WO1998008303A1 - Elliptic filter and method of making the same - Google Patents
Elliptic filter and method of making the same Download PDFInfo
- Publication number
- WO1998008303A1 WO1998008303A1 PCT/US1997/011392 US9711392W WO9808303A1 WO 1998008303 A1 WO1998008303 A1 WO 1998008303A1 US 9711392 W US9711392 W US 9711392W WO 9808303 A1 WO9808303 A1 WO 9808303A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- filter
- baw
- baw resonator
- resonator
- mode number
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000758 substrate Substances 0.000 claims description 22
- 230000005540 biological transmission Effects 0.000 claims description 19
- 239000003990 capacitor Substances 0.000 claims description 11
- 238000013461 design Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 230000002238 attenuated effect Effects 0.000 abstract description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 9
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000005350 fused silica glass Substances 0.000 description 5
- 239000011787 zinc oxide Substances 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 238000001914 filtration Methods 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- PSHMSSXLYVAENJ-UHFFFAOYSA-N dilithium;[oxido(oxoboranyloxy)boranyl]oxy-oxoboranyloxyborinate Chemical compound [Li+].[Li+].O=BOB([O-])OB([O-])OB=O PSHMSSXLYVAENJ-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02062—Details relating to the vibration mode
- H03H9/02078—Details relating to the vibration mode the vibration mode being overmoded
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/542—Filters comprising resonators of piezoelectric or electrostrictive material including passive elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/56—Monolithic crystal filters
Definitions
- the present invention relates generally to broadband filters and, in particular, to broadband elliptic filters made from Overmoded Bulk Acoustic Wave piezoelectric resonators.
- Wideband radio transceivers currently require front-end, broadband filtering. Because of stringent filter specifications of many transceivers (insertion loss, quality factor, size. . . , etc.), expensive front- end filters comprising bulky coaxial resonators in metallic enclosures are typically utilized for broadband filtering. Since next-generation radio transceivers require smaller, less expensive filters, a need exists for a front-end, broadband filter that is less costly and smaller than current filters, yet meets the stringent filter specifications required by many transceivers.
- FIG. 1 is an over-moded Bulk Acoustic Wave resonator in accordance with a preferred embodiment of the present invention.
- FIG. 2 is a transmission energy versus frequency graph of a Bulk Acoustic Wave resonator operating at mode two.
- FIG. 3 illustrates a broadband filter in accordance with a preferred embodiment of the present invention.
- FIGs. 4-6 illustrate attenuation of unwanted passbands in accordance with a preferred embodiment of the present invention.
- FIG. 7 illustrates a circuit schematic diagram of an elliptic filter in accordance with a preferred embodiment of the present invention.
- FIGs. 8 through 10 illustrate a broadband filter on a substrate in accordance with a preferred embodiment of the present invention.
- FIG. 11 is a flow chart illustrating manufacture of the filter of FIGs. 8 through 10 in accordance with a preferred embodiment of the present invention.
- FIGs. 12 through 18 are specific examples that serve to illustrate the practice of particular embodiments of the present invention.
- a broadband elliptic filter having a first Bulk Acoustic Wave (BAW) resonator operating at a first mode number and a first center frequency.
- a second BAW resonator is provided operating at a second mode number.
- the first and second BAW resonators operate at the same center frequency.
- Operating BAW resonators at differing modes allows the unwanted passbands of the first BAW resonator to be attenuated by the second BAW resonator.
- Such an elliptic filter design allows for an N-pole, (N-1 )/2 zero elliptic filter having (N-1)/2 BAW resonators, N capacitors, and N transmission lines.
- the present invention encompasses a filter having a first BAW resonator operating at a first mode number and operating at a first center frequency. Additionally, the filter comprises a second BAW resonator operating at a second mode number, and operating at substantially the first center frequency.
- a filter allows for an odd order, N-pole, (N- 1)/2 zero filter comprising (N-1)/2 piezoelectric resonators and N transmission lines.
