WO1999011108A1

WO1999011108A1 - Non-rotative driving pump and colling system for electronic equipment using the same

Info

Publication number: WO1999011108A1
Application number: PCT/KR1997/000158
Authority: WO
Inventors: Sang Cheol Lee
Original assignee: Sang Cheol Lee
Priority date: 1997-08-26
Filing date: 1997-08-26
Publication date: 1999-03-04
Also published as: AU3953397A

Abstract

A non-rotative driving pump and an electronic equipment cooling system using the same installed in electronic equipment for cooling the internal components of the electronic equipment, are provided. The cooling system includes an endothermic portion (100), a radiator (80), a pipe (90) and a pump (60). The cooling system having such a configuration can cool the components without vibration or noise while protecting the inside of the electronic equipment from dust. Also, the cooling system can endure electromagnetic interference and electromagnetic resistance.

Description

NON-ROTATIVE DRIVING PUMP AND COOLING SYSTEM FOR ELECTRONIC EQUIPMENT USING THE SAME

Technical Field

The present invention relates to a non-rotative driving pump and a cooling system for electronic equipment using the same, and more particularly, to a non- rotative driving pump and an electronic equipment cooling system using the same which is installed in electronic equipment to cool the inside of the electronic equipment.

Background Art General electronic equipment, including computers, TVS. VCRs, TV projectors, power units, slide projectors, overhead projectors, refrigerators. facsimile machines, etc. , generates heat from internal components during use.

Thus, a cooling system is installed in the electronic equipment to remove the generated heat. Taking a personal computer (PC) as an example, as shown in FIG. 1 , a power supply 2, a main board 3 and an auxiliary storage device 4 are installed in the base frame 1 of the PC. A central processing unit (CPU) 5 is installed on the main board 3. Cooling devices 6 are installed on each of the CPU 5. the power supply 2 and the base frame 1. Such components are cooled by air cooling devices 6. that is, cooling fans. Particularly, the power supply 2 is enclosed by a cover so that only air can flow, thereby forming an internal space.

The power supply 2 converts an AC main voltage such as 110V or 220V into a predetermined DC voltage, and supplies it to the main board 3. the CPU 5. the auxiliary storage device 4 and the cooling devices 6, respectively. The cooling devices 6 primarily cool the power supply 2 and the CPU 5 which generate more heat than any other components, and supplementarily cool the other components. The reason of cooling the power supply 2, the CPU 5 and the other components is to prevent reduction of the lifetime of each component or. at worst. the destruction thereof due tυ the heat generated from the components themselves. Particularly, if the power supply 2 is overheated, a fire may break out, and if the CPU 5 is overheated, the processing speed thereof becomes slow, the lifetime thereof is shortened, and the operation thereof is stopped in an extreme circumstance. Therefore, cooling fans 6 have been used as the cooling devices to cool the

CPU 5, the power supply 2, a hard disk drive 8 and the other components, in the conventional art. The cooling fans 6 are installed on the CPU 5 and the power supply 2, and supplementarily installed in the base frame 1. That is, the cooling fans 6 receive power from the power supply 2 and rotate to quickly circulate air to cool the internal components of the PC.

However, vibration generated from the rotation of the cooling fans 6 affects the other components badly. Noise generated from the rotation of the cooling fans 6 and from the operation of the hard disk drive 8 do not make good working conditions. For example, when people use a PC in a quiet room, they may be relatively sensitive to the noise, enough to disturb their work.

As the cooling fans 6 rotate, internal hot air flows from the inside of the PC to the outside thereof, and external cold air flows into the PC. In the latter case, external dust also flows into the PC.

Such dust adheres to each component according to an electrophoresis phenomenon or an electrostatic phenomenon, thereby preventing the transfer of heat. Thus, the temperature of each component increases. Meanwhile, a filter for filtering the dust is installed in the hard disk drive 8 used as an auxiliary storage device. Such a filter wears out quickly under dusty conditions. If the filter is out of order, dust enters the hard disk, and damages it. That is, although the hard disk originally can be used for ten years or more, the lifetime is reduced by more than half under dusty conditions.

