WO1998007902A1 - Method to produce a diamond wire for use in cutting stone materials, and diamond wire produced with said method - Google Patents
Method to produce a diamond wire for use in cutting stone materials, and diamond wire produced with said method Download PDFInfo
- Publication number
- WO1998007902A1 WO1998007902A1 PCT/EP1997/004512 EP9704512W WO9807902A1 WO 1998007902 A1 WO1998007902 A1 WO 1998007902A1 EP 9704512 W EP9704512 W EP 9704512W WO 9807902 A1 WO9807902 A1 WO 9807902A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- diamond
- spring
- pins
- sectors
- wire
- Prior art date
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 108
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 107
- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000005520 cutting process Methods 0.000 title claims abstract description 8
- 239000004575 stone Substances 0.000 title claims abstract description 5
- 239000000463 material Substances 0.000 title abstract description 5
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 37
- 239000010959 steel Substances 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 238000013016 damping Methods 0.000 claims description 4
- 239000013536 elastomeric material Substances 0.000 claims 2
- 238000009413 insulation Methods 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000004033 plastic Substances 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- 125000006850 spacer group Chemical group 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000750 progressive effect Effects 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000001033 granulometry Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 238000010073 coating (rubber) Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000006223 plastic coating Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
- C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
Definitions
- the present invention refers to a method for the production of a diamond wire and of a diamond wire obtained by means of said method, to be used in cutting stone materials
- a diamond v/ire is made of a supporting steel wire, with high resistance and good flexibility, normally with a diameter of about 5 mm, onto which so called “diamond p ns" are inserted and blocked m a suitable way.
- Diamond pins are very small iron rolls having diamond grains or chips fixed on their external surface; the technique used to fix the diamond chips on the pins is normally the so called “electrolytic deposit of diamond” , which consists of forming on the pin surface an attack layer of electrolytic nichel, applying on said layer diamond chips and fixing said chips through electrolytic deposit of a further layer or nichel coating on the pm support, said coating incorporating the diamond chips
- the pins have a diameter of about 10 to 11 mm and are kept reciprocally spaced on the steel wire by the interposition of spring or plastic spacers
- Diamond wires having the above mentioned sizes are properly used in extraction quarries, but are definitely less indicated if used in sawing plants for transforming the blocks in flat or shaped plates or to work thin or thick plates with fretwork machines.
- the diamond w re dimension, that is the diameter of the pins is very important in such types of works: as it can be guessed, the smaller is the diameter of the pins the better is in or ⁇ r to produce reduced quantities of scraps, to cut as sharp as possible, and to absorb the minimum power possible
- a distinction between the most common diamond wires can be made: - 1) diamond wires of the diameter of 10-11 mm with traditional mounting on a steel wire having a diameter of 5 mm, with spring spacers between the diamons p ns, and with the possibility of an easy lmkin ⁇ between various wire sections through special junctions, for example as the ones described in the Italian utility model MI94U 000778 m the name of the same Applicant, opened to public on May 1996, they can be covered in rubber or plastic and their use
- the diamond wires described at points 2) , 3) and 4) are coated with rubber or plastic, so as to assure a longer ] ⁇ fe to the ciamond wire structure and a greater safety Furthermore it would be preferable that, in such cases, there are not unctions, which always represent a critical point, but that the r ng shaped structure - produced with the method of progressive splicing of the various strands composing the steel wire - is completed before its coating with rubber or plastic
- junction method - which can be used either in wires with traditional mounting with springs or spacers, or in wires with plastic or rubber mounting - require nevertheless that the difference between the diameter of the pin and the diameter of the steel wire is large enough to include the junction; therefore the junction will be usually applicable in diamond wires of greater diameter.
- the progressive splicing method can be used only in diamond wires coated with rubber or plastic, where the closed ring of diamond wire do not need to be reopened in order to carry out the cutting. It is therefore clear that, as the dimensional constraint of the junction does not exist, the diameter of the diamond pins can be reduced considerably, for the same dimensions of the steel wire.
- the diamond pins are produced from a steel bar by working on automatic lathe both the profile or external dimensions and the threaded axial bore.
- the threaded bore is necessary in order to ensure the blocking of the diamond pins on the supporting steel wire through the rubber coating injected onto the wire after the mounting of the diamond pins.
