WO1993006696A1 - Headset - Google Patents

Headset Download PDF

Info

Publication number
WO1993006696A1
WO1993006696A1 PCT/CA1991/000332 CA9100332W WO9306696A1 WO 1993006696 A1 WO1993006696 A1 WO 1993006696A1 CA 9100332 W CA9100332 W CA 9100332W WO 9306696 A1 WO9306696 A1 WO 9306696A1
Authority
WO
WIPO (PCT)
Prior art keywords
mount
earphone
cavity
molded plastics
headset
Prior art date
Application number
PCT/CA1991/000332
Other languages
French (fr)
Inventor
Chik Sum Chan
Barry Miller
Original Assignee
Tq Tradex Ltd.
Fujikon Industrial Co. Ltd.
Jackson C. S. Chan & Co. Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tq Tradex Ltd., Fujikon Industrial Co. Ltd., Jackson C. S. Chan & Co. Ltd. filed Critical Tq Tradex Ltd.
Priority to PCT/CA1991/000332 priority Critical patent/WO1993006696A1/en
Publication of WO1993006696A1 publication Critical patent/WO1993006696A1/en

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058Manufacture or assembly
    • H04R1/1066Constructional aspects of the interconnection between earpiece and earpiece support
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1008Earpieces of the supra-aural or circum-aural type
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R5/00Stereophonic arrangements
    • H04R5/033Headphones for stereophonic communication
    • H04R5/0335Earpiece support, e.g. headbands or neckrests

Definitions

  • the present invention relates to an audio headset, and more particularly, to a headset for use in airline entertainment systems.
  • headsets must be inexpensive to fabri- cate, light, and comfortable. Most parts are molded plastics material although some, such as head band parts, may be metal.
  • the earphones in some models are mounted to swivel about a longi ⁇ tudinal axis of the end portion of the head band.
  • the construction of such a swivel requires that the earphone and the end of the head band be provided with molded plastics first and second elements and an integral molded pivot pin extending from one element and journaled in the other.
  • the problem which occurs, however, is that the pivot pin breaks off easily and the earphone falls away, leaving the headset useless.
  • a construction according to the present invention comprises a headset having an adjustable head band having a pair of molded plastics mounts, one at each end of the head band.
  • Each mount includes a cavity and a swivel sliding surface and an opening in the mount at the sliding surface communicating with the cavity.
  • An earphone includes a molded plastics housing and a projection thereon having a planar sliding surface adapted to coact with the sliding surface on the mount.
  • a molded plastics swivel pin is integrally molded to the earphone projection and is adapted to extend through the opening in the mount and be journaled in the cavity of the mount.
  • a metal reinforcing pin extends from the interior of the earphone housing through and coaxial with the molded plastics swivel pin to within the cavity in the mount.
  • Fig. 1 is a fragmentary perspective view of a portion of a headset in accordance with the present invention
  • Fig. 2 is an enlarged fragmentary view of a detail of the headset shown in Fig. 1
  • Fig. 3 is an axial cross-section taken through the detail shown in Fig. 2;
  • Fig. 4 is an axial cross-section taken at 90° to the cross-section of Fig. 3 through the same detail of Fig. 2.
  • the headset 10 includes a molded plastics head band portion 12 with a socket 18 through which a metal head band element 14 is adapted to slide.
  • the purpose of the head band portion 14 sliding through the socket 18 is to allow for size adjustment when fitting the headset to one's head.
  • An earphone 16 is illustrated in Fig. 1 at the end of the head band portion 14.
  • the head band portion 14 is, in fact, fixed within a molded plastics mount 20 as will be described further.
  • the earphone includes a molded plastics housing 16 with an ear contact portion which is covered by a foam muff 22. These foam muffs 22 are usually replaceable after each use in order to provide a hygienically presentable headset for each use. On the periphery of the housing 16, there is provided an integral projection 26.
  • Figs. 3 and 4 are cross-sections of the projection 26 and the mount 20.
  • Mount 20, as shown in Fig. 4, includes two molded parts which are clamped together. These parts are identified as 20a and 20b.
  • the molded parts 20a and 20b forming the mount 20 lock-in the metal blade of the head band portion 14.
  • a cavity 28 is defined in the mount 20.
  • the cavity has an enlarged cylindrical portion communicating with a narrow neck portion and with an opening onto a flat planar surface forming the swivel joint, as will be described.
  • the projection 26 on the earphone housing 16 includes a similar planar sliding surface 26a which coacts with the sliding surface of the mount 20.
  • a swivel pin 30 is integrally molded to the projection 26 and extends through the opening into the cavity 28.
  • the pin 30 is of similar cross-section to the cavity to allow 360 rotation of the earphone relative to the mount 20.
  • a small diameter metal screw or bolt 34 passes from the interior of the housing 16 through the wall of the projection 26 and coaxially through the swivel pin 30 to the top thereof coinciding with the cavity 28.
  • the reinforcing pin 32 is in the form of a bolt having a head 34 which abuts against a reinforcing plate 36 within the housing 16 against the wall of the projec ⁇ tion 26.
  • the swivel pin 30 is maintained in a reinforced condition, avoiding or reducing the risk of the earphone breaking off from the head band in the area of the swivel pin 30 which is usually its weakest point.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Headphones And Earphones (AREA)

