WO1997036335A1 - Radiation-emitting semiconductor diode having a separate confinement layer comprising a semiconductor material with at most 30 % aluminum or a semiconductor material free of aluminum - Google Patents
Radiation-emitting semiconductor diode having a separate confinement layer comprising a semiconductor material with at most 30 % aluminum or a semiconductor material free of aluminum Download PDFInfo
- Publication number
- WO1997036335A1 WO1997036335A1 PCT/IB1997/000253 IB9700253W WO9736335A1 WO 1997036335 A1 WO1997036335 A1 WO 1997036335A1 IB 9700253 W IB9700253 W IB 9700253W WO 9736335 A1 WO9736335 A1 WO 9736335A1
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- Prior art keywords
- layer
- diode
- aluminum
- separate confinement
- radiation
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 58
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 41
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 239000000463 material Substances 0.000 title claims abstract description 40
- 238000005253 cladding Methods 0.000 claims abstract description 58
- 125000005842 heteroatom Chemical group 0.000 claims abstract description 7
- 238000004519 manufacturing process Methods 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 21
- 230000004888 barrier function Effects 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 230000005670 electromagnetic radiation Effects 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052760 oxygen Inorganic materials 0.000 abstract description 7
- 239000001301 oxygen Substances 0.000 abstract description 7
- 230000015556 catabolic process Effects 0.000 abstract description 5
- 238000006731 degradation reaction Methods 0.000 abstract description 5
- 230000004048 modification Effects 0.000 description 17
- 238000012986 modification Methods 0.000 description 17
- 239000000203 mixture Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000000927 vapour-phase epitaxy Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000004943 liquid phase epitaxy Methods 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34313—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/3434—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer comprising at least both As and P as V-compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/3409—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers special GRINSCH structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34306—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength longer than 1000nm, e.g. InP based 1300 and 1500nm lasers
Definitions
- Ra ⁇ .ation-err tting semiconductor diode having a separate confinement layer comprising a semiconductor material with at most 30% aluminum or a semiconductor material free of aluminum.
- the invention relates to a radiation-emitting semiconductor diode, in particular a laser (amplifier) diode, comprising a semiconductor body with a semiconductor substrate of a first conductivity type on which a semiconductor layer structure is present which comprises in that order a first cladding layer of InP and of the first conductivity type, an active layer, a second cladding layer of InP and of a second conductivity type opposed to the first, and at least one separate confinement layer situated between the active layer and the first or second cladding layer, while the substrate and the second cladding layer are provided with electrical connections such that, given a sufficient current strength in the forward direction across a pn junction formed between the first and the second cladding layer and within a strip-shaped active region of the active layer, radiation can be generated whose wavelength is greater than or equal to 1 ⁇ m, and in which semiconductor body a strip-shaped region is present which comprises at least the second cladding layer, the separate confinement layer, and the active layer and which is bounded on either side by
- the invention also relates to a method of manufacturing such a diode.
- a diode is used inter alia as a transmitter or amplifier in systems for optical glass fiber communication.
- the emission/amplification wavelength often lies between 1.3 and 1.6 ⁇ m.
- Such a diode is known from "Novel etching technique for a buried heterostructure GalnAs/AlGalnAs quantum-well laser diode" by A. Kasukawa et al., published in Appl. Phys. Lett. 59(11), 9 September 1991 , pp. 1269-1271.
- This relates to a so-called SIPBH (Semi-Insulating Planar Buried Hetero) diode with InP cladding layers and an active layer of GalnAs/AlGalnAs on an InP substrate.
- a strip-shaped region of the diode here comprises the upper cladding layer, the active layer, and two separate confinement layers adjoining the latter.
- the strip-shaped region is bounded on either side by an InP current-blocking layer.
- a diode of the buried hetero type has particularly attractive properties such as a low starting current, a stable lateral modus, a substantially circular-symmetrical radiation beam, and a low parasitic capacitance.
- Gal nAs(P) /AIGalnAs for the active layer has the important advantage over the alternative GaInAs(P)/GaInAsP that the jump in the conduction band is much greater, which gives the diode a particularly high efficiency and a low starting current, while the latter quantity in addition increases little with an increase in temperature.
- a disadvantage of the known diode is that its starting current rises comparatively strongly in time. This renders the diode unsuitable for use in an optical communication system because a useful life of, for example, 20 to 25 years is required for this, whereas the known diode shows an inadmissible increase in the starting current after 500 to 1,000 hours already.
- the present invention has for its object inter alia to provide a radiation- emitting semiconductor diode which does not have the above disadvantage, or at least to a much lesser degree, and which accordingly shows no or substantially no increase in the starting current in time.
