WO1982000745A1 - Back plate for condenser microphone and structure thereof - Google Patents

Back plate for condenser microphone and structure thereof Download PDF

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Publication number
WO1982000745A1
WO1982000745A1 PCT/JP1981/000047 JP8100047W WO8200745A1 WO 1982000745 A1 WO1982000745 A1 WO 1982000745A1 JP 8100047 W JP8100047 W JP 8100047W WO 8200745 A1 WO8200745 A1 WO 8200745A1
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WIPO (PCT)
Prior art keywords
microphone
plate
pack plate
pack
condenser
Prior art date
Application number
PCT/JP1981/000047
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French (fr)
Japanese (ja)
Inventor
Co Ltd Primo
Original Assignee
Kishi K
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Publication date
Application filed by Kishi K filed Critical Kishi K
Publication of WO1982000745A1 publication Critical patent/WO1982000745A1/en

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers

Definitions

  • the present invention relates to a condenser microphone and, more particularly, to a pack plate used for a fixed electrode of an electrostatic converter in such a microphone and a structure thereof.
  • a condenser microphone is an electroacoustic element that converts a sound wave into an electric waveform using an electrostatic converter composed of a fixed electrode and a movable electrode.
  • Fig. 1 shows a longitudinal cross-sectional view of a model that has been widely used in the past as such a microphone mouthpiece.
  • the vibrating membrane 1z extends on a ring frame to form a vibrating plate (movable electrode), and faces a pack plate (fixed electrode) 4 'having a flat surface with a narrow gap 3' therebetween. You. Thereby, a capacitance C is formed between the vibrating membrane 1 'and the pack plate.
  • a DC voltage is applied to the pack plate via a high resistance (not shown), and electric charges are charged between both electrodes.
  • a permanent charge is held between both electrodes by interposing an electret.
  • the thickness of the gap 5 ′ between the active membrane 1 ′ and the pack plate 4 is generally about 20 to 30 so that the capacitance C is formed, while the gap in the gap is thin.
  • Air layer force Shows the viscoelasticity of the fluid and controls the vibration of diaphragm 1.
  • the pack plate is provided with a plurality of through holes 5 ′ so that the gap 3 ′ communicates with the back room 0 ′.
  • the vibrating membrane 1 ′ vibrates, the air molecules in the gap 3 ′ flow in the radial direction as shown by the arrows, and escape from the through-hole 5 ′ to the back chamber 0 ′, and then again into the gap. Breathing is performed.
  • the air flowing through the narrow gap 3 ' has viscous resistance rA and elastic CA, this is the vibrating membrane as shown in the equivalent circuit diagram of the condenser microphone vibration system in Fig. 2.
  • An effective mass m Q of 1 'and an elastic Co by extension tension are added in series to control the velocity u of the vibrating membrane.
  • the 'viscous resistance rA is a force that has the effect of suppressing the resonance of the vibrating membrane 1' and flattening the characteristics.This is unfavorable because excessively lowering the sensitivity of the microphones .
  • elastic CA has the effect of increasing the resonance frequency of the diaphragm and extending the band, but if it is excessive, it produces a high-pitched beak and causes mechanical vibration of the diaphragm. This is also harmful, such as increased dance and reduced sensitivity. Therefore, when making a condenser microphone, it is necessary to determine the optimal conditions for elastic CA and viscous resistance rA. Basically important.
  • Such a conventional condenser microphone horn pack prep is composed entirely of a flat surface, and is provided with a groove, a through-hole, a closed hole, or the like, and is appropriately connected to the diaphragm. The air flow in the gap is adjusted.
  • the above-mentioned conventional adjustment means are no longer applicable.
  • pack electret microphone in which an electret film is applied to a pack plate, when the through hole 5 ′ is processed, the sagging or separation of the film or separation of the film occurs. Paris tends to occur, causing variations in sensitivity and characteristics.
  • the rotating surface is made a rotating curved surface and is made non-porous, and furthermore, a structure that does not require a ring for setting a gap is used.
  • the pack plate of the condenser microphone and its structure which facilitates the automation of the assembling work and enables the supply of a compact and high-performance condenser microphone at low cost, has been developed. With the purpose of providing Is what you do.
  • a pack plate of a capacitor microphone wherein the effective surface is formed of a non-porous and non-flat rotating surface, and a rotating surface of an effective non-porous and non-flat surface.
  • the inclined peripheral surface of the pack plate of the condenser microphone configured with the above is engaged with and held by the triangular cuts of a plurality of holding claws projecting from the insulating holding body, and the holding body is It is a component of a condenser plate of a condenser microphone that is fitted and fixed to another tube that forms part of the microphone.
  • Fig. 1 is a horizontal vertical sectional view of a conventional condenser microphone.
  • Fig. 2 is an equivalent circuit diagram of the condenser microphone of Fig. 1,
  • 3 (a) to 3 (e) are schematic longitudinal sectional views showing a basic form of a pack plate and a diaphragm according to an embodiment of the present invention
  • FIG. 4 is a perspective view showing the holding cylinder and the intermediate cylinder in the first embodiment
  • FIG. 5 is a longitudinal sectional view of the microphone mouth phone according to the first embodiment
  • FIG. 5 is a longitudinal sectional view of the microphone mouth phone according to the second embodiment
  • FIG. 7 is a holding cylinder and a diaphragm in the second embodiment.
  • a perspective view of the packing plate
  • FIG. 8 is a longitudinal sectional view of the microphone according to the third embodiment
  • FIG. 9 is a perspective view of the microphone according to the present invention having an electret film applied thereto.
