WO1998052396A1 - Heat exchanger for electronic components and electrotechnical installation - Google Patents

Heat exchanger for electronic components and electrotechnical installation Download PDF

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Publication number
WO1998052396A1
WO1998052396A1 PCT/FR1998/000948 FR9800948W WO9852396A1 WO 1998052396 A1 WO1998052396 A1 WO 1998052396A1 FR 9800948 W FR9800948 W FR 9800948W WO 9852396 A1 WO9852396 A1 WO 9852396A1
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WO
WIPO (PCT)
Prior art keywords
heat exchanger
plate
exchanger according
flanges
cover
Prior art date
Application number
PCT/FR1998/000948
Other languages
French (fr)
Inventor
Jean-Luc Chevallet
Jean-Noël JULIEN
Christian Bonhomme
Original Assignee
Ferraz
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferraz filed Critical Ferraz
Priority to AU76630/98A priority Critical patent/AU7663098A/en
Publication of WO1998052396A1 publication Critical patent/WO1998052396A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a heat exchanger for electronic components and electrotechnical equipment.
  • Exchangers of this type can be used in particular in power assemblies in order to cool the components thanks to the circulation of a heat transfer fluid such as water.
  • a power assembly comprises a variable number of electrical or electronic components, so that several individual heat exchangers must most often be provided in the vicinity of such an assembly. These individual exchangers must respectively be supplied with heat transfer fluid, so that a network must be created between them. This network is made using sections of tubes, end fittings, elbows and fittings which induce significant pressure losses and the risk of leaks detrimental to the proper functioning of the electrical components.
  • Document US-A-5, 088, 005 discloses a cold plate formed of several layers, some of which are provided with orifices for passage of a heat-transfer fluid, which extend over a large width and a great length. These layers, in particular those provided with orifices, are not adapted as a function of the distribution of the electronic components and of the electrotechnical apparatuses placed in contact with the cold plate thus formed.
  • the multi-layer structure is composed of many elements, which makes it complex and increases its cost price. Particular care must be taken in assembling such a plate, the circulation of the heat transfer fluid can be interrupted if an intermediate layer is incorrectly positioned.
  • the invention more particularly intends to remedy by proposing a heat exchanger for electronic components and electrotechnical equipment capable of cooling several components or devices without requiring the use of piping or a multilayer structure that is complex or likely to disturb the operation of electrical devices.
  • the invention relates to a heat exchanger for electronic components and electrotechnical equipment comprising a plate provided with a plurality of channels for circulation of a heat-transfer fluid, characterized in that said plate comprises several imprints for receiving stacking of openwork flanges, said channels placing said cavities in fluid communication.
  • the invention allows several stacks of perforated flanges, such as, for example, those known from EP-A1-0 611 235, can be housed in the indentations of a plate so as to cool different components or devices arranged opposite of these footprints.
  • the flange stacks can be those used for individual heat exchangers, so that economies of scale can be realized.
  • at least one of the indentations is capable of receiving several stacks of openwork flanges arranged side by side. This aspect of the invention makes it possible to cool a large area by using stacks of standard flanges whose cost price is relatively low.
  • the cavities have for internal dimensions multiples of dimensions of perforated flanges used in individual heat exchangers. This aspect of the invention makes it possible to obtain a large standardization of the flanges used.
  • the flanges are produced from an aluminum-based alloy frame coated with two layers of an aluminum and magnesium alloy. This structure of the flanges of the invention makes it possible to obtain a brazing of these, once stacked in the cavities of the plate.
  • the flanges are stacked in the cavities over a height slightly greater than the depth of the imprints.
  • This aspect of the invention makes it possible to guarantee that the flanges, once brazed, will completely fill the imprint even if the brazing results in a slight reduction in their thickness.
  • the heat exchanger comprises a cover brazed under vacuum on the plate. This cover is intended to seal the circulation channels for heat transfer fluid and the indentations relative to the outside.
  • this brazing sheet can be produced from an aluminum-based alloy frame coated with two layers of an aluminum and magnesium alloy. In all cases, provision may be made for the puddles, the cover and / or the sheet disposed between the cover and the plate to be brazed under vacuum at a temperature in the region of 600 ° C.
  • the heat exchanger comprises means for fixing, on the plate or the cover, electronic components or electrotechnical equipment.
  • This aspect of the invention makes it possible to easily attach the electronic components or the electrotechnical equipment to be cooled and the heat exchanger according to the invention.
  • FIG. 1 is a schematic perspective representation of an electronic power assembly incorporating a heat exchanger according to the invention
  • FIG. 2 is a vertical section in the plane
  • FIG. 4 is a perspective view of a stack of flanges used with the exchanger of the invention.
  • FIG. 5 is a view on a larger scale of the detail V of FIG. 4.
  • An IGBT circuit (Insulated Gâte Bipolar Transistor) shown in FIG. 1 comprises power elements 1, l 'and 1 "controlled by a control circuit 2, as well as a fuse holder plate 3.
  • the elements of the IGBT circuit are arranged in contact with a heat exchanger 4, of generally parallelepiped shape, and comprising a base plate 5 and a cover 6.
  • the plate 5 is provided with several channels 7 and impressions 8, 9 and 10 intended to receive stacks of openwork flanges.
  • the stacks of perforated flanges are provided to define between them baffles imposing a circulation path on a heat transfer fluid penetrating into the channels 7 by an inlet orifice and coming out through an outlet orifice 12.