- An alternate embodiment of the present invention encompasses a method of making an odd order, N-pole, (N-1 )/2 zero elliptic filter by photolithographically creating on a substrate, a first BAW resonator operating at a first mode number and a first center frequency.
- a second BAW resonator is photolithographically created on the substrate, the second BAW resonator operates at substantially the first center frequency and at a second mode number.
- FIG. 1 illustrates a BAW resonator 100 in accordance with a preferred embodiment of the present invention.
- BAW resonator 100 comprises first electrode 102, first buffer layer 104, piezoelectric film 106, second buffer layer 108, second electrode 110, and delay section substrate 112.
- electrodes 102 and 1 10 are Aluminum electrodes, but other highly conductive material (for example, Silver or Gold) may be substituted.
- Buffer layers 104 and 108 serve to protect piezoelectric film 106 during the manufacturing process, and are preferably Silicon Nitride layers.
- substrate 112 is preferably a Fused Quartz substrate, but other substrates (for example, Lithium Niobate, Dilithium Tetraborate, Yttrium Aluminum Garnet, or Sapphire) can be used as well.
- piezoelectric film 106 made from Aluminum Nitride is utilized as a transducer to excite longitudinal waves in substrate 112.
- piezoelectric film 106 is a Zinc Oxide film utilized because of the larger electromechanical coupling coefficient needed in broad band filters.
- BAW resonator 100 is capable of achieving very large quality factor (Q) values provided substrate 112 comprises a material with very low acoustic loss and mode numbers of more than one are used.
- Mode number is defined as the ratio of the acoustic half wavelengths of substrate 112 thickness to the acoustic half wavelength of piezoelectric film 106.
- a compromise between Q and filter bandwidth is made such that BAW resonator 100 operates at a lower mode number (below 20) in order to obtain the necessary bandwidth for front-end, broadband filtering requirements.
- Elliptic or Cauer filter bandwidth depends on low pass prototype reflection coefficient (passband ripple), ultimate attenuation required in the stop band, and available resonator shunt to motional capacitance ratio at the working mode. Largest bandwidths are obtained with filters having the lowest stopband attenuation. For a given stopband attenuation the theoretical maximum ripple bandwidth is equal to:
- Fo filter center frequency (Hz)
- r resonator (shunt to series) capacitance ratio at the operating mode
- L2 is the smallest product of adjacent, normalized L and C values in standard Cauer low-pass prototype filter tables.
- BAW resonator 100 additionally has the property of creating unwanted spurious responses that exist at frequencies on either side of the resonator center frequency. This can be seen in FIG. 2, where a transmission energy versus frequency graph of a mode two BAW resonator 100 is shown. Unwanted spurious responses 201 (referred to as unwanted passbands in a filter context) exist at equal spacing from the center frequency fo on the low and high frequency side of center frequency 203 (only low side unwanted passbands 201 are shown). Unwanted passbands 201 exist due to the harmonics of substrate 112's fundamental acoustic resonance. Thus for BAW resonator 100 operating at mode number ⁇ , there will be ⁇ unwanted passbands 201. The approximate frequency locations of unwanted passbands 203 are given by the formula:
- FIG. 3 illustrates a broadband filter 300 in accordance with a preferred embodiment of the present invention.
- Filter 300 comprises over-moded BAW resonator 302, overmoded BAW resonator 304 operating at the same center frequency as BAW resonator 302, and coplanar waveguide transmission lines 306-314.
- filter 300 is an odd order Cauer filter since even ordered filters require the output resonator to be a series LC circuit that cannot be synthesized with the use of BAW resonators like 302 and 304
- broadband filter 300 is shown as a 5-pole, 2 zero elliptic filter, in alternate embodiments of the present invention, broadband filter 300 can be any odd order N-pole, (N-1 )/2 zero elliptic filter with a similar BAW resonator configuration, resulting in an N-pole, (N-1)/2 zero elliptic filter having (N-1)/2 BAW resonators, N capacitors, and N transmission lines.