  • FIG. 3 shows a basic form of the pack plate of the present invention and a configuration of a capacitor microphone horn which faces the diaphragm with a gap 3 therebetween.
  • a film of biaxially stretched polyester resin having a thickness of 5 or less is suitable, and a metal layer such as aluminum is deposited on the upper surface as a conductive surface. It is spread flat on the ring frame 2 and electrically conductively bonded. If the surface of the pack plate 4 that faces the vibrating membrane 1 and forms a capacitance is the effective surface 7, the surface 7 is constituted by a rotating curved surface that is not a flat surface.
  • the surface of a small disk-shaped pack plate 4 mainly made of metal is formed into a convex or concave lens shape.
  • the effective surface 7 is held by a highly insulating holding carrier, which will be described later, and faces the vibrating membrane 1 with a narrow gap 3 of about 20 to 30 to form a thin air layer.
  • a capacitance of about 20 to 30 PF is formed. .
  • the air flow in the gap is good.
  • the air bypasses the peripheral end face 9 of the pack plate 4 and can easily reach the back chamber ⁇ behind.As a viscoelastic effect of the thin air layer, the elastic CA is small and the viscous resistance r A is large. O PI be able to.
  • a top concave type in which the center of the convex surface is a concave surface, etc. Is effective.
  • the protruding type shown in Fig. 3 (e) is easy to process and can be manufactured at low cost.
  • the mushroom-shaped mushroom-shaped ones shown in Fig. 8 are suitable for ultra-small microphones, and can be widely used depending on the application.
  • the peripheral surface 9 of these pack plates is formed as an inclined surface in order to easily hold the pack plate, reduce stray capacitance, and improve air flow.
  • the insulating holder 10 made of synthetic resin has a right-angled triangular notch 1
  • the three holding claws 11 that form 1a are erected, and the pack plate 4 cuts the peripheral end face 9 while pushing the claws 11 slightly open using a jig (not shown). 1a is inserted, and the portion below the effective surface 7 is clamped by the claws 11. Then, this is press-fitted into a metal or resin intermediate cylinder 12.
  • the flat surface 13 at the upper end of the intermediate cylinder 12 is a reference surface on which the diaphragm is placed, and is attached to a jig for setting the size of the gap 3 (for example, a flat surface plate, not shown). And press-fit the holder 10 into the intermediate cylinder 12 until the gap between the jig and the effective surface 7 reaches a predetermined gap. When the position is determined, the holder 10 and the intermediate cylinder Inject an appropriate amount of cyanoacrylate instant adhesive from the lower end to the contact surface with 1 and 2 to fix them together.
  • This gap size setting is based on the capacitance measurement between the metal jig on which the flat surface 15 is placed and the pack plate 4 rather than the method of directly measuring the gap size as described above.
  • the indirect setting method is preferred.
  • the pack plate having completed the setting of the gap 3 is held by pressing the tapered surface below the effective surface by the pawls 11 and press-fitted into the intermediate cylinder 12 to be joined.
  • the peripheral end surface 9 of the pack plate 4 is held in an insulated manner by the inner surface of the intermediate cylinder 12 and the insulating retaining claws 11, so that the intermediate cylinder 1 2 There is no problem even if is made of metal.
  • a field-effect transistor 14 for constructing a capacitor microphone has a drain and source terminal 1 ⁇ soldered to a printed circuit board 17, and a coil spring 15 connected to the gate.
  • the gate When the gate is inserted and inserted through the transistor opening 25 provided in the holder 10, the gate conducts to the back of the pack plate 4 and signal output can be taken out between the drain and source. State.
  • the diaphragm is placed on the flat surface 13 at the upper end of the intermediate cylinder 12, the shield case 19 is fitted over it, and the lower end 20 of the case 19 is narrowed down.
  • the vibrating membrane 1 is grounded to the case 19 via the metal ring frame 2 to form a transistor circuit and complete an integrated structure as a microphone unit.
  • this microphone microphone In order to make this microphone microphone have directivity, as shown in Fig. 5, the holes 21 of the printed circuit board 17, the ventilation resistance 22 of the felt, etc., and the holes 18 of the holder 10
  • the sidetone can be introduced into the back room ⁇ ⁇ ⁇ ⁇ through the.
  • the microphones shown in Fig. I overall cross-sectional view
  • Fig. 7 partial configuration diagram
  • the holding body 10 has four holding claws 11. It has a right-angled triangular notch 11 1a and a flat surface 13 at the upper end.When the diaphragm is placed on the flat surface 13, a notch is made so that the specified gap size can be obtained with the packed plate that is sandwiched. It is configured by determining the position of 1 1a.
  • the holding body 10 holding the pack plate 4 is pressed into the case 19, and the screw at the lower end is inserted.
  • the lid 25 is tightened, the gap 7 is maintained between the surface 7 of the pack plate 4 and the diaphragm 1, and the claws 11 are tightened on the inner surface of the case 19.
  • the dimension between the lower surface of the notch 11a of the claw 11 of the holder 10 and the flat surface 13 at the upper end must be accurately obtained, and this is a limitation in processing.
  • the intermediate cylinder 12 in the first embodiment is not required, the outer diameter can be made thin. Therefore, this configuration is suitable for microphones that require miniaturization.
