WO1998001906A1 - Support lateral flottant pour extremites d'elements d'interconnexion allonges - Google Patents

Support lateral flottant pour extremites d'elements d'interconnexion allonges Download PDF

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Publication number
WO1998001906A1
WO1998001906A1 PCT/US1997/012541 US9712541W WO9801906A1 WO 1998001906 A1 WO1998001906 A1 WO 1998001906A1 US 9712541 W US9712541 W US 9712541W WO 9801906 A1 WO9801906 A1 WO 9801906A1
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WO
WIPO (PCT)
Prior art keywords
interconnection elements
elongate
lateral support
elements
elongate interconnection
Prior art date
Application number
PCT/US1997/012541
Other languages
English (en)
Inventor
Igor Y. Khandros
Benjamin N. Eldridge
Gaetan L. Mathieu
Sheldon A. Taylor
Original Assignee
Formfactor, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/788,740 external-priority patent/US5994152A/en
Priority claimed from PCT/US1997/008606 external-priority patent/WO1997043653A1/fr
Application filed by Formfactor, Inc. filed Critical Formfactor, Inc.
Priority to AU36034/97A priority Critical patent/AU3603497A/en
Publication of WO1998001906A1 publication Critical patent/WO1998001906A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Definitions

  • the present invention relates to interconnection elements for connecting to microelectronic components and, more particularly to interconnection elements which are elongate and which have free ends for making a connection with terminals of the microelectronic components.
  • interconnections between electronic components can be classified into the two broad categories of “relatively permanent” and “readily demountable”.
  • a “relatively permanent” connection is a solder joint. Once two electronic components are soldered to one another, a process of unsoldering must be used to separate the components.
  • a wire bond such as between a semiconductor die and inner leads of a semiconductor package (or inner ends of leadframe fingers) is another example of a “relatively permanent" connection.
  • An example of a "readily demountable" connection is rigid pins of one electronic component being received by resilient socket elements of another electronic component .
  • interconnection elements which themselves are resilient (springy) or are mounted in or on a springy medium.
  • these resilient interconnection elements are also elongate.
  • An example of an elongate spring contact element is a tungsten needle of a probe card component .
  • Such spring contact elements are intended to effect temporary pressure connections between a component (e.g., a printed circuit board) to which they are mounted (affixed) and terminals of another component, such as bond pads of a semiconductor device under test (DUT) .
  • a certain minimum contact force is desired to effect reliable pressure contact to electronic components (e.g. , to terminals on electronic components) .
  • a contact (load) force of approximately 15 grams (including as little as
  • a space transformer is a multilayer interconnection substrate having terminals disposed at a first pitch on a one surface thereof and having corresponding terminals disposed at a second pitch on an opposite surface thereof, and is used to effect "pitch-spreading" from the first pitch to the second pitch.
  • the free ends (tips) of the elongate spring contact elements make pressure connections with corresponding terminals on an electronic component being probed (e.g., tested) .
  • elongate resilient (spring) interconnect elements can suitably be used to make pressure connections to terminals of electronic components such as semiconductor devices.
  • the contact force resulting from a pressure connection is generally longitudinal (reacted along the length of the elongate interconnection element) .
  • each spring contact element has the ability to "survive” (react) a modest amount of lateral force, springing back to its original shape when the force is removed, when that modest amount of lateral force is exceeded, the spring contact element may permanently become deformed and damaged.
  • a "floating lateral support” is a relatively rigid planar member having a plurality (e.g., four hundred) of holes through which the free ends of a corresponding plurality of elongate interconnection elements extend.
  • This arrangement permits a small (constrained) amount of independent lateral deflection for each interconnection element .
  • an individual interconnection element exceeds the permitted amount of lateral deflection, it "bumps" into the sidewall of the respective hole in the floating lateral support through which it extends, and further lateral deflection of that interconnection element is resisted by the floating lateral support coming into contact with the remaining (e.g., three hundred ninety nine) interconnection elements. In this manner, further deformation of the laterally-deflected interconnection element is prevented.
  • the floating lateral support of the present invention is a planar member, is preferably substantially rigid, and is suitably made of an insulating material such as ceramic or polyimide (e.g., kapton-tm or upilex-tm) , thermoplastic, liquid crystal polymer, or of conductive materials such as steel or molybdenum overcoated with an insulating material. Molybdenum is favored for applications where its coefficient of thermal expansion is relevant, such as in semiconductor applications.
  • the holes through the floating lateral support are preferably elongate, having a larger dimension in a direction wherein, in use, it is anticipated that the elongate interconnection elements extending through the holes in the floating lateral support will be subjected to lateral deflection. However, if a 'preferred' direction (orientation) cannot be ascertained, the holes through the lateral support may be circular (round) . Typically, the cross-section of an elongate interconnection element is circular (round) .
  • the interconnection elements are elongate, have a length of 20-100 mils, and have a diameter of 1-4 mils; and the holes in the floating lateral support are 2-20 mils larger in diameter than the diameter of the interconnection elements. If the holes through the floating lateral support are elongate rather than round, they suitably may be 2 mils larger than the diameter of the interconnection element in a one direction, and 20 mils larger than the diameter of the interconnection element in a second direction orthogonal to the first direction, the second direction being the direction in which it is expected that individual interconnection elements may be subjected to potentially-damaging lateral deflection.
