WO1989009240A1 - Imide-containing polysiloxanes and a process for preparing them - Google Patents
Imide-containing polysiloxanes and a process for preparing them Download PDFInfo
- Publication number
- WO1989009240A1 WO1989009240A1 PCT/KR1989/000006 KR8900006W WO8909240A1 WO 1989009240 A1 WO1989009240 A1 WO 1989009240A1 KR 8900006 W KR8900006 W KR 8900006W WO 8909240 A1 WO8909240 A1 WO 8909240A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- bismaleimide
- carbon atoms
- formula
- polysiloxane
- poly
- Prior art date
Links
- 0 C*[Si](*)(*)O*(C)*C(CC(C(C)=C1)=O)C1=O Chemical compound C*[Si](*)(*)O*(C)*C(CC(C(C)=C1)=O)C1=O 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
- C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
- C08G77/388—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
Definitions
- the present invention relates to a novel polysiloxanes containing imide terminal groups shown by the following formula(I), and to a process for preparing them. Especially, the present invention relates to the polysiloxanes shown by the following formula(I) which can be effectively used as the modifying agent in the field of synthetic resins.
- R 1 and R 2 independent of each other, represent methyl, ethyl, propyl or phenyl;
- R 3 represents an alkylene having carbon atoms of 1 to 8 or an alkyl substituted alkylene having carbon atoms of 1 to 8, whose terminals include secondary amine groups;
- n represents an integer of 30 to 400, which indicates the degree of polymerization of the polysiloxane;
- A represents a divalent group having carbon atoms of at least 2, preferably 2 to 20.
- thermosetting resins such as unsaturated polyester, epoxy resins and the like
- thermosetting resins such as unsaturated polyester, epoxy resin, polyamide and so on.
- An object of the present invention is to provide new polysiloxanes whose both terminals are substituted by imide groups, which are shown by the formula(I).
- Another object of the present invention is to provide a process for preparing the polysiloxanes containing imide terminal groups which are shown by the formula(I).
- the present invention relates to the polysiloxanes containing terminal groups shown by the following formula(I), which may be prepared by the Michael addition reaction of a bismaleimide shown by the following formula(II) and a polysiloxane shown by the following formula(III) at a temperature of 110 to 150°C
- R 1 and R 2 independent of each other, represent methyl, ethyl, propyl or phenyl;
- R 3 represents an alkylene having carbon atoms of 1 to 8 or an alkyl substituted alkylene having carbon atoms of 1 to 8, whose terminals include secondary amine groups;
- R 3 ' represents a primary amine corresponding to R 3 ;
- n represents an integer of 30 to 400, which indicates the degree of polymerization of the polysiloxane;
- A represents a divalent group having carbon atoms of at least 2, preferably 2 to 20; and
- B represents a divalent group having carbon atoms of at least 2, preferably 2 to 6, which contains a carbon-carbon double bond.
- the bismaleimides of the formula(II) include, for example, N,N'-1 ,3-phei ⁇ ylene bismaleimide, N,N'-4,4'--diphenylmethane bismaleimide, N',N' -4,4'-diphenylether bismaleimide, N',N'-4,4'-diphenylsulfone bismaleimide, N,N'-3,4'-diphenylsulfone bismaleimide, N,N'-4,4'-dimethylcyclohexane bismaleimide, N,N'-4, 4'-diphenylcyclohexane bismaleimide, N,N'-1,3-xylilene bismaleimide, 2,4-bismaleimide toluene, 2,6-bismaleimide toluene, and so on.
- the polysiloxanes of the formula(III) include, for example, poly(dimethyl siloxane), poly(methylphenyl siloxane), poly(epoxy modified siloxane), poly(dimethyl siloxane)-co-poly(diphenyl siloxane), fatty acid-modified polysiloxane, polysiloxane-polyether copolymer, and so on.
- the bismaleimide of the formula(II) is preferably used in an amount of 3 to 10 parts by weight, more preferably 4 to 7 parts by weight, to the polysiloxane of the formula(III) of 30 to 100 parts by weight, more preferably 40 to 60 parts by weight.