  • the screw cap at the lower end as shown
  • the pack plate 4 is mushroom-shaped, has fixing feet 4a at the center of the lower surface, and is inserted into the hole at the center of the holder 10 of the ecstatic green. Penetration, caulking and fixing
  • the flat surface 28 at the upper end of the shield case 19 is a reference surface for placing the diaphragm. In the case of assembly, this surface is placed on a metal flat plate (not shown) and While gradually measuring the capacitance between the plate 4 and the leveling plate, the holder 10 is gradually press-fitted. When the capacitance reaches a predetermined value, the connection between the holder 10, 10 and the case 19 is established. Inject an appropriate amount of cyanoacrylate instant adhesive from the rear end to the contact surface to complete the fixation.
  • the field-effect transistor 14 has the drain and source terminals 1 ⁇ attached to the printed circuit board 17, and the spring 15 is fitted to the gate to form the hollow caulking of the pack plate. Insert into the hole, connect cord 27 to terminal 1, and apply screw cap 25. Then, the diaphragm is placed on the flat surface 28 of the shield case 19, and the cap 29 having the front opening 30 is tightened to complete the microphone microphone.
  • the pack plate of the present invention used in the above three examples can be manufactured by using a precision die in a cold forging method using a metal plate such as a copper alloy or aluminum. High-precision products can be mass-produced and supplied at low cost.
  • the electret microphones are formed by vacuum molding. Can be simultaneously coated on the surface 7 of a large number of metal pack plates, and unnecessary parts (called ears) can be punched out with a taper. It is easy if you use the surface.
  • minute-polar processing (c:?
  • the gap setting step can be performed on the completed structure, there is no charge decay such as deterioration of tentacles, which is advantageous. is there.
  • This polarization treatment can be performed using either the high-pressure method, which is performed one by one, or the low-pressure method, which is performed simultaneously on a large number. That is, a ground electrode is inserted into the transistor opening 23 to ground the pack plate. In the high-pressure method, the needle end electrodes are opposed to each other, and a high-voltage collector of DC 25 KV or more is used. Discharge.
  • a multipole electrode for applying an electric field is adhered to the surface of a number of pack plate components arranged on a jig, and a voltage of 250 V DC or more is applied in a heating atmosphere. Slowly cools to obtain stable and good electret charges.
  • the pack plate 4 is non-porous, the effective surface 7 is composed of a rotating curved surface, and by selecting the radius of curvature, the best value of the viscoelastic effect is obtained, and the DC pass type or electret
  • a compact and high-quality condenser microphone can be constructed by applying it to any of the tube-type models.
  • the holding claw 10 Holds the holding claw 10 with the holding claw 11 and presses it into the intermediate cylinder to tighten it. Or, if it has supporting feet, it will be caulked to the center of the holding body 10 and fixed, so stable performance Can be maintained. And the effective surface 7 is a curved surface
  • the stray capacitance generated between the periphery of the pack plate and the ring frame 2 or the shield case 19 can be minimized to reduce sensitivity loss, improve ⁇ ratio, and increase nonlinearity. Distortion (mainly third harmonic distortion) can be improved, which is particularly advantageous when constructing a small microphone with a small diameter.
  • Capacitance, electric charge, insularity, etc. can be checked in a timely manner in the intermediate process of assembling by using the transistor opening, the early detection and rejection of defective products can be achieved, and the quality can be improved. Thorough management can be implemented.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

A back plate, and the structure thereof, used for a stationary electrode of an electrostatic converter for a condenser microphone. The effective surface (7) of the back plate (4) is devoid of holes and is not flat but defines a hyperboloid of revolution, which surface is either convex or concave or a composite of these shapes. Further, the peripheral edge surface (9) of the back plate (4) is inclined into a tapered state, and is engaged with the triangular cutouts (11a) of a plurality of retaining hooks (11) projecting from an insulating retainer (10), thereby to retain the back plate, and the retainer (10) is fixedly engaged with an intermediate cylinder (12) forming a part of a microphone. The air between the electrodes moves around the peripheral edge surface (9) of the back plate (4) to thus reach a back chamber (6) behind the back plate (4).

Description

明 細 醫  Akira
発 明 の 名 称  Name of the invention
コンデンサマイク口ホ.ンのパックプレー トおよびその構成体 技 - 術 分 野  Pack plate of condenser microphone mouth phone and its components
本発明はコ ンデンサ型マ イ ク ロ ホ ンに関し、 更に詳細 には、 この種マイク ロホンにおける静電変換器の固定電 極に用いられるパックプレー トおよびその構成体に^す る  The present invention relates to a condenser microphone and, more particularly, to a pack plate used for a fixed electrode of an electrostatic converter in such a microphone and a structure thereof.
