WO1994028449A1 - Process for producing guiding elements for optical waveguide fibres - Google Patents
Process for producing guiding elements for optical waveguide fibres Download PDFInfo
- Publication number
- WO1994028449A1 WO1994028449A1 PCT/DE1994/000594 DE9400594W WO9428449A1 WO 1994028449 A1 WO1994028449 A1 WO 1994028449A1 DE 9400594 W DE9400594 W DE 9400594W WO 9428449 A1 WO9428449 A1 WO 9428449A1
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- WO
- WIPO (PCT)
- Prior art keywords
- injection molding
- produced
- guide
- guide elements
- molded part
- Prior art date
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
- G02B6/3696—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier by moulding, e.g. injection moulding, casting, embossing, stamping, stenciling, printing, or with metallic mould insert manufacturing using LIGA or MIGA techniques
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
- G02B6/3833—Details of mounting fibres in ferrules; Assembly methods; Manufacture
- G02B6/3834—Means for centering or aligning the light guide within the ferrule
- G02B6/3838—Means for centering or aligning the light guide within the ferrule using grooves for light guides
- G02B6/3839—Means for centering or aligning the light guide within the ferrule using grooves for light guides for a plurality of light guides
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
- G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
Definitions
- a method for connecting fiber optic optical fibers in which the ends of the optical fibers are inserted into the V-shaped guide groove of a guide element.
- a cover plate is then placed on the optical waveguide, which can also be designed as a guide element with a V-shaped guide groove.
- a silicon plate is used, into which the guide groove is made with high dimensional accuracy by anisotropic etching.
- a multiple connector for fiber optic optical fibers is known, in which guiding elements with several V-shaped guide grooves serving to receive fiber optic optical fibers are provided as connector parts.
- the joint between the two connector parts is bridged by guide pins which are attached to a connector part and are pushed into the assigned male connector part when they are joined together.
- a plate made of ceramic material is used, from which the V-shaped guide grooves are machined.
- the master structure is produced together on a silicon substrate, both for receiving an integrated optical waveguide and an anisotropically etched guide structure for fiber-optic optical waveguides, this master structure is galvanically molded and the resulting negative mold for production is more identical to the master structure Daughter structures used.
- the anisotropically etched V-shaped positioning trench which later serves as a guide structure for fiber-optic optical waveguides, is first filled with polymeric materials, so that a flat surface is obtained, which is then coated with a photoresist or with another structurable polymer .
- Trench-shaped openings which later give the integrated optical waveguide, are structured in the polymeric coating and the trench structures are opened by means of laser ablation. Galvanic molding of the master structure produced in this way then gives rise to the negative mold, with the aid of which the daughter structures are produced by injection molding or injection molding. To produce the integrated optical waveguides, the corresponding trench-shaped openings in the daughter structures are filled with a light-guiding polymer.
- the invention specified in claim 1 is based on the problem of an economical method suitable for mass production for producing with guide grooves to provide provided guide elements for fiber optic optical waveguides.
- a master form of a guide element is first produced with high precision, to which this high precision is transferred to a metallic molded part by means of galvanoplastic molding.
- the guide elements can then be manufactured in large quantities as precision parts with high dimensional accuracy by injection molding or injection molding of plastic.
- several molded parts can be molded from a master mold, and that each molded part is suitable for injection molding or injection molding of dimensionally accurate guide elements in extremely large numbers. In injection molding, up to one million injections can be achieved with a hollow mold.
- the development according to claim 2 enables the production of a master form of highest precision in silicon etching technology.
- the embodiment according to claim 3 enables the galvanoplastic molding of a master mold made of an electrically non-conductive material.
- the surface of the master mold is preferably made electrically conductive by germination and subsequent electroless metal deposition. This economical method has proven itself, for example, in the production of printed circuit boards using the so-called additive technology.
- the surface of the original shape is made electrically conductive by the currentless deposition of a nickel-phosphorus alloy. Since the nickel-phosphorus alloy is particularly hard, it contributes to a particularly long service life of the molded part.
- the embodiment according to claim 7 offers a further possibility of increasing the attainable service life of the molded part, since nickel is a particularly hard and wear-resistant material.
- the embodiment according to claim 9 enables a particularly high precision of the injection-molded or injection-molded guide elements through the use of liquid-crystalline thermoplastics.
- FIG. 1 to Figure 7 different stages in the manufacture of guide elements for fiber optic optical fibers
- FIG. 8 shows an end view from above of a multiple plug connector for fiber optic light waveguides constructed using guide elements produced according to the invention.
- FIG. 1 shows a silicon plate designated SP, into which V-shaped guide grooves FN and two likewise V-shaped additional grooves N are introduced by anisotropic etching. the.
- the body produced by this anisotropic etching forms the original shape U which can be seen in FIG. 2 and which corresponds in shape and size to a guide element to be produced.
- photolithographic methods are used in a known manner to produce an etching resist (not shown in more detail) in connection with the anisoptropic etching.
- a KOH solution for example, can be used for the anisotropic etching of silicon.