  • additional openings can be provided through the lateral support to permit access to the surface of the electronic component to which the elongate interconnection elements are mounted, such as for mounting discrete components to its surface with the lateral support in place.
  • the element 199 may be similar in many respects to the element 299 in another figure. Also, often, similar elements are referred to with similar numbers in a single drawing. For example, a plurality of elements 199 may be referred to as 199a, 199b, 199c, etc.
  • Figure 1A is a perspective view of an assembly of a plurality of elongate interconnection elements mounted to an electronic component .
  • Figure IB is a side view of the electronic assembly illustrated in Figure 1A.
  • Figure 1C is a side view of the electronic assembly of Figure 1A, in use, making a number of touchdowns upon (pressure connections to) another electronic component.
  • Figure 2A is a side view, comparable to the side view of Figure IB, of an electronic assembly of the present invention.
  • Figure 2B is a top view of the electronic assembly of Figure 2A .
  • Figure 2C is a partial side view of an electronic assembly, comparable to that of Figure 2A, wherein the free ends of the elongate interconnection elements have contact tip structures joined thereto, according to an alternate embodiment of the present invention.
  • Figure 3 is a side view of an electronic assembly, comparable to that of Figure 2A, illustrating an additional component, according to an alternate embodiment of the invention.
  • Figure 1A is a perspective view of a portion of an electronic assembly 100 having a plurality (four of many shown) of elongate interconnection elements 102 extending from a like plurality of terminals 104 on a surface of an electronic component 106.
  • the electronic component may be the space transformer component of the probe card assembly described in the aforementioned PCT/US95/14844.
  • the elongate interconnection elements may be the composite interconnection elements of the aforementioned PCT/US95/14909.
  • the present invention is not limited to this particular electronic component or to this particular elongate interconnection element. In most cases, however, the elongate interconnection elements will be resilient (spring) contact elements, such as are used to establish temporary pressure connections to terminals (not shown) of other electronic components.
  • Figure IB is a side view of the electronic assembly 100 of
  • each elongate interconnection element 102 is affixed by its base end 102a to a corresponding terminal 104, and has a free end 102b distal from the base end.
  • Figure 1C illustrates the electronic assembly 100 in an exemplary use of making a sequence (series) of pressure connections to sets of terminals on another electronic component 110.
  • the free ends (102b) of the elongate interconnection elements 102 contact a first set of terminals 112a on the semiconductor wafer 110, such as the bond pads of a single die 110a on the semiconductor wafer 110.
  • the assembly 100 and the wafer 110 are brought together, resulting in longitudinal contact forces being reacted by the interconnection elements.
  • the assembly 100 is then shifted to the right (as viewed) relative to the wafer 110 (or vice-versa) to make a subsequent touchdown.
  • the free ends (102b) of the elongate interconnection elements 102 contact a second set of terminals 112b on the semiconductor wafer 110, such as the bond pads of another (e.g., adjacent) single die 110b on the semiconductor wafer 110.
  • the assembly 100 is then shifted to the right (as viewed) relative to the wafer 110 (or vice-versa) to make a subsequent touchdown.
  • a third position of the assembly 100 (shown in solid lines as 100c) , representative of a subsequent touchdown, the free ends (102b) of a portion of the elongate interconnection elements 102 are off of the edge of the semiconductor wafer 100. This is indicative of a situation wherein the elongate interconnection elements 102 can be damaged by lateral (across the page, as viewed) , a problem which is addressed by the present invention.
  • the lateral deflection situation includes the problem of the electronic assembly (100) or a portion thereof "stepping off" the edge of a semiconductor wafer.
  • FIG. 1A is a side view, partially in cross-section, showing an assembly 200 (compare 100) of a floating lateral support element 220 in conjunction with a plurality (two of many shown) of elongate interconnection elements 202 (compare 102).
  • the interconnection elements 202 each have two ends, a proximal end 202a (compare 102a) and a distal "free" end 202b (compare 102b) , and may optionally be mounted at their proximal ends 202a to a substrate (e.g., to a terminal of an electronic component) 206 (compare 106) .
  • the distal ends 202b of the interconnection elements extend through respective holes 208 in a floating lateral support element 220. As illustrated, the ends 202b of the interconnection elements 202 protrude through the lateral support element 220 so that they can effect pressure connections to terminals of electronic components (compare Figure 1C) .
  • Figure 2B is a top view of the assembly 200 of Figure 2A, showing a plurality (four of many) of elongate interconnection elements 212a, 212b, 212c and 212d (compare 202) extending through a corresponding plurality of holes 218a, 218b, 218c and 218d (compare 208) in the floating lateral support member 220.
  • the interconnection elements (102, 202) are typically resilient (spring) contact structures which may be either composite interconnection elements or monolithic interconnection elements, and are generally intended to make pressure connections to terminals (not shown) of electronic components (not shown) .
  • the general direction of the desired pressure connection force would be into the page as viewed in Figure 2B (i.e., along the length/longitude of the interconnection element) , or vertically downward onto the ends (202b) of the interconnection elements as viewed in Figure 2A.
  • the interconnection elements are intended to react longitudinal forces, and may become damaged if they are subjected to excessive transverse (lateral) forces.
  • the interconnection element 212a has been subjected to a lateral force, thereby becoming displaced (to the left, as viewed in the figure) to the position shown in dashed lines.