背 景' 技 術  Background 'technology
コ ンデンサマイ ク ロホ ンは、 固定電極と可動電極とか らなる静電変換器を使用して音声波を電気波形に変換す る電気音響素子である。 第 1 図には、 このよ うなマイク 口ホンとして従来広く使われている型の模型縦断面図を 示す。 第 1 図において振動膜 1 z はリ ング枠に展張して 振動板(可動電極) を構成し、 狭い間隙 3 ' を隔てて平 坦面を有するパック プレ— ト (固定電極) 4 ' に対向す る。 これによ り、 これら振動膜 1 ' とパックプレート 間 には静電容量 Cが形成される。 さらにパックプレー ト には高抵抗 (図示せず) を介して直流電圧が印加され、 両電極間に電荷が充電される。 また、 あるいはエ レク ト レツ トを介在させて両電極間に永久電荷を保有させる。 そして信号音圧士 P o が加わって有効面積 Sをもつ振動 膜 が振動すると、 静電容量 Gに士 の微小変化を 生じ、 これによ りパックプレー ト 4 に信号起電力が誘 起する。 この信号は電界効果ト ラ ンジス タ等のイ ン ビー  A condenser microphone is an electroacoustic element that converts a sound wave into an electric waveform using an electrostatic converter composed of a fixed electrode and a movable electrode. Fig. 1 shows a longitudinal cross-sectional view of a model that has been widely used in the past as such a microphone mouthpiece. In FIG. 1, the vibrating membrane 1z extends on a ring frame to form a vibrating plate (movable electrode), and faces a pack plate (fixed electrode) 4 'having a flat surface with a narrow gap 3' therebetween. You. Thereby, a capacitance C is formed between the vibrating membrane 1 'and the pack plate. Further, a DC voltage is applied to the pack plate via a high resistance (not shown), and electric charges are charged between both electrodes. Alternatively, a permanent charge is held between both electrodes by interposing an electret. When the vibrating membrane having an effective area S is vibrated by the addition of the signal sound pressure member P o, a small change in the capacitance G occurs, and a signal electromotive force is induced in the pack plate 4. This signal is transmitted to an in-vehicle device such as a field-effect transistor.
_ΟΙ.ίΡΙ - ダンス変換増幅器 8 z によ り増幅された後外部の 0点に 出力信号電圧として送られる。 _ΟΙ.ίΡΙ- After being amplified by the dance conversion amplifier 8z, it is sent to the external zero point as an output signal voltage.
捱動膜 1 ' とパックプレー ト 4 との間の間隙 5 ' の 厚さは、 一般に 2 0〜 3 0 程度であり、 これによ り静 電容量 Cを形成する一方において、 間隙内の薄い空気層 力 流体の粘弾性を示し、 振動膜 1 の振動を制御する。 普通、 パックプレー ト には、 複数の通孔 5 ' を設けて間 隙 3 ' を背室 0 ' に通じさせている。 振動膜 1 ' が振動 するとき間隙 3 ' 内の空気分子は、 矢印のよ うに、 半径 方向に流動して、 通孔 5 ' から背室 0 ' に逃がれ、 次に また間隙内に戾つて呼吸が行なわれる。 このとき、 狭い 間隙 3 ' を流動する空気には粘性抵抗 rA と弾性 CA が あるため、 第 2図のコ ンデンサマ イ ク ロ ホ ン振動系の等 価回路図に示すよ う に、 これが振動膜 1 ' の実効質量 mQ 、 展張力による弾性 Co に直列に加わって振動膜 の運動速度 uを制御する。 この外に輻射イ ン ピーダンス があるがここでは除外する。 上記中、' 粘性抵抗 rA は、 振動膜 1 ' の共振を抑えて特性を平坦化する作用がある 力 これ^、 過剰であれば徒らにマイク ロホ ンの感度を 低下させるので好まし くない。 また、 弾性 CA は振動膜 の共振周波数を高め、 帯域を拡張する効果があるが、 こ れが過剰であれば、 高音ビークを生じ、 振動膜の機械ィ ン ヒ。一 ダンスを増加させ感度が低下するなどこれまた有 害である。 従つてコンデンサマイ ク 口 ホンを作るに当つ ては弾性 CA 、 粘性抵抗 rA の最適条件を求めることが 基本的に重要である。 The thickness of the gap 5 ′ between the active membrane 1 ′ and the pack plate 4 is generally about 20 to 30 so that the capacitance C is formed, while the gap in the gap is thin. Air layer force Shows the viscoelasticity of the fluid and controls the vibration of diaphragm 1. Normally, the pack plate is provided with a plurality of through holes 5 ′ so that the gap 3 ′ communicates with the back room 0 ′. When the vibrating membrane 1 ′ vibrates, the air molecules in the gap 3 ′ flow in the radial direction as shown by the arrows, and escape from the through-hole 5 ′ to the back chamber 0 ′, and then again into the gap. Breathing is performed. At this time, since the air flowing through the narrow gap 3 'has viscous resistance rA and elastic CA, this is the vibrating membrane as shown in the equivalent circuit diagram of the condenser microphone vibration system in Fig. 2. An effective mass m Q of 1 'and an elastic Co by extension tension are added in series to control the velocity u of the vibrating membrane. There is a radiation impedance outside this, but it is excluded here. Among the above, the 'viscous resistance rA is a force that has the effect of suppressing the resonance of the vibrating membrane 1' and flattening the characteristics.This is unfavorable because excessively lowering the sensitivity of the microphones . Also, elastic CA has the effect of increasing the resonance frequency of the diaphragm and extending the band, but if it is excessive, it produces a high-pitched beak and causes mechanical vibration of the diaphragm. This is also harmful, such as increased dance and reduced sensitivity. Therefore, when making a condenser microphone, it is necessary to determine the optimal conditions for elastic CA and viscous resistance rA. Basically important.
