WO1999014766A1 - Moisture-curable electrically-insulating resin - Google Patents
Moisture-curable electrically-insulating resin Download PDFInfo
- Publication number
- WO1999014766A1 WO1999014766A1 PCT/US1997/016210 US9716210W WO9914766A1 WO 1999014766 A1 WO1999014766 A1 WO 1999014766A1 US 9716210 W US9716210 W US 9716210W WO 9914766 A1 WO9914766 A1 WO 9914766A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin
- polymer
- group
- water
- silicon
- Prior art date
Links
- 239000011347 resin Substances 0.000 title claims abstract description 97
- 229920005989 resin Polymers 0.000 title claims abstract description 97
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 claims abstract description 73
- 239000002808 molecular sieve Substances 0.000 claims abstract description 72
- 229920000642 polymer Polymers 0.000 claims abstract description 52
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 51
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 47
- 238000009413 insulation Methods 0.000 claims abstract description 44
- 239000010703 silicon Substances 0.000 claims abstract description 43
- 239000003054 catalyst Substances 0.000 claims abstract description 30
- XLYOFNOQVPJJNP-DYCDLGHISA-N deuterium hydrogen oxide Chemical compound [2H]O XLYOFNOQVPJJNP-DYCDLGHISA-N 0.000 claims abstract description 20
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 15
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 14
- 231100000053 low toxicity Toxicity 0.000 claims abstract description 10
- 229920000620 organic polymer Polymers 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 66
- 229910001868 water Inorganic materials 0.000 claims description 66
- 239000011342 resin composition Substances 0.000 claims description 57
- 239000000203 mixture Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 17
- 238000006460 hydrolysis reaction Methods 0.000 claims description 14
- 229920000570 polyether Polymers 0.000 claims description 12
- 230000007062 hydrolysis Effects 0.000 claims description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- 238000007872 degassing Methods 0.000 claims description 7
- 125000002947 alkylene group Chemical group 0.000 claims description 6
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 4
- 239000011148 porous material Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000004971 Cross linker Substances 0.000 claims 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 45
- 238000001723 curing Methods 0.000 description 25
- 239000000945 filler Substances 0.000 description 20
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 16
- 239000000463 material Substances 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 10
- 238000004132 cross linking Methods 0.000 description 9
- 229920001451 polypropylene glycol Polymers 0.000 description 9
- 238000010998 test method Methods 0.000 description 9
- 229910000019 calcium carbonate Inorganic materials 0.000 description 8
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 5
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000004014 plasticizer Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000000454 talc Substances 0.000 description 4
- 229910052623 talc Inorganic materials 0.000 description 4
- 239000010457 zeolite Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000002318 adhesion promoter Substances 0.000 description 3
- HHSPVTKDOHQBKF-UHFFFAOYSA-J calcium;magnesium;dicarbonate Chemical compound [Mg+2].[Ca+2].[O-]C([O-])=O.[O-]C([O-])=O HHSPVTKDOHQBKF-UHFFFAOYSA-J 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 230000001877 deodorizing effect Effects 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- YOBOXHGSEJBUPB-MTOQALJVSA-N (z)-4-hydroxypent-3-en-2-one;zirconium Chemical compound [Zr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O YOBOXHGSEJBUPB-MTOQALJVSA-N 0.000 description 2
- TYKCBTYOMAUNLH-MTOQALJVSA-J (z)-4-oxopent-2-en-2-olate;titanium(4+) Chemical compound [Ti+4].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O TYKCBTYOMAUNLH-MTOQALJVSA-J 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 229910021536 Zeolite Inorganic materials 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- 229910000323 aluminium silicate Inorganic materials 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 2
- BSDOQSMQCZQLDV-UHFFFAOYSA-N butan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] BSDOQSMQCZQLDV-UHFFFAOYSA-N 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- DYHSMQWCZLNWGO-UHFFFAOYSA-N di(propan-2-yloxy)alumane Chemical compound CC(C)O[AlH]OC(C)C DYHSMQWCZLNWGO-UHFFFAOYSA-N 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000000383 hazardous chemical Substances 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- HKJYVRJHDIPMQB-UHFFFAOYSA-N propan-1-olate;titanium(4+) Chemical compound CCCO[Ti](OCCC)(OCCC)OCCC HKJYVRJHDIPMQB-UHFFFAOYSA-N 0.000 description 2
- ZGSOBQAJAUGRBK-UHFFFAOYSA-N propan-2-olate;zirconium(4+) Chemical compound [Zr+4].CC(C)[O-].CC(C)[O-].CC(C)[O-].CC(C)[O-] ZGSOBQAJAUGRBK-UHFFFAOYSA-N 0.000 description 2
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 2
- 238000010561 standard procedure Methods 0.000 description 2
- -1 trimethylsiloxy group Chemical group 0.000 description 2
- 150000003755 zirconium compounds Chemical class 0.000 description 2
- ZBBLRPRYYSJUCZ-GRHBHMESSA-L (z)-but-2-enedioate;dibutyltin(2+) Chemical compound [O-]C(=O)\C=C/C([O-])=O.CCCC[Sn+2]CCCC ZBBLRPRYYSJUCZ-GRHBHMESSA-L 0.000 description 1