  • the interconnection element contacts the bore (sidewall) of the corresponding hole 218a.
  • Such a lateral force may, as mentioned hereinabove, result from the entire plurality of interconnection elements being brought into contact with an electronic component (not shown, compare 110) having an edge, such as the edge of a semiconductor wafer. This would be likely to occur in the case of a multiple memory chip probe, where a portion of the probe would inevitably "step off" an edge of the wafer.
  • a lateral force when a lateral force is applied to a selected one or more of the interconnection elements, they behave as individuals, allowing the lateral support to move ("float") with the interconnection element (212a) being deflected laterally, until the lateral force reaches a threshold, at which position of the floating lateral support member (220) the plurality of interconnection elements behave as a group .
  • the lateral support member of the present invention thus helps prevent damage to elongate interconnection elements resulting from lateral forces.
  • the floating lateral support member 220 is relatively rigid, made of any suitable insulating material such as ceramic or polyimide (e.g., kapton-tm or upilex-tm) , thermoplastic, liquid crystal polymer, or of conductive materials such as steel or molybdenum overcoated with an insulating material . Molybdenum is favored for applications where its coefficient of thermal expansion is relevant, such as in semiconductor applications .
  • a plurality of contact tip structures are pre-fabricated on a sacrificial substrate and are joined to ends of a corresponding plurality of interconnection elements.
  • a plurality of tip structures 230 can be joined (such as by brazing) to the distal (free) ends 202b of the interconnection elements 202 after the floating lateral support member 220 has been placed over the free ends.
  • pre-fabricating tip structures for joining to ends of interconnection elements can be found in the aforementioned PCT/US96/08107.
  • the tip structures can be caused to have surface textures (e.g., surface roughness and shape) specifically adapted to the terminal metallurgy of the electronic component (s) ;
  • the tip structures can have a metallurgy which is entirely dissimilar from that of the interconnection elements to which they are mounted;
  • the tip structures can be accurately located with respect to one another, thereby relaxing constraints on the accurate relative position of the ends of the interconnection elements to which they are joined;
  • the tip structures can be of a larger cross-dimension (e.g., diameter) than the interconnection elements to which they are joined.
  • the contact tip structures 230 are preferably of a larger diameter than the holes (208) through the lateral support member 220 and would thus necessarily be joined to the free ends 202b of the elongate interconnection elements 202 after the floating lateral support component 220 is "installed" over the free ends 202b of the interconnection elements 202. In this manner, an additional advantage of the contact tip structures 230 is in preventing the floating lateral support component 220 from being removed from or from sliding off of the ends 202b of elongate interconnection elements 202.
  • interconnection elements may be composite interconnection elements or monolithic interconnection elements, including tungsten needles .
  • additional openings 240 can be provided in the floating lateral support member 220 so that after the floating lateral support member is in place, additional discrete components such as resistors or capacitors (not shown) can be inserted through the floating lateral support member 220 and mounted (e.g., soldered) to terminals (not shown) onto the surface of the component (see 206, Figure 2A) to which the elongate interconnection elements 202 are mounted.
  • additional discrete components such as resistors or capacitors (not shown) can be inserted through the floating lateral support member 220 and mounted (e.g., soldered) to terminals (not shown) onto the surface of the component (see 206, Figure 2A) to which the elongate interconnection elements 202 are mounted.
  • Figure 3 illustrates another embodiment of the invention wherein the assembly 300 includes a plurality (two of many shown) of elongate interconnection elements 302 (compare 202) extending from a surface of an electronic component 306 (compare 206) , each having a free end 302b (compare 202b) extending through a corresponding hole 308 (compare 208) in a floating lateral support member 320 (compare 220) .
  • the assembly 300 is provided with a mechanical rigid stop mechanism 330.
  • the stop mechanism 330 is suitably in the form of a square ring affixed to the top (as viewed in the figure) surface of the electronic component 306.
  • the stop mechanism 330 has an inner dimension (ID) which is greater than the outer (peripheral) dimension of the floating lateral support 320, for example 20- 50 mils greater, resulting in a lateral gap 332 of controlled dimension between the edge (periphery) of the floating lateral support 320 and the stop mechanism 330.
  • the stop mechanism is suitably made of a rigid insulating material, or may be a metallic ring which may or may not be insulated, and extends above the top surface of the component to a height which is less than the height of the interconnection elements 302, for example 10-25 mils less so that the interconnection elements can compress longitudinally when the assembly 300 is being urged against another electronic component (compare Figure 1C) .
  • a one of the two illustrated interconnection elements 302 were to become laterally-deflected, it would deflect laterally and engage the sidewall of the corresponding hole 308 through the lateral support member 320.
  • the remaining holes 308 in the lateral support member 320 would contact the remaining interconnection elements 302, which would resist (but not absolutely prevent) further lateral deflection of the support member and the interconnection element.
  • the lateral support member 320 would contact the stop mechanism 330 which would prevent any further lateral deflection.
  • the remaining interconnection elements 302 resist lateral displacement of the floating lateral support 320, and the stop mechanism 330 prevents further (excessive) lateral displacement of the floating lateral support 320.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