  • the plate 5 is a single piece which can be substituted for the multiple pipes, fittings and elbows used in the devices of the prior art in cooperation with a frame.
  • This plate can be machined on a numerically controlled machine, to form the channels 7 and the imprints 8, 9 and
  • the imprints 8, 9 and 10 can have different shapes.
  • the imprint 8 has a substantially rectangular shape and is intended to receive a stack 13 of flanges also substantially rectangular whose dimensions are approximately equal to the dimensions of the imprint 8.
  • the imprint 9 has an area approximately 4 times greater than the imprint 8, because it is capable of receiving four stacks 13 of generally rectangular flanges arranged side by side. This footprint 9 is twice as wide and twice as long as the stacks 13, so that the four stacks can be accommodated there without difficulty.
  • the cavity 10 is, in turn, cylindrical with a circular section so as to receive a stack 14 of disc-shaped flanges, for example of the type described in EP-A1-0 611 235.
  • the geometry of the indentations 8, 9 and 10 is defined as a function of the transverse dimensions of the power elements 1, l 'and 1 ".
  • each flange 15 is twelve in number, each flange 15 being pierced with openings 16 allowing the circulation of the heat transfer fluid.
  • Each flange 15 is produced from a frame 17 of an aluminum-based alloy and in particular of an Al Mnl Cu alloy identified under the reference 3003 by standard AFNOR A 02-104.
  • the two upper and lower faces of the frame 17 are respectively coated with a layer of an aluminum and magnesium alloy, for example of the alloy bearing the reference 4004 in the aforementioned standard.
  • This construction of the flanges 15 makes it possible to envisage their brazing under vacuum, that is to say at a pressure of the order of 10 "4 to 10 " 5 atmospheres, during the assembly process of the heat exchanger.
  • the melting temperature of alloy 4004 is of the order of 570 ° C while the melting temperature of alloy 3003 is of the order of 640 ° C, so that brazing of the flanges 15 constituting the stack 13 can be obtained by heating this stack to a temperature close to 600 ° C.
  • This brazing is carried out under vacuum to avoid any risk of oxidation and taking advantage, as far as possible, of the Getter effect corresponding to the creation of a higher vacuum due to the vaporization of magnesium at a similar temperature 560 ° C.
  • the flanges 15 tend to crush, so 'as to effectively fill the cavities 8, 9 and 10 after brazing, the plates 15 are stacked in these fingerprints on a height slightly greater than the depth of footprints.
  • the stacks 13 and 14 have a height substantially equal to the depth of the imprints. In practice, one chooses to produce a stack 13 or 14 whose height before brazing is greater than the depth of the imprints 8, 9 and 10 from 1 to 5%.
  • the cover 6 is also fixed to the plate 5 by brazing.
  • a solder sheet 19 is interposed between the cover 6 and the plate 5 and is intended to partially melt while being brought to a predetermined temperature.
  • the solder sheet 19 a structure equivalent to that of the flanges 15, that is to say an aluminum alloy frame, for example of the 3003 type, coated with layers of an aluminum and magnesium alloy, for example of the 4004 type.
  • the brazing of the sheet 19 on the plate 5 and of the sheet 19 on the cover 6 can be carried out under vacuum by carrying the assembly of 1 heat exchanger at a temperature close to 600 ° C.
  • the assembly of the heat exchanger according to the invention can be carried out as follows:
  • Stacks 13 or 14 of openwork flanges are installed in the cavities 8, 9 and 10 over a height slightly greater than the depth of the cavities, the sheet 19 is placed on the plate 5, then the cover 6 is installed on the sheet 19. It is advantageous to compress the assembly thus produced by means of clamping nuts.
  • the assembly thus produced is then brought to a temperature of the order of 600 ° C. under vacuum.
  • the assembly thus formed is kept at the appropriate temperature for a period depending on the dimensions and the mass of this assembly, so that brazing is carried out.
  • the heat exchanger constitutes a one-piece, sealed assembly ready to operate.
  • the cover 6 is coated on its underside with a layer of alloy based on aluminum and magnesium, which makes it possible to dispense with the sheet 19 insofar as the brazing of the cover 6 on the plate 5 can take place directly by bringing the assembly formed by the plate 5 and the cover 6 to a temperature in the region of 600 ° C.
  • the invention also makes it possible to provide, in the plate 5, groups of parallel channels 20 and 21 serving to create a calibrated flow of the heat transfer liquid.
  • These flows 20 and 21 can be conventionally used for cooling the control circuit 2, which for example includes resistors and capacitors whose temperature must generally be kept below 70 ° C. or the fuses carried by the plate 3 whose temperature should not be too large.
  • the invention therefore makes it possible to cool, thanks to the same heat transfer fluid, both the power elements 1, l 'and 1 "thanks to the stacks 13 and 14 of perforated flanges 15 and the control systems 2 and 3 thanks to a flow calibrated with the same fluid.
  • bores are advantageous aspect of the invention.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention concerns a heat exchanger for electronic components and electrotechnical installations comprising a plate (5) provided with a plurality of channels (7) for the circulation of a liquid coolant, characterised in that said plate (5) comprises a plurality of cavities (8-10) for receiving stacks (13,14) of bored shields (15), said channels (7) ensuring fluid communication between said cavities (8-10).

