WO1986003620A2 - Process for forming diffusion regions in a semiconductor substrate - Google Patents
Process for forming diffusion regions in a semiconductor substrate Download PDFInfo
- Publication number
- WO1986003620A2 WO1986003620A2 PCT/US1985/002302 US8502302W WO8603620A2 WO 1986003620 A2 WO1986003620 A2 WO 1986003620A2 US 8502302 W US8502302 W US 8502302W WO 8603620 A2 WO8603620 A2 WO 8603620A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- diffusion regions
- layer
- heating
- regions
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 46
- 238000009792 diffusion process Methods 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000004065 semiconductor Substances 0.000 title claims abstract description 12
- 239000002019 doping agent Substances 0.000 claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 5
- 239000003989 dielectric material Substances 0.000 claims abstract description 4
- 238000002955 isolation Methods 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052785 arsenic Inorganic materials 0.000 claims description 6
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 6
- 229910052796 boron Inorganic materials 0.000 claims description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims description 6
- 239000011574 phosphorus Substances 0.000 claims description 6
- 239000012535 impurity Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 2
- 230000001590 oxidative effect Effects 0.000 claims description 2
- 239000012212 insulator Substances 0.000 abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 15
- 229910052710 silicon Inorganic materials 0.000 description 15
- 239000010703 silicon Substances 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 238000001020 plasma etching Methods 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 238000005204 segregation Methods 0.000 description 6
- 235000012239 silicon dioxide Nutrition 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000012876 topography Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 238000010849 ion bombardment Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- QKCGXXHCELUCKW-UHFFFAOYSA-N n-[4-[4-(dinaphthalen-2-ylamino)phenyl]phenyl]-n-naphthalen-2-ylnaphthalen-2-amine Chemical compound C1=CC=CC2=CC(N(C=3C=CC(=CC=3)C=3C=CC(=CC=3)N(C=3C=C4C=CC=CC4=CC=3)C=3C=C4C=CC=CC4=CC=3)C3=CC4=CC=CC=C4C=C3)=CC=C21 QKCGXXHCELUCKW-UHFFFAOYSA-N 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000004151 rapid thermal annealing Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76237—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials introducing impurities in trench side or bottom walls, e.g. for forming channel stoppers or alter isolation behavior
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
- H01L21/2255—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer comprising oxides only, e.g. P2O5, PSG, H3BO3, doped oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/92—Capacitors having potential barriers
- H01L29/94—Metal-insulator-semiconductors, e.g. MOS
- H01L29/945—Trench capacitors
Definitions
- This invention relates to processes of the kind for forming diffusion regions in a semiconductor substrate.
- the invention has a particular application where the diffusion regions form channel stop structures, either alone, or in combination with trench isolation structures.
- VLSI integrated circuit structures are being scaled to ever smaller minimum feature sizes and separations to provide greater device densities and faster operation speeds.
- the minimum feature size and the minimum feature separation depend in part upon the minimum mask dimensions that are available for the particular lithographic process. These, in turn, depend upon various factors, including the lithographic process itself, the wafer topography, and the feature change associated with the particular process step (etching, implanting, diffusion).
- Figure 1 illustrates a desirable NMOS FET 11, which incorporates narrow channel stops 12 along the vertical semiconductor sidewalls of trench structures 13.
- the NMOS FET 11 is part of a CMOS (complementary MOS) structure and is formed in the p-well 14 of an n-type epitaxial layer 15.
- the FET 11 includes heavily doped source and drain regions 16 and 17 and LDD (lightly doped drain) regions 18, all of which are self-aligned with the conductively doped polysilicon gate 19.
- the FET IC structure also includes gate oxide sidewall spacers 21, interlevel dielectric 22, and aluminum interconnect 23.
- the prevalent techniques for forming channel stops involve the application of conventional lithographic masking and doping and thus are subject to the relatively large alignment tolerances associated with conventional lithographic masking, and variability in lateral diffusions of the channel stop regions during dopant drive cycle. For such reasons, conventional techniques are not suitable for forming the narrow channel stop structure shown in Figure 1.
- U.S. Patent No. 4,209,350 discloses a process of forming channel stops using deposition and reactive ion etching, and avoids the use of a lithographic mask, per se, in defining the width of the channel stops.
- the horizontal/lateral width of the channel stop diffusion regions is defined by the corresponding dimension of an overlying, highly doped layer which is the source of the impurity dopant for the diffusion region.