このよ うな従来から用いられているコンデンサマイ ク 口ホ ンのパックプレ トは、 総て平面で構成され、 溝切 り、 貫通孔あるいは閉塞孔等を適宜開設するこ とによつ て振動膜との間隙内の空気流を調整するものである。 し かしながら、 近時、 マイクロホンが次第に小形化するに 及び、 前記の従来の調整手段は、 もはや適用が困難とな つている。 また、 パック プレー ト にエ レク ト レッ ト膜を 被着させた所謂パック エレク ト レッ ト方式のマイ ク ロ ホ ンの場合は、 通孔 5 ' の加工時に抜きダレや膜の剝離ぁ るいはパリを発生して、 感度、 特性のばらつきを生じ易 い。 更に、 また間隙リ ングを揷入して振動膜とパックプ レ一 ト との間隙を設定する従来から慣用されている一般 構'造のマイク ロホ ンの場合には、 多くの漂遊 '容量を生じ て、 これが本来の主容量に並列に加わるために感度損失 を招いて 比を劣化し、 非直線ひずみを増加するなど 性能を低下する原因になっている。  Such a conventional condenser microphone horn pack prep is composed entirely of a flat surface, and is provided with a groove, a through-hole, a closed hole, or the like, and is appropriately connected to the diaphragm. The air flow in the gap is adjusted. However, in recent years, as microphones have become increasingly smaller, the above-mentioned conventional adjustment means are no longer applicable. Also, in the case of a so-called pack electret microphone in which an electret film is applied to a pack plate, when the through hole 5 ′ is processed, the sagging or separation of the film or separation of the film occurs. Paris tends to occur, causing variations in sensitivity and characteristics. Furthermore, in the case of a conventional microphone having a general structure in which a gap ring is inserted to set a gap between the diaphragm and the pack plate, a large amount of stray capacity is generated. However, this is added in parallel to the original main capacitance, causing sensitivity loss, degrading the ratio, and reducing the performance, such as increasing nonlinear distortion.
発 明 の 開 示  Disclosure of the invention
本発明は、 有効表面を平面にしてこれに孔を開設する 代わりに、 これを回転曲面にしてしかも無孔に構成し、 さらには間隙設定用リ ングを不要とする構成によって、 従来のものの上記欠点を除き、 さらに組立作業の自動化 を容易にして小型高性能のコ ンデンサマイク 口ホ ンを廉 価に供給できる よ う にしたコ ンデンサマ イ ク 口 ホンのパ ック プレー トおよびその構成体を提供することを目的と するものである。 According to the present invention, instead of making the effective surface a flat surface and forming a hole in the surface, the rotating surface is made a rotating curved surface and is made non-porous, and furthermore, a structure that does not require a ring for setting a gap is used. Except for the drawbacks, the pack plate of the condenser microphone and its structure, which facilitates the automation of the assembling work and enables the supply of a compact and high-performance condenser microphone at low cost, has been developed. With the purpose of providing Is what you do.
本発明は、 有効表面が無孔であり、 かつ平坦面でない 回転曲面をもって構成したことを特徴とするコ ンデンサ マイク ロホンのパックプレー ト、 および有効平面が無孔 であり、 かつ平坦面でない回転曲面をもって構成したコ ンデンサマイ ク ロ ホンのパック プレー 卜 の傾斜した周端 面を、 絶縁性の保持体に突設した複数の保持爪の三角形 の切込みに係合させて保持し、 該保持体を該マイクロ ホ ンの一部を構成する他の筒に嵌人し固定したコンデンサ マイ ク ロホンのパックプレー ト の構成体である。  According to the present invention, there is provided a pack plate of a capacitor microphone, wherein the effective surface is formed of a non-porous and non-flat rotating surface, and a rotating surface of an effective non-porous and non-flat surface. The inclined peripheral surface of the pack plate of the condenser microphone configured with the above is engaged with and held by the triangular cuts of a plurality of holding claws projecting from the insulating holding body, and the holding body is It is a component of a condenser plate of a condenser microphone that is fitted and fixed to another tube that forms part of the microphone.
図面の簡単な説明  BRIEF DESCRIPTION OF THE FIGURES
第 1 図は従来のコンデンサマイクロホンの横型縦断面 図、 . 、  Fig. 1 is a horizontal vertical sectional view of a conventional condenser microphone.
第 2図は第 1 図のコ ンデンサマイク ロホンの等価回路 図、 —一  Fig. 2 is an equivalent circuit diagram of the condenser microphone of Fig. 1,
第 3図 (a)〜(e)は本発明の実施例によるパックプレー ト の基本形と振動板とを示す略縦断面図、  3 (a) to 3 (e) are schematic longitudinal sectional views showing a basic form of a pack plate and a diaphragm according to an embodiment of the present invention,
第 4図は第一実施例における保持筒と中間筒とを示す 斜視図、 ·  FIG. 4 is a perspective view showing the holding cylinder and the intermediate cylinder in the first embodiment,
第 5図は第一実施例によるマイク 口ホ ンの縦断面図、 第 ό 図は第二実施例によるマイ ク 口 ホンの縱断面図、 第 7図は第二実施例における保持筒、 振動板及びパッ クプレ一 ト の斜視図、  FIG. 5 is a longitudinal sectional view of the microphone mouth phone according to the first embodiment, FIG. 5 is a longitudinal sectional view of the microphone mouth phone according to the second embodiment, and FIG. 7 is a holding cylinder and a diaphragm in the second embodiment. And a perspective view of the packing plate,
第 8図は第三実施例によるマイク ロホンの縦断面図、 第 9図はエレク ト レツ ト膜を被着した本発明によるパ' ックプレー トの縦断面図。 FIG. 8 is a longitudinal sectional view of the microphone according to the third embodiment, and FIG. 9 is a perspective view of the microphone according to the present invention having an electret film applied thereto. FIG.
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
本発明を以下第 3図〜第 9図を引用して説明する。  The present invention will be described below with reference to FIGS.
