) 1999-06-10

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