- IYNGLSRZLOHZJA-UHFFFAOYSA-N 1,4,7-triazabicyclo[5.2.2]undecane Chemical compound C1CN2CCN1CCNCC2 IYNGLSRZLOHZJA-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 125000004423 acyloxy group Chemical group 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 125000003158 alcohol group Chemical group 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000003302 alkenyloxy group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000002344 aminooxy group Chemical group [H]N([H])O[*] 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013522 chelant Chemical class 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 231100000206 health hazard Toxicity 0.000 description 1
- 239000007970 homogeneous dispersion Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 229920001477 hydrophilic polymer Polymers 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- YMQPOZUUTMLSEK-UHFFFAOYSA-L lead(2+);octanoate Chemical compound [Pb+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O YMQPOZUUTMLSEK-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 150000001282 organosilanes Chemical class 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- IUTCEZPPWBHGIX-UHFFFAOYSA-N tin(2+) Chemical class [Sn+2] IUTCEZPPWBHGIX-UHFFFAOYSA-N 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000000196 viscometry Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/427—Polyethers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
Definitions
- the present invention relates to moisture-curable resins comprising one or more organic polymers bearing silicon-containing end groups, one or more curing catalysts, one or more molecular sieves and water.
- the resins can be cured to form void-free resin masses suitable for use as potting compounds and as insulating resins for electrical cable splices, particularly low-voltage splices.
- US 3,971,751 describes a composition comprising a polyether having silicon end groups which is curable to a rubber-like substance upon exposure to atmospheric moisture at room temperature which is useable as a sealing material or adhesive. Curing catalysts and fillers such as calcium carbonate are described.
- Japanese patent 3-6941 (1991) describes a room temperature curable composition
- a room temperature curable composition comprising a) 100 parts by weight of a polymer comprising a polyether segment bearing hydrolyzable silicon-containing radicals capable of causing a crosslinking reaction b) 0.01 to 30 parts by weight zeolite and c) 0.0001 to 10 parts by weight curing catalyst.
- Zeolite as one of a group of silicious materials, is added to the resin to prevent deactivation of the curing agents at exposed surface of the resin which are cast on release liners to form thin films and sheets.
- Such polymers allow continued employment of certain useful polymeric backbone segments such as polyethers and polyurethanes, while offering new end-group chemistries for the curing of such polymers.
- isocyanate chemistry commonly used as a crosslinking mechanism for polymers used in insulating resins, can be replaced with reactive silicon chemistry.
- Use of new end group chemistries requires that new resin compositions be found which meet the requirements generally imposed in electrical applications and in particular in insulation of electrical splices in for example, low (up to IK Volt) or medium (up to 36K Volt) voltage applications.
- Such requirements typically include: room temperature curability, appropriate viscosity, good adhesion to cable jacket, high volume resistivity, high electrical resistance, an appropriate pot life, a high hardness, non- foaming in the presence of water and low moisture pickup.
- the invention also provides a kit of two parts, wherein part I comprises at least one polymer (A) having an organic backbone and at least one silicon-containing end group having at least one hydroxyl or hydrolyzable group, whereby said polymer is crosslinkable through formation of one or more siloxane bonds, at least one molecular sieve (C) and water (D), wherein the amounts of molecular sieve (C) and water (D) and are selected so that the insulation resistance, R grim of the cured resin is at least 10,000 MOhm, and wherein part II comprises at least one curing catalyst (B).
- part I comprises at least one polymer (A) having an organic backbone and at least one silicon-containing end group having at least one hydroxyl or hydrolyzable group, whereby said polymer is crosslinkable through formation of one or more siloxane bonds, at least one molecular sieve (C) and water (D), wherein the amounts of molecular sieve (C) and water (D) and are selected so that the insulation resistance, R mica of
- the present invention provides the use of such a resin composition for electrical applications.
- a low-toxicity moisture-curable resin comprising
- the resin composition of the present invention comprises at least one polymer having an organic backbone and at least one silicon-containing end group having at least one hydroxyl or hydrolyzable group.
- Polymers bearing hydrolyzable silicon-containing end groups, denoted as component (A) of the composition of the present invention, may comprise any organic backbone chain.
- Specific examples of organic backbones useful in the present invention comprise polyethers having repeating units of the formula -R-O- in which R is a divalent organic group, preferably a divalent alkylene group (as described, for example, in Japanese patent application No.