第 3図は、 本発明のパックプレー トの基本形と、 これ に振動板を間隙 3を隔てて対向するコ ンデ サマイク 口 ホ-ンの構成とを示す。 この振動板の振動膜 1 には、 厚さ 5 以下の 2軸延伸 リ エステル樹脂のフィル厶が適し ており、 上面にアル ミ - ゥ ム等の金属層を導電面として 蒸着したものを、 金属のリ ン グ枠 2に平坦に展張し、 導 電的に接着したものである。 パックプレー ト 4の、 振動 膜 1 に対向し静電容量を形成する表面を有効表面 7 とす れば、 該表面 7は平坦面でない回転曲面で構成され、 第 FIG. 3 shows a basic form of the pack plate of the present invention and a configuration of a capacitor microphone horn which faces the diaphragm with a gap 3 therebetween. For the diaphragm 1 of the diaphragm, a film of biaxially stretched polyester resin having a thickness of 5 or less is suitable, and a metal layer such as aluminum is deposited on the upper surface as a conductive surface. It is spread flat on the ring frame 2 and electrically conductively bonded. If the surface of the pack plate 4 that faces the vibrating membrane 1 and forms a capacitance is the effective surface 7, the surface 7 is constituted by a rotating curved surface that is not a flat surface.
3図 (a) , (b)のよ うに主として金属製を可とする小形円盤 状のパックプレー ト 4の表面に凸面または凹面のレンズ 状に形成される。. こ の有効表面 7は、 後述する高絶縁性 の保持担体によ り保持されて、 振動膜 1 と 2 0〜 3 0 程度の狭い間隙 3を隔てて対向し、 薄い空気層を'形成す ると同時に、 2 0〜 3 0 P F 程度の静電容量を形成して いる。 . 3 As shown in FIGS. 3 (a) and 3 (b), the surface of a small disk-shaped pack plate 4 mainly made of metal is formed into a convex or concave lens shape. The effective surface 7 is held by a highly insulating holding carrier, which will be described later, and faces the vibrating membrane 1 with a narrow gap 3 of about 20 to 30 to form a thin air layer. At the same time, a capacitance of about 20 to 30 PF is formed. .
第 3図 (a)の凸 レンズ形パック プレー ト においては、 間 隙 3 の断面が中心から外周へ向い広がっている形状であ るから、 この間隙内の空気の流動性が良好であり、 該空 気はパック プレー ト 4の周端面 9を迂回して、 背後の背 室 όに容易に達することができ、 薄い空気層の粘弾性効 果としては、 弾性 C A が小さく粘性抵抗 r A を大にする O PI ことができる。 In the convex lens pack plate shown in FIG. 3 (a), since the cross section of the gap 3 has a shape extending from the center to the outer periphery, the air flow in the gap is good. The air bypasses the peripheral end face 9 of the pack plate 4 and can easily reach the back chamber ό behind.As a viscoelastic effect of the thin air layer, the elastic CA is small and the viscous resistance r A is large. O PI be able to.
—方、 第 3図 ( )の凹レンズ形のパックプレー トでは、 間隙 3の周辺端が狭搾されているため、 空気の流動性が 劣り滞溜し易くなり、 弾性 C A が大で、 粘性抵抗?· A が 小となる。 このよ う に第 5図 (a), (b)のパックフ。レー トは相 反する勃果を有するから、 凸面乃至は凹面の曲率半径を 選択し、 あるいは、'両者を複合した形状によ り彈性 C A、 粘性抵抗 r A の最適値を求めることができる。 例えば、 第 3図 (c)のよ う に ύ面の中心部が平坦面をなすト ップフ ラッ ト形、 第 3図 (d)のよ う に凸面の中心部が凹面をなす トップ凹面形などの複合変形が効果的である。 また、 第 3図 (e)の突き出し形は、 加工容易で安価に製作できる。 さらに第 8 ·図に示す茸形のものは、 支持方法が超小形マ イ クに適するものであり、 これらはそれぞれ用途に応じ て広く利用できる。 なお、 これらのパックプレー トの周 端面 9は保持を確実容易とし、 漂遊静電容量を減少させ、 かつ空気の流動を良好にするために、 傾斜面としている。  On the other hand, in the concave lens-shaped pack plate shown in Fig. 3 (), since the peripheral edge of the gap 3 is narrowed, the air flow is poor and the air tends to accumulate, the elastic CA is large, and the viscous resistance is high. ? · A becomes small. Thus, the packs shown in Figs. 5 (a) and 5 (b). Since the rate has contradictory erections, the radius of curvature of the convex or concave surface can be selected, or the optimal values of elasticity C A and viscous resistance r A can be obtained by combining the two. For example, as shown in Fig. 3 (c), a top flat type in which the center of the flat surface is a flat surface, as shown in Fig. 3 (d), a top concave type in which the center of the convex surface is a concave surface, etc. Is effective. The protruding type shown in Fig. 3 (e) is easy to process and can be manufactured at low cost. Furthermore, the mushroom-shaped mushroom-shaped ones shown in Fig. 8 are suitable for ultra-small microphones, and can be widely used depending on the application. The peripheral surface 9 of these pack plates is formed as an inclined surface in order to easily hold the pack plate, reduce stray capacitance, and improve air flow.
これらのパックプレー トを使用してコ ンデンサマイク 口ホ ンを構成する.には、 振動膜 1 との間隙 3を所定の大 きさに維持しつつパック プレ一 トを強固に保持すること が必要である。  In order to construct a condenser microphone mouth phone using these pack plates, it is necessary to firmly hold the pack plate while maintaining the gap 3 with the diaphragm 1 at a predetermined size. is necessary.
