WO1998016969A1

WO1998016969A1 - Transmitter and receiver module for a phase controlled antenna

Info

Publication number: WO1998016969A1
Application number: PCT/EP1997/005652
Authority: WO
Inventors: Helmut Dreher; Heinz-Peter Feldle; Rudolf Hetterich; Dieter Schmidt; Bernhard Schweizer
Original assignee: Daimler-Benz Aerospace Ag
Priority date: 1996-10-16
Filing date: 1997-10-14
Publication date: 1998-04-23
Also published as: DE19642681A1; EP0932916A1

Abstract

The invention relates to a transmitter and receiver module in which several layers of components, especially a HF layer and a control layer, are arranged on top of each other in a housing. The HF layer, for instance, contains all HF components required for a T/R module and/or HF sub-assemblies (transmission/reception path, amplitude and/or phase final controlling elements) which are required to control a transmitter/receiver radiation element. Preferably, control layer contains all (digitally operating) sub-assemblies (ASICs, EPROMs) which are required for (digital) control and/or setting of one or several transmitter/receiver modules. If necessary, a third layer can be provided, containing components, especially capacitors, required for T/R module voltage and power supply.

Description

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Transmit / receive module 1 — for a phase-controlled antenna

The invention is based on a transmission / reception module for a phase-controlled antenna according to the preamble of claim 1.

A phase-controlled antenna essentially consists of a matrix-like arrangement of transmit / receive radiator elements which are at a (matrix) distance of approximately λ / 2, where λ means the wavelength of the transmitted and / or received radiation. If different phase relationships are now set between the radiator elements, at least the type (character) of the transmission / reception lobe and the (main) transmission / reception direction can thus be set. It is expedient to arrange the circuit arrangement required for this directly behind the level of the radiator elements, since then in particular there is no distribution network for the transmit / receive signals.

It is furthermore expedient to arrange, at least in the immediate vicinity of the high-frequency part of the transmission / reception modules, the control logic required for the phase and / or amplitude adjusters contained therein, which is preferably designed in digitally working technology.

It is advantageous to design this circuit arrangement in such a way that even with a large number of radiating elements, for example a few thousand, the smallest possible number of cable line and / or plug connections is required, on the one hand between the transmitter / receiver modules and on the other hand between them Entire, which is also called an active front end, and an associated central evaluation and / or control unit.

Such a front end should be mechanically robust and also light in weight, so that it can be rotatably arranged on a mast, for example. This is particularly useful for a radar antenna. If this is now to be operated, for example, in the centimeter or millimeter wavelength range, the radiator elements must have a corresponding distance and also the transmitter / receiver modules arranged behind them.

The invention has for its object to provide a generic transmission / reception module that has a high packing density for electronic components of various types, that is mechanically robust, spatially small and inexpensive to manufacture. This object is achieved by the features specified in the characterizing part of patent claim 1. Advantageous refinements and / or further developments can be found in the further claims.

A first advantage of the invention is that a good dissipation of the heat loss generated is possible, so that in particular a high transmission power can be achieved for a radiator element.

A second advantage is that all of the components and / or assemblies used can be easily tested, particularly in industrial series production.

A third advantage is that a predeterminable number of transmission / reception modules on a common carrier, which can be flooded by a coolant, can be mounted in rows or double rows and checked.

A fourth advantage is that a possibly defective module can be replaced inexpensively during maintenance and / or repair work.

Further advantages result from the description below.

The invention is explained in more detail below on the basis of exemplary embodiments.

These are suitable for a radar transmit / receive antenna in the GHz range. A circuit arrangement known per se for an individual transmit / receive module is assumed. This includes in particular a transmission path that contains at least one GHz power amplifier;

a receive path containing at least one low-noise GHz preamplifier;

a transmit / receive U switch, for example a circulator for coupling a transmit / receive radiator element to the transmit and receive path;

at least one adjustable amplitude and / or phase adjuster for setting a predeterminable transmission / reception characteristic of all radiator elements and for carrying out an electrically controlled pivoting of the transmission / reception lobes;

the associated digital circuit logic;

the associated line connections as well

the associated current / voltage supply.

The detailed structure of the above-mentioned electrical and / or electronic assemblies is not described below since the invention essentially relates to the arrangement of these assemblies with respect to one another.

In the case of the invention, it is advantageously possible to arrange the assemblies belonging to a predeterminable number of radiator elements arranged next to one another in a cell in a single electrically conductive (module) housing.