Disclosure of Invention

An object of the present invention is to provide a non-rotative driving pump for generating a driving force for circulating a fluid which can cool each component of the electronic equipment. Another object of the present invention is to provide an electronic equipment cooling system using the above non-rotative driving pump. Still another object of the present invention is to provide an electronic equipment cooling system whereby noise generated in electronic equipment can be compulsorily blocked. Yet another object of the present invention is to provide an electronic equipment cooling system for improving the lifetime of electronic equipment by reducing dust which enters thereinto. To accomplish the above objects, there is provided a cooling system for electronic equipment having at least one heat generating component, comprising: endothermic means for absorbing heat generated by the heat generating component; exothermic means for emitting heat transferred from the endothermic means; fluid path means for providing a path for allowing a fluid to circulate between the endothermic means and the exothermic means to transmit the heat from the endothermic means to the exothermic means; and electrically driven non- rotative pump means combined with the fluid path means for circulating the fluid in one direction.

The pump means includes an operating portion which is electrically driven, and a pressure generating chamber for circulating the fluid in one direction along the fluid path means by varying the pressure of a fluid in the fluid path means by a non-rotative motion of the operating portion.

Also, the pump means further includes check valves for preventing the reverse flow of a fluid in either contact portion between the pressure generating chamber and the fluid path means.

According to the non-rotative driving pump and the electronic equipment cooling system using the same having the above structure, each component of the electronic equipment is cooled without newly generating noise and by compulsively blocking noise generated from a disk drive.

Brief Description of the Drawings

The above objects and advantages of the present invention will become more apparent by describing in detail a preferred embodiment thereof with reference to the attached drawings in which:

FIG. 1 is a perspective view of a conventional computer cooling system: FIG. 2 is a perspective view of a computer cooling system according to one embodiment of the present invention;

FIG. 3 is a perspective view of a radiator of a different type to one shown in FIG. 2;

FIG. 4 is a piping diagram showing the piping layout of the computer cooling system shown in FIG. 2;

FIG. 5 is a perspective view of a pump, using a piezoelectric element, shown in FIG. 4;

FIG. 6 is a perspective view of a pump, using an electromagnet, shown in FIG. 4;

FIG. 7 is a perspective view of another type of the pump, using an electromagnet, shown in FIG. 4; FIG. 8 is an exploded perspective view of a computer main board, an element endothermic plate and a board endothermic plate;

FIG. 9 is a perspective view of the elements of FIG. 8 assembled;

FIG. 10 is a side section view of the portion V of the main board of FIG. 8, viewed in a direction A indicated by an arrow; FIG. 11 is an exploded perspective view of a power board, an element endothermic plate and a board endothermic plate;

FIG. 12 is a perspective view of the elements of FIG. 11 assembled;

FIG. 13 is an exploded perspective view of a hard disk drive and a board endothermic plate; FIG. 14 is a perspective view of the elements of FIG. 13 assembled;

FIG. 15 is a perspective view of the elements of FIG. 13 assembled, showing the hard disk drive body covered by the board endothermic plate; and

FIG. 16 is a cutaway perspective view showing the state where a board having electronic components is installed inside an element endothermic plate.

Best Mode For Carrying out the Invention

An electronic equipment cooling system according to the present invention can be applied to any electronic equipment which generates heat, e.g. , computers. TVS, VCRs. TV projectors, power units, cineprojectors. slide projectors, overhead projectors, refrigerators and facsimile machines. As an example, a personal computer in which the electronic equipment cooling system according to a preferred embodiment of the present invention is installed, will now be described. As shown in FIG. 2, a power supply 30, a main board 40, a floppy disk drive 50, a hard disk drive 51 and a pump 60 are installed in a base frame 10 of a personal computer (PC) . A central processing unit (CPU) 70 is installed on the main board 40. These components are isolated from the outside by an enclosure 20 on which a radiator 80 is installed, so that only air can cool them.

