WO1990016087A3 - Dispositif piezo-electrique a entaille remplie d'air - Google Patents
Dispositif piezo-electrique a entaille remplie d'airInfo
- Publication number
- WO1990016087A3 WO1990016087A3 PCT/US1990/003247 US9003247W WO9016087A3 WO 1990016087 A3 WO1990016087 A3 WO 1990016087A3 US 9003247 W US9003247 W US 9003247W WO 9016087 A3 WO9016087 A3 WO 9016087A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- air
- piezoelectric device
- piezoelectric
- kerf
- filled
- Prior art date
Links
- 239000011159 matrix material Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US36306389A | 1989-06-06 | 1989-06-06 | |
US363,063 | 1989-06-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1990016087A2 WO1990016087A2 (fr) | 1990-12-27 |
WO1990016087A3 true WO1990016087A3 (fr) | 1991-04-18 |
Family
ID=23428633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1990/003247 WO1990016087A2 (fr) | 1989-06-07 | 1990-06-07 | Dispositif piezo-electrique a entaille remplie d'air |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO1990016087A2 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5297553A (en) * | 1992-09-23 | 1994-03-29 | Acuson Corporation | Ultrasound transducer with improved rigid backing |
JP3243047B2 (ja) * | 1993-03-12 | 2002-01-07 | 呉羽化学工業株式会社 | 受波型圧電素子 |
JP3324593B2 (ja) * | 1999-10-28 | 2002-09-17 | 株式会社村田製作所 | 超音波振動装置 |
AT503816B1 (de) * | 2006-06-06 | 2008-01-15 | Piezocryst Advanced Sensorics | Piezoelektrischer sensor |
US8508103B2 (en) * | 2009-03-23 | 2013-08-13 | Sonavation, Inc. | Piezoelectric identification device and applications thereof |
US20190103547A1 (en) | 2017-09-29 | 2019-04-04 | Olympus Scientific Solutions Americas Inc. | Ultrasonic transducer using aerogel as filler material |
CN111403594A (zh) * | 2020-02-26 | 2020-07-10 | 北京信息科技大学 | 一种用于制作高灵敏度水声换能器的敏感元件及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4371805A (en) * | 1979-07-20 | 1983-02-01 | Siemens Aktiengesellschaft | Ultrasonic transducer arrangement and method for fabricating same |
US4640291A (en) * | 1985-06-27 | 1987-02-03 | North American Philips Corporation | Bi-plane phased array for ultrasound medical imaging |
US4728845A (en) * | 1987-06-30 | 1988-03-01 | The United States Of America As Represented By The Secretary Of The Navy | 1-3-0 Connectivity piezoelectric composite with void |
-
1990
- 1990-06-07 WO PCT/US1990/003247 patent/WO1990016087A2/fr unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4371805A (en) * | 1979-07-20 | 1983-02-01 | Siemens Aktiengesellschaft | Ultrasonic transducer arrangement and method for fabricating same |
US4640291A (en) * | 1985-06-27 | 1987-02-03 | North American Philips Corporation | Bi-plane phased array for ultrasound medical imaging |
US4728845A (en) * | 1987-06-30 | 1988-03-01 | The United States Of America As Represented By The Secretary Of The Navy | 1-3-0 Connectivity piezoelectric composite with void |
Also Published As
Publication number | Publication date |
---|---|
WO1990016087A2 (fr) | 1990-12-27 |
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