次に、 このパックプレー トを使用した構成体としての コンデンサマイ ク ロ ホンを三つの実施例について説明す 実 施 例 1  Next, a condenser microphone as a structure using the pack plate will be described with reference to three embodiments.
O PI 第 4図 (部分斜視図) および第 5図 (全体構成断面図) に示すよ うに、 合成樹脂製の絶縁性保持体 1 0には、 先 端部内側に下面が水平な直角三角形の切込み 1 1 aを形 成した 3個の保持爪 1 1 を立設してあり、 パックプレー ト 4は爪 1 1 を治具 (図示せず) によ り僅かに押し開き つつ周端面 9を切込み 1 1 aに嵌入され、 爪 1 1により、 有効表面 7 よ り下方の部分を挾持される。 ついで、 これ を金属製または樹脂製の中間筒 1 2に圧入する。 中間筒 1 2の上端の平坦面 1 3は、 振動板を載置するための規 準面であるが、 間隙 3の寸法設定用治具(例えば平定盤、 図示せず) に平端面 1 3を載せ、 該治具と有効表面 7 と の間隙寸法が所定の間隙寸法になるまで保持体 1 0を中 間筒 1 2に圧入し、 位置が決ったならば保持体 1 0 と中 間筒 1 2 との接触面に下端よ り シァノアク リ レー ト系の 瞬間接着剤を適量注入して両者を固定する。 この間隙寸 法設定には、 上記のよ う にして間隙寸法を直接測定する 方法よ り も平坦面 1 5を載せた金属の治具とパック プレ ート 4 との間の静電容量測定による間接設定法が好適で める。 O PI As shown in FIG. 4 (partial perspective view) and FIG. 5 (cross-sectional view of the entire structure), the insulating holder 10 made of synthetic resin has a right-angled triangular notch 1 The three holding claws 11 that form 1a are erected, and the pack plate 4 cuts the peripheral end face 9 while pushing the claws 11 slightly open using a jig (not shown). 1a is inserted, and the portion below the effective surface 7 is clamped by the claws 11. Then, this is press-fitted into a metal or resin intermediate cylinder 12. The flat surface 13 at the upper end of the intermediate cylinder 12 is a reference surface on which the diaphragm is placed, and is attached to a jig for setting the size of the gap 3 (for example, a flat surface plate, not shown). And press-fit the holder 10 into the intermediate cylinder 12 until the gap between the jig and the effective surface 7 reaches a predetermined gap. When the position is determined, the holder 10 and the intermediate cylinder Inject an appropriate amount of cyanoacrylate instant adhesive from the lower end to the contact surface with 1 and 2 to fix them together. This gap size setting is based on the capacitance measurement between the metal jig on which the flat surface 15 is placed and the pack plate 4 rather than the method of directly measuring the gap size as described above. The indirect setting method is preferred.
このよ うにして、 間隙 3 の設定を完了したパックプレ 一トは爪 1 1 によ り有効表面よ り下方のテーパ面を保持 されて、 中間筒 1 2に圧入して結合されるから間隙寸法 が安定して狂いを生ずる懼れがない。 しかも、 パック プ レー ト 4の周端面 9は中間筒 1 2の内面と絶縁性の保持 爪 1 1 によって絶緣性よ く保持されるので、 中間筒 1 2 が金属製であっても全く支障がない。 同時に、 パックプ レー ト周端面と中間筒 1 2の内面との間には保持爪 1 1、 1 1 に隔てられた円弧形の間隙があるので、 間隙 3 と背 室 ό との間で自由に空気を呼吸することができ、 従来の ようにパックプレー ト 4に通孔 5を穿設する必要がない。 コ ンデンサマイク ロホンを構成するための電界効果型 ト ラ ンジスタ 1 4は、 プリ ン ト基板 1 7 に ドレ ン、 ソ ー スの端子 1 ό を半田付けし、 ゲー ト にはコイルスプリ ン グ 1 5を嵌挿して、 保持体 1 0に設けた ト ラ ンジスタ用 開孔 2 5から挿し込めば、 ゲー トはパックプレー ト 4の 裏面に導通してドレ ン、 ソ ース間から信号出力が取出せ る状態になる。 最後に、 振動板を中間筒 1 2の上端の平 坦面 1 3に載置しその上からシ ール ドケー ス 1 9を外嵌 し、 ケー ス 1 9の下端部 2 0を絞り込めば、 振動膜 1 は 金属のリ ング枠 2を介してケース 1 9に接地され、 ト ラ ンジス タ回路が形成され、 かつマイ ク ロ ホ ンユニッ ト と しての一体構造が完成する。 このマイ ク口ホンに指向性 を持たせるには、 第 5図のよ うにプリ ン ト基板 1 7の孔 2 1 、 フ ェ ル ト等の通気抵抗 2 2、 保持体 1 0の孔 1 8 を通して側音を背室 όに導入すればよい。 In this way, the pack plate having completed the setting of the gap 3 is held by pressing the tapered surface below the effective surface by the pawls 11 and press-fitted into the intermediate cylinder 12 to be joined. However, there is no fear that the information will be out of order. In addition, the peripheral end surface 9 of the pack plate 4 is held in an insulated manner by the inner surface of the intermediate cylinder 12 and the insulating retaining claws 11, so that the intermediate cylinder 1 2 There is no problem even if is made of metal. At the same time, there is an arc-shaped gap between the peripheral edge of the pack plate and the inner surface of the intermediate cylinder 12, separated by the holding claws 11, 11, so that there is free space between the gap 3 and the back chamber ό. It is possible to breathe air in the air, and there is no need to drill through holes 5 in the pack plate 4 as in the conventional case. A field-effect transistor 14 for constructing a capacitor microphone has a drain and source terminal 1 ό soldered to a printed circuit board 17, and a coil spring 15 connected to the gate. When the gate is inserted and inserted through the transistor opening 25 provided in the holder 10, the gate conducts to the back of the pack plate 4 and signal output can be taken out between the drain and source. State. Finally, the diaphragm is placed on the flat surface 13 at the upper end of the intermediate cylinder 12, the shield case 19 is fitted over it, and the lower end 20 of the case 19 is narrowed down. The vibrating membrane 1 is grounded to the case 19 via the metal ring frame 2 to form a transistor circuit and complete an integrated structure as a microphone unit. In order to make this microphone microphone have directivity, as shown in Fig. 5, the holes 21 of the printed circuit board 17, the ventilation resistance 22 of the felt, etc., and the holes 18 of the holder 10 The sidetone can be introduced into the back room を 通 し て through the.