The power supply 30 converts an AC main voltage such as 110V or 220V into a predetermined DC voltage, and supplies it to the main board 40, the CPU 70, the floppy disk drive 50, the hard disk drive 51 and the pump 60.

The hard disk drive 51 generates a lot of noise, so it is completely enclosed by a board endothermic plate 122 shown in FIG. 13 to prevent the generated noise from being transmitted to the outside.

The cooling system for electronic equipment according to the present invention chiefly cools the power supply 30, the main board 40, the closed hard disk drive 51 and the CPU 70, and supplementarily cools the other components. The power supply 30, the CPU 70, the hard disk drive 51 and the other components are cooled to prevent heat damage, as in the prior art. In particular, the hard disk drive 51 is closed to shield noise, so it is not naturally air-cooled.

To cool the electronic components, the present invention uses an electronic equipment cooling system using a flowing fluid. The electronic equipment cooling system can be compared to a heart circulating blood to cool a human body. That is. the pump 60 can be compared to the heart, a pipe 90 can be compared to a blood vessel, the base frame and the enclosure 20 can be compared to the skin, and the cooling fluid can be compared to the blood.

As blood clots with air to control bleeding, it is preferable that a material which solidifies in contact with air is added to the cooling fluid, or that the cooling fluid is made of a hardening material. The material hardening in contact with air can be a material hardening into another ingredient by reacting to air, or a material hardening by evaporating a volatile element into air. The former material can be often seen as adhesives such as a cyanoacrylate commonly used in daily life. Also. it is preferable that the cooling fluid has a low freezing point due to an added antifreeze solation.

Referring to FIG. 2. the electronic equipment cooling system according to the present invention includes an endothermic unit 110. 120 and 130 which directly or indirectly contacts the electronic components generating heat, such as the main board 40, the CPU 70, the power supply 30 and the hard disk drive 51 and through which a fluid flows; a radiator 80 which is installed on the base frame 10 or the enclosure 20 and through which a fluid flows; a pipe 90 connecting the radiator and the endothermic unit with each other to make the fluid flow therethrough, and made of a metal capable of excellently conducting heat or a synthetic resin; and a pump

60 for circulating the fluid.

Referring to FIG. 5, the pump 60 includes a pressure generating chamber

61 connected to the pipe 90 and forming an internal space, at least two check valves 63 and 63' installed between the pressure generating chamber 61 and the pipe 90, and a pressure varying unit installed inside or outside the pressure generating chamber 61, for varying the pressure of a fluid flowing in the pressure generating chamber 61. Preferably, the pressure varying unit is a piezoelectric element 62 installed between first and second check valves 63 and 63' which are installed one at each end of the pressure generating chamber 61.

As is well known, the multi-layered piezoelectric element 62 expands if electricity is applied thereto or generates electricity if pressure is applied thereto. The piezoelectric element 62 applies pressure to the fluid flowing in the pressure generating chamber 61 to push out the fluid when expanding, and lowers the pressure of the internal fluid flowing in the pressure generating chamber to draw fluid into the pressure generating chamber when contracting. At this time, the fluid is guided in one direction by the check valves 63 and 63' .

Referring to FIG. 6, an electromagnet can be used as an alternative of the piezoelectric element. A permanent magnet 65 and an electromagnet 66 oppose each other inside a contractible outer cover 64. If an alternating current is applied to the electromagnet 66, the pressure of the fluid flowing in the pressure generating chamber 61 varies with the variation of the distance between the permanent magnet 65 and the electromagnet 66. At this time, the fluid is guided in one direction by the check valves 63 and 63' (see FIG. 5). It is preferable that the power applied to the electromagnet 66 is a general commercial power voltage such as 110V and

220V at 50Hz or 60Hz. Since the main power is used with no conversion, manufacturing costs can be reduced.