Description

ECHA GEUR DE CHALEUR POUR COMPOSANTS ELECTRONIQUES ET APPAREILLAGES ELECTROTECHNIQUES HEAT EXCHANGER FOR ELECTRONIC COMPONENTS AND ELECTROTECHNICAL APPARATUS
L'invention a trait à un échangeur de chaleur pour composants électroniques et appareillages électrotechniques. Les échangeurs de ce type peuvent être utilisés notamment dans des ensembles de puissance afin de refroidir les composants grâce à la circulation d'un fluide caloporteur tel que de l'eau.The invention relates to a heat exchanger for electronic components and electrotechnical equipment. Exchangers of this type can be used in particular in power assemblies in order to cool the components thanks to the circulation of a heat transfer fluid such as water.
Un ensemble de puissance comprend un nombre variable de composants électriques ou électroniques, de sorte que plusieurs échangeurs de chaleur individuels doivent le plus souvent être prévus au voisinage d'un tel ensemble. Ces échangeurs indivi- duels doivent être respectivement alimentés en fluide caloporteur, de sorte qu'un réseau doit être créé entre ceux-ci. Ce réseau est réalisé à l'aide de tronçons de tubes, d'embouts, de coudes et de raccords qui induisent des pertes de charge non négligeables et des risques de fuites préjudiciables au bon fonctionnement des composants électriques.A power assembly comprises a variable number of electrical or electronic components, so that several individual heat exchangers must most often be provided in the vicinity of such an assembly. These individual exchangers must respectively be supplied with heat transfer fluid, so that a network must be created between them. This network is made using sections of tubes, end fittings, elbows and fittings which induce significant pressure losses and the risk of leaks detrimental to the proper functioning of the electrical components.
En outre, ces assemblages de tuyaux et d' échangeurs de chaleur individuels doivent être supportés par un cadre, ce qui majore d'autant le prix de revient global de l'installation.In addition, these assemblies of pipes and individual heat exchangers must be supported by a frame, which all the more increases the overall cost price of the installation.
Par le document US-A-5 , 088 , 005 on connaît une plaque froide formée de plusieurs couches, dont certaines pourvues d'orifices de passage d'un fluide caloporteur, qui s'étendent sur une grande largeur et une grande longueur . Ces couches , notamment celles pourvues d'orifices, ne sont pas adaptées en fonction de la distribution des composants électroniques et des appareillages électrotechniques disposés au contact de la plaque froide ainsi constituée. En outre, la structure multi- couche est composée de nombreux éléments, ce qui la rend complexe et augmente son prix de revient. Un soin tout particulier doit être apporté à l'assemblage d'une telle plaque, la circulation du fluide caloporteur pouvant être interrompue si une couche intermédiaire est mal positionnée.Document US-A-5, 088, 005 discloses a cold plate formed of several layers, some of which are provided with orifices for passage of a heat-transfer fluid, which extend over a large width and a great length. These layers, in particular those provided with orifices, are not adapted as a function of the distribution of the electronic components and of the electrotechnical apparatuses placed in contact with the cold plate thus formed. In addition, the multi-layer structure is composed of many elements, which makes it complex and increases its cost price. Particular care must be taken in assembling such a plate, the circulation of the heat transfer fluid can be interrupted if an intermediate layer is incorrectly positioned.
C'est à ces inconvénients qu'entend plus particulièrement remédier l'invention en proposant un échangeur de chaleur pour composants électroniques et appareillages électrotechniques apte à refroidir plusieurs composants ou appareils sans nécessiter l'utilisation d'une tuyauterie ou d'une structure multicouche complexe ou susceptible de perturber le fonctionne- ment des appareils électriques.It is to these drawbacks that the invention more particularly intends to remedy by proposing a heat exchanger for electronic components and electrotechnical equipment capable of cooling several components or devices without requiring the use of piping or a multilayer structure that is complex or likely to disturb the operation of electrical devices.
Dans cet esprit, l'invention concerne un échangeur de chaleur pour composants électroniques et appareillages électrotechniques comportant une plaque munie d'une pluralité de canaux de circulation d'un fluide caloporteur caractérisé en ce que ladite plaque comprend plusieurs empreintes de réception d'empilement de flasques ajourés, lesdits canaux mettant en communication fluidique lesdites empreintes.In this spirit, the invention relates to a heat exchanger for electronic components and electrotechnical equipment comprising a plate provided with a plurality of channels for circulation of a heat-transfer fluid, characterized in that said plate comprises several imprints for receiving stacking of openwork flanges, said channels placing said cavities in fluid communication.
Grâce à l'invention, plusieurs empilements de flasques ajourés, tels que, par exemple, ceux connus de EP-A1-0 611 235, peuvent être logés dans les empreintes d'une plaque de façon à refroidir différents composants ou appareillages disposés en regard de ces empreintes. Les empilements de flasques peuvent être ceux utilisés pour des échangeurs individuels, de sorte que des économies d'échelle peuvent être réalisées. Selon un premier aspect avantageux de l'invention, l'une au moins des empreintes est apte à recevoir plusieurs empilements de flasques ajourés disposés côte à côte. Cet aspect de l'invention permet de refroidir une grande surface en utilisant des empilements de flasques standard dont le prix de revient est relativement faible.Thanks to the invention, several stacks of perforated flanges, such as, for example, those known from EP-A1-0 611 235, can be housed in the indentations of a plate so as to cool different components or devices arranged opposite of these footprints. The flange stacks can be those used for individual heat exchangers, so that economies of scale can be realized. According to a first advantageous aspect of the invention, at least one of the indentations is capable of receiving several stacks of openwork flanges arranged side by side. This aspect of the invention makes it possible to cool a large area by using stacks of standard flanges whose cost price is relatively low.
