WO1997021229A3 - Electrically conducting reaction resin mixture - Google Patents

Electrically conducting reaction resin mixture Download PDF

Info

Publication number
WO1997021229A3
WO1997021229A3 PCT/DE1996/002322 DE9602322W WO9721229A3 WO 1997021229 A3 WO1997021229 A3 WO 1997021229A3 DE 9602322 W DE9602322 W DE 9602322W WO 9721229 A3 WO9721229 A3 WO 9721229A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrically conducting
resin mixture
reaction resin
hardened
conducting reaction
Prior art date
Application number
PCT/DE1996/002322
Other languages
German (de)
French (fr)
Other versions
WO1997021229A2 (en
Inventor
Heiner Bayer
Wilhelm Hekele
Erich Kattner
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Priority to JP9520867A priority Critical patent/JP2000501551A/en
Priority to EP96946140A priority patent/EP0865653A2/en
Publication of WO1997021229A2 publication Critical patent/WO1997021229A2/en
Publication of WO1997021229A3 publication Critical patent/WO1997021229A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Abstract

To create electrically conducting adhesive compounds and electrically conducting structures, an epoxy-based reaction resin mixture is proposed which can be hardened by a selected initiator system, UV radiation or heat. The single-component reaction resin mixture which stores well can be applied by, for example, screen printing, hardened rapidly with UV light and fully hardened with heat.
PCT/DE1996/002322 1995-12-06 1996-12-04 Electrically conducting reaction resin mixture WO1997021229A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9520867A JP2000501551A (en) 1995-12-06 1996-12-04 Conductive reaction resin mixture
EP96946140A EP0865653A2 (en) 1995-12-06 1996-12-04 Electrically conducting reaction resin mixture

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19545522 1995-12-06
DE19545522.3 1995-12-06

Publications (2)

Publication Number Publication Date
WO1997021229A2 WO1997021229A2 (en) 1997-06-12
WO1997021229A3 true WO1997021229A3 (en) 1997-08-07

Family

ID=7779358

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1996/002322 WO1997021229A2 (en) 1995-12-06 1996-12-04 Electrically conducting reaction resin mixture

Country Status (3)

Country Link
EP (1) EP0865653A2 (en)
JP (1) JP2000501551A (en)
WO (1) WO1997021229A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU711786B2 (en) * 1997-05-16 1999-10-21 National Starch And Chemical Investment Holding Corporation Reactive radiation- or thermally-initiated cationically- curable epoxide monomers and compositions made from those monomers
US6020508A (en) * 1997-05-16 2000-02-01 National Starch And Chemical Investment Holding Corporation Radiation- or thermally-initiated cationically-curable epoxide compounds and compositions made from those compounds
JP2002097443A (en) * 2000-09-21 2002-04-02 Hitachi Chem Co Ltd Adhesive composition, circuit-connecting material using the same, and connected body
DE10062865A1 (en) * 2000-12-16 2002-07-04 Technoplast Beschichtungsgmbh Conductive, scratch-resistant and printable surfaces
US7271075B2 (en) 2002-09-04 2007-09-18 Koninklijke Philips Electronics N.V. Method and a device for bonding two plate-shaped objects
JP5953131B2 (en) * 2011-06-10 2016-07-20 積水化学工業株式会社 Anisotropic conductive material, connection structure, and manufacturing method of connection structure
CN103087640A (en) * 2011-11-08 2013-05-08 汉高股份有限公司 Dual-curing adhesive composition and application thereof and method for bonding substrates
SG11201502443WA (en) * 2012-09-29 2015-04-29 3M Innovative Properties Co Adhesive composition and adhesive tape
JP2015168803A (en) 2014-03-10 2015-09-28 日立化成株式会社 Conductive adhesive composition, connection body, solar cell module and method of producing the same
WO2018180685A1 (en) * 2017-03-30 2018-10-04 デクセリアルズ株式会社 Anisotropic electroconductive adhesive and production method for connection body
JP2018178125A (en) * 2018-06-26 2018-11-15 日立化成株式会社 Conductive adhesive composition, connection body, solar cell module and method for producing the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0234347A1 (en) * 1986-02-24 1987-09-02 International Business Machines Corporation Electrically conductive composition and use thereof
DE3939628A1 (en) * 1989-11-30 1991-06-06 Siemens Ag Adhesive compsn. which can be cured by UV light - used to fix components to hybrid substrates before solder reflow process and can be exposed by radiation through substrate
JPH04255776A (en) * 1991-02-07 1992-09-10 Hitachi Chem Co Ltd Uv curable adhesive sheet, production thereof, apparatus therefor and production of substrate for circuit board and circuit board using the same sheet
EP0584570A1 (en) * 1992-08-10 1994-03-02 Siemens Aktiengesellschaft Epoxy resin composition containing analiphatic sulphonium salts
EP0653763A1 (en) * 1993-11-17 1995-05-17 SOPHIA SYSTEMS Co., Ltd. Ultraviolet hardenable, solventless conductive polymeric material

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0234347A1 (en) * 1986-02-24 1987-09-02 International Business Machines Corporation Electrically conductive composition and use thereof
DE3939628A1 (en) * 1989-11-30 1991-06-06 Siemens Ag Adhesive compsn. which can be cured by UV light - used to fix components to hybrid substrates before solder reflow process and can be exposed by radiation through substrate
JPH04255776A (en) * 1991-02-07 1992-09-10 Hitachi Chem Co Ltd Uv curable adhesive sheet, production thereof, apparatus therefor and production of substrate for circuit board and circuit board using the same sheet
EP0584570A1 (en) * 1992-08-10 1994-03-02 Siemens Aktiengesellschaft Epoxy resin composition containing analiphatic sulphonium salts
EP0653763A1 (en) * 1993-11-17 1995-05-17 SOPHIA SYSTEMS Co., Ltd. Ultraviolet hardenable, solventless conductive polymeric material

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch Week 9243, Derwent World Patents Index; Class A18, AN 92-353606, XP002032213 *

Also Published As

Publication number Publication date
WO1997021229A2 (en) 1997-06-12
EP0865653A2 (en) 1998-09-23
JP2000501551A (en) 2000-02-08

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