- This known process is illustrated in perhaps its broadest aspect by the formation of the channel stops 27 shown in Figure 2 herein.
- These channel stops are formed as follows. First, a diffusion barrier layer 28 of silicon dioxide or the like is formed on the semiconductor substrate 29. Reactive ion etching (RIE) is then applied to form openings 31 in the diffusion barrier layer 28.
- RIE reactive ion etching
- a doped insulator or polysilicon source layer is deposited on the diffusion barrier layer 28 and reactive ion etched to remove the horizontal portions of the layer and leave only the vertical sections 32 on the sidewalls of the diffusion barrier layer 28.
- the substrate channel stops 27 are then formed by vertical diffusion from the bottom of residual sections 32.
- the deposited thickness of dopant source layer 32 on the sidewalls of diffusion barrier layer 28 determines the width of the channel stops 27.
- the known process uses the sidewalls of a first layer to locate a second doped layer for vertical diffusion into an underlying substrate.
- Diffusion barrier layer 28 blocks lateral diffusion from the layers 32 so that the diffusion is directed vertically downward into the substrate 29.
- a process for forming diffusion regions in a semiconductor substrate characterized by the steps of: etching selected substrate regions to form substantially vertical sidewalls in said substrate; forming a layer of doped material over the resulting surface including the vertical sidewalls and horizontal surfaces; applying an anisotropic etch medium to said layer to remove said layer from the substrate surface except for sidewall sections over said vertical sidewalls; and heating the resulting structure to effect the diffusion of dopant from said sidewall sections into said substrate to form said diffusion regions.
- a further advantage of the invention is that the process is readily and precisely controllable to provide desired dimensions and concentration levels for the diffusion regions.
- a preferred embodiment of the invention involves forming shallow diffusion regions in vertically disposed surfaces of a semiconductor substrate, by forming a layer of doped dielectric material such as silicon dioxide on the surface topography of the substrate, including the vertical sidewall regions; etching the substrate to remove the horizontal sections of the dielectric layer while leaving intact the vertical sidewall sections; and heating the structure to drive dopant from the vertical sidewall layer sections into the substrate vertical sidewalls, whereby the segregation coefficient of the dopant in silicon and the dielectric, or selective heating of the glass, concentrates the impurity at the silicon dielectric interface.
- doped dielectric material such as silicon dioxide
- the preferred process is applied to forming combined channel stop-trench isolation structures by removing the doped dielectric layer, then filling in the etched regions with dielectric material.
- well implant regions such as those used for CMOS integrated circuits, may be formed between the trench structures prior to or subsequent to depositing and driving in the channel stop dopant.
- the horizontal/lateral doping concentration and profile of the channel stop diffusions are controlled by the dopant impurity concentration of the dielectric layer, the sidewall thickness of the dielectric layer and the time/temperature product of the anneal as well as the above-mentioned segregation coefficients.
- Fig. 1 is a cross-section through a preferred integrated circuit structure having channel stops formed in the vertical sidewalls of trench isolation structures;
- Figs. 2 and 3 are schematic cross-sectional representations of a partially completed, integrated circuit illustrating prior art techniques for fabri ⁇ cating substrate diffusion regions/channel stops; and Figs. 4 through 8 schematically represent cross-sections taken through an integrated circuit structure during the sequence of fabricating channel stops or combined channel stop-trench isolation struc ⁇ tures in accordance with the present invention.
- the present channel stopper process uses the relative segregation coefficients of boron in silicon and in silicon dioxide or other suitable dielectric to thermally drive the boron into substrate trench side- walls from borosilicate glass which is formed on the sidewalls.
- the process is completely compatible with the self-aligned gate technique.
- the approach eliminates the constraints of both litho ⁇ graphic mask formation and vertical diffusion which heretofore limited the minimum feature size of channel stopper regions.
- the channel stop formation process is readily and precisely controllable to provide the desired dimensions and concentration levels.
- the channel stop process is ideally suited to integration with trench isolation fabrication techniques and to the formation of com ⁇ bined trench isolation and channel stop structures.
- FIG. 4 A typical starting structure for the fabrication of a combined channel stop-trench isolated structure is shown in Fig. 4 as a p ⁇ silicon substrate 40 having a resistivity of 1 to 20 ohm- centimeters.
- the substrate could actually comprise a p-well formed within a n- epitaxial layer, as depicted in Fig. 1.