Referring to FIG. 7. a pressure varying unit is installed on the outside of the pressure generating chamber 61. The pressure varying unit installed on the outside of the pressure generating chamber 61 includes a rubber diaphragm 67 made of rubber covering a hole in the pressure generating chamber 61 , a permanent magnet 69 fixed to the rubber diaphragm 67, an electromagnet 68 installed opposite to the permanent magnet 69, and a support frame 61a for maintaining a gap between the electromagnet 68 and the permanent magnet 69. It is preferable that the permanent magnet 69 is inserted into the center void of the coil of the electromagnet 68. Depending on the direction of a current applied to the electromagnet 68, the distance between the permanent magnet 69 and the electromagnet 68 varies, that is, the position of the electromagnet is changed. Accordingly, the rubber diaphragm 67 changes the pressure of the fluid flowing in the pressure generating chamber 61. The fluid is guided in one direction by the check valves 63 and 63' (see FIG. 5). Preferably, the voltage applied to the electromagnet is a commercial power such as 110V and 220V at 50Hz or 60Hz. Since the main power is used with no conversion, manufacturing costs can be reduced.

Referring to FIG. 5, the check valves 63 and 63' include a support plate 63d having three holes 63e formed therein, a bolt 63c installed in the center of the support plate 63d, a thin rubber disc 63b, having a hole 63f to fit over the bolt 63c formed therein, and a nut 63a for fixing the rubber disc 63b to the bolt 63c. Preferably, the rubber disc 63b contains a material having magnetism, and the support plate 63d, made of a metal affected by magnetic force, adheres to the rubber disc 63b. The above-structured check valve 63 or 63^' responds quickly to the pressure of the fluid, so the fluid can be effectively moved in one direction even if there is a small pressure change in which the flow of the fluid is turned on or off by the electromagnetic operation of the check valve..

Referring to FIGS. 2 and 4. the endothermic unit 100 and the radiator 80 can be realized in various types. That is. the endothermic unit 100 is designed so that it effectively absorbs the heat generated by the electronic components installed inside the enclosure 20. and the radiator 80 is designed so that it effectively irradiates the heat absorbed by the endothermic unit 100. Also, it is preferable that three elements of the endothermic unit 100 and two elements of the radiator 80 are connected to each other in parallel, respectively. The endothermic unit 100 and the radiator 80 according to the present invention are connected to each other by the pipe 90. The radiator 80 includes a left radiator element 80a installed on the left of the enclosure 20 and a right radiator element 80b installed on the right thereof. The endothermic unit 100 includes a power supply endothermic element 130 installed in the power supply 30, a central endothermic element 120 installed in the main board 40 and the CPU 70, and a storage device endothermic element 130 installed in the auxiliary storage device such as the hard disk drive 51.

Referring to FIGS. 4 and 9, heat generated from the CPU 70 is absorbed by an element endothermic plate 121 of the central endothermic element 120, and heat generated from the main board 40 is absorbed by a board endothermic plate 122 of the central endothermic element 120. A predetermined space containing a flowing fluid is formed inside the element endothermic plate 121. The predetermined space connects with the pipe 90. The element endothermic plate 121 is attached to the CPU 70.

Referring to FIG. 8, the board endothermic plate 122 includes a reservoir 122c connected to the pipe 90, storing a fluid flowing in and out through the pipe 90. a heat exchange layer 122b covering the reservoir 122c, and a fixing member 122a for fixing the heat exchange layer 122b to the reservoir 122c. The main board 40 is held against the heat exchange layer 122b of the above-structured board endothermic plate 122 by three clamps 140. The heat of the main board 40 clamped to the heat exchange layer 122b can be effectively transmitted to the fluid in the reservoir 122c via the heat exchange layer 122b.

As is well known, the leads 41 of various components installed on the main board 40 pass through the main board 40 and are fixed thereto by solder 42 as shown in FIG. 10 taken by viewing the portion V of FIG. 8 in the direction of an arrow A. Thus, the heat generated by the electronic components can be effectively transmitted to the board endothermic plate 122 via the leads 41. It is preferable that the heat exchange layer 122b is made of silicon, being a flexible insulating material having an excellent thermal conductivity.