- polyacrylates obtainable through radical polymerization of an acrylate, acrylate copolymers of an acrylate with, for example, vinyl acetate, acrylonitrile, methylmethacrylate or styrene (as described, for example, in Japanese Patent Kokai Publication No. 168014/1984); saturated hydrocarbon based polymers such as isoprene-based polymers and hydrogenated diene-based polymers (described, for example, in Japanese patent application Nos.
- polyethers modified with vinyl monomers which can be prepared by polymerizing vinyl monomers (such as, for example, (meth)acrylates where the alcohol residue has 1-12 carbon atoms, vinyl acetate, styrene or acrylonitrile) in polyethers which have been prepared by polymerizing cyclic ethers (such as propylene oxide, ethylene oxide or tetrahydrofuran), and polyurethanes described, for example, in US 5,587,502.
- vinyl monomers such as, for example, (meth)acrylates where the alcohol residue has 1-12 carbon atoms, vinyl acetate, styrene or acrylonitrile
- cyclic ethers such as propylene oxide, ethylene oxide or tetrahydrofuran
- polyurethanes described, for example, in US 5,587,502.
- R is a divalent organic group, preferably a divalent alkylene group and especially preferably R is propylene, are preferred.
- the polyether polymer segment may be of any molecular weight which results in the formation of a curable resin composition which is liquid and pourable at ambient temperatures.
- Molecular weight of the polyether polymer segment is preferably in the range of 500 - 20,000 as measured by number average molecular weight, Mschreib.
- M n is preferably 1,000 - 10,000 and most preferably 1,000 - 5,000.
- the silicon-containing end groups of polymer (A) are well known groups and can be crosslinked even at ambient temperatures.
- a typical example of such a group may be represented by the formula (II)
- the silicon-containing end group may also be a triorganosiloxy group of the formula III:
- the silicon-containing reactive group When the silicon atoms are bonded to the organic backbone through siloxane linkages, the silicon-containing reactive group preferably contains ⁇ 20 silicon atoms.
- the polymer of component (A) bearing hydrolyzable silicon-containing end groups has more than one, preferably 1.2 to 6 silicon-containing reactive groups in a molecule on the average. When the number of the silicon-containing group in a molecule is less than about 1.2 on the average, the curable composition is not effectively cured and the improvement of the properties is not satisfactorily achieved. When the average number of the silicon-containing reactive groups exceeds six, the cured polymer tends to lose flexibility.
- Kits of parts comprising two-part resin compositions are disclosed, for example, in U.S. Patent 2,932,385 or U.S. Patent 3,074,544.
- U.S. Patent 3,074,544 discloses a multiple compartment, flexible, unitary package for compartmentalized accommodation and selective admixture of at least two fluent materials, comprising a normally flat envelope being joined by heat sealing to form a transversely extending rupturable seam separating the interior of said envelope into individual compartments.
- the seam includes masking means in the form of a substantially uniformly open web interposed between the sidewalls and through the openings of which the sidewalls are heat sealed.
- Another suitable kit of parts comprising a two part pouch package described in DE 42 39 288. It comprises a surrounding bag with two portion bags therein.
- thermocycles in air where one thermocycle comprises 5 hours at elevated temperature followed by 3 hours of cooling.
- Kaneka (Tokyo).
- Example 1 A mixture of 36.64 parts polypropylene oxide having silicon-containing end groups having hydrolyzable groups, having a molecular weight of approximately 5000, lightly branched (available as SAT 030 from Kaneka, Tokyo), 0.60 parts deionized water, 36.64 parts CaCO 3 (available as MICRODOL 1 from Norwegian Talc) and 0.77 parts aminosilane A 1 100 (available from Union Carbide) and 24.57 parts molecular sieves (13 Angstrom, available as BAYLITH W from Bayer (Leverkusen Germany) was stirred for 10 min using a Cowles dissolver operated at approx. 5,000 rpm.
- Catalyst H (adduct of dibutyl tin and dioctylphthalate, available as #918 from Sankyo, Japan), comprising Part II, was added in the amount of 0.77 parts directly to Part I after degassing. Stirring was continued for about 3 minutes by hand using a spatula to insure homogeneous dispersion.
- Example 1 Example 1 was repeated with identical components with the exception that the levels were varied slightly. Again, amounts were selected so as to have no free water or methanol in the cured resin.
- the resin composition were prepared and cured as in Example 1 and insulation resistance, R j , measured as above.
- the insulation resistance of Example 2 was > 10,000 MOhm.
- Comparative Example 1 A resin composition was prepared by the procedure given in Example 1 using 49.00 parts SAT 010, 0.60 parts water, 49.00 parts filler R and 1.00 parts adhesion promoter Y.
- the curing agent employed was 0.40 parts catalyst G (dibutyltin diacetylacetonate, available as NEOSTANN U220 from Nitto Kasei).