- the polysiloxanes containing imide terminal groups of the formula(I) which are prepared in accordance with the present invention have some advantages, for example, they have good compatibility with organic resins, and then they can be preferably used as the modifying agents thermosetting resins such as unsaturated polyester, epoxy resins, polyamide, etc. and also thus modified resins show markedly shortened flash lengths when molded.
- the obtained composition was melt-mixed using a mixer such as an extruder, a kneader and rolls. After suddenly cooling down the composition in the stage B to room temperature and finely pulverizing it, the pulverized composition was put in an aluminum mold preheated to 175 °C, and cured for 3 minutes.
- a mixer such as an extruder, a kneader and rolls.
- the resin compositions which comprise the polysiloxanes containing imide terminal groups according to the present invention, have considerably short flash lengths, improved flexural strength, and then excellent, processability.
- the present invention provides novel polysiloxanes containing imide terminal groups which are shown by the formula (I) and which can be effectively used as a modifying agent for synthetic resins.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Silicon Polymers (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Epoxy Resins (AREA)
Abstract
Disclosed are novel polysiloxanes containing imide terminal groups shown by formula (I) which can be prepared by the Michael addition reaction of a bismaleimide and a reactive polysiloxane. The polysiloxanes according to the present invention are useful as a modifying agent for synthetic resins. In said formula, R1 and R2, independent of each other, represent methyl, ethyl, propyl or phenyl; R3 represents an alkylene having carbon atoms of 1 to 8 or an alkyl substituted alkylene having carbon atoms of 1 to 8, whose terminals include secondary amine groups; n represents an integer of 30 to 400, which indicates the degree of polymerization of the polysiloxane; and A represents a divalent group having carbon atoms of at least 2, preferably 2 to 20.
Description
IMIDE-CONTAINING POLYSILOXANES AND A PROCESS FOR PREPARING THEM
TECHNICAL FIELD
The present invention relates to a novel polysiloxanes containing imide terminal groups shown by the following formula(I), and to a process for preparing them. Especially, the present invention relates to the polysiloxanes shown by the following formula(I) which can be effectively used as the modifying agent in the field of synthetic resins.
wherein R1 and R2, independent of each other, represent methyl, ethyl, propyl or phenyl; R3 represents an alkylene having carbon atoms of 1 to 8 or an alkyl substituted alkylene having carbon atoms of 1 to 8, whose terminals include secondary amine groups; n represents an integer of 30 to 400, which indicates the degree
of polymerization of the polysiloxane; and A represents a divalent group having carbon atoms of at least 2, preferably 2 to 20.
Recently, there have been widely known various plastics which have been modified with siloxane compounds.
For the purpose of modifying synthetic resins, polysiloxanes containing hydroxy terminal groups have been already used. In the GB patent No. 880,022, there is disclosed the method that a polyoxyalkylene is reacted with a polysiloxane containing two alkoxy groups at ends to give polyoxyalkylene-polysiloxanediol block copolymers.
Also, a process for preparing new polysiloxanes containing hydroxy terminal groups is proposed in the US patent No. 3,981,898, in which polysiloxanes containing hydroxy terminal groups are prepared by reacting polysiloxanes with polyols and diols.
But, when said polysiloxanes were used as the modifying agents of the thermosetting resins such as unsaturated polyester, epoxy resins and the like, there was disadvantage in that an excess
of flash was occurred during the molding process.
On the other hand, in the DE patent No. 1,618,836, there are used trisiloxanols, having hydroxy groups directly bonded to Si atoms, as the plastic modifier. However, such siloxanol compounds have a disadvantage that it is difficult to process them with organic resins and hence they cannot be suitably used as modifying agents for synthetic resins.
Therefore, the present inventors have eagerly studied to overcome the prior disadvantages as described above, and consequently we have developed novel polysiloxanes containing imide terminal groups which are effectively used as a modifying agent for especially thermosetting resins such as unsaturated polyester, epoxy resin, polyamide and so on.
SUMMARY OF THE INVENTION An object of the present invention is to provide new polysiloxanes whose both terminals are substituted by imide groups, which are shown by the formula(I).