- the original form U shown in FIG. 2 is etched and germinated, whereupon the electrically conductive layer ES recognizable in FIG. 3 is applied to the profiled surface of the original form U by electroless metal deposition.
- the etching can be carried out, for example, in a mixture of nitric acid and hydrofluoric acid, while a mixture of palladium chloride and hydrofluoric acid has proven useful for germination. Because of their hardness and wear resistance, a nickel-phosphorus alloy is used as the material for the electrolessly deposited electrically conductive layer ES.
- FIG. 4 shows the galvanoplastic impression of the original form U made electrically conductive by means of galvanic metal deposition. This creates a molded part FT, which is a negative of the guide elements to be produced. Because of their hardness and wear resistance, nickel is preferred for the galvanic reinforcement of the electrically conductive layer ES, which can no longer be seen separately in FIG.
- FIG. 5 shows the molded part FT produced by the electrodeposition of Nik ⁇ kei after the separation from the original form U. Since the adhesive strength of the molded part FT on the original form U is relatively low, the separation can be done easily and without damaging the original form U. Take off are made.
- the molded part FT is installed in an injection mold SW.
- Injection mold SW is then filled with a thermoplastic molding compound by injection.
- the injection molding tool SW is lifted off the injection nozzle, the sprue is separated and the injection molding tool SW is opened so that the injection molding can be ejected.
- a finished guide element FE produced by injection molding is shown in FIG.
- the guide grooves FN and the two outer additional grooves N correspond in shape and size to the guide grooves FN and the additional grooves N of the original form U shown in FIG. 2.
- LCP is preferred as the material for the injection molding of the guide elements FE.
- These liquid crystalline polymers can be sprayed thinly, are very hard and have very good thermal properties, with the low thermal expansion in particular being emphasized here.
- Suitable liquid-crystalline polymers can be obtained, for example, from Farbwerke Hoechst AG, Frankfurt / Main, DE under the trade name "VECTRA".
- FIG. 8 shows an end view from above of a multiple connector for fiber optic optical fibers.
- Two identical guide elements FE produced according to the invention by injection molding are held together by resilient clamps Z, the guide grooves FN and the additional grooves N forming diamond-shaped guide channels in cross section.
- the guide channels formed by the guide grooves FN are intended to receive optical fibers or fiber-optic optical waveguides, while the guide channels formed by additional grooves N accommodate extending rods AS.
- AusrenntStangen AS enable two connector parts to be assembled in the correct position.
- guide elements for fiber optic optical waveguides produced by injection molding of plastic are, in addition to being used in plug connectors, also suitable for many other purposes, for example for use in splice connections of fiber optic optical waveguides Splicing devices for fiber optic optical waveguides, with branching elements or with fiber optic couplers.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Coupling Of Light Guides (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
In order to produce guiding elements provided with guiding grooves for optical waveguide fibres, first an original template of a guiding element is produced, then a metallic mould (FT) which represents a negative model of the guiding element is produced by galvanoplastically duplicating the original template. Guiding elements made of plastics are then produced with said mould (FT) by injection moulding or stamping in an injection moulding tool (SW) or injection stamping tool. The original template is preferably produced from a silicon plate into which the guiding grooves are anisotropically etched. The injection moulding or stamping process allows high precision guiding elements to be economically mass produced.
Description
Verfahren zur Herstellung von Führungselementen für faserop¬ tische LichtwellenleiterProcess for the production of guide elements for fiber optic optical waveguides
Aus der DE-A-23 45 273 ist ein Verfahren zum Verbinden von faseroptischen Lichtwellenleitern bekannt, bei welchem die Lichtwellenleiter mit ihren Enden aufeinanderstoßend in die V-förmige Führungsnut eines Führungselementes eingelegt wer¬ den. Anschließend wird auf die Lichtwellenleiter eine Deck- platte gelegt, die ebenfalls als Führungselement mit einer V- för igen Führungsnut ausgebildet sein kann. Bei der Herstel¬ lung der Führungselernente wird von einer Siliziumplatte aus¬ gegangen, in welche die Führungsnut mit hoher Maßgenauigkeit durch anisotropes Ätzen eingebracht wird.From DE-A-23 45 273 a method for connecting fiber optic optical fibers is known, in which the ends of the optical fibers are inserted into the V-shaped guide groove of a guide element. A cover plate is then placed on the optical waveguide, which can also be designed as a guide element with a V-shaped guide groove. In the manufacture of the guide element, a silicon plate is used, into which the guide groove is made with high dimensional accuracy by anisotropic etching.