- etch mask 40 is masked using any of a number of materials in ⁇ cluding silicon nitride, silicon dioxide or combina ⁇ tions thereof, as well as by the exemplary photoresist mask 41.
- mask compositions suitable for X-ray or ion beam exposure can be used.
- photo ⁇ resist a layer thereof is formed on the substrate, then is exposed and developed to produce the etch mask
- trenches 43 are etched to a typical depth of 1 to 6 microns, preferably using an aniso ⁇ tropic etch process such as plasma etching or reactive ion etching (RIE) .
- RIE reactive ion etching
- a fluorine etchant gas such as nitrogen trifluoride (NF3) .
- the mechanical component or ion bombardment component 48 dominates the chemical reac- tion component and provides the vertical sidewalls which are desirable in order to provide minimal lateral width in the subsequently formed channel stops and trench isolation structures.
- the mask 41 is removed such as by a plasma ashing process using, for example, an CHF3 etchant gas.
- a highly doped insulator layer 49 is formed on the substrate surface topography, includ ⁇ ing the trench sidewalls. Boron dopant is preferred for its segregation coefficient. However, phosphorus or arsenic can be used if selective heating such as by a 10.6 micrometers CO2 laser is used to heat the doped insulator significantly more than the silicon.
- the layer 49 can be doped after its formation, for example by thermal oxidation in steam or by chemical vapor deposition. Preferably, however, the insulator layer 49 is doped during formation.
- the doped dielectric layer 49 is borosilicate (or phospho- silicate or arsenic-doped) glass which is conformally deposited to a thickness of about 0.1 micrometers to
- the layer is formed using a low pressure, plasma assisted chemical vapor deposition reactor and using, e.g., the reactant gases SiH4 and N2O and BF3 (or PH3) as the dopant gas at a tem ⁇ perature of 380°C and pressure of one Torr.
- the reactant gases SiH4 and N2O and BF3 or PH3
- the thickness and doping level of the layer 49 is chosen in conjunction with the time/temperature product of the subsequent drive-in into the silicon substrate to control the concentration of the result ⁇ ing channel stops.
- the next step is to again subject the surface topography to an anisotropic etch process, this time to remove those portions of the glass layer 49 which are formed on the horizontal surfaces 44 and 47, while retaining the vertical sections on the trench side ⁇ walls, so as to create the structure shown in Fig. 6.
- An anisotropic etch process is reactive etching using CHF3 etchant gas.
- the ion bombardment component dominates the chemical reaction component and, in this case, removes the horizontal portions of the dielectric layer 49 without removing the vertical sidewall sections 49V.
- anisotropic etching of an insulator layer is described in Pogge, U.S. 4,256,514.
- trench structures are formed in a silicon substrate, and an insulator layer such as silicon oxide is formed on the resulting horizontal and vertical surfaces.
- the insulator layer is then etched to remove the layer from the floor of the trench, so that the sections of the layer on the vertical sidewalls of the trench define a narrow diffusion mask.
- substrate 40 as depicted in Fig. 6 included a well, such as p-well 14 in epi layer 15 as depicted in Fig. 1, the substrate would have to be photolithographically processed to mask the desired segments of trench sidewall oxide 49V while the ex ⁇ posed segments were removed with an isotrophic etch.
- doped oxide segments 49V should be retained by such masking only where the channel stop is to be created by the diffusion of a dopant opposite that previously characterizing the trench wall.
- the next step in progression from Fig. 6 to Fig. 7 is to laterally drive-in the boron dopant from the trench sidewall oxide 49V into the silicon trench sidewalls 46.
- Rapid thermal annealing or furnace diffusion can be used to form channel stops 12 about 0.1 - 0.2 micrometers in depth.
- a furnace annealing temperature of about 900 to 1100°C in a non-oxidizing ambient such as nitrogen ambient applied for about 2 to 5 hours provides channel stops 12 of approximately 1013 atoms per c concentration and 0.1 micrometers effective diffusion depth into the trench sidewall.
- the direction and magnitude of the diffusion is based on the segregation coefficient of boron in silicon vs. silicon dioxide.
- phosphorus doped (phosphosilicate) or arsenic doped glass 49 can be used.
- their segregation coefficients are such that phosphorus and arsenic tend to segregate to the silicon.
- selective heating can be used to control the tendency to segregate to the silicon and provide very shallow, controllable doping.
- a CO2 laser operating at 10.6 micrometers will selectively heat the arsenic doped or phosphorus doped glass while the silicon remains relatively transparent to the laser and thus relatively cool.