L'invention concerne des extrémités (202b) d'éléments d'interconnexion allongés, tels que des éléments de contact à ressort (202), assurant des connexions par pression aux bornes de composants électroniques comme des dispositifs à semi-conducteurs résidant sur une pastille de semi-conducteurs. Ces extrémités sont protégées contre les effets indésirables de forces latérales par un élément de support latéral 'flottant' (220). Ce support (220) est un élément plan qui présente plusieurs trous (208) à travers lesquels s'étendent les extrémités libres (202b) des éléments d'interconnexion allongés (202) et assure une faible déflexion latérale indépendante pour chaque élément d'interconnexion (202). Lorsqu'un élément d'interconnexion individuel (212a) excède la déflexion latérale autorisée, il 'heurte' la paroi latérale du trou correspondant dans le support latéral flottant (220) à travers lequel il s'étend. En outre, toute autre déflexion latérale de l'élément d'interconnexion se voit opposer une résistance par le support latéral flottant (220) qui se déplace latéralement avec l'élément d'interconnexion défléchi dans le sens latéral (212a) et entre en contact avec les éléments d'interconnexion restants '212b, 212c, 212d). Ce processus permet de restreindre tout autre mouvement latéral de l'élément d'interconnexion défléchi dans le sens latéral (212a). Tout autre déplacement latéral est bloqué par un mécanisme d'arrêt indépendant (330) placé à la périphérie du support latéral flottant (320).
PCT/US1997/012541 1996-07-05 1997-07-03 Support lateral flottant pour extremites d'elements d'interconnexion allonges WO1998001906A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU36034/97A AU3603497A (en) 1996-07-05 1997-07-03 Floating lateral support for ends of elongate interconnection elements