Abstract

A headset (10) for use on airlines including a molded plastics head band (12) to which a pair of metal blades (14) are adapted to slide thereon to allow adjustment of the size of the headset (10). At each end of the metal blades (14) there is a molded plastics mount (20) locked thereon. An earphone (16) including an integrally molded swivel pin (30) with a reinforcing metal pin (32) coaxial therewith and the swivel pin (30) extends within the mount (20) into a cavity (28) therein and is journalled therein. The mount (20) and the earphone (16) have coacting sliding surfaces forming the swivel joint.

Description

HEADSET
TECHNICAL FIELD
The present invention relates to an audio headset, and more particularly, to a headset for use in airline entertainment systems.
BACKGROUND ART
With the advent of wide-bodied aircraft, individual audio systems have been adopted by airlines in an effort to entertain passengers on longer flights. This has meant a considerable market for low-cost, light audio headsets. At first, such headsets were pneumatic and thus of relatively low quality. However, airlines, in an attempt to upgrade their first class and business class sections, are increasingly using electronic headsets. Many airlines are also making use of such electronic headsets in economy class as well. Thus, the volume of electronic headsets is increasing rapidly.
Such headsets must be inexpensive to fabri- cate, light, and comfortable. Most parts are molded plastics material although some, such as head band parts, may be metal.
In an attempt to simplify the construction of the headset, yet make it comfortable, the earphones in some models are mounted to swivel about a longi¬ tudinal axis of the end portion of the head band. The construction of such a swivel requires that the earphone and the end of the head band be provided with molded plastics first and second elements and an integral molded pivot pin extending from one element and journaled in the other. The problem which occurs, however, is that the pivot pin breaks off easily and the earphone falls away, leaving the headset useless.
DISCLOSURE OF INVENTION
It is an aim of the present invention to provide an improved headset with earphones each having a swivel feature and including a reinforced swivel pin in order to reduce the risk of breakage.
A construction according to the present invention comprises a headset having an adjustable head band having a pair of molded plastics mounts, one at each end of the head band. Each mount includes a cavity and a swivel sliding surface and an opening in the mount at the sliding surface communicating with the cavity. An earphone includes a molded plastics housing and a projection thereon having a planar sliding surface adapted to coact with the sliding surface on the mount. A molded plastics swivel pin is integrally molded to the earphone projection and is adapted to extend through the opening in the mount and be journaled in the cavity of the mount. A metal reinforcing pin extends from the interior of the earphone housing through and coaxial with the molded plastics swivel pin to within the cavity in the mount.
BRIEF DESCRIPTION OF THE DRAWINGS Having thus generally described the nature of the invention, reference will now be made to the accompanying drawings, showing by way of illustration, a preferred embodiment thereof, and in which:
Fig. 1 is a fragmentary perspective view of a portion of a headset in accordance with the present invention;
Fig. 2 is an enlarged fragmentary view of a detail of the headset shown in Fig. 1 Fig. 3 is an axial cross-section taken through the detail shown in Fig. 2; and
Fig. 4 is an axial cross-section taken at 90° to the cross-section of Fig. 3 through the same detail of Fig. 2.
MODES FOR CARRYING OUT THE INVENTION
Referring now to the drawings, there is shown an electronic headset 10 of the type used on airlines. The headset 10 includes a molded plastics head band portion 12 with a socket 18 through which a metal head band element 14 is adapted to slide. The purpose of the head band portion 14 sliding through the socket 18 is to allow for size adjustment when fitting the headset to one's head. An earphone 16 is illustrated in Fig. 1 at the end of the head band portion 14. The head band portion 14 is, in fact, fixed within a molded plastics mount 20 as will be described further.
The earphone includes a molded plastics housing 16 with an ear contact portion which is covered by a foam muff 22. These foam muffs 22 are usually replaceable after each use in order to provide a hygienically presentable headset for each use. On the periphery of the housing 16, there is provided an integral projection 26.
Figs. 3 and 4 are cross-sections of the projection 26 and the mount 20. Mount 20, as shown in Fig. 4, includes two molded parts which are clamped together. These parts are identified as 20a and 20b. The molded parts 20a and 20b forming the mount 20 lock-in the metal blade of the head band portion 14. A cavity 28 is defined in the mount 20. The cavity has an enlarged cylindrical portion communicating with a narrow neck portion and with an opening onto a flat planar surface forming the swivel joint, as will be described.
The projection 26 on the earphone housing 16 includes a similar planar sliding surface 26a which coacts with the sliding surface of the mount 20. A swivel pin 30 is integrally molded to the projection 26 and extends through the opening into the cavity 28. The pin 30 is of similar cross-section to the cavity to allow 360 rotation of the earphone relative to the mount 20. A small diameter metal screw or bolt 34 passes from the interior of the housing 16 through the wall of the projection 26 and coaxially through the swivel pin 30 to the top thereof coinciding with the cavity 28. In the embodiment shown in the drawings, the reinforcing pin 32 is in the form of a bolt having a head 34 which abuts against a reinforcing plate 36 within the housing 16 against the wall of the projec¬ tion 26.
Thus, the swivel pin 30 is maintained in a reinforced condition, avoiding or reducing the risk of the earphone breaking off from the head band in the area of the swivel pin 30 which is usually its weakest point.