- the hot glass adjacent the cooler silicon outdiffuses phosphorus or arsenic in a shallow, 0.1 micrometers wide diffusion 12 along the silicon trench sidewalls.
- the trench structures 13 are completed as shown in Fig. 8 by forming dielectric layers 51 of silicon dioxide in the trenches.
- the oxide can be deposited by low pressure chemical vapor deposition using the reaction gases SiH4 and 02, a temperature of 450°C and pressure of one Torr.
- the above process is readily integrated into IC fabrication sequences.
- the well implants used in CMOS structures can be formed either prior to or after the doping of the substrate side- walls.
- channel stop thermal drive-in parameters may be altered to accommodate the subse ⁇ quent thermal processing of the substrate in order to provide the desired final channel stop dimension and dopant profile in the completed IC structure.
- CMOS complementary metal-oxide-semiconductor
- bipolar structures including NMOS, PMOS, CMOS and bipolar structures.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Element Separation (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8585906019T DE3574077D1 (en) | 1984-12-10 | 1985-11-25 | Process for forming diffusion regions in a semiconductor substrate |
JP60505264A JPH0628283B2 (en) | 1984-12-10 | 1985-11-25 | Method for forming diffusion region in semiconductor substrate |
DE1985906019 DE204752T1 (en) | 1984-12-10 | 1985-11-25 | METHOD FOR PRODUCING DIFFUSION ZONES. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/680,034 US4666557A (en) | 1984-12-10 | 1984-12-10 | Method for forming channel stops in vertical semiconductor surfaces |
US680,034 | 1984-12-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1986003620A2 true WO1986003620A2 (en) | 1986-06-19 |
WO1986003620A3 WO1986003620A3 (en) | 1986-07-31 |
Family
ID=24729383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1985/002302 WO1986003620A2 (en) | 1984-12-10 | 1985-11-25 | Process for forming diffusion regions in a semiconductor substrate |
Country Status (5)
Country | Link |
---|---|
US (1) | US4666557A (en) |
EP (1) | EP0204752B1 (en) |
JP (1) | JPH0628283B2 (en) |
DE (1) | DE3574077D1 (en) |
WO (1) | WO1986003620A2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0259605A1 (en) * | 1986-08-29 | 1988-03-16 | Siemens Aktiengesellschaft | Method of producing a well-defined doping into sidewalls and bottoms of trenches etched into semiconductor substrates |
EP0259629A1 (en) * | 1986-08-19 | 1988-03-16 | Siemens Aktiengesellschaft | Method of producing a well-defined doping in the vertical sidewalls and bottoms of trenches engraved in semiconducting substrates |
EP0367729A2 (en) * | 1988-11-03 | 1990-05-09 | STMicroelectronics S.r.l. | Process for forming trench isolation structures in a silicon substrate for CMOS and NMOS devices |
EP0441482A1 (en) * | 1990-02-05 | 1991-08-14 | Advanced Micro Devices, Inc. | Doping process |
AU627972B2 (en) * | 1990-03-06 | 1992-09-03 | Digital Equipment Corporation | Method of forming trench isolated regions with sidewall doping |
EP0631305A1 (en) * | 1993-06-23 | 1994-12-28 | Siemens Aktiengesellschaft | Process for manufacturing un isolation region in a substrate for smart-power-technology |
Families Citing this family (25)
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JPH01147829A (en) * | 1987-12-04 | 1989-06-09 | Toshiba Corp | Manufacture of semiconductor device |
US5354710A (en) * | 1988-01-14 | 1994-10-11 | Kabushiki Kaisha Toshiba | Method of manufacturing semiconductor devices using an adsorption enhancement layer |
US5057443A (en) * | 1988-06-29 | 1991-10-15 | Texas Instruments Incorporated | Method for fabricating a trench bipolar transistor |
US5008208A (en) * | 1988-12-07 | 1991-04-16 | Honeywell Inc. | Method of making planarized, self-aligned bipolar integrated circuits |
JP2641781B2 (en) * | 1990-02-23 | 1997-08-20 | シャープ株式会社 | Method of forming semiconductor element isolation region |
JP2597022B2 (en) * | 1990-02-23 | 1997-04-02 | シャープ株式会社 | Method of forming element isolation region |
