WO1992003031A1 - Conditionnement de circuits hybrides - Google Patents

Conditionnement de circuits hybrides Download PDF

Info

Publication number
WO1992003031A1
WO1992003031A1 PCT/GB1991/001341 GB9101341W WO9203031A1 WO 1992003031 A1 WO1992003031 A1 WO 1992003031A1 GB 9101341 W GB9101341 W GB 9101341W WO 9203031 A1 WO9203031 A1 WO 9203031A1
Authority
WO
WIPO (PCT)
Prior art keywords
frame
floor
circuits
face
rims
Prior art date
Application number
PCT/GB1991/001341
Other languages
English (en)
Inventor
Anthony Ralph Hayles
Original Assignee
Matra Marconi Space (Uk) Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matra Marconi Space (Uk) Limited filed Critical Matra Marconi Space (Uk) Limited
Publication of WO1992003031A1 publication Critical patent/WO1992003031A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6688—Mixed frequency adaptations, i.e. for operation at different frequencies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to packaging and especially to a frame for hybrid circuits of the type in which R.F. signals are processed using digital and/or D.C. techniques.
  • Such hybrid circuits are usually formed on an alumina substrate and may include thick film circuits formed thereon together with hermetically sealed flat packs and conventional surface mounted components.
  • the aluminate substrates are of a standard size of 2 inches by 1 inch (5.08 era by 2.54 cm) and are mounted within rebates within a metal chassis to provide a heat sink and electromagnetically shield the circuitry. It can be awkward to provide the necessary R.F. and digital interconnections between external components and the components on the substrate and to pack the circuits to a high density. It is accordingly an object of the invention to provide packaging for hybrid circuits which allows the circuits to be packed to a high density, and allows R.F. signals and digital and/or D.C.
  • a frame for hybrid circuit comprises a floor surrounded on each face by a respectiv upstanding rim, in which the floor provides a ground plan for circuits mountable upon each face of the floor, the rims including sockets to receive complementary R.F. connectors for supplying R.F. signals into and out of the circuits, the rims further including connection means by which digital and/or D.C. signals can be interconnected with the circuits.
  • the two circuits do not need to be housed separately, which means that there can be an overall reduction in height when several such frames are stacked one above the other.
  • the use of such frames also allows the circuits to be mounted in a modular way which can facilitate the design and manufacture of systems or devices comprising such circuits.
  • the presence of sockets on the rim to receive complementary R.F. connectors ensures that R.F. signals can be interconnected with the circuits in a simple and convenient way, and can omit the need for R.F. leads to extend into the circuits from above.
  • the digital and/or D.C. connection means in the rims of the frame ensures that such signals can be applied to suitable components which are mounted on circuits within the same frame as R.F.
  • the frame may be formed in two halves sandwiched together about a floor, or may be formed in one piece with an integral floor.
  • the frame comprises a plurality of wall members having inter-engaging means for connecting the wall member to the floor and/or to an adjacent wall member.
  • the frame is of rectangular shape in plan and includes R.F. sockets on opposing faces of the rim.
  • the sockets are preferably offset with respect to the central floor so that a pin housed centrally within the socket for interconnection with a suitable connector extends inwardly into the frame above one or other face of the floor.
  • the pin within the R.F. socket may be retained within an annular block of insulating material secured within the socket.
  • the floor preferably includes a recess extending inwardly of the floor from the edge portion located adjacent the socket and a further recess in the surface of the floor to be located beneath the portion of the pin that extends into the interior of the frame.
  • the rim may also include further R.F. pins for making R.F. connections, e.g. between adjacent frames.
  • Figure 1 is an exploded isometric view of a frame and a hybrid circuit according to the invention
  • Figure 2 is a plan view of the frame shown in Figure 1;
  • Figures 3 and 4 are respectively sectional views along lines X-X and Y-Y of Figure 2;
  • Figure 5 is a view to an enlarged scale of part of Figure 3 showing the detail of the R.F. socket;
  • Figure 6 is a plan view showing how frames of the type shown in Figure 1 can be stacked together within a chassis;
  • Figure 7 is a schematic longitudinal sectional view of the stack of frames shown in Figure 6;
  • Figure 8 is an isometric view of a frame according to another embodiment of the invention.
  • Figure 9 is an exploded isometric view of a frame according to yet another embodiment of the invention.
  • a frame 1 is of generally rectangular shape and comprises a central floor 2 from each face of which extends a respective upstanding rim 3a, 3b.
  • the accessible floor area is sufficient to contain two hybrid circuits 4 of standard 2 inch by 1 inch (5.08 cm by 2.54 cm) size, one bonded to each face of the floor (only one such circuit is shown in Figure 1) .
  • the circuits each comprise an aluminate substrate 5 upon which tracks 6 are formed together with, for instance, thick film circuits and also conventional hermetically sealed flat packs 7 and surface mounted components 8.
  • the frame shown in Figure 1 comprises two rim halves 3a, 3b, sandwiched about the floor 2. Both faces of the floor are earthed which can therefore act as a ground plane for the hybrid circuits 4.
  • the rim halves 3a, 3b may be formed from an alloy such as Kovar with a copper tungsten floor 2. The whole frame may then be gold-plated.
  • R.F. socket 9 defining a primary R.F. interface to receive a complementary connector is formed within each shorter end 10 of the frame for interconnecting R.F. signals into and out of the circuitry.
  • the detail of the R.F. socket 9 is best shown in Figure 5 and comprises an
  • a 50 ohm glass bead terminal comprises a pin 12 located within an annular bead 13 of glass, as an insulating material.