- Example 3-4 and Comparative Example 3 Three resin compositions were prepared by the method described in Example 1. Each resin comprised the same components at the same levels with the exception that the type of molecular sieve was varied, in particular the pore size.
- Example 3 contained molecular sieve K (13 Angstrom)
- Example 4 contained molecular sieve M (3
- Examples 5-6 The resin compositions of Examples 5-6 were compounded on a large scale to provide about 4 kg of finished resin composition.
- the resin compositions are summarized in Table 3.
- the resin was poured directly after mixing into a large two-part mold body encasing a low voltage splice and allowed to cure at 23 °C for approximately 24 hours.
- the resin encapsulated splice referred to hereinafter as a loop, was then subjected to rigorous practical tests prescribed by the VDE as in the method described under Test Methods. Test results are summarized in Table 4. Smaller portions of the same resin were cast into small molds and/or formed into sheets commonly used for the measurement of physical properties such as Shore A hardness and cured at a temperature of 23° C for 24 hours. Test results are summarized in Table 4.
- Example 8 was prepared as Example 5, with the exception that both a mixture of two polymers A and B as well as a mixture of two molecular sieves K and N were employed.
- Example 9 was prepared in a manner similar to Example 8, with the exception that a mixtures of fillers was used as well.
- hollow glass microspheres filled with inert gas available as AMOSPHERES CN from AML International
- AMOSPHERES CN available as AMOSPHERES CN from AML International
- Comparative Example 5 The resin of comparative Example 5 was prepared by the method of Example 1. Molecular sieves and water were present at such levels that the free MeOH/H 2 O in the cured resin was 0.72 wt. percent. An insulation resistance of 3,500 MOhm was measured. Table 3
- Comparative Examples 6-13 Resin compositions were prepared as in Example 1. Water and molecular sieves were added in amounts, the combination of which resulted in sufficient water/methanol (greater than 0.4 weight percent) residue that the insulation resistance of the cured resin was less than 10,000 MOhm.
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Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP97941568A EP1021810A1 (en) | 1997-09-16 | 1997-09-16 | Moisture-curable electrically-insulating resin |
PCT/US1997/016210 WO1999014766A1 (en) | 1997-09-16 | 1997-09-16 | Moisture-curable electrically-insulating resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/US1997/016210 WO1999014766A1 (en) | 1997-09-16 | 1997-09-16 | Moisture-curable electrically-insulating resin |
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WO1999014766A1 true WO1999014766A1 (en) | 1999-03-25 |
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Application Number | Title | Priority Date | Filing Date |
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PCT/US1997/016210 WO1999014766A1 (en) | 1997-09-16 | 1997-09-16 | Moisture-curable electrically-insulating resin |
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EP (1) | EP1021810A1 (en) |
WO (1) | WO1999014766A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112175565A (en) * | 2019-07-01 | 2021-01-05 | 三键有限公司 | Moisture-curable resin composition and cured product |
CN112175565B (en) * | 2019-07-01 | 2024-07-02 | 三键有限公司 | Moisture-curable resin composition and cured product |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3305656A (en) * | 1963-12-26 | 1967-02-21 | Gen Electric | Electrical insulation containing a molecular sieve having adsorbed perhalogenated fluid |
GB2113453A (en) * | 1982-01-07 | 1983-08-03 | Electricity Council | Electric power cable |
EP0123429A1 (en) * | 1983-03-25 | 1984-10-31 | Minnesota Mining And Manufacturing Company | Cast cable connection |
WO1995009426A1 (en) * | 1993-09-29 | 1995-04-06 | University Of Connecticut | An improved insulated electric cable |
-
1997
- 1997-09-16 WO PCT/US1997/016210 patent/WO1999014766A1/en not_active Application Discontinuation
- 1997-09-16 EP EP97941568A patent/EP1021810A1/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3305656A (en) * | 1963-12-26 | 1967-02-21 | Gen Electric | Electrical insulation containing a molecular sieve having adsorbed perhalogenated fluid |
GB2113453A (en) * | 1982-01-07 | 1983-08-03 | Electricity Council | Electric power cable |
EP0123429A1 (en) * | 1983-03-25 | 1984-10-31 | Minnesota Mining And Manufacturing Company | Cast cable connection |
WO1995009426A1 (en) * | 1993-09-29 | 1995-04-06 | University Of Connecticut | An improved insulated electric cable |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112175565A (en) * | 2019-07-01 | 2021-01-05 | 三键有限公司 | Moisture-curable resin composition and cured product |
CN112175565B (en) * | 2019-07-01 | 2024-07-02 | 三键有限公司 | Moisture-curable resin composition and cured product |
Also Published As
Publication number | Publication date |
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EP1021810A1 (en) | 2000-07-26 |
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