- filter 300 is designed with the aid of transmission lines 306-314 forming shorted or open stubs to replace the design coils. This is done in order to minimize insertion loss when coils of the required inductance have insufficient Q. Additionally, transmission lines 306-314 are inserted in order to increase the bandwidth obtainable with BAW resonators 302 and 304 alone. As discussed below, filter 300 can meet the insertion loss specification of many cellular wideband filters when manufactured with coils having Q as low as 250 to 300 provided that the resonator's Q is above 3,000 (a Q requirement that can be met only by Overmoded BAW resonators working at mode numbers between 2 and 6 when using Fused Quartz substrates).
- filter 300 requires a minimum capacitance ratio of 44 and unloaded Q of at least 3,000 hence, in a preferred embodiment of the present invention mode 2 through 6 resonators are used.
- BAW resonator 302 operates at a different mode than BAW resonator 304. Designing filter 300 in such a way will result in the stop band of one resonator attenuating the spurious pass bands of the other.
- BAW resonators 302 and 304 can be designed any number of modes apart (within the limits indicated above), in a preferred embodiment of the present invention, BAW resonator 302 is designed to operate at one or two mode below that of BAW resonator 304.
- the improvement obtained by designing BAW resonator 302 one mode lower than that of BAW resonator 304 is illustrated in FIGs. 4-6.
- FIGs. 4 and 5 illustrate unwanted passbands 201 for filter 300 designed with BAW resonator 302 and 304, each operating at mode two and mode three respectively.
- FIG. 6 illustrates operation of filter 300 with BAW resonator 302 operating at mode two and BAW resonator 304 operating at mode three, with both BAW resonators 302 and 304 operating at the same center frequency.
- BAW resonators 302 and 304 with a one mode separation, allows the stop band of one resonator to attenuate the spurious pass bands of the other, resulting in most unwanted passbands 201 being attenuated.
- the highest two modes are used since the unwanted passbands 201 closest to the passband 203 are higher in level and more difficult to attenuate.
- filter 300 is designed with BAW resonators 302 and 304 operating at modes 2 and 3 or at modes 3 and 4.
- unwanted passbands 201 are attenuated by offsetting piezoelectric film 104 thickness between BAW resonator 302 and BAW resonator 304, and compensating the change in center frequency by changing the thickness of electrode 102 accordingly.
- Such a filter 300 will displace the frequency of unwanted passbands 201 of BAW resonator 302 from those of BAW resonator 304 so that the stop band of one resonator attenuates the spurious passbands of the other.
- FIG. 7 illustrates a circuit schematic diagram of elliptic filter 300 in accordance with a preferred embodiment of the present invention.
- filter 300 is derived from a low pass Cauer C05 10 25 type filter consisting of five parallel LCR and 2 series LCR circuits, all resonant at the same center frequency.
- the series resonant circuits and two of the shunt capacitors of filter 300 are replaced by the equivalent series LC circuits of BAW resonators 302 and 304, allowing filter 300 to be designed with two piezoelectric resonators.
- BAW resonator 302 operates at a different mode than BAW resonator 304, allowing for the stop band of one resonator to attenuate the unwanted passbands of the other.
- Replacing series resonant circuits and capacitors (CP2 and CP4) of filter 300 with piezoelectric resonators 302, 304 allows for the manufacture of a N-pole, (N-1 )/2 zero elliptic front-end, broadband filter 300 comprising only (N-1 )/2 piezoelectric resonators.
- Such a filter 300 is less costly and smaller than current filters, yet meets the stringent filter specifications required by many transceivers.
- FIGs. 8 through 10 illustrate broadband filter 800 manufactured on substrate 811 in accordance with a preferred embodiment of the present invention.
- Filter 800 is a 5 pole, two-zero elliptic filter of the same design as FIG. 5 comprising two overmoded BAW resonators 802 and 804, five short pieces of coplanar waveguide transmission lines 806, and three chip capacitors 803.
- Filter 800 additionally comprises input 801 , output 809, air bridges 805, upper ground plane 807, lower ground plane 813, and resonator wells 815.