Referring to FIG. 8. the clamp 140 is comprised of a support member 140a fixed to the board endothermic plate 122. and a screw 140b installed in the support member 140a. Thus, the screw 140b presses the main board 40 against the board endothermic plate 122.

Referring to FIGS. 2, 11 and 12, an element endothermic plate 151 and a board endothermic plate 152 having the similar structures to and performing the same functions as those of the above-described element endothermic plate 121 and the board endothermic plate 122 are also installed in the power supply endothermic element 130 of the power supply 30. The element endothermic plate 151 to which a power transistor 32 is directly attached is used to cool the power transistor which generates much heat. The board endothermic plate 152 is used to effectively absorb the heat of a power supply board 31 on which the power transistor 32 is installed.

Referring to FIGS. 4 and 13, the two board endothermic plates 112 are used as the storage device endothermic element 110 installed on the hard disk drive 51. That is, the upper and lower portions of the hard disk drive 51 are covered and sealed by the board endothermic plates 112. As described above, when the hard disk drive 51 is sealed as shown in FIG. 14, noise generated by the hard disk drive 51 can be reduced by about 95% . Also, a cooling fluid is supplied to the board endothermic plate 112 via the pipe 90, so that the heat generated by the hard disk drive 51 can be effectively removed.

Referring to FIGS. 13 and 15, the hard disk drive 51 can be separated into a hard disk drive body 51a and a circuit board 51b which are connected to each other via a flexible cable 51c. Accordingly, only the hard disk drive body 51a but not the circuit board 51b are covered and sealed by the two board endothermic plates 112. Thus, the hard disk drive body 51a is cooled by the board endothermic plates 112, and the heat generated from the circuit board 51b is naturally air- cooled.

As shown in FIG. 2, the left and right radiator elements 80a and 80b of FIG. 4 can be made of the curved metal pipe 90 installed on the left and right sides of the outside of the enclosure 20. Alternatively, each of the left and right radiator elements 80a and 80b can be made of a plate 82 having an internal channel 81. attached to the left and right sides of the outside of the enclosure 20. as shown in

FIG. 3. It is preferable that heat radiating fins 83 are formed on the plate 82 to enhance the heat dissipation.

The electronic equipment cooling system according to the present invention as constructed above circulates the fluid to cool the electronic equipment.

In the case of PCS, various electronic components shown in FIG. 2 generate heat. The element endothermic plate and the board endothermic plate are installed on the main board 40, the CPU 70, the power supply 30 and the hard disk drive 51. Thus, the heat generated by the above components is transmitted to the endothermic unit 100 such as the element endothermic plate and the board endothermic plate. The heat transmitted to the endothermic unit 100 is transferred to the cooling fluid. The cooling fluid is moved to the radiator 80 by the pump 60 via the pipe 90. The thermal energy of the fluid moved to the radiator 80 is emitted when the fluid passes through the radiating plate 82. That is, the radiator 80 is installed on the outside of the base frame 10 and the enclosure 20, and the temperature of the fluid is higher than that of the atmosphere. Thus, the heat of the fluid is emitted via the radiator 80 into the air. The electronic equipment cooling system according to a preferred embodiment of the present invention can move the fluid by a pump without vibration or noise, to thereby cool the respective components of the electronic equipment without vibration or noise. Also, the inside of the electronic equipment is perfectly sealed, to thereby endure electromagnetic resistance and/or electromagnetic interference as well as to protect the inside thereof from dust.

According to an experiment conducted by the present inventor, the noise of a computer adopting the electronic equipment cooling system installed therein is reduced by about 95 % compared to that of a computer having a conventional air- cooling system. The preferred embodiment of the present invention described referring to the attached drawings is only an example. Those skilled in the art can realize a similar non-rotative driving pump and a similar electronic equipment cooling system using the pump by having a sufficient understanding of the preferred embodiments of the present invention. For instance, according to a preferred embodiment of the present invention. an electromagnet and a permanent magnet are used as a pressure varying unit of a pump. However, the pressure varying unit of the pump can be realized by using only the electromagnet coils instead of the permanent magnet. Also, in the preferred embodiments of the present invention, electronic components are fixed to an element endothermic plate to emit heat. However, electronic components and a board 160 having the components fixed thereto can be coated, and submerged in a fluid flowing in the inside of the element endothermic plate 120 as shown in FIG. 16.