- a radiation-emitting semiconductor diode of the kind mentioned in the opening paragraph is for this purpose characterized in that the separate confinement layer comprises an aluminum-containing semiconductor material with at most 30% aluminum, and preferably at most 20% aluminum, or an aluminum-free semiconductor material.
- the invention is based inter alia on the surprising recognition that the increase in the starting current is caused by degradation of the diode owing to the presence of oxygen-containing material at the lateral side of the strip-shaped region contiguous to the third cladding layer.
- oxygen-containing material is formed at the area of a side face of the separate cladding layer upon exposure to the atmosphere after the strip- shaped region has been formed and before the third cladding layer is provided.
- the presence of aluminum plays a part in the formation of said oxygen-containing material.
- the oxide formed cannot be reduced at a temperature at which the diode is manufactured or to which the diode can be exposed without damage.
- the aluminum content of an aluminum-containing material of the separate confinement layer is limited to a maximum of 30%, and preferably to a maximum of 20%, according to the invention, it is found that a sufficiently small quantity of the oxygen-containing material is formed in general, at least so small that it causes no or at least substantially no degradation.
- a diode according to the invention has a particularly long life and is particularly suitable for use in a system for optical communication.
- the separate confinement layer comprises AIGalnAs.
- the separate confinement layer can be manufactured from one and the same material.
- the composition of such a material may be varied in that the concentration of exclusively the group III elements is varied. This can be better controlled than a variation of the concentrations of both the group III elements and the group V elements.
- the separate confinement layer may have a constant aluminum content which is the same as or greater than that of the active layer or - in the case of a MQW active layer - the barrier layers thereof. It is also possible, indeed favorable, for the aluminum content of the separate confinement layer to show a gradient in its thickness direction.
- the maximum aluminum content must comply with the condition as defined according to the invention.
- the bandgap for InP-matching AIGalnAs with 30% aluminum is 1.20 eV, corresponding to Al 0 30 Ga o .gltio jjAs, while for 20% the bandgap is 1.06 eV, corresponding to lo.2 ⁇ Gao .2 8 'fl ⁇ 52 AS.
- the separate confinement layer comprises GalnAsP. With this aluminum-free material, the separate confinement layer can have a bandgap between 0.80 eV (Gao 42 Ino 5gAso.90Po. 1 0) a °d 1.35 eV (InP).
- the degradation of a diode according to this modification is very small and its life is long thanks to the fact that the separate confinement layer is free from aluminum.
- the separate confinement layer may alternatively be built up from various sub-layers of different materials, for example AIGalnAs and GalnAsP. It is also possible to vary the composition within a material. This means that bandgap and refractive index may show gradients within the separate confinement layer.
- the separate confinement layer has a bandgap and refractive index which lie between those of the active layer and of the first or second cladding layer.
- the optical confinement then extends - in contrast to the electrical confinement - (mainly) in the separate confinement layers (and a small portion of the cladding layers).
- the efficiency of the diode is very high, the starting current very low, and its useful life very long. The latter effects are strongest in the case of a bandgap gradient: low adjacent the active layer and high adjacent the cladding layer.
- the quantum well layers then preferably comprise GalnAs or GalnAsP and the barrier layers AIGalnAs.
- the latter layers are also subject to the condition that the aluminum content must not be higher than 30% , and preferably not higher than 20%.
- a usual emission wavelength lies between 1.3 and 1.6 ⁇ m, which implies that the aluminum content of the barrier layer will (have to) be lower than 20%.
- the substrate of the diode according to the invention preferably comprises
- the substrate may alternatively be, for example, of Si.
- the third cladding layer is current-blocking and comprises semi- insulating (Fe-doped) InP, or comprises a number of layers alternately of p-InP and n-InP which during operation form current-blocking pn junctions.
- the diode according to the invention preferably is a laser diode of the buried hetero type in which the strip-shaped region also comprises the first cladding layer and/or part of the substrate.
- a diode according to the invention is obtained by such a method in a simple manner.
- the strip-shaped region is formed, preferably by etching, after at least the first cladding layer, the active layer, and the second cladding layer have been provided in a first growing process, whereupon the third cladding layer is provided in a second growing process.
- FIG. 1 diagrammatically and in perspective view shows an embodiment of a radiation-emitting semiconductor diode according to the invention
- Fig. 2 is a diagram showing the conduction band as a function of the thickness in a portion of the layers of a first modification of the diode of Fig. 1 ,
- Fig. 3 is a diagram showing the conduction band as a function of the thickness in a portion of the layers of a second modification of the diode of Fig. 1 , and
- Figs. 4 and 5 diagrammatically show the diode of Fig. 1 in consecutive stages of its manufacture by a method according to the invention.