Another object of the present invention is to provide a process for preparing the polysiloxanes containing imide terminal groups which are shown by the formula(I).
DISCLOSURE OF THE INVENTION
The present invention relates to the polysiloxanes containing terminal groups shown by the following formula(I), which may be prepared by the Michael addition reaction of a bismaleimide shown by the following formula(II) and a polysiloxane shown by the following formula(III) at a temperature of 110 to 150°C
wherein
R1 and R2, independent of each other, represent methyl, ethyl, propyl or phenyl;
R3 represents an alkylene having carbon atoms of 1 to 8 or an alkyl substituted alkylene having carbon atoms of 1 to 8, whose terminals include secondary amine groups; R3' represents a primary amine corresponding to R3; n represents an integer of 30 to 400, which indicates the degree of polymerization of the polysiloxane; A represents a divalent group having carbon atoms of at least 2, preferably 2 to 20; and B represents a divalent group having carbon atoms of at least 2, preferably 2 to 6, which contains a carbon-carbon double bond.
In the present invention, the bismaleimides of the formula(II) include, for example, N,N'-1 ,3-pheiιylene bismaleimide, N,N'-4,4'--diphenylmethane bismaleimide, N',N' -4,4'-diphenylether bismaleimide, N',N'-4,4'-diphenylsulfone bismaleimide, N,N'-3,4'-diphenylsulfone bismaleimide, N,N'-4,4'-dimethylcyclohexane bismaleimide, N,N'-4, 4'-diphenylcyclohexane bismaleimide, N,N'-1,3-xylilene bismaleimide, 2,4-bismaleimide toluene, 2,6-bismaleimide toluene, and so on.
And, the polysiloxanes of the formula(III) include, for example, poly(dimethyl siloxane), poly(methylphenyl siloxane), poly(epoxy
modified siloxane), poly(dimethyl siloxane)-co-poly(diphenyl siloxane), fatty acid-modified polysiloxane, polysiloxane-polyether copolymer, and so on.
According to the present invention, the bismaleimide of the formula(II) is preferably used in an amount of 3 to 10 parts by weight, more preferably 4 to 7 parts by weight, to the polysiloxane of the formula(III) of 30 to 100 parts by weight, more preferably 40 to 60 parts by weight.
The polysiloxanes containing imide terminal groups of the formula(I) which are prepared in accordance with the present invention have some advantages, for example, they have good compatibility with organic resins, and then they can be preferably used as the modifying agents thermosetting resins such as unsaturated polyester, epoxy resins, polyamide, etc. and also thus modified resins show markedly shortened flash lengths when molded.
This invention will be further described in detail with the following examples. It should be noted that the present invention is not limited to these examples.
And, the material properties of the resin compositions which have been prepared by Examples and Comparative examples were evaluated
by the method as follows:
Flexural Strength ; ASTM D-790 Flexural Modulus ; ASTM D-790
Preparation 1
50g of reactive poly(dimethyl siloxane; were put in a 100mℓ threeneck flask equipped with a stirrer and a thermometer, and preheated to 130 ºC. After 5g of N,N'-4,4'-diphenylmethane bismaleimide were added therein, the mixture was reacted for 10 minutes at 130 °C with stirring. When the reaction mixture turns into a highly viscous phase, and it was cooled down to room temperature to give the objective polysiloxane. Elementary Analysis
N ; 1.8%, C ; 33.2%, H; 8.28% IR (cm-1) -NH2 ; v = 3,600 (disappeared in the reaction product)
-NH ; v - 3,750 -C-N ; v = 1,350
Preparation 2 50g of reactive poly(methylphenyl siloxane) and 6.5g of N,N'-
diphenylether bismaleimide were put in a 100mℓ three-neck flask equipped with a stirrer and a thermometer. The reaction mixture was heated for 10 minutes at 140°C with stirring. At the completion of the reaction, the highly viscous reaction mixture was cooled down to room temperature to give the objective polysilioxane. Elementary Analysis
N ; 2.1%, C ; 32.5%, H; 7.4% IR (cm-1) -NH2 ; v = 3,610 (disappeared in the reaction product) -NH ; v = 3,730 -C-N ; v = 1,320
NMR(ppm) -N-H ; δ = 0.6
Example 1
5g of the polysiloxane obtained by Preparation 1 and 95g of cresol novolak epoxy resin having epoxide equivalent weight of 213 were put in a 300mℓ three-neck flask equipped with a stirrer and a thermometer and intensely stirred for about an hour at 150~160 ºC to obtain a resin mixture. The obtained mixture was designated as Mixture A. After cooling down the mixture to room temperature, 80g of this mixt ure were mixed in a mechanical mixer with 40g of phenol
novolak resin having hydroxy equivalent weight of 306, as curing agent, 1.1g of triphenyl phosphine as curing accelerator, 3g of calcium stearate as releasing agent, and 337g of silica powder.