Therefore, the true technical protection scope of the present invention should be defined by the appended claims.

Industrial Applicability

The present invention can be used in general electronic equipment, such as PCS, TVS, VCRs, TV projectors, power units, slide projectors, overhead projectors, refrigerators, facsimile machines which generate heat from internal components during use, to thereby cool the electronic equipment effectively without noise or dust contamination.

Claims

What is claimed is:

1. A cooling system for electronic equipment having at least one heat generating component, comprising: endothermic means (100) for absorbing heat generated by said heat generating component; exothermic means (80) for emitting heat transferred from said endothermic means (100); fluid path means (90) for providing a path for allowing a fluid to circulate between said endothermic means (100) and said exothermic means (80) to transmit the heat from said endothermic means (100) to said exothermic means (80); and electrically driven non-rotative pump means (60) combined with said fluid path means (90) for circulating the fluid in one direction.

2. The cooling system for electronic equipment as claimed in claim 1 , wherein said pump means (60) includes an operating portion which is electrically driven, and a pressure generating chamber (61) for circulating the fluid in one direction along said fluid path means by varying the pressure of a fluid in said fluid path means by a non-rotative motion of said operating portion.

3. The cooling system for electronic equipment as claimed in claim 2, wherein said pump means (60) further includes check valves (63) and (63') for preventing the reverse flow of a fluid in either contact portion between said pressure generating chamber (61) and said fluid path means (90).

4. The cooling system for electronic equipment as claimed in claim 3, wherein said operating portion includes a pressure varying portion installed inside or outside said pressure generating chamber (61), for varying the pressure of said fluid.

5. The cooling system for electronic equipment as claimed in claim 4. wherein said pressure varying portion includes a piezoelectric element group (62). installed in said pressure generating chamber (61), and electrically operated to transform an electric current into pressure.

6. The cooling system for electronic equipment as claimed in claim 4. wherein said pressure varying portion includes an electromagnet (66). installed in said pressure generating chamber (61). for generating a magnetic force, and an object which is affected by the magnetic force of said electromagnet (66).

7. The cooling system for electronic equipment as claimed in claim 4, wherein said pressure varying portion includes a flexible, elastic diaphragm (64), and an electromagnet (66) and a permanent magnet (65) that oppose each other in said diaphragm, or alternatively only an electromagnet, wherein said permanent magnet and said electromagnet generate a mutual force of alternating polarity according to a current applied to said electromagnet, thereby vibrating said diaphragm.

8. The cooling system for electronic equipment as claimed in claim 4, wherein said pressure varying portion includes a flexible, elastic rubber diaphragm (67) made of rubber for covering an opening in said pressure generating chamber, a permanent magnet (69) fixed to said rubber diaphragm, an electromagnet (68) installed opposite said permanent magnet (69), and a support frame (61a) for properly maintaining an interval between said electromagnet (68) and said permanent magnet (69).

9. The cooling system for electronic equipment as claimed in any one of claims 3 through 8, wherein said check valve (63) or (63') is formed between said pressure generating chamber and said fluid path means (90), and includes a support plate (63d) having a hole formed therein, and a rubber plate (63b) fixed by some portion to said support plate (63d).

10. The cooling system for electronic equipment as claimed in claim 9, wherein said rubber plate (63b) contains a magnetic material and said support plate (63d) is made of a material affected by the magnetic force, in which said rubber plate (63b) and said support plate (63d) adhere to each other.

11. The cooling system for electronic equipment as claimed in any one of claims 1 through 8, wherein said endothermic means is connected to said fluid path means, and is comprised of an element endothermic plate (121) or (151) for absorbing the heat from said heat generating component by forming a predetermined space through which said fluid passes.