Aus der DE-A-25 14 141 ist ein Mehrfach-Steckverbinder für faseroptische Lichtwellenleiter bekannt, bei welchem als Steckerteile Führungselernente mit mehreren, zur Aufnahme von faseroptischen Lichtwellenleitern dienenden V-förmigen Füh¬ rungsnuten vorgesehen sind. Die Stoßstelle zwischen den bei- den Steckerteilen wird durch Führungsstifte überbrückt, die an einem Steckerteil befestigt sind und beim Zusammenfügen in den zugeordneten S.teckerteil eingeschoben werden. Bei der Herstellung der Führungselemente wird hier von einer Platte aus keramischen Werkstoff ausgegangen, aus welcher die V-för- migen Führungsnuten herausgearbeitet werden.From DE-A-25 14 141 a multiple connector for fiber optic optical fibers is known, in which guiding elements with several V-shaped guide grooves serving to receive fiber optic optical fibers are provided as connector parts. The joint between the two connector parts is bridged by guide pins which are attached to a connector part and are pushed into the assigned male connector part when they are joined together. When manufacturing the guide elements, a plate made of ceramic material is used, from which the V-shaped guide grooves are machined.
Aus der DE-A-32 28 219 ist es auch bekannt, mit mehreren V- förmigen Führungsnuten versehene Führungselemente bei der Herstellung von faseroptischen Kopplern mit Kernanschliff einzusetzen. Bei der Herstellung dieser Führungselemente wird auch hier von einer Siliziumplatte ausgegangen, in welche die Führungsnuten mit hoher Maßgenauigkeit durch anisotropes Ät¬ zen eingebracht werden. Außerdem wird'in dieser Druckschrift
darauf hingewiesen, daß anstelle der Siliziumplatte für die Halterung und Führung der Lichtwellenleiter auch Glaskörper oder plastisch verformbare Körper verwendet werden können, in welche die Führungsnuten durch Sägen, Schlitzen oder Prägen eingebracht werden. Dabei wird die Herstellung von Führungs¬ elementen durch Präzisions-Heißpressen von Glas hervorgeho¬ ben.From DE-A-32 28 219 it is also known to use guide elements provided with a plurality of V-shaped guide grooves in the production of fiber-optic couplers with core grinding. In the production of these guide elements, a silicon plate is also assumed here, into which the guide grooves are made with high dimensional accuracy by anisotropic etching. In addition, ' in this publication pointed out that instead of the silicon plate for holding and guiding the optical waveguide, glass bodies or plastically deformable bodies can also be used, into which the guide grooves are made by sawing, slitting or embossing. The production of guide elements by precision hot pressing of glass is emphasized.
In der älteren, nicht vorveröffentlichten deutschen Patentan¬ meldung entsprechend der DE-A-42 12 208 wird ein Verfahren zur Herstellung passiver und/oder aktiver optischer Polymer¬ bauelemente mit integrierter Faser-Chip-Kopplung in Abform¬ technik vorgeschlagen. Dazu wird auf einem Siliziumsubstrat gemeinsam die Masterstruktür sowohl zur Aufnahme eines inte¬ grierten Lichtwellenleiters, als auch eine in das Substrat anisotrop eingeätzten FührungsStruktur für faseroptische Lichtwellenleiter hergestellt, diese Masterstruktur galva¬ nisch abgeformt und die so entstandene Negativform zur Her¬ stellung mit der MasterStruktur identischer Tochterstrukturen eingesetzt. Der anisotrop eingeätzte und später als Führungs- Struktur für faseroptische Lichtwellenleiter dienende V-för¬ mige Positioniergraben, wird dabei zunächst mit polymeren Materialien aufgefüllt, so daß sich eine ebene Oberfläche' ergibt, die dann mit einem Photolack oder mit einem anderen strukturierbaren Polymer beschichtet wird. In die poly ere Beschichtung werden grabenförmige, später den integrierten Lichtwellenleiter ergebende, Öffnungen strukturiert und die Grabenstrukturen mittels Laserablation geöffnet. Durch galva¬ nische Abformung der derart hergestellten Masterstruktur ent¬ steht dann die Negativform, mit deren Hilfe die Tochterstruk- turen im Spritzgieß- oder Spritzprägeverfahren hergestellt werden. Zur Herstellung der integrierten Lichtwellenleiter werden die entsprechenden grabenförmigen Öffnungen der Toch¬ terstrukturen mit einem lichtführenden Polymer gefüllt.In the older, unpublished German patent application corresponding to DE-A-42 12 208, a method for producing passive and / or active optical polymer components with integrated fiber-chip coupling in impression technique is proposed. For this purpose, the master structure is produced together on a silicon substrate, both for receiving an integrated optical waveguide and an anisotropically etched guide structure for fiber-optic optical waveguides, this master structure is galvanically molded and the resulting negative mold for production is more identical to the master structure Daughter structures used. The anisotropically etched V-shaped positioning trench, which later serves as a guide structure for fiber-optic optical waveguides, is first filled with polymeric materials, so that a flat surface is obtained, which is then coated with a photoresist or with another structurable polymer . Trench-shaped openings, which later give the integrated optical waveguide, are structured in the polymeric coating and the trench structures are opened by means of laser ablation. Galvanic molding of the master structure produced in this way then gives rise to the negative mold, with the aid of which the daughter structures are produced by injection molding or injection molding. To produce the integrated optical waveguides, the corresponding trench-shaped openings in the daughter structures are filled with a light-guiding polymer.