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
US2166796P 1996-07-05 1996-07-05
US60/021,667 1996-07-05
US2440596P 1996-08-22 1996-08-22
US60/024,405 1996-08-22
US08/788,740 1997-01-24
US08/788,740 US5994152A (en) 1996-02-21 1997-01-24 Fabricating interconnects and tips using sacrificial substrates
US77902097A 1997-02-10 1997-02-10
US08/779,020 1997-02-10
US81946497A 1997-03-17 1997-03-17
US08/819,464 1997-03-17
US82498897A 1997-03-27 1997-03-27
US08/824,988 1997-03-27
USPCT/US97/08606 1997-05-15
PCT/US1997/008606 WO1997043653A1 (fr) 1996-05-17 1997-05-15 Structures a pointes de contact pour elements d'interconnexion micro-electroniques et procedes de fabrication correspondant

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WO1998001906A1 true WO1998001906A1 (fr) 1998-01-15

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PCT/US1997/012541 WO1998001906A1 (fr) 1996-07-05 1997-07-03 Support lateral flottant pour extremites d'elements d'interconnexion allonges

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WO (1) WO1998001906A1 (fr)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1111397A2 (fr) * 1999-12-21 2001-06-27 Infineon Technologies AG Dispositif pour tester des pouces avec un circuit intégré
US6525555B1 (en) 1993-11-16 2003-02-25 Formfactor, Inc. Wafer-level burn-in and test
US6534856B1 (en) 1997-06-30 2003-03-18 Formfactor, Inc. Sockets for “springed” semiconductor devices
US6627483B2 (en) 1998-12-04 2003-09-30 Formfactor, Inc. Method for mounting an electronic component
US6705876B2 (en) 1998-07-13 2004-03-16 Formfactor, Inc. Electrical interconnect assemblies and methods
US7064566B2 (en) 1993-11-16 2006-06-20 Formfactor, Inc. Probe card assembly and kit
EP1548450A3 (fr) * 1999-08-19 2006-07-26 Fujitsu Limited Carte à sondes et procédé de test d'une plaquette semiconductrice pourvue d'une pluralité de dispositifs semiconducteurs
EP0925510B1 (fr) * 1996-09-13 2007-04-11 International Business Machines Corporation Sonde souple integree de test et de deverminage a l'echelle d'une tranche
US7944225B2 (en) 2008-09-26 2011-05-17 Formfactor, Inc. Method and apparatus for providing a tester integrated circuit for testing a semiconductor device under test
US8872534B2 (en) 2007-09-27 2014-10-28 Formfactor, Inc. Method and apparatus for testing devices using serially controlled intelligent switches
US9087649B2 (en) 2012-08-22 2015-07-21 Bae Systems Controls Inc. Very low inductance distributed capacitive filter assembly
CN107580680A (zh) * 2015-03-13 2018-01-12 泰克诺探头公司 用于测试头的接触探针
CN109283371A (zh) * 2017-07-21 2019-01-29 中华精测科技股份有限公司 探针装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH661129A5 (de) * 1982-10-21 1987-06-30 Feinmetall Gmbh Kontaktiervorrichtung.
DE4236822A1 (fr) * 1991-11-01 1993-05-06 The Whitaker Corp., Wilmington, Del., Us
US5517126A (en) * 1993-03-18 1996-05-14 Tokyo Electron Limited Probe apparatus
WO1996015551A1 (fr) * 1994-11-15 1996-05-23 Formfactor, Inc. Montage de composants electroniques sur une carte a circuits imprimees