Selon un autre aspect avantageux de l'invention, les empreintes ont pour dimensions internes des multiples de dimensions de flasques ajourés utilisés dans des échangeurs de chaleur individuels. Cet aspect de l'invention permet d'obtenir une grande standardisation des flasques utilisés.According to another advantageous aspect of the invention, the cavities have for internal dimensions multiples of dimensions of perforated flanges used in individual heat exchangers. This aspect of the invention makes it possible to obtain a large standardization of the flanges used.
Selon un autre aspect avantageux de l'invention, les flasques sont réalisés à partir d'une armature en alliage à base d'aluminium revêtue de deux couches d'un alliage d'aluminium et de magnésium. Cette structure des flasques de 1 ' inven- tion permet d'obtenir un brasage de ceux-ci, une fois empilés dans les empreintes de la plaque.According to another advantageous aspect of the invention, the flanges are produced from an aluminum-based alloy frame coated with two layers of an aluminum and magnesium alloy. This structure of the flanges of the invention makes it possible to obtain a brazing of these, once stacked in the cavities of the plate.
Selon un autre aspect avantageux de l'invention, les flasques sont empilés dans les empreintes sur une hauteur légèrement supérieure à la profondeur des empreintes . Cet aspect de l'invention permet de garantir que les flasques, une fois brasés, rempliront complètement l'empreinte même si le brasage résulte dans une légère diminution de leur épaisseur. Selon un autre aspect avantageux de l'invention, 1 ' échangeur de chaleur comprend un couvercle brasé sous vide sur la plaque. Ce couvercle est destiné à rendre étanche les canaux de circulation de fluide caloporteur et les empreintes par rapport à l'extérieur. Dans ce cas, et selon un autre aspect avantageux de l'invention, on peut prévoir que 1 ' échangeur comprend une feuille de brasure disposée entre le couvercle et la plaque. En particulier, cette feuille de brasure peut être réalisée à partir d'une armature en alliage à base d'aluminium revêtue de deux couches d'un alliage d'aluminium et de magnésium. Dans tous les cas, on peut prévoir que les flaques, le couvercle et/ou la feuille disposée entre le couvercle et la plaque sont brasés sous vide à une température voisine de 600°C.According to another advantageous aspect of the invention, the flanges are stacked in the cavities over a height slightly greater than the depth of the imprints. This aspect of the invention makes it possible to guarantee that the flanges, once brazed, will completely fill the imprint even if the brazing results in a slight reduction in their thickness. According to another advantageous aspect of the invention, the heat exchanger comprises a cover brazed under vacuum on the plate. This cover is intended to seal the circulation channels for heat transfer fluid and the indentations relative to the outside. In this case, and according to another advantageous aspect of the invention, provision may be made for the exchanger to comprise a solder sheet disposed between the cover and the plate. In particular, this brazing sheet can be produced from an aluminum-based alloy frame coated with two layers of an aluminum and magnesium alloy. In all cases, provision may be made for the puddles, the cover and / or the sheet disposed between the cover and the plate to be brazed under vacuum at a temperature in the region of 600 ° C.
Selon un autre aspect de l'invention, 1 ' échangeur de chaleur comprend des moyens de fixation, sur la plaque ou le couvercle, de composants électroniques ou d'appareillages électrotechniques. Cet aspect de l'invention permet de solidariser facilement les composants électroniques ou les appareillages électrotechniques devant être refroidis et 1 ' échangeur de chaleur suivant l'invention.According to another aspect of the invention, the heat exchanger comprises means for fixing, on the plate or the cover, electronic components or electrotechnical equipment. This aspect of the invention makes it possible to easily attach the electronic components or the electrotechnical equipment to be cooled and the heat exchanger according to the invention.
L'invention sera mieux comprise et d'autres avantages de celle-ci apparaîtront plus clairement à la lumière de la description qui va suivre d'un mode de réalisation d'un échangeur de chaleur conforme à son principe, donnée uniquement à titre d'exemple et faite en référence aux dessins annexés dans lesquels :The invention will be better understood and other advantages thereof will appear more clearly in the light of the following description of an embodiment of a heat exchanger in accordance with its principle, given solely by way of example and made with reference to the accompanying drawings in which:
- la figure 1 est une représentation schématique en perspective d'un ensemble électronique de puissance incorporant un échangeur de chaleur conforme à l'invention ; - la figure 2 est une coupe verticale dans le plan- Figure 1 is a schematic perspective representation of an electronic power assembly incorporating a heat exchanger according to the invention; - Figure 2 is a vertical section in the plane
II-II à la figure 1 ;II-II in Figure 1;
- la figure 3 est une coupe horizontale selon le plan III-III à la figure 2 ; la figure 4 est une vue en perspective d'un empilement de flasques utilisé avec 1 ' échangeur de l'invention et- Figure 3 is a horizontal section along the plane III-III in Figure 2; FIG. 4 is a perspective view of a stack of flanges used with the exchanger of the invention and
- la figure 5 est une vue à plus grande échelle du détail V de la figure 4.FIG. 5 is a view on a larger scale of the detail V of FIG. 4.