The obtained composition was melt-mixed using a mixer such as an extruder, a kneader and rolls. After suddenly cooling down the composition in the stage B to room temperature and finely pulverizing it, the pulverized composition was put in an aluminum mold preheated to 175 °C, and cured for 3 minutes.
At this moment, the aluminum molds which had gaps of 0.005, 0.01 and 0.02 inch, were used for measuring the length of flash produced during molding process.
Then, the cured composition was used for measuring the material properties, and the results were shown in Table 1.
Example 2
5g of the polysiloxane obtained by Preparation 2 and 95g of the resin composition prepared by Example 1 were put in a 300mℓ threeneck flask equipped with a stirrer and a thermometer, and intensely stirred for about an hour at 150~160°C. Thus obtained mixture was designated as Mixture B. After cooling down the mixture to room
temperature, 80g of this mixture were mixed in a mechanical mixer with the same additives as the foregoing Example 1.
Hereinafter the procedure was the same as in Example 1, and then the results were shown in Table 1.
Comparative example 1
5g of the poly(dimethyl siloxane) used in Preparation 1 and 95g of the epoxy resin used in Example 1 were put in a 300mℓ three-neck flask equipped with a stirrer and a thermometer, and intensely stirred for about an hour at 150~160ºC. The obtained mixture was designated as Mixture C. After cooling down the mixture to room temperature, 80g of this mixture were mixed in a mechanical mixer with the same additives as used in Example 1.
Hereinafter the procedure was the same as in Example 1, and the results were shown in Table 1.
Comparative example 2
5g of the poly(methylphenyl siloxane) used in Preparation 2 and
95g of the epoxy resin used in the Example 1 were put in a 300mℓ three-neck flask equipped with a stirrer and a thermometer, and
intensely stirred for about an hour at 150~160°C. The obtained mixture was designated as Mixture D. After cooling down the mixture to room temperature, 80g of this mixture were mixed in a mechanical mixer with the same additives as used in Example 1.
Hereinafter the procedure was the same as in Example 1, and the results were shown in Table 1.
As shown in Table 1. the resin compositions, which comprise the polysiloxanes containing imide terminal groups according to the present invention, have considerably short flash lengths, improved flexural strength, and then excellent, processability.
In conclusion, the present invention provides novel polysiloxanes containing imide terminal groups which are shown by the formula (I) and which can be effectively used as a modifying agent for synthetic resins.
Claims
1. Polysiloxanes containing imide terminal groups which are shown by the formula(I)
wherein R1 and R2, independent of each other, represent methyl, ethyl, propyl or phenyl; R3 represents an alkylene having carbon atoms of 1 to 8 or an alkyl substituted alkylene having carbon atoms of 1 to 8, whose terminals include secondary amine groups; n represents an integer of 30 to 400, which indicates the degree of polymerization of the polysiloxane; and A represents a divalent group having carbon atoms of at least 2, preferably 2 to 20.
