WO1997023039A3 - Procede de structuration de substrats de composants fonctionnant avec des ondes acoustiques de surface - Google Patents

Procede de structuration de substrats de composants fonctionnant avec des ondes acoustiques de surface Download PDF

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Publication number
WO1997023039A3
WO1997023039A3 PCT/DE1996/002413 DE9602413W WO9723039A3 WO 1997023039 A3 WO1997023039 A3 WO 1997023039A3 DE 9602413 W DE9602413 W DE 9602413W WO 9723039 A3 WO9723039 A3 WO 9723039A3
Authority
WO
WIPO (PCT)
Prior art keywords
components
structuring
substrates
surface acoustic
acoustic waves
Prior art date
Application number
PCT/DE1996/002413
Other languages
German (de)
English (en)
Other versions
WO1997023039A2 (fr
Inventor
Wolfgang Pahl
Alois Ambrugger
Alfred Schilling
Original Assignee
Siemens Matsushita Components
Wolfgang Pahl
Alois Ambrugger
Alfred Schilling
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Matsushita Components, Wolfgang Pahl, Alois Ambrugger, Alfred Schilling filed Critical Siemens Matsushita Components
Publication of WO1997023039A2 publication Critical patent/WO1997023039A2/fr
Publication of WO1997023039A3 publication Critical patent/WO1997023039A3/fr

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02614—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves
    • H03H9/02622—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves of the surface, including back surface
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02866—Means for compensation or elimination of undesirable effects of bulk wave excitation and reflections

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

L'invention concerne un procédé de structuration de substrats de composants fonctionnant avec des ondes acoustiques de surface, consistant à effectuer un sablage. Selon ce procédé, on applique un masque de sablage sur le substrat (1), masque dans lequel, aux emplacements à structurer, sont ménagées, de façon sélective, des fenêtres, à travers lesquelles le sablage est exécuté.
PCT/DE1996/002413 1995-12-21 1996-12-16 Procede de structuration de substrats de composants fonctionnant avec des ondes acoustiques de surface WO1997023039A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19548043.0 1995-12-21
DE1995148043 DE19548043A1 (de) 1995-12-21 1995-12-21 Verfahren zur Strukturierung von Substraten von mit akustischen Oberflächenwellen arbeitenden Bauelementen - OFW-Bauelemente -

Publications (2)

Publication Number Publication Date
WO1997023039A2 WO1997023039A2 (fr) 1997-06-26
WO1997023039A3 true WO1997023039A3 (fr) 1997-08-21

Family

ID=7780954

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1996/002413 WO1997023039A2 (fr) 1995-12-21 1996-12-16 Procede de structuration de substrats de composants fonctionnant avec des ondes acoustiques de surface

Country Status (2)

Country Link
DE (1) DE19548043A1 (fr)
WO (1) WO1997023039A2 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2242814A1 (fr) * 1973-09-04 1975-03-28 Philips Nv
US3887887A (en) * 1973-12-28 1975-06-03 Texas Instruments Inc Acoustic bulk mode suppressor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2242814A1 (fr) * 1973-09-04 1975-03-28 Philips Nv
US3887887A (en) * 1973-12-28 1975-06-03 Texas Instruments Inc Acoustic bulk mode suppressor

Also Published As

Publication number Publication date
DE19548043A1 (de) 1997-07-03
WO1997023039A2 (fr) 1997-06-26

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