Un circuit IGBT (Insulated Gâte Bipolar Transistor) représenté à la figure 1 comprend des éléments de puissance 1, l' et 1" pilotés par un circuit de commande 2, ainsi qu'une plaque porte-fusible 3. Les éléments du circuit IGBT sont disposés au contact d'un échangeur de chaleur 4, de forme globalement parallelepipedique, et comprenant une plaque de base 5 et un couvercle 6.An IGBT circuit (Insulated Gâte Bipolar Transistor) shown in FIG. 1 comprises power elements 1, l 'and 1 "controlled by a control circuit 2, as well as a fuse holder plate 3. The elements of the IGBT circuit are arranged in contact with a heat exchanger 4, of generally parallelepiped shape, and comprising a base plate 5 and a cover 6.
Conformément à l'invention et comme il apparaît plus clairement à la figure 3, la plaque 5 est munie de plusieurs canaux 7 et d'empreintes 8, 9 et 10 destinées à recevoir des empilements de flasques ajourés. Les empilements de flasques ajourés sont prévus pour définir entre eux des chicanes imposant un trajet de circulation à un fluide caloporteur pénétrant dans les canaux 7 par un orifice d'entrée 11 et en ressortant par un orifice de sortie 12. Ainsi, la plaque 5 est une pièce unique qui peut être substituée aux multiples tuyaux, raccords et coudes utilisés dans les dispositifs de l'art antérieur en coopération avec un cadre.In accordance with the invention and as it appears more clearly in FIG. 3, the plate 5 is provided with several channels 7 and impressions 8, 9 and 10 intended to receive stacks of openwork flanges. The stacks of perforated flanges are provided to define between them baffles imposing a circulation path on a heat transfer fluid penetrating into the channels 7 by an inlet orifice and coming out through an outlet orifice 12. Thus, the plate 5 is a single piece which can be substituted for the multiple pipes, fittings and elbows used in the devices of the prior art in cooperation with a frame.
Cette plaque peut être usinée sur une machine à commande numérique, pour former les canaux 7 et les empreintes 8, 9 etThis plate can be machined on a numerically controlled machine, to form the channels 7 and the imprints 8, 9 and
10 en fonction des paramètres d'un fichier informatique édité à partir des données spécifiques de l'ensemble de puissance auquel doit être couplé 1 ' échangeur de chaleur suivant l'invention. En d'autres termes, il suffit de définir informatiquement l'emplacement des empilements de flasques destinés au refroidissement de composants électroniques et de programmer un centre d'usinage pour réaliser, en une opération, la plaque 5 dans laquelle il suffit ensuite de déposer des empilements de flasques . On note que les empreintes 8, 9 et 10 peuvent avoir des formes différentes. Par exemple, l'empreinte 8 a une forme sensiblement rectangulaire et est destinée à recevoir un empilement 13 de flasques également sensiblement rectangulaires dont les dimensions sont à peu près égales aux dimensions de l'empreinte 8.10 as a function of the parameters of a computer file edited from specific data of the power assembly to which the heat exchanger according to the invention is to be coupled. In other words, it suffices to define the location of the flange stacks intended for cooling electronic components by computer and to program a machining center to produce, in one operation, the plate 5 in which it is then sufficient to deposit stacks of flanges. It is noted that the imprints 8, 9 and 10 can have different shapes. For example, the imprint 8 has a substantially rectangular shape and is intended to receive a stack 13 of flanges also substantially rectangular whose dimensions are approximately equal to the dimensions of the imprint 8.
L'empreinte 9 a une surface environ 4 fois supérieure à l'empreinte 8, car elle est apte à recevoir quatre empilements 13 de flasques globalement rectangulaires disposés côte à côte. Cette empreinte 9 est deux fois plus large et deux fois plus longue que les empilements 13 , de telle sorte que les quatre empilements peuvent y être logés sans difficulté.The imprint 9 has an area approximately 4 times greater than the imprint 8, because it is capable of receiving four stacks 13 of generally rectangular flanges arranged side by side. This footprint 9 is twice as wide and twice as long as the stacks 13, so that the four stacks can be accommodated there without difficulty.
L'empreinte 10 est, quant à elle, cylindrique à section circulaire de façon à recevoir un empilement 14 de flasques en forme de disque, par exemple du type décrit dans EP-A1-0 611 235.The cavity 10 is, in turn, cylindrical with a circular section so as to receive a stack 14 of disc-shaped flanges, for example of the type described in EP-A1-0 611 235.
La géométrie des empreintes 8, 9 et 10 est définie en fonction des dimensions transversales des éléments de puissance 1, l' et 1" .The geometry of the indentations 8, 9 and 10 is defined as a function of the transverse dimensions of the power elements 1, l 'and 1 ".