- Fig. 1 diagrammatically and in perspective view shows an embodiment of a radiation-emitting semiconductor diode according to the invention.
- Figs. 2 and 3 are diagrams showing the conduction band as a function of the thickness in a portion 20 of the layers of a first and a second modification, respectively, of the diode of Fig. 1.
- the diode in this example is a diode laser and will be mostly referred to as diode for short hereinafter.
- the diode comprises a semiconductor body 10 with a substrate 11 , here made of InP, and of a first, here the n conductivity type, provided with a metal layer 7, on which substrate a semiconductor layer structure is present with an active layer 2 situated between a first and a second InP cladding layer 1 , 3 and having a pn junction, here between the cladding layers 1 , 3 which are of the first, accordingly the n conductivity type and of a second conductivity type opposed to the first, so the p type.
- the first cladding layer 1 in this example forms part of the substrate 11.
- the pn junction is capable of generating electromagnetic radiation with a wavelength greater than 1 ⁇ m within a strip-shaped active region 2A of the active layer 2 which forms part of a strip- shaped region 30 of the semiconductor body 10 which also comprises the second cladding layer 3, and here also the first cladding layer 1 , and which is surrounded by a current- blocking third cladding layer 5 of Fe-doped InP.
- the diode is provided with two end faces 50, 51 which extend parallel to the plane of drawing and which bound the strip-shaped active region 2 A, thus defining a resonant cavity required for laser operation.
- the diode further comprises a first contact layer 6a which lies within the strip-shaped region 30 and a second contact layer 6b which extends over the entire surface of the diode and is provided with a metal layer 8.
- the metal layers 7, 8 form electrical connections 7, 8 for the diode.
- the diode comprises two separate confinement layers 4, i.e. on either side of the active layer 2.
- the separate confinement layer 4 comprises an aluminum- containing semiconductor material with an aluminum content of at most 30, but preferably at most 20% aluminum, or an aluminum-free semiconductor material.
- the separate confinement layer comprises AIGalnAs with an aluminum content of 16% .
- the diode in this embodiment has an exceptionally long life.
- the separate confinement layer 4 comprises GalnAsP, i.e. a semiconductor material free from aluminum.
- This modification also has a very long life for the same reason as indicated above for the first modification.
- the bandgap of the separate confinement layers 4 gradually increases from the active layer 2 in the direction of the cladding layers 1, 3.
- the initial composition corresponds to, for example, which matches InP, while the final composition corresponds to InP.
- the intermediate compositions are also chosen such that ⁇ a/a is approximately zero each time.
- the total thickness of the separate confinement layer 4 in this modification is approximately 0.1 ⁇ m.
- the other layers of the diode in this second modification are identical to those of the first modification, for which reference is made to the above Table.
- the width and length of the strip-shaped region 30, and thus of the active region 2A, are 1.5 and 250 ⁇ m, respectively.
- the dimensions of the semiconductor body 10 are 300 x 250 ⁇ m 2 .
- the emission wavelength of the diode in this example is 1.480 ⁇ m.
- Figs. 4 and 5 diagrammatically show the diode of Fig. 1, i.e. its modification according to Fig. 2, in consecutive stages of its manufacture by a method according to the invention.
- This starts with a substrate 11 of n-type InP with a thickness of approximately 360 ⁇ m, a (100) orientation, and a doping concentration of, for example, 5*10 18 atoms per cm 3 .
- the (upper portion 1 of the) substrate 11 here at the same time acts as the first cladding layer 1.
- MOVPE Metal Organic Vapor Phase Epitaxy
- RIE Reactive Ion Etching
- the structure obtained according to the invention is introduced into a growing apparatus again, and a third, in this case high-ohmic cladding layer 5 is provided on either side of the mesa 30 in a selective growing process, again MOVPE here, so that a plane structure results.
- the device After removal from the growing apparatus and removal of the mask 40, the device (see Fig. 1) is placed in the (MOVPE) growing apparatus again, and a second contact layer 6b is provided over the entire upper surface.
- metal layers 7, 8 of usual composition and thickness are provided at the upper and lower side of the semiconductor body 100 in a usual manner, to which layers current supply conductors can be connected. After cleaving in two mutually perpendicular directions, the semiconductor body 10 of an individual diode is obtained and is ready for use.
- the end faces of the diodes may be provided with suitable reflection or anti-reflection layers.