- coplanar waveguide stubs function as inductances they can be replaced by other types of transmission lines 806, such as, but not limited to ribbon inductances, microstrip, suspended microstrip or stripline, provided they have adequate Q (in a preferred embodiment, about 300).
- Q in a preferred embodiment, about 300.
- the length (los) of open stubs 806 are calculated with the equation:
- manufacture of filter 800 occurs as described in reference to FIG. 11.
- a 1000 micron thick Fused Quartz substrate 811 with pre-etched resonator wells 815 has deposited on both sides, a .1 micron sublayer of chrome, and a 100 micron top layer of copper protected by a 5 micron layer of Gold.
- both upper and lower sides of substrate 81 1 are photolithographically processed to expose the desired metalization pattern, and then chemically etched (step 1106) to achieve the desired topography.
- step 1108 Aluminum electrode 110 (preferably .2 microns thick), is deposited on substrate 811 followed by step 1 1 10 where Silicon Nitride buffer layer 108 (preferably .15 microns thick) is deposited onto the Aluminum electrode 110.
- step 1 112 piezoelectric film 106 is deposited on the Silicon Nitride buffer layer.
- piezoelectric film 106 comprises a 3.15177 micron thick layer of Zinc Oxide.
- a Silicon Nitride buffer layer 104 (preferably .15 microns thick) is deposited on piezoelectric film 106, and finally at step 1116, an Aluminum electrode 104 (preferably .2 microns thick) is deposited onto buffer layer completing the build of the resonator.
- an Aluminum electrode 104 (preferably .2 microns thick) is deposited onto buffer layer completing the build of the resonator.
- step 1117 the remaining components, including chip capacitors 803 and air bridges 805 are applied to filter 800 and the process flow ends at step 11 18.
- the graph of FIG. 12 shows insertion and return loss of filter 300 having a 25 MHz bandwidth with a parallel LC circuit Q of 300, and a series LC circuit (circuit's that can be replaced by BAW resonators 302 and 304) having a Q of 800 and infinity. Note that even with the series LC circuits Q of infinity, a flat loss of 1.5 dB occurs at midband and about 3 dB at band edges due to the finite Q of the coils. Additionally, dropping the series LC circuit's Q to 800 added only .5 dB at midband and less than .97 dB at the band edges.
- FIG. 13-15 A simulation of filter 300 having BAW resonator 302 with no mode separation (both operating at mode 3), one, and two mode separation from BAW resonator 304 is shown in FIGs. 13-15. As is evident, operation at both a one and two mode separation improve the closer unwanted passbands 201 to at least 32 dB, with operation at two mode separation giving the best overall result. For narrow band filters, where higher mode number resonators can be used, the number of mode separation can be more than two, and depends on the bandwidth and the mode at which the higher mode resonator operates.
- FIG. 16 illustrates a simulation of filter 300 having resonator 302 operating at mode 2 and resonator 304 at mode 4. When the required Q allows the use of mode 1 , similar results can be obtained as shown in FIG. 17, where resonator 302 is operating at mode 1 and resonator 304 at mode 4.
- FIG. 18 A simulation of filter 300 having a differing electrode thickness between BAW resonators 302 and 304 is illustrated in FIG. 18.
- BAW resonator 302 comprises electrode 102 having a thickness of .10 micrometers and piezoelectric thickness of 3.2507 micrometers, with BAW resonator 304 having electrode 102 thickness of .29 micrometers and piezoelectric thickness of 3.05935 micrometers. Both BAW resonators 302 and 304 operate at the same center frequency.
- this method is not as effective as is the method of separating modes between BAW resonators 302 and 304, but still reduces the higher frequency unwanted passband 201 to 22 dB and the lower frequency unwanted passbands 201 to 43 and 71 dB respectively.