12. The cooling system for electronic equipment as claimed in any one of claims 1 through 8. wherein said endothermic means is connected to said fluid path means, and is comprised of a board endothermic plate, for absorbing heat from said heat generating component, which includes a reservoir (122c) for containing said fluid and passing said fluid therethrough, a flexible heat exchange layer (122b) for sealing said reservoir, and a fixing member (122a) for fixing said heat exchange layer to said reservoir.

13. The cooling system for electronic equipment as claimed in claim 11 or 12, wherein said heat generating component is covered and sealed by said board endothermic plate or said element endothermic plate.

14. The cooling system for electronic equipment as claimed in claim 11 or 12, wherein a board (40) on which said heat generating component is installed is held by a clamp (140) including a support member (140a) fixed to said board endothermic plate and a screw (140b) installed in said support member.

15. The cooling system for electronic equipment as claimed in any one of claims 11 through 14, wherein said heat exchange layer is made of silicon.

16. The cooling system for electronic equipment as claimed in any one of claims 1 through 8, wherein said exothermic means is connected to said fluid path means and comprised of a radiating plate (82) having a path, through which said fluid flows, formed therein.

17. The cooling system for electronic equipment as claimed in claim 16, wherein said radiating plate (82) further comprises heat radiating fins formed on the surface of said exothermic plate.

18. The cooling system for electronic equipment as claimed in any one of claims 1 through 8, wherein said fluid path .means is made of a metal or a synthetic resin having an excellent thermal conductivity, and is generally formed as a transparent or opaque pipe.

19. The cooling system for electronic equipment as claimed in any one of claims 1 through 8, wherein a material which hardens in contact with air is added to said fluid, or said fluid is made of a material which hardens in contact with air.

20. The cooling system for electronic equipment as claimed in claim 19. wherein said material hardens to another ingredient in contact with air. or hardens by evaporating a volatile element into the air.

21. The cooling system for electronic equipment as claimed in claim 20. wherein said material is made of cyanoacrylate.

22. A non-rotative driving pump comprising a pressure generating chamber (61) through which a fluid flows; a check valve (63) or (63') installed in said pressure generating chamber (61) for confining the movement of an internal fluid to one direction; and a pressure varying portion installed inside or outside said pressure generating chamber (61) for varying the pressure of said fluid, wherein said pressure varying portion includes a piezoelectric element group (62) installed in said pressure generating chamber (61) and electrically operated to transform a voltage into pressure.

23. The non-rotative driving pump as claimed in claim 22, wherein said pressure varying portion includes an electromagnet (66) in said pressure generating chamber for generating a magnetic force, and an object (65) which is affected by the magnetic force of said electromagnet.

24. The non-rotative driving pump as claimed in claim 22, wherein said pressure varying portion includes a flexible, elastic diaphragm (64) installed in said pressure generating chamber, and an electromagnet (66) and a permanent magnet (65) that oppose each other on said diaphragm (64) or alternatively only an electromagnet, wherein said permanent magnet and said electromagnet generate a mutual force of alternating polarity according to a current applied to said electromagnet, thereby vibrating said diaphragm (64).

25. The non-rotative driving pump as claimed in claim 22, wherein said pressure varying portion includes a flexible, elastic rubber diaphragm (67) covering an opening in said pressure generating chamber, a permanent magnet (69) or a material affected by a magnetic force, fixed to said rubber diaphragm (67), an electromagnet (68) installed opposite said permanent magnet (69) or a material affected by a magnetic force, and a support frame (61a) for properly maintaining an interval between said electromagnet and said permanent magnet.

26. The non-rotative driving pump as claimed in any one of claims 22 through 25. wherein said check valve (63) or (63') is formed in said pressure generating chamber (61) and includes a support plate (63d) having a hole (63e) formed therein, and a rubber plate (63b) fixed by some portion to said support plate.

27. The non-rotative driving pump as claimed in claim 26. wherein said rubber plate (63b) contains a magnetic material and said support plate (63d) is made of a material affected by the magnetic force, in which said rubber plate (63b) and said support plate (63d) adhere to each other.