Comme il apparaît plus clairement aux figures 4 et 5, les flasques formant les empilements 13 , 14 sont au nombre de douze, chaque flasque 15 étant percé d'ajours 16 permettant la circulation du fluide caloporteur. Chaque flasque 15 est réalisé à partir d'une armature 17 en alliage à base d'aluminium et notamment d'alliage Al Mnl Cu identifié sous la référence 3003 par la norme AFNOR A 02-104. Les deux faces supérieure et inférieure de l'armature 17 sont respectivement revêtues d'une couche d'un alliage d'aluminium et de magnésium, par exemple de l'alliage portant la référence 4004 dans la norme précitée. Cette construction des flasques 15 permet d'envisager leur brasage sous vide, c'est-à-dire à une pression de l'ordre de 10"4 à 10"5 atmosphères, au cours du procédé d'assemblage de 1 ' échangeur de chaleur conforme à l'invention. En effet, la température de fusion de l'alliage 4004 est de l'ordre de 570°C alors que la température de fusion de l'alliage 3003 est de l'ordre de 640°C, de sorte qu'un brasage des flasques 15 constituant l'empilement 13 peut être obtenu en chauffant cet empilement à une température voisine de 600°C. Ce brasage est effectué sous vide pour éviter tout risque d'oxydation et en profitant, dans la mesure du possible, de l'effet Getter correspondant à la création d'un vide plus poussé du fait de la vaporisation du magnésium à une température voisine de 560 °C .As appears more clearly in Figures 4 and 5, the flanges forming the stacks 13, 14 are twelve in number, each flange 15 being pierced with openings 16 allowing the circulation of the heat transfer fluid. Each flange 15 is produced from a frame 17 of an aluminum-based alloy and in particular of an Al Mnl Cu alloy identified under the reference 3003 by standard AFNOR A 02-104. The two upper and lower faces of the frame 17 are respectively coated with a layer of an aluminum and magnesium alloy, for example of the alloy bearing the reference 4004 in the aforementioned standard. This construction of the flanges 15 makes it possible to envisage their brazing under vacuum, that is to say at a pressure of the order of 10 "4 to 10 " 5 atmospheres, during the assembly process of the heat exchanger. heat according to the invention. Indeed, the melting temperature of alloy 4004 is of the order of 570 ° C while the melting temperature of alloy 3003 is of the order of 640 ° C, so that brazing of the flanges 15 constituting the stack 13 can be obtained by heating this stack to a temperature close to 600 ° C. This brazing is carried out under vacuum to avoid any risk of oxidation and taking advantage, as far as possible, of the Getter effect corresponding to the creation of a higher vacuum due to the vaporization of magnesium at a similar temperature 560 ° C.
Au cours du brasage des couches 18, les flasques 15 ont tendance à s'écraser, de sorte 'que pour remplir efficacement les empreintes 8, 9 et 10 après brasage, on empile les flasques 15 dans ces empreintes sur une hauteur légèrement supérieure à la profondeur des empreintes. Ainsi, une fois brasés, les empilages 13 et 14 ont une hauteur sensiblement égale à la profondeur des empreintes. En pratique, on choisit de réaliser un empilement 13 ou 14 dont la hauteur avant brasage est supé- rieure à la profondeur des empreintes 8, 9 et 10 de 1 à 5%.During brazing layer 18, the flanges 15 tend to crush, so 'as to effectively fill the cavities 8, 9 and 10 after brazing, the plates 15 are stacked in these fingerprints on a height slightly greater than the depth of footprints. Thus, once brazed, the stacks 13 and 14 have a height substantially equal to the depth of the imprints. In practice, one chooses to produce a stack 13 or 14 whose height before brazing is greater than the depth of the imprints 8, 9 and 10 from 1 to 5%.
Le couvercle 6 est également fixé sur la plaque 5 par brasage. Pour ce faire, une feuille de brasure 19 est intercalée entre le couvercle 6 et la plaque 5 et est destinée à fondre partiellement en étant portée à une température prédé- terminée. On peut en particulier choisir, pour la feuille de brasure 19, une structure équivalente à celle des flasques 15, c'est-à-dire une armature en alliage à base d'aluminium, par exemple du type 3003, revêtue de couches d'un alliage d'aluminium et de magnésium, par exemple du type 4004. Comme précédem- ment, le brasage de la feuille 19 sur la plaque 5 et de la feuille 19 sur le couvercle 6 peut être réalisé sous vide en portant l'ensemble de 1 ' échangeur de chaleur à une température voisine de 600°C.The cover 6 is also fixed to the plate 5 by brazing. To do this, a solder sheet 19 is interposed between the cover 6 and the plate 5 and is intended to partially melt while being brought to a predetermined temperature. In particular, it is possible to choose, for the solder sheet 19, a structure equivalent to that of the flanges 15, that is to say an aluminum alloy frame, for example of the 3003 type, coated with layers of an aluminum and magnesium alloy, for example of the 4004 type. As before, the brazing of the sheet 19 on the plate 5 and of the sheet 19 on the cover 6 can be carried out under vacuum by carrying the assembly of 1 heat exchanger at a temperature close to 600 ° C.
Le montage de 1 ' échangeur de chaleur conforme à 1 ' inven- tion peut être réalisé de la façon suivante :The assembly of the heat exchanger according to the invention can be carried out as follows:
On installe des empilements 13 ou 14 de flasques ajourés dans les empreintes 8, 9 et 10 sur une hauteur légèrement supérieure à la profondeur des empreintes, on dépose la feuille 19 sur la plaque 5, puis on installe le couvercle 6 sur la feuille 19. On peut avantageusement comprimer l'ensemble ainsi réalisé au moyen de noix de serrage. On porte alors l'ensemble ainsi réalisé à une température de l'ordre de 600°C sous vide. On maintient l'ensemble ainsi formé à la température adéquate pendant une durée dépendant des dimensions et de la masse de cet ensemble, de sorte que le brasage est effectué. Lorsqu'il est extrait du four, 1 ' échangeur de chaleur constitue un ensemble monobloc et étanche prêt à fonctionner.Stacks 13 or 14 of openwork flanges are installed in the cavities 8, 9 and 10 over a height slightly greater than the depth of the cavities, the sheet 19 is placed on the plate 5, then the cover 6 is installed on the sheet 19. It is advantageous to compress the assembly thus produced by means of clamping nuts. The assembly thus produced is then brought to a temperature of the order of 600 ° C. under vacuum. The assembly thus formed is kept at the appropriate temperature for a period depending on the dimensions and the mass of this assembly, so that brazing is carried out. When removed from the oven, the heat exchanger constitutes a one-piece, sealed assembly ready to operate.