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- External Artificial Organs (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU35866/97A AU708019B2 (en) | 1996-08-23 | 1997-07-01 | Elliptic filter and method of making the same |
JP51072598A JP2001523405A (en) | 1996-08-23 | 1997-07-01 | Elliptic filter and manufacturing method thereof |
EP97932402A EP0922329A4 (en) | 1996-08-23 | 1997-07-01 | Elliptic filter and method of making the same |
CA002262977A CA2262977C (en) | 1996-08-23 | 1997-07-01 | Elliptic filter and method of making the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/701,825 | 1996-08-23 | ||
US08/701,825 US5760663A (en) | 1996-08-23 | 1996-08-23 | Elliptic baw resonator filter and method of making the same |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998008303A1 true WO1998008303A1 (en) | 1998-02-26 |
Family
ID=24818833
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1997/011392 WO1998008303A1 (en) | 1996-08-23 | 1997-07-01 | Elliptic filter and method of making the same |
Country Status (7)
Country | Link |
---|---|
US (1) | US5760663A (en) |
EP (1) | EP0922329A4 (en) |
JP (1) | JP2001523405A (en) |
KR (1) | KR100321555B1 (en) |
AU (1) | AU708019B2 (en) |
CA (1) | CA2262977C (en) |
WO (1) | WO1998008303A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019170338A1 (en) * | 2018-03-06 | 2019-09-12 | RF360 Europe GmbH | Rf filter, rf filter component and method of manufacturing an rf filter |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6239536B1 (en) * | 1998-09-08 | 2001-05-29 | Tfr Technologies, Inc. | Encapsulated thin-film resonator and fabrication method |
US6339276B1 (en) * | 1999-11-01 | 2002-01-15 | Agere Systems Guardian Corp. | Incremental tuning process for electrical resonators based on mechanical motion |
FI107661B (en) | 1999-11-29 | 2001-09-14 | Nokia Mobile Phones Ltd | A method for adjusting the center frequency of a balanced filter and a plurality of balanced filters |
US6746577B1 (en) | 1999-12-16 | 2004-06-08 | Agere Systems, Inc. | Method and apparatus for thickness control and reproducibility of dielectric film deposition |
US6524971B1 (en) | 1999-12-17 | 2003-02-25 | Agere Systems, Inc. | Method of deposition of films |
DE19962028A1 (en) * | 1999-12-22 | 2001-06-28 | Philips Corp Intellectual Pty | Filter arrangement |
US7296329B1 (en) * | 2000-02-04 | 2007-11-20 | Agere Systems Inc. | Method of isolation for acoustic resonator device |
US6437667B1 (en) | 2000-02-04 | 2002-08-20 | Agere Systems Guardian Corp. | Method of tuning thin film resonator filters by removing or adding piezoelectric material |
US6323744B1 (en) | 2000-02-04 | 2001-11-27 | Agere Systems Guardian Corp. | Grounding of TFR ladder filters |
US6377136B1 (en) | 2000-02-04 | 2002-04-23 | Agere Systems Guardian Corporation | Thin film resonator filter having at least one component with different resonant frequency sets or electrode capacitance |
US6306313B1 (en) | 2000-02-04 | 2001-10-23 | Agere Systems Guardian Corp. | Selective etching of thin films |
US6603241B1 (en) | 2000-05-23 | 2003-08-05 | Agere Systems, Inc. | Acoustic mirror materials for acoustic devices |
US6355498B1 (en) | 2000-08-11 | 2002-03-12 | Agere Systems Guartian Corp. | Thin film resonators fabricated on membranes created by front side releasing |
US6486751B1 (en) | 2000-09-26 | 2002-11-26 | Agere Systems Inc. | Increased bandwidth thin film resonator having a columnar structure |
US6674291B1 (en) | 2000-10-30 | 2004-01-06 | Agere Systems Guardian Corp. | Method and apparatus for determining and/or improving high power reliability in thin film resonator devices, and a thin film resonator device resultant therefrom |
US6587212B1 (en) | 2000-10-31 | 2003-07-01 | Agere Systems Inc. | Method and apparatus for studying vibrational modes of an electro-acoustic device |