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH661129A5 (de) * 1982-10-21 1987-06-30 Feinmetall Gmbh Kontaktiervorrichtung.
DE4236822A1 (fr) * 1991-11-01 1993-05-06 The Whitaker Corp., Wilmington, Del., Us
US5517126A (en) * 1993-03-18 1996-05-14 Tokyo Electron Limited Probe apparatus
WO1996015551A1 (fr) * 1994-11-15 1996-05-23 Formfactor, Inc. Montage de composants electroniques sur une carte a circuits imprimees
WO1996015458A1 (fr) * 1994-11-15 1996-05-23 Formfactor, Inc. Kit et ensemble carte de controle, et leurs procedes d'utilisation

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"Pinless Module Connector System", RESEARCH DISCLOSURE, no. 286, February 1988 (1988-02-01), HAVANT GB, pages 86, XP002040698 *

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7345493B2 (en) 1993-11-16 2008-03-18 Formfactor, Inc. Wafer-level burn-in and test
US7064566B2 (en) 1993-11-16 2006-06-20 Formfactor, Inc. Probe card assembly and kit
US6525555B1 (en) 1993-11-16 2003-02-25 Formfactor, Inc. Wafer-level burn-in and test
US7078926B2 (en) 1993-11-16 2006-07-18 Formfactor, Inc. Wafer-level burn-in and test
US6788094B2 (en) 1993-11-16 2004-09-07 Formfactor, Inc. Wafer-level burn-in and test
EP0925510B1 (fr) * 1996-09-13 2007-04-11 International Business Machines Corporation Sonde souple integree de test et de deverminage a l'echelle d'une tranche
US7059047B2 (en) 1997-06-30 2006-06-13 Formfactor, Inc. Sockets for “springed” semiconductor devices
US6642625B2 (en) 1997-06-30 2003-11-04 Formfactor, Inc. Sockets for “springed” semiconductor devices
US6534856B1 (en) 1997-06-30 2003-03-18 Formfactor, Inc. Sockets for “springed” semiconductor devices
US7618281B2 (en) 1998-07-13 2009-11-17 Formfactor, Inc. Interconnect assemblies and methods
US6705876B2 (en) 1998-07-13 2004-03-16 Formfactor, Inc. Electrical interconnect assemblies and methods
US6948941B2 (en) 1998-07-13 2005-09-27 Formfactor, Inc. Interconnect assemblies and methods
US7169646B2 (en) 1998-07-13 2007-01-30 Formfactor, Inc. Interconnect assemblies and methods
US6627483B2 (en) 1998-12-04 2003-09-30 Formfactor, Inc. Method for mounting an electronic component
US6887723B1 (en) 1998-12-04 2005-05-03 Formfactor, Inc. Method for processing an integrated circuit including placing dice into a carrier and testing
US6644982B1 (en) 1998-12-04 2003-11-11 Formfactor, Inc. Method and apparatus for the transport and tracking of an electronic component
US7217580B2 (en) 1998-12-04 2007-05-15 Formfactor Inc. Method for processing an integrated circuit
EP1548450A3 (fr) * 1999-08-19 2006-07-26 Fujitsu Limited Carte à sondes et procédé de test d'une plaquette semiconductrice pourvue d'une pluralité de dispositifs semiconducteurs
EP1111397A2 (fr) * 1999-12-21 2001-06-27 Infineon Technologies AG Dispositif pour tester des pouces avec un circuit intégré
EP1111397B1 (fr) * 1999-12-21 2005-10-26 Infineon Technologies AG Dispositif pour tester des pouces avec un circuit intégré
US8872534B2 (en) 2007-09-27 2014-10-28 Formfactor, Inc. Method and apparatus for testing devices using serially controlled intelligent switches
US7944225B2 (en) 2008-09-26 2011-05-17 Formfactor, Inc. Method and apparatus for providing a tester integrated circuit for testing a semiconductor device under test
US9087649B2 (en) 2012-08-22 2015-07-21 Bae Systems Controls Inc. Very low inductance distributed capacitive filter assembly
CN107580680A (zh) * 2015-03-13 2018-01-12 泰克诺探头公司 用于测试头的接触探针
CN109283371A (zh) * 2017-07-21 2019-01-29 中华精测科技股份有限公司 探针装置

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