WO1998048168A3 - In situ getter pump system and method - Google Patents

In situ getter pump system and method Download PDF

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Publication number
WO1998048168A3
WO1998048168A3 PCT/US1998/007459 US9807459W WO9848168A3 WO 1998048168 A3 WO1998048168 A3 WO 1998048168A3 US 9807459 W US9807459 W US 9807459W WO 9848168 A3 WO9848168 A3 WO 9848168A3
Authority
WO
WIPO (PCT)
Prior art keywords
chamber
processing
getter pump
processing chamber
noble
Prior art date
Application number
PCT/US1998/007459
Other languages
French (fr)
Other versions
WO1998048168A2 (en
Inventor
D Arcy H Lorimer
Gordon P Krueger
Original Assignee
Saes Pure Gas Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saes Pure Gas Inc filed Critical Saes Pure Gas Inc
Priority to JP54613198A priority Critical patent/JP2001524872A/en
Priority to EP98915555A priority patent/EP1012478A2/en
Publication of WO1998048168A2 publication Critical patent/WO1998048168A2/en
Publication of WO1998048168A3 publication Critical patent/WO1998048168A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B23/00—Pumping installations or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/006—Processes utilising sub-atmospheric pressure; Apparatus therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
    • F04B37/02—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for evacuating by absorption or adsorption
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2257/00—Components to be removed
    • B01D2257/10—Single element gases other than halogens
    • B01D2257/108—Hydrogen
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2257/00—Components to be removed
    • B01D2257/80—Water
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2258/00—Sources of waste gases
    • B01D2258/02—Other waste gases
    • B01D2258/0216—Other waste gases from CVD treatment or semi-conductor manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2259/00—Type of treatment
    • B01D2259/40—Further details for adsorption processes and devices
    • B01D2259/416—Further details for adsorption processes and devices involving cryogenic temperature treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/02—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
    • B01D53/04—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/02—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
    • B01D53/04—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
    • B01D53/0407—Constructional details of adsorbing systems
    • B01D53/0446—Means for feeding or distributing gases

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

A wafer processing system (12) including a processing chamber (18), a low pressure pump (22) coupled to the processing chamber (18) for pumping noble and non-noble gases, a valve mechanism (52) coupling a source of noble gas (54) to the processing chamber (18), an in situ getter pump (32) disposed within the processing chamber which pumps certain non-noble gases during the flow of the noble gas into the chamber (18), and a processing mechanism for processing a wafer (40) disposed within the processing chamber (18). Preferably, the in situ getter pump (32) can be operated at a number of different temperatures to preferentially pump different species of gas at those temperatures. A gas analyzer (36) is used to automatically control the temperature of the getter pump (32) to control the species of gasses that are pumped from the chamber. An alternate embodiment of the invention includes an in situ getter pump (178) additionally provided within the transfer chamber (42) of the semiconductor manufacturing equipment.
PCT/US1998/007459 1997-04-18 1998-04-15 In situ getter pump system and method WO1998048168A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP54613198A JP2001524872A (en) 1997-04-18 1998-04-15 In situ getter pump system and method
EP98915555A EP1012478A2 (en) 1997-04-18 1998-04-15 In situ getter pump system and method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US84417897A 1997-04-18 1997-04-18
US08/844,178 1997-04-18

Publications (2)

Publication Number Publication Date
WO1998048168A2 WO1998048168A2 (en) 1998-10-29
WO1998048168A3 true WO1998048168A3 (en) 2000-02-24

Family

ID=25292035

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/007459 WO1998048168A2 (en) 1997-04-18 1998-04-15 In situ getter pump system and method

Country Status (5)

Country Link
EP (1) EP1012478A2 (en)
JP (1) JP2001524872A (en)
KR (1) KR20010006278A (en)
CN (1) CN1252844A (en)
WO (1) WO1998048168A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6183564B1 (en) * 1998-11-12 2001-02-06 Tokyo Electron Limited Buffer chamber for integrating physical and chemical vapor deposition chambers together in a processing system
US7077159B1 (en) 1998-12-23 2006-07-18 Applied Materials, Inc. Processing apparatus having integrated pumping system
EP1126508A3 (en) * 2000-02-16 2005-03-30 Applied Materials, Inc. Processing apparatus having integrated pumping system
US7076920B2 (en) 2000-03-22 2006-07-18 Mks Instruments, Inc. Method of using a combination differential and absolute pressure transducer for controlling a load lock
FR2808098B1 (en) * 2000-04-20 2002-07-19 Cit Alcatel METHOD AND DEVICE FOR CONDITIONING THE ATMOSPHERE IN A PROCESS CHAMBER
US6672171B2 (en) 2001-07-16 2004-01-06 Mks Instruments, Inc. Combination differential and absolute pressure transducer for load lock control
ATE506540T1 (en) 2003-06-27 2011-05-15 Brooks Automation Inc INTEGRATION OF AN AUTOMATED CRYOPUM PUMP SAFETY FLUSH
GB0319171D0 (en) * 2003-08-15 2003-09-17 Boc Group Plc Purifier/getter for vacuum and uhp gas applications
CN102667156A (en) * 2009-09-29 2012-09-12 爱发科低温泵株式会社 Cryopump
CN105539888A (en) * 2015-12-02 2016-05-04 中国科学院西安光学精密机械研究所 Low air pressure test device
US10153282B1 (en) * 2017-08-11 2018-12-11 Lam Research Corporation Ultra-high vacuum transport and storage
CN114318518B (en) * 2021-12-31 2023-05-05 季华实验室 Epitaxial furnace hydrogen absorption system, method, electronic equipment and storage medium

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4137012A (en) * 1976-11-03 1979-01-30 S.A.E.S. Getters S.P.A. Modular getter pumps
US4571158A (en) * 1983-09-09 1986-02-18 Siemens Aktiengesellschaft Getter sorption pump with heat accumulator for high-vacuum and gas discharge systems
US5286296A (en) * 1991-01-10 1994-02-15 Sony Corporation Multi-chamber wafer process equipment having plural, physically communicating transfer means
EP0693626A1 (en) * 1994-07-20 1996-01-24 Applied Materials, Inc. Vacuum chamber for ultra high vacuum processing at high temperatures

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4137012A (en) * 1976-11-03 1979-01-30 S.A.E.S. Getters S.P.A. Modular getter pumps
US4571158A (en) * 1983-09-09 1986-02-18 Siemens Aktiengesellschaft Getter sorption pump with heat accumulator for high-vacuum and gas discharge systems
US5286296A (en) * 1991-01-10 1994-02-15 Sony Corporation Multi-chamber wafer process equipment having plural, physically communicating transfer means
EP0693626A1 (en) * 1994-07-20 1996-01-24 Applied Materials, Inc. Vacuum chamber for ultra high vacuum processing at high temperatures

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
LORIMER D'ARCY, ET AL.: "ENHANCED UHV PERFORMANCE WITH ZIRCONIUM-BASED GETTERS.", SOLID STATE TECHNOLOGY., PENNWELL CORPORATION, TULSA, OK., US, 1 September 1990 (1990-09-01), US, pages 01 - 04., XP002910002, ISSN: 0038-111X *

Also Published As

Publication number Publication date
KR20010006278A (en) 2001-01-26
WO1998048168A2 (en) 1998-10-29
CN1252844A (en) 2000-05-10
JP2001524872A (en) 2001-12-04
EP1012478A2 (en) 2000-06-28

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