US6743731B1 (en) | 2000-11-17 | 2004-06-01 | Agere Systems Inc. | Method for making a radio frequency component and component produced thereby |
US7435613B2 (en) * | 2001-02-12 | 2008-10-14 | Agere Systems Inc. | Methods of fabricating a membrane with improved mechanical integrity |
EP1455448B1 (en) * | 2001-12-14 | 2008-09-24 | Mitsubishi Electric Corporation | Filter circuitry |
DE10234980B4 (en) * | 2002-07-31 | 2018-01-04 | Snaptrack, Inc. | Resistant to resonant acoustic wave resonator |
DE10316716A1 (en) * | 2003-04-11 | 2004-10-28 | Epcos Ag | Component with a piezoelectric functional layer |
GB0308913D0 (en) * | 2003-04-17 | 2003-05-21 | Koninkl Philips Electronics Nv | Method of, and circuit for,broadening the frequency band of frequency dependentloads |
JP2005136467A (en) * | 2003-10-28 | 2005-05-26 | Tdk Corp | Piezoelectric resonator and electronic component employing same |
US9154107B2 (en) * | 2009-05-28 | 2015-10-06 | Northrop Grumman Systems Corporation | Lateral over-moded bulk acoustic resonators |
KR101716335B1 (en) * | 2010-12-03 | 2017-03-15 | 삼성전자주식회사 | Low pass filter using bulk acoustic wave resonator |
WO2019138811A1 (en) * | 2018-01-12 | 2019-07-18 | 株式会社村田製作所 | Elastic wave device, multiplexer, a high-frequency front end circuit, and communication device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3609601A (en) * | 1970-01-12 | 1971-09-28 | Collins Radio Co | Monolithic filter having "m" derived characteristics |
US4156214A (en) * | 1977-01-14 | 1979-05-22 | Motorola, Inc. | Multipole resonator |
US5382930A (en) * | 1992-12-21 | 1995-01-17 | Trw Inc. | Monolithic multipole filters made of thin film stacked crystal filters |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4052251A (en) * | 1976-03-02 | 1977-10-04 | Rca Corporation | Method of etching sapphire utilizing sulfur hexafluoride |
US4245193A (en) * | 1978-08-09 | 1981-01-13 | Harris Corporation | High-Q multi-mode resonator controlled source |
US4785269A (en) * | 1986-05-15 | 1988-11-15 | Westinghouse Electric Corp. | Magnetically tuned high overtone bulk acoustic resonator |
US5194836A (en) * | 1990-03-26 | 1993-03-16 | Westinghouse Electric Corp. | Thin film, microwave frequency manifolded filter bank |
US5231327A (en) * | 1990-12-14 | 1993-07-27 | Tfr Technologies, Inc. | Optimized piezoelectric resonator-based networks |
US5233259A (en) * | 1991-02-19 | 1993-08-03 | Westinghouse Electric Corp. | Lateral field FBAR |
US5185589A (en) * | 1991-05-17 | 1993-02-09 | Westinghouse Electric Corp. | Microwave film bulk acoustic resonator and manifolded filter bank |
US5294898A (en) * | 1992-01-29 | 1994-03-15 | Motorola, Inc. | Wide bandwidth bandpass filter comprising parallel connected piezoelectric resonators |
US5291159A (en) * | 1992-07-20 | 1994-03-01 | Westinghouse Electric Corp. | Acoustic resonator filter with electrically variable center frequency and bandwidth |
US5373268A (en) * | 1993-02-01 | 1994-12-13 | Motorola, Inc. | Thin film resonator having stacked acoustic reflecting impedance matching layers and method |
US5446306A (en) * | 1993-12-13 | 1995-08-29 | Trw Inc. | Thin film voltage-tuned semiconductor bulk acoustic resonator (SBAR) |
-
1996
- 1996-08-23 US US08/701,825 patent/US5760663A/en not_active Expired - Fee Related
-
1997
- 1997-07-01 KR KR1019997001457A patent/KR100321555B1/en not_active IP Right Cessation
- 1997-07-01 AU AU35866/97A patent/AU708019B2/en not_active Ceased
- 1997-07-01 EP EP97932402A patent/EP0922329A4/en not_active Withdrawn
- 1997-07-01 CA CA002262977A patent/CA2262977C/en not_active Expired - Fee Related
- 1997-07-01 JP JP51072598A patent/JP2001523405A/en active Pending
- 1997-07-01 WO PCT/US1997/011392 patent/WO1998008303A1/en not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3609601A (en) * | 1970-01-12 | 1971-09-28 | Collins Radio Co | Monolithic filter having "m" derived characteristics |