Der im Anspruch 1 angegebenen Erfindung liegt das Problem zugrunde, ein wirtschaftliches und für die Massenfertigung geeignetes Verfahren zur Herstellung von mit Führungsnuten
versehenen Führungselementen für faseroptische Lichtwellen¬ leiter zu schaffen.The invention specified in claim 1 is based on the problem of an economical method suitable for mass production for producing with guide grooves to provide provided guide elements for fiber optic optical waveguides.
Bei dem erfindungsgemäßen Verfahren wird zunächst eine Urform eines Führungselementes mit hoher Präzision hergestellt, wor- auf diese hohe Präzision durch galvanoplastische Abformung auf ein metallisches Formteil übertragen wird. Unter Verwen¬ dung dieses, durch galvanoplastische Abformung hergestellten Formteils in einem Spritzgieß-oder Spritzprägewerkzeug können dann die Führungselemente durch Spritzgießen oder Spritzprä- gen von Kunststoff in hohen Stückzahlen als Präzisionsteile mit hoher Maßgenauigkeit hergestellt werden. Hervorzuheben ist dabei noch, daß von einer Urform mehrere Formteile galva¬ noplastisch abgeformt werden können, und daß jedes Formteil für das Spritzgießen oder Spritzprägen maßgenauer Führungs- elemente in äußerst hohen Stückzahlen geeignet ist. Beim Spritzgießen können mit einer Hohlform bis zu einer Million Spritzungen erreicht werden.In the method according to the invention, a master form of a guide element is first produced with high precision, to which this high precision is transferred to a metallic molded part by means of galvanoplastic molding. Using this molded part produced by galvanoplastic molding in an injection molding or injection molding tool, the guide elements can then be manufactured in large quantities as precision parts with high dimensional accuracy by injection molding or injection molding of plastic. It should also be emphasized that several molded parts can be molded from a master mold, and that each molded part is suitable for injection molding or injection molding of dimensionally accurate guide elements in extremely large numbers. In injection molding, up to one million injections can be achieved with a hollow mold.
Vorteilhafte Ausgestaltungen der Erfindung sind in den Unter¬ ansprüchen angegeben.Advantageous embodiments of the invention are specified in the subclaims.
Die Weiterbildung nach Anspruch 2 ermöglicht die Herstellung einer Urform höchster Präzision in Silizium-Ätztechnik.The development according to claim 2 enables the production of a master form of highest precision in silicon etching technology.
Die Ausgestaltung gemäß Anspruch 3 ermöglicht die galvanopla¬ stische Abformung einer Urform aus einem elektrisch nicht leitenden Material. Gemäß Anspruch 4 wird die Oberfläche der Urform dabei vorzugsweise durch Bekeimung und nachfolgende stromlose Metallabscheidung elektrisch leitend gemacht. Diese wirtschaftliche Methode hat sich beispielsweise bei der Herstellung von Leiterplatten nach der sogenannten Addi¬ tivtechnik bewährt.The embodiment according to claim 3 enables the galvanoplastic molding of a master mold made of an electrically non-conductive material. According to claim 4, the surface of the master mold is preferably made electrically conductive by germination and subsequent electroless metal deposition. This economical method has proven itself, for example, in the production of printed circuit boards using the so-called additive technology.
Gemäß Anspruch 5 ist es besonders günstig, wenn die Oberflä¬ che der Urform durch die stromlose Abscheidung einer Nickel- Phosphor-Legierung elekrisch leitend gemacht wird. Da die Nickel-Phosphor-Legierung eine besonders hohe Härte aufweist,
trägt sie zu einer besonders hohen Standzeit des galvanopla¬ stisch abgeformten Formteils bei.According to claim 5, it is particularly favorable if the surface of the original shape is made electrically conductive by the currentless deposition of a nickel-phosphorus alloy. Since the nickel-phosphorus alloy is particularly hard, it contributes to a particularly long service life of the molded part.
Gemäß Anspruch 6 hat es sich als besonders günstig erwiesen, die Oberfläche der Urform vor der Bekeimung zur Erhöhung der Haftfestigkeit anzuätzen.According to claim 6, it has proven to be particularly advantageous to etch the surface of the original form before germination to increase the adhesive strength.
Die Ausgestaltung nach Anspruch 7 bietet eine weitere Mög¬ lichkeit, die erreichbare Standzeit des Formteils zu erhöhen, da es sich bei Nickel um einen besonders harten und ver¬ schleißfesten Werkstoff handelt.The embodiment according to claim 7 offers a further possibility of increasing the attainable service life of the molded part, since nickel is a particularly hard and wear-resistant material.
Die Weiterbildung nach Anspruch 8 ermöglicht eine besonders wirtschaftliche Herstellung der Führungselemente, da ther¬ moplastische Formmassen im Werkzeug durch Abkühlen erstarren und keine Aushärtezeiten benötigen.The development according to claim 8 enables the guide elements to be produced particularly economically, since thermoplastic molding compositions solidify in the mold by cooling and require no curing times.