- the aim is that to produce very thin diamond wires, it is clear that it has to be reduced at the minimum both the steel wire diameter and, consequently, the external diameter of the steel support pin, which will become a diamond pin after the electrolytic deposit of diamond
- a first object of the present invention is therefore to propose a method to realize, in a more economically and simply way, a diamond wire with a diameter considerably smaller than the ones of the existing wires at present on the market
- a further object cf the present invention is to propose an l moroved diamond wire, with a considerably reduced diameter, obtained bv said method.
- fig. 1 illustrates, partially m section, an initial phase of the diamond wire production method, using a spring with close coils as metal support for tne production of diamond pins according to the presen t invention
- fig. 2 illustrates a second phase, wherein the spring support is divided in different sectors
- fig. 3 illustrates a third phase, wherein a layer of electrolytic deposit is formed on the spring support
- fig. 4 illustrates a fourth phase wherein the formation of the electrolytic deposit produce the fixing of the diamond chips onto the spring support
- fig 5 illustrates the end phase of the electrolytic deposit formation incorporating the diamond chips, fig.
- fig illustrates a phase wherein the spring support is sub j ected to a traction beyond the elasticity limit of the spring itself
- fig. 8 illustrates a phase wherein two spring support sections obtained according to the present invention, are joined together.
- a steel spring 2 with close coils is used as a support for the diamond electrolytic deposit .
- the surface of tne spring 2 is divided into several side-by-side sectors alternately electroconductors and insulated
- insulating bands at regular intervals onto the spring support: by way of example some strips 3 of very plastic insulating tape may be used, which perfectly adhere to the spring support surface.
- Some electroconductive sections 2A are thus defined, where the diamond electrolytic deposit will be formed, alternately to sections 2B covered by strips 3 (fig. 2) and therefore inert from the point of view of the phenomenon of electrolytic deposit The same result could be achieved by applying little elastic rings to the spring support, placed at regular intervals.
- the spring support 2 - possibly mounted onto a little rod 1 forming a temporary supporting electric conductor - is immersed in a bath of nichel salts, and electrically linked to a device for electrolytic deposit (not shown) so as to act as a cathod Then a first phase of cathod reduction starts, with deposit of a nichel base layer on the surface sectors 2A (see fig. 3) This base layer adheres to the spring 2 retaining firmly close the coils wherein sucn adhesion occurs.
- the spring 2 is then immersed m another nichel bath containing also the diamond chips.
- a second nichel layer is then formed on the base layer, which incorporates the diamond chips leaning on the base layer, so as to form a true diamond pin 5 (fig. 4) .
- the spring 2 is immersed again m the electrolytic bath containing nichel salts, and a further superficial nichel layer is formed onto the diamond pins 5, which completes the incorporation of the diamond chips (fig. 5) fixing them tightly to the spring support.
- the spring 2 was formed by a steel wire having a section of 0 2 mm of diameter woun ⁇ in spirals with close coils naving an external diameter of 2 mm and an internal diameter of 1,6 mm, where a steel supporting wire can be passed through, which, as already said, has a diameter of 1,5 mm.
- short section of said support spring 2 are used, for example sections having a length of about 50 cm.
- a first nichel layer is applied on spaced sectors of the external surface of each section, by electrolytic deposit, said layer having a thickness of 0,1 mm., this first layer forms a support base for a further diamond layer of 0,3 - 0,4 mm, using a fairly large granulometry of ⁇ iamon ⁇ pow ⁇ er Therefore altogether a layer of 0,4 - 0,5 mm is formed, to reacn a final diameter of said diamond wire of 2,8 - 3 , 0 mm Using smaller granulometry it might be possible to have even more re ⁇ uced final diameters.
- the spring sections 2 so formed are then inserted on the supporting steel wire, furthermore the end parts of each of said spring section 2, after being mounted on the steel wire, can be jointed at the end parts of contiguous spring sections by simply screwing, as shown m fig. 8, in order to obtain a continuous diamond wire of any desired length
- the whole diamond wire is then slightly axially compressed, so that the spaced spring coils may produce the forseen damping action
- firs t of all, the splicing of tne steel strand is performed, in this compressed condition of the diamond wire, the splicing blocking the spring sections and the diamonc pins m the diamond wire; at the end also the coating with rubber or plastic is made.
- a continuous ring of diamond wire s obtained, said ring having the desired length and an extremely reduced transversal section.
- a spring 2 is used, having a diameter smaller than requested in relation to the diameter of the steel wire l on which diamonds pins are to be mounted.