US4156214A (en) * | 1977-01-14 | 1979-05-22 | Motorola, Inc. | Multipole resonator |
US5382930A (en) * | 1992-12-21 | 1995-01-17 | Trw Inc. | Monolithic multipole filters made of thin film stacked crystal filters |
Non-Patent Citations (1)
Title |
---|
See also references of EP0922329A4 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019170338A1 (en) * | 2018-03-06 | 2019-09-12 | RF360 Europe GmbH | Rf filter, rf filter component and method of manufacturing an rf filter |
Also Published As
Publication number | Publication date |
---|---|
KR20000068306A (en) | 2000-11-25 |
US5760663A (en) | 1998-06-02 |
AU708019B2 (en) | 1999-07-29 |
AU3586697A (en) | 1998-03-06 |
CA2262977C (en) | 2001-11-06 |
CA2262977A1 (en) | 1998-02-26 |
EP0922329A4 (en) | 2004-09-08 |
KR100321555B1 (en) | 2002-01-23 |
JP2001523405A (en) | 2001-11-20 |
EP0922329A1 (en) | 1999-06-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5760663A (en) | Elliptic baw resonator filter and method of making the same | |
US6404302B1 (en) | Surface acoustic wave filter utilizing a transmission line with phase characteristics that increase filter out of band attenuation | |
US7616079B2 (en) | Bulk acoustic wave resonator and circuit comprising same | |
DE69838195T2 (en) | Filters with stacked thin-film filter structures and thin-film resonators with bulk acoustic waves | |
CN111327288B (en) | Bulk acoustic wave resonator, ultra-narrow band filter, duplexer and multiplexer | |
US20080048804A1 (en) | Coupled lamb wave resonators filter | |
JP4468185B2 (en) | Cavity filter structure with equal resonant frequency | |
US5485131A (en) | Transmission line filter for MIC and MMIC applications | |
EP1402634B1 (en) | Bulk acoustic wave filter | |
JP2006513662A5 (en) | ||
US7791436B2 (en) | Radio frequency filter having coupled transmission lines and an acoustic impedance element | |
US20180041193A1 (en) | Acoustic filtering circuitry including capacitor | |
US20210265979A1 (en) | Filter and multiplexer | |
CN113067561A (en) | Band-stop filter and multi-frequency band-stop filter | |
EP0140462B1 (en) | Temperature compensated capacitor | |
CN115603690B (en) | N77 frequency band miniaturized filter based on IPD technology | |
CN116169975A (en) | Band-stop filter, multiband-stop filter and wireless communication system | |
CN116599493A (en) | Low-pass filter, band-pass filter and multiplexer | |
US3697903A (en) | Equal-resonator piezoelectric ladder filters | |
US20040183626A1 (en) | Electronically tunable block filter with tunable transmission zeros | |
CN113630102A (en) | Acoustic wave filter | |
Dean | Suspended substrate stripline filters for ESM applications | |
CN112910434A (en) | Multiplexer based on high-frequency acoustic wave resonator | |
CN112491384A (en) | FBAR filter circuit | |
Dworsky | A comparison of band pass filter technologies for communications system applications |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AU CA JP KR SG |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 1997932402 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 2262977 Country of ref document: CA Ref country code: CA Ref document number: 2262977 Kind code of ref document: A Format of ref document f/p: F |
|
ENP | Entry into the national phase |
Ref country code: JP Ref document number: 1998 510725 Kind code of ref document: A Format of ref document f/p: F |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1019997001457 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 1997932402 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1019997001457 Country of ref document: KR |
|
WWG | Wipo information: grant in national office |
Ref document number: 1019997001457 Country of ref document: KR |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 1997932402 Country of ref document: EP |