WO1995030239A3 - Semiconductor processing system with wafer container docking and loading station - Google Patents

Semiconductor processing system with wafer container docking and loading station Download PDF

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Publication number
WO1995030239A3
WO1995030239A3 PCT/US1995/005274 US9505274W WO9530239A3 WO 1995030239 A3 WO1995030239 A3 WO 1995030239A3 US 9505274 W US9505274 W US 9505274W WO 9530239 A3 WO9530239 A3 WO 9530239A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafers
interface section
processing
processing system
semiconductor processing
Prior art date
Application number
PCT/US1995/005274
Other languages
French (fr)
Other versions
WO1995030239A2 (en
Inventor
Raymon F Thompson
Robert W Berner
Gary L Curtis
Stephen P Culliton
Blaine G Wright
Darryl S Byle
Original Assignee
Semitool Inc
Raymon F Thompson
Robert W Berner
Gary L Curtis
Stephen P Culliton
Blaine G Wright
Darryl S Byle
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/236,424 external-priority patent/US5544421A/en
Application filed by Semitool Inc, Raymon F Thompson, Robert W Berner, Gary L Curtis, Stephen P Culliton, Blaine G Wright, Darryl S Byle filed Critical Semitool Inc
Priority to AU23684/95A priority Critical patent/AU2368495A/en
Priority to EP95917737A priority patent/EP0757843A1/en
Publication of WO1995030239A2 publication Critical patent/WO1995030239A2/en
Publication of WO1995030239A3 publication Critical patent/WO1995030239A3/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781Batch transfer of wafers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769Storage means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775Docking arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/137Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138Wafers positioned vertically within cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Processors (40, 400) for processing integrated circuit wafers, semiconductor substrates, data disks and similar units (50) requiring very low contamination levels. An interface section (43, 401) receives wafers in standard wafer carriers (51). One preferred interface section transfers wafers (50) from carriers onto novel trays (60) for improved processing. In other forms the wafers are processed without transfer. A conveyor (140) having an automated arm assembly (157) moves wafers between processing stations (71-3, 411-5). The processing stations are accessed from an enclosed work space (46) adjoining the interface section. An alternative loading subsystem (600) is shown which docks with and unloads or reloads sealed containers (602) which enclose wafer carriers (51).
PCT/US1995/005274 1994-04-28 1995-04-28 Semiconductor processing system with wafer container docking and loading station WO1995030239A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU23684/95A AU2368495A (en) 1994-04-28 1995-04-28 Semiconductor processing system with wafer container docking and loading station
EP95917737A EP0757843A1 (en) 1994-04-28 1995-04-28 Semiconductor processing system with wafer container docking and loading station

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US08/236,424 1994-04-28
US08/236,424 US5544421A (en) 1994-04-28 1994-04-28 Semiconductor wafer processing system
US08/415,927 1995-03-31
US08/415,927 US5660517A (en) 1994-04-28 1995-03-31 Semiconductor processing system with wafer container docking and loading station

Publications (2)

Publication Number Publication Date
WO1995030239A2 WO1995030239A2 (en) 1995-11-09
WO1995030239A3 true WO1995030239A3 (en) 1995-12-07

Family

ID=26929761

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1995/005274 WO1995030239A2 (en) 1994-04-28 1995-04-28 Semiconductor processing system with wafer container docking and loading station

Country Status (4)

Country Link
US (1) US5836736A (en)
EP (1) EP0757843A1 (en)
AU (1) AU2368495A (en)
WO (1) WO1995030239A2 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6447232B1 (en) * 1994-04-28 2002-09-10 Semitool, Inc. Semiconductor wafer processing apparatus having improved wafer input/output handling system
US5664337A (en) 1996-03-26 1997-09-09 Semitool, Inc. Automated semiconductor processing systems
US6799932B2 (en) 1994-04-28 2004-10-05 Semitool, Inc. Semiconductor wafer processing apparatus
US6723174B2 (en) 1996-03-26 2004-04-20 Semitool, Inc. Automated semiconductor processing system
US6942738B1 (en) 1996-07-15 2005-09-13 Semitool, Inc. Automated semiconductor processing system
KR100265757B1 (en) * 1997-05-09 2000-09-15 윤종용 Wafer status checking sensor for prevention of miss loading in wafer processing equipment
US6454512B1 (en) 1999-03-18 2002-09-24 Pri Automation, Inc. Person-guided vehicle
JP2004524673A (en) * 2000-07-07 2004-08-12 セミトゥール・インコーポレイテッド Automatic processing system
FR2844258B1 (en) * 2002-09-06 2005-06-03 Recif Sa SYSTEM FOR TRANSPORTING AND STORING SEMICONDUCTOR PLATE CONTAINERS, AND TRANSFER MECHANISM
JP3865703B2 (en) * 2002-10-25 2007-01-10 ファナック株式会社 Article conveying system and conveying method
US7597319B2 (en) * 2005-05-20 2009-10-06 Hewlett-Packard Development Company, L.P. Sheet handling using a ramp and grippers on an endless belt
US7815856B2 (en) * 2006-05-23 2010-10-19 Taiwan Semiconductor Manufacturing Co., Ltd. Storage container for detecting presence of checmical elements
US20080019811A1 (en) * 2006-07-11 2008-01-24 Michael Krolak Method and apparatus for vertical wafer transport, buffer and storage
WO2014080067A1 (en) * 2012-11-23 2014-05-30 Picosun Oy Substrate loading in an ald reactor
CN104813438B (en) * 2012-11-28 2017-07-25 盛美半导体设备(上海)有限公司 The cleaning method and device of semi-conductor silicon chip
CN111727158B (en) * 2017-11-03 2022-05-06 拉布拉多系统公司 Indoor automatic robot system for object picking, placing and transporting
CN110441996B (en) * 2019-08-13 2023-09-12 大同新成新材料股份有限公司 Immersion lithography machine for semiconductor chip production and method thereof
JP7488442B2 (en) * 2019-09-26 2024-05-22 シンフォニアテクノロジー株式会社 Transport System