Selon une variante de réalisation non représentée de l'invention, le couvercle 6 est revêtu sur sa face inférieure d'une couche d'alliage à base d'aluminium et de magnésium, ce qui permet de se dispenser de la feuille 19 dans la mesure où le brasage du couvercle 6 sur la plaque 5 peut avoir lieu directement en portant l'ensemble formé de la plaque 5 et du couvercle 6 à une température voisine de 600°C.According to an alternative embodiment not shown of the invention, the cover 6 is coated on its underside with a layer of alloy based on aluminum and magnesium, which makes it possible to dispense with the sheet 19 insofar as the brazing of the cover 6 on the plate 5 can take place directly by bringing the assembly formed by the plate 5 and the cover 6 to a temperature in the region of 600 ° C.
L'invention permet également de prévoir, dans la plaque 5, des groupes de canaux parallèles 20 et 21 servant à créer un écoulement calibré du liquide caloporteur. Ces écoulements 20 et 21 peuvent être classiquement utilisés pour le refroidissement du circuit de commande 2, qui comprend par exemple des résistances et des capacités dont la température doit généralement être maintenue inférieure à 70°C ou les fusibles portés par la plaque 3 dont la température ne doit pas être trop importante. L'invention permet donc de refroidir, grâce au même fluide caloporteur, à la fois les éléments de puissance 1, l' et 1" grâce aux empilements 13 et 14 de flasques ajourés 15 et les systèmes de contrôle 2 et 3 grâce à un écoulement calibré de ce même fluide. Selon un aspect avantageux de l'invention, des perçagesThe invention also makes it possible to provide, in the plate 5, groups of parallel channels 20 and 21 serving to create a calibrated flow of the heat transfer liquid. These flows 20 and 21 can be conventionally used for cooling the control circuit 2, which for example includes resistors and capacitors whose temperature must generally be kept below 70 ° C. or the fuses carried by the plate 3 whose temperature should not be too large. The invention therefore makes it possible to cool, thanks to the same heat transfer fluid, both the power elements 1, l 'and 1 "thanks to the stacks 13 and 14 of perforated flanges 15 and the control systems 2 and 3 thanks to a flow calibrated with the same fluid. According to an advantageous aspect of the invention, bores
8a., 9a. et 10a_ taraudés sont respectivement répartis autour des empreintes 8, 9 et 10 de façon à permettre la fixation des éléments de puissance 1, l' et 1" sur la plaque 5 à travers le couvercle 6 qui est pourvu de perçages correspondants. Des perçages 20a_ et 21a_ sont également prévus au voisinage des groupes de canaux 20 et 21. Ces perçages 8a_, 9a_, 10a_, 20a_ et 21a_ permettent de prévoir une fixation efficace des composants électroniques et des appareillages électrotechniques sans ajout d'un cadre, ce qui simplifie 1 ' échangeur de chaleur de 1 ' inven- tion par rapport aux systèmes connus de l'art antérieur. 8a., 9a. and 10a_ threaded are respectively distributed around the cavities 8, 9 and 10 so as to allow the fixing of the power elements 1, l 'and 1 "on the plate 5 through the cover 6 which is provided with corresponding bores. Bores 20a_ and 21a_ are also provided in the vicinity of the groups of channels 20 and 21. These holes 8a_, 9a_, 10a_, 20a_ and 21a_ make it possible to provide efficient fixing of electronic components and electrotechnical devices without adding a frame, which simplifies 1 Heat exchanger of the invention compared to known systems of the prior art.

Claims

REVENDICATIONS
1. Echangeur de chaleur pour composants électroniques et appareillages électrotechniques (1, l', 1", 2, 3) comportant une plaque (5) munie d'une pluralité de canaux (7) de circulation d'un fluide caloporteur caractérisé en ce que ladite plaque (5) comprend une pluralité d'empreintes (8, 9, 10) de réception d'empilements (13, 14) de flasques ajourés (15), lesdits canaux mettant en communication fluidique lesdites empreintes .1. Heat exchanger for electronic components and electrotechnical equipment (1, l ', 1 ", 2, 3) comprising a plate (5) provided with a plurality of channels (7) for circulation of a heat transfer fluid, characterized in that that said plate (5) comprises a plurality of cavities (8, 9, 10) for receiving stacks (13, 14) of perforated flanges (15), said channels placing said cavities in fluid communication.
2. Echangeur de chaleur selon la revendication 1, caractérisé en ce que l'une (9) au moins desdites empreintes est apte à recevoir plusieurs empilements (13) de flasques ajourés (15) disposés côte à côte.2. Heat exchanger according to claim 1, characterized in that at least one (9) of said cavities is capable of receiving several stacks (13) of perforated flanges (15) arranged side by side.