Die Ausgestaltung nach Anspruch 9 ermöglicht durch die Ver- wendung flüssigkriatalliner Thermoplaste eine besonders hohe Präzision der spritzgegossenen oder durch Spritzprägen herge¬ stellten Führungselemente.The embodiment according to claim 9 enables a particularly high precision of the injection-molded or injection-molded guide elements through the use of liquid-crystalline thermoplastics.
Ausführungsbeispiele der Erfindung sind in der Zeichnung dar¬ gestellt und werden im folgenden näher beschrieben.Exemplary embodiments of the invention are shown in the drawing and are described in more detail below.
Es zeigenShow it
Figur 1 bis Figur 7 verschiedene Stadien bei der Herstellung von Führungselementen für faseroptische Lichtwellenleiter undFigure 1 to Figure 7 different stages in the manufacture of guide elements for fiber optic optical fibers and
Figur 8 eine stirnseitige Draufsicht auf einen unter Verwen¬ dung von erfindungsgemäß hergestellten Führungselementen aufgebauten Mehrfach-Steckverbinder für faseroptischeLicht- wellenleiter.FIG. 8 shows an end view from above of a multiple plug connector for fiber optic light waveguides constructed using guide elements produced according to the invention.
Figur 1 zeigt eine mit SP bezeichnete Siliziumplatte, in wel¬ che durch anisotropes Ätzen V-förmige Führungsnuten FN und zwei ebenfalls V-förmige zusätzliche Nuten N eingebracht wer-
den. Der durch dieses anisotrope Ätzen hergestellte Körper bildet die in Figur 2 erkennbare Urform U, die in Form und Größe einem herzustellenden Führungselement entspricht. Für die Formgebung der parallel verlaufenden Führungsnuten FN und der zusätzlichen Nuten N werden in bekannter Weise fotoli- thografische Methoden zur Erzeugung eines nicht näher darge¬ stellten Ätzresists in Verbindung mit dem anisoptropen Ätzen eingesetzt. Für das anisotrope Ätzen von Silizium kann bei¬ spielsweise eine KOH-Lösung verwendet werden.FIG. 1 shows a silicon plate designated SP, into which V-shaped guide grooves FN and two likewise V-shaped additional grooves N are introduced by anisotropic etching. the. The body produced by this anisotropic etching forms the original shape U which can be seen in FIG. 2 and which corresponds in shape and size to a guide element to be produced. For the shaping of the parallel guide grooves FN and the additional grooves N, photolithographic methods are used in a known manner to produce an etching resist (not shown in more detail) in connection with the anisoptropic etching. A KOH solution, for example, can be used for the anisotropic etching of silicon.
Die in Figur 2 dargestellte Urform U wird angeätzt und be¬ keimt, worauf die Figur 3 erkennbare elektrisch leitende Schicht ES durch stromlose Metallabscheidung auf die profi¬ lierte Oberfläche der Urform U aufgebracht wird. Das Anätzen kann beispielsweise in einer Mischung aus Salpetersäure und Flußsäure erfolgen, während sich für das Bekeimen eine Mi¬ schung aus Palladiumchlorid und Flußsäure bewährt hat. Wegen ihrer Härte und Verschleißfestigkeit wird als Material für die stromlos abgeschiedene elektrisch leitende Schicht ES eine Nickel-Phosphor-Legierung verwendet.The original form U shown in FIG. 2 is etched and germinated, whereupon the electrically conductive layer ES recognizable in FIG. 3 is applied to the profiled surface of the original form U by electroless metal deposition. The etching can be carried out, for example, in a mixture of nitric acid and hydrofluoric acid, while a mixture of palladium chloride and hydrofluoric acid has proven useful for germination. Because of their hardness and wear resistance, a nickel-phosphorus alloy is used as the material for the electrolessly deposited electrically conductive layer ES.
Figur 4 zeigt die galvanoplastische Abformung der elektrisch leitend gemachten Urform U durch galvanische Metallabschei¬ dung. Dabei entsteht ein Formteil FT, welches ein Negativ der herzustellenden Führungselemente darstellt. Wegen ihrer Härte und Verschleißfestigkeit wird für die galvanische Verstärkung der in Figur 4 nicht mehr getrennt erkennbaren elektrisch leitenden Schicht ES Nickel bevorzugt.FIG. 4 shows the galvanoplastic impression of the original form U made electrically conductive by means of galvanic metal deposition. This creates a molded part FT, which is a negative of the guide elements to be produced. Because of their hardness and wear resistance, nickel is preferred for the galvanic reinforcement of the electrically conductive layer ES, which can no longer be seen separately in FIG.
Figur 5 zeigt das durch die galvanische Abscheidung von Nik¬ kei hergestellte Formteil FT nach der Trennung von der Urform U. Da die Haftfestigkeit des Formteils FT auf der Urform U relativ gering ist, kann das Trennen auf einfache Weise und ohne Beschädigung der Urform U durch Abheben vorgenommen wer¬ den.FIG. 5 shows the molded part FT produced by the electrodeposition of Nik¬ kei after the separation from the original form U. Since the adhesive strength of the molded part FT on the original form U is relatively low, the separation can be done easily and without damaging the original form U. Take off are made.
