WO1990015478A3 - Improved three-dimensional circuit component assembly and method corresponding thereto - Google Patents

Improved three-dimensional circuit component assembly and method corresponding thereto Download PDF

Info

Publication number
WO1990015478A3
WO1990015478A3 PCT/US1990/002757 US9002757W WO9015478A3 WO 1990015478 A3 WO1990015478 A3 WO 1990015478A3 US 9002757 W US9002757 W US 9002757W WO 9015478 A3 WO9015478 A3 WO 9015478A3
Authority
WO
WIPO (PCT)
Prior art keywords
carrier package
circuit component
carrier
package assembly
improved
Prior art date
Application number
PCT/US1990/002757
Other languages
French (fr)
Other versions
WO1990015478A2 (en
Inventor
G Mark Berhold
Original Assignee
Trove Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trove Technology Inc filed Critical Trove Technology Inc
Publication of WO1990015478A2 publication Critical patent/WO1990015478A2/en
Publication of WO1990015478A3 publication Critical patent/WO1990015478A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/023—Stackable modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Abstract

A plurality of plate-like circuit component carrier packages (71) are stacked adjacent one to another with the flat faces (72, 74) thereof in contact to form a carrier package assembly (40). Each carrier package houses one or more electrical circuit component (110) coupled to electrical contacts (84, 86) on the flat faces and electrical contacts (98) or upstanding pins (424, 436) on the sides. These cooperate with those of adjacent carrier packages to electrically interconnect with the circuit components therein. A flexible, printed circuit board (50) having an array of contact sites (52) selectively interconnected by printed routing traces (54) is wrapped around the carrier package assembly. The ends of the carrier package assembly are fitted with supporting and electrically interconnecting connector blocks (22, 16). Plural carrier package assemblies are interconnectable directly, by nesting, or through intermediate connecting structures.
PCT/US1990/002757 1989-05-19 1990-05-18 Improved three-dimensional circuit component assembly and method corresponding thereto WO1990015478A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US35576589A 1989-05-19 1989-05-19
US355,765 1989-05-19

Publications (2)

Publication Number Publication Date
WO1990015478A2 WO1990015478A2 (en) 1990-12-13
WO1990015478A3 true WO1990015478A3 (en) 1991-03-21

Family

ID=23398753

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1990/002757 WO1990015478A2 (en) 1989-05-19 1990-05-18 Improved three-dimensional circuit component assembly and method corresponding thereto

Country Status (4)

Country Link
EP (1) EP0428695A4 (en)
JP (1) JPH03506105A (en)
CA (1) CA2033081A1 (en)
WO (1) WO1990015478A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4198498B2 (en) * 2003-03-24 2008-12-17 株式会社モリテックス Manufacturing method of annular oblique illumination device and flexible wiring board
US7112877B2 (en) * 2004-06-28 2006-09-26 General Electric Company High density package with wrap around interconnect
JP4400673B2 (en) * 2007-12-13 2010-01-20 住友金属鉱山株式会社 Three-dimensional circuit board forming apparatus and forming method
DE102008017155B4 (en) * 2008-04-03 2016-08-11 Siemens Healthcare Gmbh Holding device for printed circuit boards on curved surfaces
JP2012156528A (en) * 2012-03-22 2012-08-16 Spansion Llc Laminated type semiconductor device and manufacturing method of laminated type semiconductor device
DE102012205439A1 (en) * 2012-04-03 2013-10-10 Zf Friedrichshafen Ag Circuit substrate for electronic module e.g. mechatronic module of motor vehicle, has connecting element that is arranged on outer surface, for forming electrical connection between contact surfaces of respective conductor layers
US9407021B2 (en) * 2013-12-29 2016-08-02 Continental Automotive Systems, Inc. Compound cylinder PCB connection

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3065384A (en) * 1959-12-18 1962-11-20 Burroughs Corp Modularized electrical network assembly
US3596140A (en) * 1969-12-01 1971-07-27 Ronald A Walsh Demountable peripheral-contact electronic circuit board assembly
US4868712A (en) * 1987-02-04 1989-09-19 Woodman John K Three dimensional integrated circuit package

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT324470B (en) * 1972-11-02 1975-09-10 Gossen Gmbh ARRANGEMENT FOR WIRING ELECTRIC ROTARY SWITCHES WITH MULTIPLE LEVELS OF SWITCHING
US4833568A (en) * 1988-01-29 1989-05-23 Berhold G Mark Three-dimensional circuit component assembly and method corresponding thereto

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3065384A (en) * 1959-12-18 1962-11-20 Burroughs Corp Modularized electrical network assembly
US3596140A (en) * 1969-12-01 1971-07-27 Ronald A Walsh Demountable peripheral-contact electronic circuit board assembly
US4868712A (en) * 1987-02-04 1989-09-19 Woodman John K Three dimensional integrated circuit package

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP0428695A4 *

Also Published As

Publication number Publication date
WO1990015478A2 (en) 1990-12-13
CA2033081A1 (en) 1990-11-20
EP0428695A4 (en) 1991-12-27
EP0428695A1 (en) 1991-05-29
JPH03506105A (en) 1991-12-26

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