3. Echangeur de chaleur selon l'une des revendications 1 ou 2, caractérisé en ce que lesdites empreintes (8, 9, 10) ont pour dimensions internes des multiples des dimensions de flasques ajourés (15) utilisés dans des échangeurs de chaleur individuels.3. Heat exchanger according to one of claims 1 or 2, characterized in that said indentations (8, 9, 10) have for internal dimensions multiples of the dimensions of perforated flanges (15) used in individual heat exchangers.
4. Echangeur de chaleur selon l'une des revendications 1 à 3, caractérisé en ce que lesdits flasques (15) sont réalisés à partir d'une armature (17) en alliage à base d'aluminium revêtue de deux couches (18) d'alliage d'aluminium et de magnésium.4. Heat exchanger according to one of claims 1 to 3, characterized in that said flanges (15) are made from a frame (17) of aluminum-based alloy coated with two layers (18) d aluminum and magnesium alloy.
5. Echangeur de chaleur selon l'une des revendications 1 à 4, caractérisé en ce que lesdits flaques (15) sont empilés dans lesdites empreintes sur une hauteur légèrement supérieure à la profondeur desdites empreintes. 5. Heat exchanger according to one of claims 1 to 4, characterized in that said puddles (15) are stacked in said imprints at a height slightly greater than the depth of said imprints.
6. Echangeur de chaleur selon l'une des revendications 1 à 5, caractérisé en ce qu'il comprend un couvercle (6) brasé sous vide sur ladite plaque (5) .6. Heat exchanger according to one of claims 1 to 5, characterized in that it comprises a cover (6) brazed under vacuum on said plate (5).
7. Echangeur de chaleur suivant la revendication 6, caractérisé en ce qu'il comprend une feuille de brasure (19) disposée entre ledit couvercle (6) et ladite plaque (5) .7. Heat exchanger according to claim 6, characterized in that it comprises a solder sheet (19) disposed between said cover (6) and said plate (5).
8. Echangeur de chaleur selon la revendication 7, caractérisé en ce que ladite feuille de brasure (19) est réalisée à partir d'une armature en alliage à base d'aluminium revêtue de deux couches d'un alliage d'aluminium et de magnésium.8. Heat exchanger according to claim 7, characterized in that said solder sheet (19) is produced from an aluminum alloy frame coated with two layers of an aluminum and magnesium alloy.
9. Echangeur de chaleur selon l'une des revendications 4, 6 ou 8, caractérisé en ce que lesdits flasques (15), ledit couvercle (6) et/ou ladite feuille (19) sont brasés sous vide à une température voisine de 600°C.9. Heat exchanger according to one of claims 4, 6 or 8, characterized in that said flanges (15), said cover (6) and / or said sheet (19) are brazed under vacuum at a temperature close to 600 ° C.
10. Echangeur de chaleur selon l'une des revendications, précédentes, caractérisé en ce qu'il comprend des moyens de fixation (8a., 9a_, 10a_, 20a_, 21a) de composants électriques ou d'appareillage électrotechniques (1, l', 1", 2, 3) sur ladite plaque ou ledit couvercle. 10. Heat exchanger according to one of the preceding claims, characterized in that it comprises fixing means (8a., 9a_, 10a_, 20a_, 21a) of electrical components or electrotechnical equipment (1, l , 1 ", 2, 3) on said plate or said cover.
PCT/FR1998/000948 1997-05-12 1998-05-12 Heat exchanger for electronic components and electrotechnical installation WO1998052396A1 (en)

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AU76630/98A AU7663098A (en) 1997-05-12 1998-05-12 Heat exchanger for electronic components and electrotechnical installation

Applications Claiming Priority (2)

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FR97/06012 1997-05-12
FR9706012A FR2763204A1 (en) 1997-05-12 1997-05-12 HEAT EXCHANGER FOR ELECTRONIC COMPONENTS AND ELECTROTECHNICAL APPARATUS

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2807285A1 (en) * 2000-03-29 2001-10-05 Seem Semrac Device for thermal control of high-power electronic components by circulation of coolant
DE10056172A1 (en) * 2000-11-13 2002-06-27 Vodafone Pilotentwicklung Gmbh Electrical component
FR2818447B1 (en) * 2000-12-18 2003-03-07 Ferraz Date Ind COOLED ELECTRICAL CONNECTION, PARTICULARLY FOR STRONG CURRENTS, AND MANUFACTURING METHOD THEREOF
US11732978B2 (en) 2016-04-18 2023-08-22 Qcip Holdings, Llc Laminated microchannel heat exchangers
KR102494649B1 (en) * 2016-04-18 2023-01-31 오리건 스테이트 유니버시티 Laminate Microchannel Heat Exchanger

Citations (3)

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EP0455229A2 (en) * 1990-05-02 1991-11-06 Mitsubishi Materials Corporation Ceramic substrate used for fabricating electric or electronic circuit
US5088005A (en) * 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
US5423376A (en) * 1993-02-12 1995-06-13 Ferraz A French Societe Anonyme Heat exchanger for electronic components and electro-technical equipment

Patent Citations (3)

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EP0455229A2 (en) * 1990-05-02 1991-11-06 Mitsubishi Materials Corporation Ceramic substrate used for fabricating electric or electronic circuit
US5088005A (en) * 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
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