EP0635884A1 (en) * | 1993-07-13 | 1995-01-25 | Siemens Aktiengesellschaft | Method for forming a trench in a substrate and application to smart-power-technology |
US5406515A (en) * | 1993-12-01 | 1995-04-11 | International Business Machines Corporation | Method for fabricating low leakage substrate plate trench DRAM cells and devices formed thereby |
DE4404757C2 (en) * | 1994-02-15 | 1998-08-20 | Siemens Ag | Method for producing a diffusion region adjacent to a trench in a substrate |
KR0151051B1 (en) * | 1995-05-30 | 1998-12-01 | 김광호 | Method of forming insulation film for semiconductor device |
TW304293B (en) * | 1996-11-18 | 1997-05-01 | United Microelectronics Corp | Manufacturing method for shallow trench isolation |
US5851900A (en) * | 1997-04-28 | 1998-12-22 | Mosel Vitelic Inc. | Method of manufacturing a shallow trench isolation for a semiconductor device |
US6069058A (en) * | 1997-05-14 | 2000-05-30 | United Semiconductor Corp. | Shallow trench isolation for semiconductor devices |
US6001684A (en) * | 1997-06-04 | 1999-12-14 | Siemens Aktiengesellschaft | Method for forming a capacitor |
US6117719A (en) * | 1997-12-18 | 2000-09-12 | Advanced Micro Devices, Inc. | Oxide spacers as solid sources for gallium dopant introduction |
TW589708B (en) * | 2003-08-19 | 2004-06-01 | Nanya Technology Corp | Method for defining deep trench in substrate and multi-layer hard mask structure for defining the same |
US20070080403A1 (en) * | 2005-10-06 | 2007-04-12 | David Litfin | Low trigger voltage electrostatic discharge protection device |
KR100769146B1 (en) * | 2006-08-17 | 2007-10-22 | 동부일렉트로닉스 주식회사 | Semiconductor device improving electric property and method for manufacturing the same |
US20090001481A1 (en) * | 2007-06-26 | 2009-01-01 | Ethan Harrison Cannon | Digital circuits having additional capacitors for additional stability |
US8129778B2 (en) * | 2009-12-02 | 2012-03-06 | Fairchild Semiconductor Corporation | Semiconductor devices and methods for making the same |
FR2978612B1 (en) * | 2011-07-27 | 2013-08-16 | St Microelectronics Crolles 2 | METHOD OF MAKING A TRENCH OF ISOLATION IN A SEMICONDUCTOR SUBSTRATE, AND STRUCTURE, PARTICULARLY CMOS IMAGE SENSOR, OBTAINED BY SAID METHOD |
US9087872B2 (en) * | 2011-07-27 | 2015-07-21 | Stmicroelectronics (Crolles 2) Sas | Method for forming an insulating trench in a semiconductor substrate and structure, especially CMOS image sensor, obtained by said method |
US10910223B2 (en) * | 2016-07-29 | 2021-02-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Doping through diffusion and epitaxy profile shaping |
EP3349239B1 (en) * | 2016-11-25 | 2020-04-08 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor device production method |
CN110233130A (en) * | 2019-05-29 | 2019-09-13 | 长江存储科技有限责任公司 | Semiconductor structure, UHV device and preparation method thereof |
Citations (3)
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---|---|---|---|---|
EP0010633A1 (en) * | 1978-11-03 | 1980-05-14 | International Business Machines Corporation | Method for forming very narrow doping regions in a semiconductor body and use of this method for producing semiconductor regions insulated from each other, bipolar semiconductor devices, integrated injection logics and double-diffused FET semiconductor devices |
EP0068071A1 (en) * | 1981-06-25 | 1983-01-05 | Rockwell International Corporation | Punch through voltage regulator diodes and methods of manufacture |
WO1985004760A1 (en) * | 1984-04-05 | 1985-10-24 | American Telephone & Telegraph Company | Method for controlled doping trench sidewalls in a semiconductor body |
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JPS5412791A (en) * | 1977-06-29 | 1979-01-30 | Tokyo Tokushu Densen Toryo | Apparatus for measuring heat softening temperature of wire coating |
US4256514A (en) * | 1978-11-03 | 1981-03-17 | International Business Machines Corporation | Method for forming a narrow dimensioned region on a body |
JPS55127016A (en) * | 1979-03-26 | 1980-10-01 | Hitachi Ltd | Manufacturing of semiconductor device |