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724874A (en) * 1986-05-01 1988-02-16 Asyst Technologies Sealable transportable container having a particle filtering system
EP0452939A1 (en) * 1990-04-19 1991-10-23 Applied Materials, Inc. Apparatus and method for loading workpieces in a processing system
EP0582019A1 (en) * 1992-08-04 1994-02-09 International Business Machines Corporation Fully automated and computerized conveyor based manufacturing line architectures adapted to pressurized sealable transportable containers

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4452831A (en) * 1979-07-24 1984-06-05 Isovolta Osterreichische Isolierstoffwerke Aktiengesellschaft Method for the production of foils from elastomeric material
DE3171220D1 (en) * 1980-09-02 1985-08-08 Heraeus Schott Quarzschmelze Method of and apparatus for transferring semiconductor wafers between carrier members
US4457661A (en) * 1981-12-07 1984-07-03 Applied Materials, Inc. Wafer loading apparatus
US4449885A (en) * 1982-05-24 1984-05-22 Varian Associates, Inc. Wafer transfer system
US4568234A (en) * 1983-05-23 1986-02-04 Asq Boats, Inc. Wafer transfer apparatus
US4705444A (en) * 1985-07-24 1987-11-10 Hewlett-Packard Company Apparatus for automated cassette handling
US4676709A (en) * 1985-08-26 1987-06-30 Asyst Technologies Long arm manipulator for standard mechanical interface apparatus
US4746256A (en) * 1986-03-13 1988-05-24 Roboptek, Inc. Apparatus for handling sensitive material such as semiconductor wafers
US4924890A (en) * 1986-05-16 1990-05-15 Eastman Kodak Company Method and apparatus for cleaning semiconductor wafers
JPS636857A (en) * 1986-06-26 1988-01-12 Fujitsu Ltd Wafer transfer device
US4721427A (en) * 1987-05-12 1988-01-26 Thermco Systems, Inc. Wafer transfer stand
JPS6448442A (en) * 1987-08-19 1989-02-22 Texas Instruments Japan Shifter for semiconductor wafer
US5125784A (en) * 1988-03-11 1992-06-30 Tel Sagami Limited Wafers transfer device
US4840530A (en) * 1988-05-23 1989-06-20 Nguyen Loc H Transfer apparatus for semiconductor wafers
US5054988A (en) * 1988-07-13 1991-10-08 Tel Sagami Limited Apparatus for transferring semiconductor wafers
US5110248A (en) * 1989-07-17 1992-05-05 Tokyo Electron Sagami Limited Vertical heat-treatment apparatus having a wafer transfer mechanism
JPH03125453A (en) * 1989-10-09 1991-05-28 Toshiba Corp Semiconductor wafer transfer device
KR0153250B1 (en) * 1990-06-28 1998-12-01 카자마 겐쥬 Vertical heat-treating apparatus
JPH04144150A (en) * 1990-10-05 1992-05-18 Oki Electric Ind Co Ltd Cassette handling device
US5055036A (en) * 1991-02-26 1991-10-08 Tokyo Electron Sagami Limited Method of loading and unloading wafer boat
US5232328A (en) * 1991-03-05 1993-08-03 Semitool, Inc. Robot loadable centrifugal semiconductor processor with extendible rotor
JPH05211224A (en) * 1991-04-19 1993-08-20 Texas Instr Japan Ltd Shifter for tubular body
JPH05146984A (en) * 1991-07-08 1993-06-15 Murata Mach Ltd Robot for handling wafer cassette
EP0552756A1 (en) * 1992-01-21 1993-07-28 Shinko Electric Co. Ltd. Article storage house in a clean room
US5301700A (en) * 1992-03-05 1994-04-12 Tokyo Electron Limited Washing system
JP3258748B2 (en) * 1993-02-08 2002-02-18 東京エレクトロン株式会社 Heat treatment equipment
KR100221983B1 (en) * 1993-04-13 1999-09-15 히가시 데쓰로 A treating apparatus for semiconductor process
DE4326309C1 (en) * 1993-08-05 1994-09-15 Jenoptik Jena Gmbh Device for transferring wafer magazines
US5586585A (en) * 1995-02-27 1996-12-24 Asyst Technologies, Inc. Direct loadlock interface

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724874A (en) * 1986-05-01 1988-02-16 Asyst Technologies Sealable transportable container having a particle filtering system
EP0452939A1 (en) * 1990-04-19 1991-10-23 Applied Materials, Inc. Apparatus and method for loading workpieces in a processing system
EP0582019A1 (en) * 1992-08-04 1994-02-09 International Business Machines Corporation Fully automated and computerized conveyor based manufacturing line architectures adapted to pressurized sealable transportable containers

Also Published As

Publication number Publication date
US5836736A (en) 1998-11-17
EP0757843A1 (en) 1997-02-12
AU2368495A (en) 1995-11-29
WO1995030239A2 (en) 1995-11-09

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