Gemäß Figur 6 wird das Formteil FT in ein Spritzgießwerkzeug SW eingebaut. Der in Figur 6 mit H bezeichnete Hohlraum des
Spritzgießwerkzeugs SW wird dann durch Einspritzen mit einer thermoplastischen Formmasse gefüllt. Nach dem Abkühlen des Spritzlings wird das Spritzgießwerkzeug SW von der Einspritz¬ düse abgehoben, der Anguß getrennt und das Spritzgießwerkzeug SW geöffnet, so daß der Spritzling ausgeworfen werden kann. Ein fertiges, durch Spritzgießen hergestelltes Führungsele¬ ment FE ist in Figur 7 dargestellt. Die Führungsnuten FN und die beiden äußeren zusätzlichen Nuten N entsprechen in Form und Größe den Führungsnuten FN und den zusätzlichen Nuten N der in Figur 2 dargestellten Urform U.According to Figure 6, the molded part FT is installed in an injection mold SW. The cavity denoted by H in FIG. 6 Injection mold SW is then filled with a thermoplastic molding compound by injection. After the injection molding has cooled, the injection molding tool SW is lifted off the injection nozzle, the sprue is separated and the injection molding tool SW is opened so that the injection molding can be ejected. A finished guide element FE produced by injection molding is shown in FIG. The guide grooves FN and the two outer additional grooves N correspond in shape and size to the guide grooves FN and the additional grooves N of the original form U shown in FIG. 2.
Als Material für das Spritzgießen der Führungselemente FE wird LCP bevorzugt. Diese flüssigkristallinen Polymere lassen sich dünn spritzen, besitzen eine hohe Härte und haben sehr gute thermische Eigenschaften, wobei hier insbesondere die geringe thermische Ausdehnung hervorzuheben ist. Geeignete flüssigkristalline Polymere können beispielsweise unter dem Handelsnamen "VECTRA" von der Farbwerke Hoechst AG, Frankfurt / Main, DE bezogen werden.LCP is preferred as the material for the injection molding of the guide elements FE. These liquid crystalline polymers can be sprayed thinly, are very hard and have very good thermal properties, with the low thermal expansion in particular being emphasized here. Suitable liquid-crystalline polymers can be obtained, for example, from Farbwerke Hoechst AG, Frankfurt / Main, DE under the trade name "VECTRA".
Figur 8 zeigt eine stirnseitige Draufsicht auf einen Mehr- fach-Steckverbinder für faseroptische Lichtwellenleiter. Dabei werden zwei erfindungsgemäß durch Spritzgießen herge¬ stellte, identische Führungselemente FE durch federnde Zwin¬ gen Z zusammengehalten, wobei die Führungsnuten FN und die zusätzlichen Nuten N im Querschnitt rautenförmige Führungs- kanäle bilden. Die durch die Führungsnuten FN gebildeten Führungskanäle sind zur Aufnahme von Lichtleitfasern bzw. von faseroptischen Lichtwellenleitern bestimmt, während die durch zusätzliche Nuten N gebildeten Führungskanäle AusriehtStangen AS aufnehmen. Diese AusriehtStangen AS ermöglichen ein lagerichtiges Zusammenfügen zweier Steckerteile.FIG. 8 shows an end view from above of a multiple connector for fiber optic optical fibers. Two identical guide elements FE produced according to the invention by injection molding are held together by resilient clamps Z, the guide grooves FN and the additional grooves N forming diamond-shaped guide channels in cross section. The guide channels formed by the guide grooves FN are intended to receive optical fibers or fiber-optic optical waveguides, while the guide channels formed by additional grooves N accommodate extending rods AS. These AusrenntStangen AS enable two connector parts to be assembled in the correct position.
Erfindungsgemäß durch Spritzgießen von Kunststoff herge¬ stellte Führungselemente für faseroptischeLichtwellenleiter sind neben dem Einsatz in Steckverbindern auch für viele an¬ dere Zwecke geeignet, beispielsweise für den Einsatz bei Spleißverbindungen von faseroptischen Lichtwellenleitern, bei
Spleißgeräten für faseroptische Lichtwellenleiter, bei Ver¬ zweigerelementen oder bei faseroptischen Kopplern.
In accordance with the invention, guide elements for fiber optic optical waveguides produced by injection molding of plastic are, in addition to being used in plug connectors, also suitable for many other purposes, for example for use in splice connections of fiber optic optical waveguides Splicing devices for fiber optic optical waveguides, with branching elements or with fiber optic couplers.