DE2951292A1 (en) * | 1979-12-20 | 1981-07-02 | Ibm Deutschland Gmbh, 7000 Stuttgart | METHOD FOR DOPING SILICON BODIES BY DIFFUSING BOR |
US4353086A (en) * | 1980-05-07 | 1982-10-05 | Bell Telephone Laboratories, Incorporated | Silicon integrated circuits |
US4407058A (en) * | 1981-05-22 | 1983-10-04 | International Business Machines Corporation | Method of making dense vertical FET's |
US4466178A (en) * | 1981-06-25 | 1984-08-21 | Rockwell International Corporation | Method of making extremely small area PNP lateral transistor by angled implant of deep trenches followed by refilling the same with dielectrics |
US4379727A (en) * | 1981-07-08 | 1983-04-12 | International Business Machines Corporation | Method of laser annealing of subsurface ion implanted regions |
US4419810A (en) * | 1981-12-30 | 1983-12-13 | International Business Machines Corporation | Self-aligned field effect transistor process |
-
1984
- 1984-12-10 US US06/680,034 patent/US4666557A/en not_active Expired - Lifetime
-
1985
- 1985-11-25 JP JP60505264A patent/JPH0628283B2/en not_active Expired - Lifetime
- 1985-11-25 WO PCT/US1985/002302 patent/WO1986003620A2/en active IP Right Grant
- 1985-11-25 DE DE8585906019T patent/DE3574077D1/en not_active Expired
- 1985-11-25 EP EP85906019A patent/EP0204752B1/en not_active Expired
Patent Citations (3)
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EP0010633A1 (en) * | 1978-11-03 | 1980-05-14 | International Business Machines Corporation | Method for forming very narrow doping regions in a semiconductor body and use of this method for producing semiconductor regions insulated from each other, bipolar semiconductor devices, integrated injection logics and double-diffused FET semiconductor devices |
EP0068071A1 (en) * | 1981-06-25 | 1983-01-05 | Rockwell International Corporation | Punch through voltage regulator diodes and methods of manufacture |
WO1985004760A1 (en) * | 1984-04-05 | 1985-10-24 | American Telephone & Telegraph Company | Method for controlled doping trench sidewalls in a semiconductor body |
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Title |
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IBM Technical Disclosure Bulletin, Volume 25, No. 12, May 1983, New York, (US) K.D. BEYER et al.: "SBD Guard Ring Scheme", see figures 1-2 * |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0259629A1 (en) * | 1986-08-19 | 1988-03-16 | Siemens Aktiengesellschaft | Method of producing a well-defined doping in the vertical sidewalls and bottoms of trenches engraved in semiconducting substrates |
EP0259605A1 (en) * | 1986-08-29 | 1988-03-16 | Siemens Aktiengesellschaft | Method of producing a well-defined doping into sidewalls and bottoms of trenches etched into semiconductor substrates |
EP0367729A2 (en) * | 1988-11-03 | 1990-05-09 | STMicroelectronics S.r.l. | Process for forming trench isolation structures in a silicon substrate for CMOS and NMOS devices |
EP0367729A3 (en) * | 1988-11-03 | 1991-01-09 | STMicroelectronics S.r.l. | Process for forming trench isolation structures in a silicon substrate for cmos and nmos devices |
EP0441482A1 (en) * | 1990-02-05 | 1991-08-14 | Advanced Micro Devices, Inc. | Doping process |
US5116778A (en) * | 1990-02-05 | 1992-05-26 | Advanced Micro Devices, Inc. | Dopant sources for cmos device |
AU627972B2 (en) * | 1990-03-06 | 1992-09-03 | Digital Equipment Corporation | Method of forming trench isolated regions with sidewall doping |
EP0631305A1 (en) * | 1993-06-23 | 1994-12-28 | Siemens Aktiengesellschaft | Process for manufacturing un isolation region in a substrate for smart-power-technology |
US5496765A (en) * | 1993-06-23 | 1996-03-05 | Siemens Aktiengesellschaft | Method for manufacturing an insulating trench in a substrate for smart-power technologies |
Also Published As
Publication number | Publication date |
---|---|
WO1986003620A3 (en) | 1986-07-31 |
EP0204752B1 (en) | 1989-11-02 |
JPS62501041A (en) | 1987-04-23 |
US4666557A (en) | 1987-05-19 |
DE3574077D1 (en) | 1989-12-07 |
EP0204752A1 (en) | 1986-12-17 |
JPH0628283B2 (en) | 1994-04-13 |
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