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Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9534178A JPH11506273A (en) | 1996-03-28 | 1997-03-13 | Radiation-emitting semiconductor diode with a separate confinement layer of a semiconductor material containing up to 30% of aluminum or a semiconductor material without aluminum |
EP97905353A EP0829100A1 (en) | 1996-03-28 | 1997-03-13 | Radiation-emitting semiconductor diode having a separate confinement layer comprising a semiconductor material with at most 30 % aluminum or a semiconductor material free of aluminum |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP96200858.7 | 1996-03-28 | ||
EP96200858 | 1996-03-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997036335A1 true WO1997036335A1 (en) | 1997-10-02 |
Family
ID=8223830
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB1997/000253 WO1997036335A1 (en) | 1996-03-28 | 1997-03-13 | Radiation-emitting semiconductor diode having a separate confinement layer comprising a semiconductor material with at most 30 % aluminum or a semiconductor material free of aluminum |
Country Status (4)
Country | Link |
---|---|
US (1) | US5914496A (en) |
EP (1) | EP0829100A1 (en) |
JP (1) | JPH11506273A (en) |
WO (1) | WO1997036335A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6528337B1 (en) * | 1999-04-08 | 2003-03-04 | The Furukawa Electric Co., Ltd. | Process of producing semiconductor layer structure |
KR100333482B1 (en) * | 1999-09-15 | 2002-04-25 | 오길록 | High speed semiconductor optical modulator and its fabrication method |
JP2001094212A (en) | 1999-09-24 | 2001-04-06 | Sanyo Electric Co Ltd | Semiconductor element and its manufacturing method |
US6996149B2 (en) * | 2002-02-19 | 2006-02-07 | The Furukawa Electric Co., Ltd. | Semiconductor laser device and semiconductor laser module |
US7042921B2 (en) * | 2003-07-11 | 2006-05-09 | Emcore Corporation | Complex coupled single mode laser with dual active region |
JP2007103581A (en) * | 2005-10-03 | 2007-04-19 | Fujitsu Ltd | Embedded semiconductor laser |
WO2007096939A1 (en) * | 2006-02-20 | 2007-08-30 | Fujitsu Limited | Optical semiconductor device and method for manufacturing same |
JP2008288284A (en) * | 2007-05-15 | 2008-11-27 | Sumitomo Electric Ind Ltd | Semiconductor optical element and method of manufacturing the same |
US8288290B2 (en) * | 2008-08-29 | 2012-10-16 | Bae Systems Information And Electronic Systems Integration Inc. | Integration CMOS compatible of micro/nano optical gain materials |
TWI416764B (en) * | 2010-05-06 | 2013-11-21 | Light emitting diode |
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EP0293000A2 (en) * | 1987-05-29 | 1988-11-30 | Hitachi, Ltd. | Light emitting device |
EP0353054A2 (en) * | 1988-07-27 | 1990-01-31 | Kokusai Denshin Denwa Kabushiki Kaisha | Quantum well structure and semiconductor device using the same |
EP0480780A1 (en) * | 1990-08-31 | 1992-04-15 | Thomson-Csf | Optoelectronic device and production of a laser and a photodetector using the same |
EP0544357A1 (en) * | 1991-11-26 | 1993-06-02 | Koninklijke Philips Electronics N.V. | Radiation-emitting semiconductor diode |
JPH07202260A (en) * | 1993-12-27 | 1995-08-04 | Furukawa Electric Co Ltd:The | Distortion superlattice light emitting element |
-
1997
- 1997-03-13 EP EP97905353A patent/EP0829100A1/en not_active Withdrawn
- 1997-03-13 JP JP9534178A patent/JPH11506273A/en not_active Ceased
- 1997-03-13 WO PCT/IB1997/000253 patent/WO1997036335A1/en not_active Application Discontinuation
- 1997-03-24 US US08/822,818 patent/US5914496A/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0293000A2 (en) * | 1987-05-29 | 1988-11-30 | Hitachi, Ltd. | Light emitting device |
EP0353054A2 (en) * | 1988-07-27 | 1990-01-31 | Kokusai Denshin Denwa Kabushiki Kaisha | Quantum well structure and semiconductor device using the same |
EP0480780A1 (en) * | 1990-08-31 | 1992-04-15 | Thomson-Csf | Optoelectronic device and production of a laser and a photodetector using the same |
EP0544357A1 (en) * | 1991-11-26 | 1993-06-02 | Koninklijke Philips Electronics N.V. | Radiation-emitting semiconductor diode |
JPH07202260A (en) * | 1993-12-27 | 1995-08-04 | Furukawa Electric Co Ltd:The | Distortion superlattice light emitting element |
Also Published As
Publication number | Publication date |
---|---|
US5914496A (en) | 1999-06-22 |
JPH11506273A (en) | 1999-06-02 |
EP0829100A1 (en) | 1998-03-18 |
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