Claims
1. Verfahren zur Herstellung von mit Führungsnuten (FN) für Lichtwellenleiter versehenen Führungselementen (FE) für fa- seroptische Lichtwellenleiterverbindungen, für faseroptische Verzweigerelemente, für faseroptische Koppler oder für den Einsatz bei Spleißgeräten für Lichtwellenleiter, mit fol¬ genden Verfahrensschritten: a) Herstellung einer Urform (U) eines Führungselementes (FE) ,* b) Galvanoplastische Abformung der Urform (U) zur Erzeugung eines metallischen Formteils (FT) , welches ein Negativ der herzustellenden Führungselemente (FE) darstellt; c) Spritzgießen oder Spritzprägen von Führungselementen (FE) aus Kunststoff unter Verwendung des im Schritt b) herge- stellten Formteils (FT) im Spritzgießwerkzeug (SW) oder im Spritzprägewerkzeug.1. Process for the production of guide elements (FE) provided with guide grooves (FN) for optical waveguides for fiber optic optical waveguide connections, for fiber optic branching elements, for fiber optic couplers or for use in splicers for optical waveguides, with the following process steps: a) production of a Master form (U) of a guide element (FE), * b) Galvanoplastic molding of the master form (U) to produce a metallic molded part (FT), which represents a negative of the guide elements (FE) to be produced; c) Injection molding or injection molding of guide elements (FE) made of plastic using the molded part (FT) produced in step b) in the injection molding tool (SW) or in the injection molding tool.
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Urform (U) aus einer Siliziumplatte (SP) hergestellt wird, in welche die Führungsnuten (FN) durch anisotropes Ätzen eingebracht werden.2. The method according to claim 1, characterized in that the master mold (U) is made of a silicon plate (SP), in which the guide grooves (FN) are introduced by anisotropic etching.
3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die Oberfläche der Urform (U) elektrisch leitend gemacht wird und daß dann das Formteil (FT) durch galvanische Metall- abscheidung erzeugt wird.3. The method according to claim 1 or 2, characterized in that the surface of the master mold (U) is made electrically conductive and that the molded part (FT) is then generated by galvanic metal deposition.
4. Verfahren nach Anspruch 3, dadurch gekennzeichnet, daß die Oberfläche der Urform (U) durch Bekeimung und nach¬ folgende stromlose Metallabscheidung elektrisch leitend ge¬ macht wird.4. The method according to claim 3, characterized in that the surface of the original form (U) is made electrically conductive by germination and subsequent electroless metal deposition.
5. Verfahren nach Anspruch 4, dadurch gekennzeichnet, daß die Oberfläche der Urform (U) durch die stromlose Ab- Scheidung einer Nickel-Phosphor-Legierung (NiP) elektrisch leitend gemacht wird.5. The method according to claim 4, characterized in that the surface of the master mold (U) by the currentless Ab- Divide a nickel-phosphorus alloy (NiP) is made electrically conductive.
6. Verfahren nach Anspruch 4 oder 5, dadurch gekennzeichnet, daß die Oberfläche der Urform (U) vor der Bekeimung angeätzt wird.6. The method according to claim 4 or 5, characterized in that the surface of the master mold (U) is etched before germination.
7. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet , daß das Formteil (FT) durch die galvanische Abscheidung von Nickel erzeugt wird.7. The method according to any one of the preceding claims, characterized in that the molded part (FT) is generated by the electrodeposition of nickel.
8. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß für das Spritzgießen oder Spritzprägen der Führungsele¬ mente (FE) Thermoplaste verwendet werden.8. The method according to any one of the preceding claims, characterized in that thermoplastics are used for the injection molding or injection molding of the guide elements (FE).
9. Verfahren nach Anspruch 8, dadurch gekennzeichnet, daß für das Spritzgießen oder Spritzprägen der Führungsele¬ mente (FE) flüssigkristalline Thermoplaste verwendet werden. 9. The method according to claim 8, characterized in that liquid-crystalline thermoplastics are used for the injection molding or injection molding of the guide elements (FE).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEP4317953.3 | 1993-05-28 | ||
DE19934317953 DE4317953A1 (en) | 1993-05-28 | 1993-05-28 | Process for the production of guide elements for optical fibers |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1994028449A1 true WO1994028449A1 (en) | 1994-12-08 |
Family
ID=6489225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1994/000594 WO1994028449A1 (en) | 1993-05-28 | 1994-05-24 | Process for producing guiding elements for optical waveguide fibres |
Country Status (2)
Country | Link |
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DE (1) | DE4317953A1 (en) |
WO (1) | WO1994028449A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995022448A2 (en) * | 1994-02-17 | 1995-08-24 | Imperial Chemical Industries Plc | Preparation of embossing shims |