  • the edge portion of the floor 2 to be located adjacent the bead 13 includes slot 2a into which the bead 13 extends.
  • the glass beads 13 can be located by this slot 2a to act as a self-jigging feature.
  • the face of the floor underlying the portion 12a of the pin 12 which extends inwardly of the frame includes a recess 2b to minimise the chance of any contact between the earthed floor and the pin 12.
  • the socket 9 has the internal features of a S.S.I.S. (sub-mounting slide in series) connector, but which is shorter in an axial direction than the known connectors so that when it is abutted with a chassis wall 15 of predetermined thickness, a standard S.S.I.S. connector (not shown) can be inserted through a hole 16 in the chassis to mate with the pin 12.
  • Providing the main R.F. interface 9 as an integral socket allows the frame to be thinner than would be the case if a suitable connector was attached as a separate item and where there would have to be sufficient
  • the sockets 9 can also be connected to one another using a so called jack-to-jack blind mate connector to be inserted in between and to bridge the two sockets 9.
  • secondary 50 ohm R.F. glass bead terminals 17 are located within the shorter end walls 10 of the frame. Two such terminals 17 are provided at each end of the frame for each hybrid circuit.
  • the floor 2 preferably includes similar recesses 2a, 2b as for the primary R.F. interface 9.
  • the pins of the glass bead terminals 17 provide a secondary R.F. interface for circuit components and allow R.F. connections to be made either to adjacent frames or to remote terminations by means of microwave laminate, P.C.B's, short wires, or semi-rigid cable.
  • Earth pins 18 are also provided on each shorter end wall 10 of the frame and are used to retain the strip-line or P.C.B' ⁇ , where appropriate, and in addition earth bond adjacent frames.
  • the longer side walls 20 of the frame carry conventional glassed-in pins 21, each side wall carrying two parallel arrays of pins, one array for each face of the floor 2.
  • the pins 21 provide digital and D.C. interfaces for the circuit components and allow printed film wiring to
  • the frame includes three mounting lugs 22 which are each spaced apart from the adjacent shorter end wall 10 by an amount equal to the width of the lug, and a fourth lug 22a extending flush with the respective adjacent end wall 10. In this way, by rotating one such frame through 180° with respect to the other, the lugs can interleave, as is best seen in Figure 6.
  • the lugs 22, 22a extend outwardly from the frame for a distance sufficient to allow space to connect the pins 21.
  • the lugs 22, 22a include holes 24 through which tie bars, not shown, can be inserted when the frames are stacked one above the other, as is shown in Figure 7, in which screening between hybrid circuits carried by the frames is provided by the floor of the frame and, if necessary, a metal foil 25 located between adjacent stacked frames.
  • the floor of the chassis 15 within which the hybrid frames are mounted also provides screening. As discussed with reference to Figure 5, R.F. connectors (not shown) may extend through the chassis wall 15 and into the sockets 11.
  • the frames can be as thin as 5.5 mm and this, together with the other features, allows a high packing density as is shown in Figure 7.
  • SUBiSH ⁇ > includes a floor 2 which is formed integrally with the rims 3. Such a frame can be formed by removing, e.g. machining away, excess material from a suitable block thereof.
  • the floor 2 includes, as shown, holes 31 through which hybrid circuits, such as the circuit 4 shown in Figure 1 , can be interconnected.
  • the frame 30 also includes five integrally formed main R.F. interfaces or sockets 9 in one of the shorter end faces 10.
  • FIG. 9 shows yet another embodiment of the invention, in which each wall 41, 42, 43 and 44 of the rims of the frame 40 comprises a planar member formed from a lightweight material such as beryllium.
  • a floor 2 comprising a sheet of beryllium includes castellations 45 along the edges to provide a means of inter-engaging the floor with complementary slots 46 formed in the walls 41-44 defining the two rims.
  • each end of the longer walls 42, 44 includes a tongue 47 to engage a complementary recess 48 in the corresponding the end of the shorter walls 41, 43.
  • Mounting lugs 22 are connected to the longer side walls 42, 44 in similar fashion.
  • the inter-engaging castellations 45 and tongues 47 may be secured in their respective slots 46, 48, by brazing. All the parts, being formed from a planar sheet of material, can be conveniently formed using a photographic mask technique to provide the
  • Beryllium is not only light weight, but has a further advantage in that its thermal conductivity is sufficiently good that it will transfer heat even when it is relatively thin.
  • the main R.F. interfaces 9 are provided by annular cylinders 49 secured within holes 50 in the shorter end walls 41, 43.
  • the digital and/or D.C. pins instead of comprising glassed-in terminals, comprise pins 53 located within thermo-plastic sleeves 54 which are heated so as to rivet the sleeve through the wall and secure the pins 53 in position.
  • the hybrid frames described may also be used for M.I.C. (microwave integrated circuit) purposes when the previously mentioned foil screen could be replaced by a cover bonded to the rim 3 of the frame. This cover may be raised in height to prevent microphony.
  • M.I.C. microwave integrated circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Le bâti d'un circuit hybride comprend un plancher entouré par un rebord vertical respectivement sur chacune de ses faces et dans lequel le plancher forme un plan de mise à la terre servant à monter des circuits sur chacune de ses faces. Les rebords comportent des prises servant à loger des connecteurs haute fréquence transmettant aux circuits des signaux haute fréquence d'entrée et de sortie; les rebords comportent, de plus, des moyens de connexion servant à interconnecter les circuits à des signaux numériques et/ou de courant continu.
PCT/GB1991/001341 1990-08-03 1991-08-05 Conditionnement de circuits hybrides WO1992003031A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9017078.8 1990-08-03
GB9017078A GB9017078D0 (en) 1990-08-03 1990-08-03 Hybrid frame