2. A process for preparing the polysiloxanes containing imide groups shown by the formula(I), which is characterized by comprising the Michael addition reaction of a bismaleimide shown by the formula (II) and a polysiloxane shown by the formula(III) at a temperature of 110 to 150ºC.
wherein
R1 and R2, independent of each other, represent methyl, ethyl, propyl or phenyl; R3 represents an alkylene having carbon atoms of 1 to 8 or an alkyl substituted alkylene having carbon atoms of 1 to 8, whose terminals include secondary amine groups; R3' represents a primary amine corresponding to R3; n represents an integer of 30 to 400, which indicates the degree of polymerization of the polysiloxane; A represents a divalent group having carbon atoms of at least 2, preferably 2 to 20; and B represents a divalent group having carbon atoms of at least 2, preferably 2 to 6, which contains a carbon-carbon double bond.
3. The process according to Claim 2, in which the bismaleimide shown by the formula(II) is selected from the group consisting of N,N'-1,3- phenylene bismaleimide, N,N'-4,4'-diphenylmethane bismaleimide, N,N'- 4,4'-diphenylether bismaleimide, N,N'-4,4'-diphenylsulfone bismaleimide, N,N'-3,4'-diphenylsulfone bismaleimide, N,N'-4,4'-dicyclohexylmethane bismaleimide, N,N'-4,4'-dimethylcyclohexane bismaleimide, N,N'-4,4'- diphenyleyelohexane bismaleimide, N,N'-1,3-xylilene bismaleimide, 2,4- bismaleimide toluene, and 2,6-bismaleimide toluene.
4. The process according to Claim 2, in which the polysiloxane shown by the formula(III) is selected from the group consisting of poly(dimethyl siloxane), poly(methylphenyl siloxane), poly(epoxy-modified siloxane), poly(dimethyl siloxane)-co-poly(diphenyl siloxane), fatty acid-modified polysiloxane, and polysiloxane-polyether copolymer .
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT89904255T ATE90705T1 (en) | 1988-03-22 | 1989-03-22 | IMIDE POLYSILOXANE AND METHOD OF PREPARATION. |
DE8989904255T DE68907206D1 (en) | 1988-03-22 | 1989-03-22 | IMIDOUS POLYSILOXANS AND METHOD FOR PRODUCING THE SAME. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019880003067A KR910005771B1 (en) | 1988-03-22 | 1988-03-22 | Polyimide siloxan and preparation for the poly imide siloxane |
KR1988/3067 | 1988-03-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1989009240A1 true WO1989009240A1 (en) | 1989-10-05 |
Family
ID=19273010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR1989/000006 WO1989009240A1 (en) | 1988-03-22 | 1989-03-22 | Imide-containing polysiloxanes and a process for preparing them |
Country Status (7)
Country | Link |
---|---|
US (1) | US5061774A (en) |
EP (1) | EP0395744B1 (en) |
JP (1) | JPH02501834A (en) |
KR (1) | KR910005771B1 (en) |
AT (1) | ATE90705T1 (en) |
DE (1) | DE68907206D1 (en) |
WO (1) | WO1989009240A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2279958A (en) * | 1993-07-13 | 1995-01-18 | Kobe Steel Europ Ltd | Siloxane-imide block copolymers for toughening epoxy resins |
CN104356388A (en) * | 2014-11-25 | 2015-02-18 | 苏州大学 | Flame-retardant bismaleimide resin and preparation method thereof |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69029104T2 (en) * | 1989-07-12 | 1997-03-20 | Fuji Photo Film Co Ltd | Polysiloxanes and positive working resist |
US5180627A (en) * | 1990-11-30 | 1993-01-19 | Ube Industries, Ltd. | Heat resistant adhesive composition |
US5300627A (en) * | 1991-10-17 | 1994-04-05 | Chisso Corporation | Adhesive polyimide film |
US5241041A (en) * | 1991-12-16 | 1993-08-31 | Occidental Chemical Corporation | Photocrosslinkable polyimide ammonium salts |