WO1997036201A1 (en) * | 1996-03-25 | 1997-10-02 | Telefonaktiebolaget Lm Ericsson (Publ) | A method and device for waveguide connection |
WO2000002070A2 (en) * | 1998-07-02 | 2000-01-13 | Tyco Electronics Logistics Ag | Ferrule for an optical plug-in connection |
CN103144241A (en) * | 2013-03-12 | 2013-06-12 | 太仓协乐高分子材料有限公司 | Manufacturing technique of plastic product |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19501285C1 (en) * | 1995-01-18 | 1996-05-15 | Bosch Gmbh Robert | Opto-electronic conversion device mfr. |
WO1996022177A1 (en) * | 1995-01-18 | 1996-07-25 | Robert Bosch Gmbh | Arrangement for converting optical into electrical signals and process for producing it |
MX336626B (en) * | 2011-04-05 | 2016-01-26 | Nanoprec Products Inc | Optical fiber connector ferrule having open fiber clamping grooves. |
CN106676585B (en) * | 2016-12-29 | 2018-09-28 | 余姚科光塑料制品有限公司 | Car light light-strip mould making method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3776770A (en) * | 1971-10-08 | 1973-12-04 | Western Electric Co | Method of selectively depositing a metal on a surface of a substrate |
EP0121876A1 (en) * | 1983-04-07 | 1984-10-17 | BASF Aktiengesellschaft | Preparation process of moulded products made of thermoplastic matter |
EP0429877A2 (en) * | 1989-11-25 | 1991-06-05 | Forschungszentrum Karlsruhe GmbH | Device for positioning optical fibres in connector elements |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA969744A (en) * | 1972-09-08 | 1975-06-24 | Louis P. Boivin | Coupling of optical fibres |
DE2514141A1 (en) * | 1975-03-29 | 1976-10-14 | Licentia Gmbh | Multiple connector for optical fibres - is of plug and socket type with fibres located in triangular grooves in supporting members |
DE3228219A1 (en) * | 1982-07-28 | 1984-02-02 | Siemens AG, 1000 Berlin und 8000 München | FIBER OPTICAL COUPLER WITH CORE GRINDING |
DE3428092A1 (en) * | 1984-07-30 | 1986-02-06 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Method for producing V-shaped grooves for a multiple splicing device for glass fibre bundles and device for carrying out the method |
DE3605966A1 (en) * | 1986-02-25 | 1987-08-27 | Philips Patentverwaltung | DEVICE FOR CONNECTING LIGHTWAVE GUIDES AND METHOD FOR THE PRODUCTION THEREOF |
DE4212208A1 (en) * | 1992-04-10 | 1993-10-14 | Bosch Gmbh Robert | Process for the production of optical polymer components with integrated fiber-chip coupling in impression technique |
-
1993
- 1993-05-28 DE DE19934317953 patent/DE4317953A1/en not_active Withdrawn
-
1994
- 1994-05-24 WO PCT/DE1994/000594 patent/WO1994028449A1/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3776770A (en) * | 1971-10-08 | 1973-12-04 | Western Electric Co | Method of selectively depositing a metal on a surface of a substrate |
EP0121876A1 (en) * | 1983-04-07 | 1984-10-17 | BASF Aktiengesellschaft | Preparation process of moulded products made of thermoplastic matter |
EP0429877A2 (en) * | 1989-11-25 | 1991-06-05 | Forschungszentrum Karlsruhe GmbH | Device for positioning optical fibres in connector elements |
Non-Patent Citations (3)
Title |
---|
"Use of high precision slicon molds for replicating microelectronic packaging structures", IBM TECHNICAL DISCLOSURE BULLETIN., vol. 30, no. 5, October 1987 (1987-10-01), NEW YORK US, pages 306 - 311 * |
EHRFELD W.: "The LIGA process for microsystems", MICRO SYSTEM TECHNOLOGIES 90 1ST INTERNATIONAL CONFERENCE ON MICRO, ELECTRO, OPTO, MECHANIC SYSTEMS AND COMPONENTS, 10 September 1990 (1990-09-10), BERLIN, pages 521 - 528HE * |
KUROKAWA T. ET AL.: "Precisely moulded plastics splices for optical fibres", ELECTRONICS LETTERS., vol. 16, no. 24, 20 November 1980 (1980-11-20), ENAGE GB, pages 911 - 912 * |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995022448A2 (en) * | 1994-02-17 | 1995-08-24 | Imperial Chemical Industries Plc | Preparation of embossing shims |
WO1995022448A3 (en) * | 1994-02-17 | 1995-10-05 | Ici Plc | Preparation of embossing shims |
WO1997036201A1 (en) * | 1996-03-25 | 1997-10-02 | Telefonaktiebolaget Lm Ericsson (Publ) | A method and device for waveguide connection |
US5984534A (en) * | 1996-03-25 | 1999-11-16 | Telefonaktiebolaget Lm Ericsson | Method and device for waveguide connection |
CN1103931C (en) * | 1996-03-25 | 2003-03-26 | 艾利森电话股份有限公司 | Method and device for waveguide connection |
WO2000002070A2 (en) * | 1998-07-02 | 2000-01-13 | Tyco Electronics Logistics Ag | Ferrule for an optical plug-in connection |
WO2000002070A3 (en) * | 1998-07-02 | 2000-06-02 | Tyco Electronics Logistics Ag | Ferrule for an optical plug-in connection |
US6478474B1 (en) | 1998-07-02 | 2002-11-12 | Tyco Electronics Logistics Ag | Ferrule for an optical plug-in connection |
CN103144241A (en) * | 2013-03-12 | 2013-06-12 | 太仓协乐高分子材料有限公司 | Manufacturing technique of plastic product |
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DE4317953A1 (en) | 1994-12-01 |
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