Publications (1)

Publication Number Publication Date
WO1992003031A1 true WO1992003031A1 (fr) 1992-02-20

Family

ID=10680137

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1991/001341 WO1992003031A1 (fr) 1990-08-03 1991-08-05 Conditionnement de circuits hybrides

Country Status (2)

Country Link
GB (1) GB9017078D0 (fr)
WO (1) WO1992003031A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1555864A1 (fr) * 2004-01-14 2005-07-20 Thomson Licensing S.A. Unité de radiofréquence comprenant des cartes à circuit imprimé empilées

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3548076A (en) * 1968-11-27 1970-12-15 Int Standard Electric Corp Electric circuit package
FR2352480A7 (fr) * 1976-05-21 1977-12-16 Lignes Telegraph Telephon Boitier metallique etanche pour circuit integre micro-onde
US4506108A (en) * 1983-04-01 1985-03-19 Sperry Corporation Copper body power hybrid package and method of manufacture
EP0221809A1 (fr) * 1985-10-16 1987-05-13 Thomson-Csf Circuit hybride et procédé de fabrication d'un tel circuit
EP0233824A2 (fr) * 1986-02-19 1987-08-26 Isotronics, Inc. Boîtiers pour micro-circuits

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3548076A (en) * 1968-11-27 1970-12-15 Int Standard Electric Corp Electric circuit package
FR2352480A7 (fr) * 1976-05-21 1977-12-16 Lignes Telegraph Telephon Boitier metallique etanche pour circuit integre micro-onde
US4506108A (en) * 1983-04-01 1985-03-19 Sperry Corporation Copper body power hybrid package and method of manufacture
EP0221809A1 (fr) * 1985-10-16 1987-05-13 Thomson-Csf Circuit hybride et procédé de fabrication d'un tel circuit
EP0233824A2 (fr) * 1986-02-19 1987-08-26 Isotronics, Inc. Boîtiers pour micro-circuits

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1555864A1 (fr) * 2004-01-14 2005-07-20 Thomson Licensing S.A. Unité de radiofréquence comprenant des cartes à circuit imprimé empilées
WO2005069709A1 (fr) * 2004-01-14 2005-07-28 Thomson Licensing Circuit rf avec plaquettes empilees
US7725095B2 (en) 2004-01-14 2010-05-25 Thomson Licensing RF circuit with stacked printed circuit boards

Also Published As

Publication number Publication date
GB9017078D0 (en) 1990-09-19

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