The invention is based on a layered arrangement of the modules within the (module) housing. The invention is explained in more detail below using an example with reference to schematically illustrated figures. Show it

FIG. 1 shows a cross section through a module, which contains, for example, two transmit / receive modules (T / R modules) to explain the layer structure;

FIG. 2a, 2b top views of different layers within a module;

FIG. 3 shows a cross section through a carrier which contains all the assemblies of a complete (radiator) line.

1 shows a cross section through a module with a length 1 of approximately 60 mm and a height h of approximately 8.5 mm. The module has a bottom BO with a thickness of approximately 0.75 mm and consists of a material, for example aluminum-silicon carbide (AL / SIC), the coefficient of thermal expansion of which is adapted to the electronic components and / or assemblies located thereon. On the floor BO, side walls SW are fastened, which likewise have a thickness of approximately 0.75 mm and which consist, for example, of Kovar, titanium or of Al / SiC (aluminum / silicon carbide). On the side walls SW there is a cover DE, which consists of a material adapted to the side walls and which has a thickness of approximately 0.5 mm. The cover can be connected to the side walls SW, preferably by a welded connection. The side walls SW also have several openings in the area of the floor BO for the implementation of connecting lines VL, preferably planar transitions, with which connections to test facilities and to others Components can be produced. A first assembly level, which is also referred to below as a high-frequency layer or HF layer HFS, is now attached to the floor BO, for example by soldering and / or gluing, so that a good electrical and heat-conductive connection is produced. The HF layer HFS consists, for example, of a plate-shaped ceramic substrate, for example aluminum oxide, with a thickness of approximately 0.25 mm. Lines are preferably attached to the substrate, for example using micro-line technology or using coplanar technology, and additional components are required, for example, by means of adhesive, soldered and / or bonded connections. Openings are located in the substrate, in which then in particular active semiconductor circuits, for example a monolithically integrated high-frequency circuit MMIC, are arranged, specifically directly on the floor BO, preferably by gluing or soldering. This advantageously brings about good thermal and electrical contacts. The semiconductor circuits can be connected to the lines on the substrate by means of bond connections. Further thermal and / or electrical contacts between the bottom BO and the upper side (lines) of the substrate can be produced by means of additional openings and / or bores (via holes) in the substrate. These are then filled with conductive materials. This HF layer HFS is preferably connected to the connecting lines VL via bond connections BON. The structure described can be checked and / or compared, for example by means of an automatic device which is connected to the connecting lines VL.

After such an intermediate check, the second assembly level ΞTE, which is also called the control layer or control level, is now applied to the RF layer, for example likewise by gluing and / or soldering and through-plating to the RF layer. The second assembly The level also consists of a substrate (cross-hatched) currently customary in circuit technology, on which, if possible, the complete control electronics and the associated connecting lines for the module are attached. The control electronics preferably contain digitally operating (control) components and / or (control) assemblies (EPROM, ASIC) as well as power modulators for the first assembly level HFS underneath and the complete module. This second component level STE can advantageously be checked and / or adjusted in itself before being installed in the module. After installation in the module, a further intermediate test can advantageously be carried out, if necessary, preferably by means of an automatically operating test and / or adjustment device. This second component level STE is connected to the first component level via the plated-through holes and / or via so-called ball-grid array connections and / or via bond connections in accordance with the required electrical circuit.

A third assembly level SPV (shown in dashed lines) is arranged above the second assembly level STE. On a printed circuit board, this contains all the components required for the voltage and / or power supply of the module, in particular capacitors CAP.

If necessary, the placement levels are arranged one above the other by means of spacers AB.

The arrangement described thus advantageously achieves a mechanical, electrical and thermal connection of the assembly levels to one another, so that very compact, three-dimensional structures with short electrical connections and shields are achieved. FIG. 2 shows top views, with the cover DE removed, of arrangements corresponding to FIG. 1. FIG. 2a shows a top view of the first assembly level HFS. This consists of the HF parts (transmitting / receiving parts) of, for example, two S / E modules arranged next to one another, which are separated from one another by a shielding and / or contacting arrangement AK, for example a ball grid array connection arrangement. FIG. 2b shows a plan view of the second component level STE belonging to FIG. 2a, on the underside of which, for example, a contact arrangement corresponding to the shielding and / or contacting arrangement AK is attached. The second assembly level STE shown includes all modules that are required to control the underlying first assembly level. It can be seen that an inexpensive and reliable connection between the assembly levels can be produced in this way.