Claims

CLAIMS :
1. A headset having an adjustable head band with a pair of molded plastics mounts, one on each end of the head band, each mount including a cavity and a swivel sliding surface and an opening in the mount at the sliding surface communicating with the cavity, an earphone including a molded plastics housing to which a projection is integrally provided thereon, the projection including a planar sliding surface adapted to coact with the sliding surface on the mount, and a molded plastics swivel pin integral with the projec¬ tion on the earphone housing adapted to extend through the opening in the mount and journaled in the cavity in the mount, the improvement including a metal reinforcing pin extending from the interior of the earphone housing through and coaxial with the molded plastics swivel pin to within the cavity in the mount.
2. A headset as defined in claim 1, wherein the reinforcing pin is in the form of a small diameter metal screw having a head and a threaded shank which extends through and is coaxial with the molded plas¬ tics swivel pin and a reinforcing washer is provided within the housing to which the head of the screw abuts .
3. An earphone as defined in claim 1, wherein the mount is in the form of a pair of coupled molded plastics members locking to the end of a metal head band blade portion which forms part of the head band.
PCT/CA1991/000332 1991-09-18 1991-09-18 Headset WO1993006696A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CA1991/000332 WO1993006696A1 (en) 1991-09-18 1991-09-18 Headset

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CA1991/000332 WO1993006696A1 (en) 1991-09-18 1991-09-18 Headset

Publications (1)

Publication Number Publication Date
WO1993006696A1 true WO1993006696A1 (en) 1993-04-01

Family

ID=4172894

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CA1991/000332 WO1993006696A1 (en) 1991-09-18 1991-09-18 Headset

Country Status (1)

Country Link
WO (1) WO1993006696A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102098602A (en) * 2009-12-04 2011-06-15 森海塞尔通信公司 Headset with side support
WO2020087448A1 (en) * 2018-10-29 2020-05-07 声电电子科技(惠州)有限公司 Structure for fixing tail end of headset steel headband

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2540839A1 (en) * 1974-09-12 1976-04-01 Nippon Musical Instruments Mfg Headphones with ball and socket joints - has joints between headband and ear pieces to allow earpieces to rotate as well as tilt
DE2642786A1 (en) * 1976-09-23 1978-04-06 Sennheiser Electronic Stereo headset with simplified mounting - has asymmetric universal suspension with single arm to permit simple adjustment
DE3225812A1 (en) * 1981-07-10 1983-02-03 Nippon Columbia K.K., Tokyo HEADPHONE
EP0071464A1 (en) * 1981-07-29 1983-02-09 Matsushita Electric Industrial Co., Ltd. Headphones
US4689822A (en) * 1986-01-29 1987-08-25 Houng Huang Chiang Headset

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2540839A1 (en) * 1974-09-12 1976-04-01 Nippon Musical Instruments Mfg Headphones with ball and socket joints - has joints between headband and ear pieces to allow earpieces to rotate as well as tilt
DE2642786A1 (en) * 1976-09-23 1978-04-06 Sennheiser Electronic Stereo headset with simplified mounting - has asymmetric universal suspension with single arm to permit simple adjustment
DE3225812A1 (en) * 1981-07-10 1983-02-03 Nippon Columbia K.K., Tokyo HEADPHONE
EP0071464A1 (en) * 1981-07-29 1983-02-09 Matsushita Electric Industrial Co., Ltd. Headphones
US4689822A (en) * 1986-01-29 1987-08-25 Houng Huang Chiang Headset

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102098602A (en) * 2009-12-04 2011-06-15 森海塞尔通信公司 Headset with side support
EP2352307A1 (en) * 2009-12-04 2011-08-03 Sennheiser Communications A/S Headset with side support
CN102098602B (en) * 2009-12-04 2015-06-03 森海塞尔通信公司 Headset with side support
WO2020087448A1 (en) * 2018-10-29 2020-05-07 声电电子科技(惠州)有限公司 Structure for fixing tail end of headset steel headband

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