JP5375094B2 (en) * | 2008-01-28 | 2013-12-25 | 東レ株式会社 | Siloxane resin composition |
US11559958B2 (en) | 2015-07-23 | 2023-01-24 | Bridgestone Americas Tire Operations, Llc | Degradable foam-containing tires, related methods and kits for adding degradable foam to tires |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1364166A (en) * | 1972-05-02 | 1974-08-21 | Gen Electric | Aliphatically unsaturated organopolysiloxanes |
GB2109390A (en) * | 1981-10-01 | 1983-06-02 | Ciba Geigy Ag | Light-crosslinkable polysiloxanes |
US4517342A (en) * | 1983-06-23 | 1985-05-14 | General Electric Company | Heat curable compositions |
US4582886A (en) * | 1984-02-27 | 1986-04-15 | General Electric Company | Heat curable epoxy resin compositions and epoxy resin curing agents |
US4630086A (en) * | 1982-09-24 | 1986-12-16 | Hitachi, Ltd. | Nonvolatile MNOS memory |
EP0284519A1 (en) * | 1987-02-24 | 1988-09-28 | Ciba-Geigy Ag | Bismaleimide siloxanes and process for their preparation |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB802688A (en) * | 1954-06-10 | 1958-10-08 | Union Carbide Corp | Improvements in or relating to organo-silicon compounds |
FR1491413A (en) * | 1966-06-27 | 1967-08-11 | Rhone Poulenc Sa | Preparation of organotrisiloxanes |
CH591535A5 (en) * | 1974-03-25 | 1977-09-30 | Ciba Geigy Ag | |
FR2612195B1 (en) * | 1987-03-10 | 1989-06-16 | Rhone Poulenc Chimie | THERMOSTABLE POLYMERS BASED ON MALEIMIDES INCLUDING A BISMALEIMIDE SILOXANE AND DIAMINES SILOXANE AND THEIR PREPARATION METHODS THEREOF |
-
1988
- 1988-03-22 KR KR1019880003067A patent/KR910005771B1/en not_active IP Right Cessation
-
1989
- 1989-03-22 EP EP89904255A patent/EP0395744B1/en not_active Expired - Lifetime
- 1989-03-22 AT AT89904255T patent/ATE90705T1/en not_active IP Right Cessation
- 1989-03-22 DE DE8989904255T patent/DE68907206D1/en not_active Expired - Lifetime
- 1989-03-22 JP JP1503641A patent/JPH02501834A/en active Granted
- 1989-03-22 US US07/435,442 patent/US5061774A/en not_active Expired - Lifetime
- 1989-03-22 WO PCT/KR1989/000006 patent/WO1989009240A1/en active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1364166A (en) * | 1972-05-02 | 1974-08-21 | Gen Electric | Aliphatically unsaturated organopolysiloxanes |
GB2109390A (en) * | 1981-10-01 | 1983-06-02 | Ciba Geigy Ag | Light-crosslinkable polysiloxanes |
US4630086A (en) * | 1982-09-24 | 1986-12-16 | Hitachi, Ltd. | Nonvolatile MNOS memory |
US4517342A (en) * | 1983-06-23 | 1985-05-14 | General Electric Company | Heat curable compositions |
US4582886A (en) * | 1984-02-27 | 1986-04-15 | General Electric Company | Heat curable epoxy resin compositions and epoxy resin curing agents |
EP0284519A1 (en) * | 1987-02-24 | 1988-09-28 | Ciba-Geigy Ag | Bismaleimide siloxanes and process for their preparation |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2279958A (en) * | 1993-07-13 | 1995-01-18 | Kobe Steel Europ Ltd | Siloxane-imide block copolymers for toughening epoxy resins |
GB2279958B (en) * | 1993-07-13 | 1997-11-05 | Kobe Steel Europ Ltd | Siloxane-imide block copolymers for toughening epoxy resins |
CN104356388A (en) * | 2014-11-25 | 2015-02-18 | 苏州大学 | Flame-retardant bismaleimide resin and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
KR890014631A (en) | 1989-10-25 |
DE68907206D1 (en) | 1993-07-22 |
EP0395744A1 (en) | 1990-11-07 |
EP0395744B1 (en) | 1993-06-16 |
US5061774A (en) | 1991-10-29 |
KR910005771B1 (en) | 1991-08-03 |
JPH0542967B2 (en) | 1993-06-30 |
ATE90705T1 (en) | 1993-07-15 |
JPH02501834A (en) | 1990-06-21 |
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