Such transmit / receive modules (T / R modules) can advantageously be combined to form compact and reliable line and / or matrix arrangements. All modules arranged side by side in a row are interconnected. The line can therefore be checked and / or compared as a whole. In addition, such a line can be replaced quickly and inexpensively, for example for maintenance and / or repair work on a phase-controlled antenna that contains a large number of lines.

Fig. 3 shows a cross section through such a row arrangement. This consists, for example, of an electrically and thermally highly conductive carrier TR, which is produced, for example, as a so-called extruded profile made of an aluminum alloy. The carrier TR has, for example, a width br of approximately 100 mm and a height ho of approximately 14 mm. The length (perpendicular to the drawing plane) is selected depending on the number of T / R modules to be arranged side by side. In its central region, the carrier TR has two cooling channels KK arranged next to one another, through which a coolant, for example a glycol / water mixture or water, can be passed in order to dissipate the heat loss from the T / R modules attached above. These are fastened, for example, by screws SR, so that good electrical and thermal contacts • occur. Transmit / receive radiator elements RE are also attached to the carrier TR, preferably one radiator element per module. In the area between the radiator elements RE and the TR modules, further components and / or assemblies are arranged, for example the transmitters / receivers (circulators) required for Ξend- / receive modules, current / voltage supply parts DC PCB and an RF distribution , which is labeled RF-TRIPLATE. Such components and / or assemblies are preferably electrically connected by means of bond and / or so-called MOE connections, polymer structures with metal components (BONDING / MOE). On the side of the TR modules facing away from the radiator element RE, further current / voltage supplies (DC PCB) and RF distributions (RF TRIPLATE) are available.

With such an arrangement, a reliable and cost-effective production of a line is advantageously possible, only a small number of inexpensive and fault-prone plug connections being required, in particular at the ends of a line for their connection to further and / or a central unit.

The invention is not restricted to the exemplary embodiments described, but can also be applied analogously to others. So it is possible, for example, in particular the side walls SW and the cover DE (Fig. 1) by a To replace (plastic) casting compound, which is suitable for electronic uses. Furthermore, it is possible to attach further TR modules and the circuit arrangements described on the underside of the carrier TR (FIG. 3), so that a double row of radiator elements and associated modules is produced. In addition, it is possible, if necessary, to arrange further components and / or assemblies, for example the transmission / reception switch (circulator) within the modulator housing BO, SW, DE.

Claims

claims

1. Transmit / receive module for a phase-controlled antenna, at least consisting of

a high-frequency circuit which contains a transmission path, a reception path and phase and / or amplitude actuators and

a control circuit for controlling the high-frequency circuit, characterized in that

that a plate-shaped floor (BO) with a predeterminable size is made of a material with predeterminable electrical and thermal properties, that a first assembly level (HFS), which contains at least a substantial part of the high-frequency circuit, is attached to the floor (BO),

- That above the first assembly level (HFS) a second

Assembly level (STE), which contains at least a substantial part of the control circuit required to control the first assembly level (HFS), is attached,

that the two assembly levels are connected at predetermined locations at least by electrical connections and

- That both assembly levels in a common electrically conductive housing (SW, DE), which is electrically connected to the bottom (BO), are arranged.

2. Transceiver module according to claim 1, characterized in that in the housing (SW, DE) there is additionally a third component level (SPV), which has at least a substantial part of the voltage / Ξtromversorgungs- circuits for the first and second Assembly level (HFS, STE) contains.

3. Transceiver module according to one of the preceding claims, characterized in that each of the assembly levels (HFS, STE, SPV) consists of a substrate with connecting lines thereon as well as electrical components and / or assemblies.

4. Transmitting / receiving module according to one of the preceding claims, characterized in that in the substrate of the first assembly level (HFS) there are openings in the heat-generating active (high-frequency) semiconductor Components and / or a heat-generating active (high-frequency) semiconductor assembly is (are) arranged such that the semiconductor component and / or the semiconductor assembly have at least one thermal contact with the floor (BO).

5. Transceiver module according to one of the preceding claims, characterized in that the housing (SW, DE) consists at least of an electrically shielding material.

6. Transceiver module according to one of the preceding claims, characterized in that the housing (SW, DE) consists at least partially of a casting compound, the surface of which contains an electrically shielding material.

7. Transceiver module according to one of the preceding claims for use in a cellular arrangement, wherein a carrier (TR) with at least one coolant channel (KK) is provided, on which a predeterminable number of housings, with assembly levels contained therein, are at least thermally attached .