- This smaller spring 2 is used only as temporary support in the phase of formation of the diamond pins through electrolytic deposit, therefore giving up to insert it onto the supporting wire
- the method remains identical to the one already described, apart from the fact that, once removed the strips 3 of insulating tape, the diamond pins 5 are removed from the same spring 2 unscrewing them from this latter; it is possible to remove said p ns 5 from the spring 2, by an unscrewing action, if the surface of the spring 2, before applying the nickel layer, had been treated with a product inhibiting tne adesion, for example with silicon resin.
- the diamond wire according to the present invention has many advantages, among which a considerable reduction of the power requested for driving the wire, at the same cutting speed, with remarkable saving of energy and plant costs. It is also possible to obtain a cutting speed much greater than the one at present obtainable with the diamond wires of the prior art Furthermore, the dimensions of the diamond wire, much smaller than the wires of the prior art, allows a very reduced production of scraps.
- a thin diamond wire according to the invenetion is particularly suitable to be used for fretworks, wnere there is the necessity to obtain very small bend radiuses.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Springs (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP97941946A EP0935680A1 (en) | 1996-08-21 | 1997-08-19 | Method to produce a diamond wire for use in cutting stone materials, and diamond wire produced with said method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT96MI001772A IT1283819B1 (en) | 1996-08-21 | 1996-08-21 | PROCEDURE FOR THE PRODUCTION OF A DIAMOND WIRE FOR USE IN CUTTING STONE MATERIALS AND DIAMOND WIRE WITH IT PRODUCED |
ITMI96A001772 | 1996-08-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998007902A1 true WO1998007902A1 (en) | 1998-02-26 |
Family
ID=11374811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP1997/004512 WO1998007902A1 (en) | 1996-08-21 | 1997-08-19 | Method to produce a diamond wire for use in cutting stone materials, and diamond wire produced with said method |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0935680A1 (en) |
IT (1) | IT1283819B1 (en) |
WO (1) | WO1998007902A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002040207A1 (en) * | 2000-11-17 | 2002-05-23 | Schrittwieser, Robert | Cutting wire |
ITMI20092352A1 (en) * | 2009-12-30 | 2011-06-30 | Diamond Pauber Srl | MONOLITHIC DIAMOND BELL AND RELATED ASSEMBLY |
CN103173841A (en) * | 2013-04-09 | 2013-06-26 | 何建久 | Method and device for fabricating self-rotating diamond wire saw |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2545956C2 (en) * | 2012-01-13 | 2015-04-10 | Общество с ограниченной ответственностью "Объединенные Беспроводные Технологии" | Production of diamond-abrasive wire |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3150470A (en) * | 1961-08-11 | 1964-09-29 | Lee H Barron | Diamond coated wire saw |
EP0185091A1 (en) * | 1984-06-25 | 1986-06-25 | Funasaw Co., Ltd. | Method for electrodeposition of metal and granular abrasive on a tool |
WO1988007427A1 (en) * | 1987-03-24 | 1988-10-06 | Mvz Maschinenbau Und Verzahnungstechnik Johannes F | Sawing tool |
-
1996
- 1996-08-21 IT IT96MI001772A patent/IT1283819B1/en active IP Right Grant
-
1997
- 1997-08-19 EP EP97941946A patent/EP0935680A1/en not_active Withdrawn
- 1997-08-19 WO PCT/EP1997/004512 patent/WO1998007902A1/en not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3150470A (en) * | 1961-08-11 | 1964-09-29 | Lee H Barron | Diamond coated wire saw |
EP0185091A1 (en) * | 1984-06-25 | 1986-06-25 | Funasaw Co., Ltd. | Method for electrodeposition of metal and granular abrasive on a tool |
WO1988007427A1 (en) * | 1987-03-24 | 1988-10-06 | Mvz Maschinenbau Und Verzahnungstechnik Johannes F | Sawing tool |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002040207A1 (en) * | 2000-11-17 | 2002-05-23 | Schrittwieser, Robert | Cutting wire |
ITMI20092352A1 (en) * | 2009-12-30 | 2011-06-30 | Diamond Pauber Srl | MONOLITHIC DIAMOND BELL AND RELATED ASSEMBLY |
CN103173841A (en) * | 2013-04-09 | 2013-06-26 | 何建久 | Method and device for fabricating self-rotating diamond wire saw |
Also Published As
Publication number | Publication date |
---|---|
ITMI961772A0 (en) | 1996-08-21 |
ITMI961772A1 (en) | 1998-02-21 |
IT1283819B1 (en) | 1998-04-30 |
EP0935680A1 (en) | 1999-08-18 |
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