実 施 例 2 Example 2
第 ό図 (全体断面図) および第 7図 (部分構成図) に 示されたマイ ク ロ ホ ンは、 外径 ό 〜 8 程度の所謂タ イ ピンマイ ク (襟止マイ ク ロ ホン ) の実施例である。 第 7 図において、 保持体 1 0には 4個の保持爪 1 1 があり、 先端の直角三角形の切込み 1 1 a と上端の平坦面 1 3を それぞれもち、 平坦面 1 3 に振動板を载置するとき、 挾 持したパックプレー ト と所定の間隙寸法が得られる様に 切込み 1 1 aの位置を決めて構成される。 従って、 前面 開口 3 0を有するシ ー ル ドケー ス 1 9 に振動板を揷入し たのち、 該ケー ス 1 9 にパックプレー ト 4を挾持した保 持体 1 0を圧入し、 下端のねじ蓋 2 5を緊締すれば、 パ ック プレ一 ト 4の表面 7 と振動膜 1 とは所定の間隙寸法 を保ち、 爪 1 1 はケー ス 1 9の内面で緊締される。 The microphones shown in Fig. I (overall cross-sectional view) and Fig. 7 (partial configuration diagram) use a so-called tie pin microphone (neck collar microphone) with an outer diameter of about 〜 to 8. It is an example. In FIG. 7, the holding body 10 has four holding claws 11. It has a right-angled triangular notch 11 1a and a flat surface 13 at the upper end.When the diaphragm is placed on the flat surface 13, a notch is made so that the specified gap size can be obtained with the packed plate that is sandwiched. It is configured by determining the position of 1 1a. Therefore, after the diaphragm is inserted into the shield case 19 having the front opening 30, the holding body 10 holding the pack plate 4 is pressed into the case 19, and the screw at the lower end is inserted. When the lid 25 is tightened, the gap 7 is maintained between the surface 7 of the pack plate 4 and the diaphragm 1, and the claws 11 are tightened on the inner surface of the case 19.
この実施例 2は、 保持体 1 0 の爪 1 1 の切込み 1 1 a の下面と上端の平坦面 1 3 との間の寸法を精度よ く出さ なければならないから、 これが加工上の制約となるが、 実施例 1 における中間筒 1 2が不要であるので、 外径寸- 法を細く作ることができる。 従って小型化が要求される マイ ク ロ ホ ンに好適な構成である。 なお、 マイ ク ロ ホン を単一指向性とする場合は図示のよ う に下端のねじ蓋 In the second embodiment, the dimension between the lower surface of the notch 11a of the claw 11 of the holder 10 and the flat surface 13 at the upper end must be accurately obtained, and this is a limitation in processing. However, since the intermediate cylinder 12 in the first embodiment is not required, the outer diameter can be made thin. Therefore, this configuration is suitable for microphones that require miniaturization. When the microphone is unidirectional, the screw cap at the lower end as shown
2 5の通孔 2 5 aからケー ス内に側音を導入し、 これを プリ ン 基板 1 7の孔 2 1、 保持体 1 0の通孔 1 8から 背室 όへ導けば、 単一指向性を持たせることができる。 第 ό図において、 2 όはウ ィ ン ドス ク リ ー ン、 2 7は出 . 力導出用コ一 ドである。 If a sidetone is introduced into the case from the through hole 25 of 25, and this is led from the hole 21 of the printed circuit board 17 and the through hole 18 of the holder 10 to the back room 、, Directivity can be provided. In FIG. 5, numeral 2 denotes a wind screen, and numeral 27 denotes an output deriving code.
実 施 例 3 Example 3
第 8図 (断面図) に示すよ う にパックプレー ト 4は茸 状をなし、 下面の中心に固定用足 4 aをもち、 絶緑性の 保持体 1 0の中心部の孔にこれを揷通し、 かしめて固定  As shown in Fig. 8 (cross-sectional view), the pack plate 4 is mushroom-shaped, has fixing feet 4a at the center of the lower surface, and is inserted into the hole at the center of the holder 10 of the ecstatic green. Penetration, caulking and fixing
: IFI: IFI
— する。 シー ル ドケー ス 1 9の上端の平坦面 2 8は、 振動 板を載置するための規準面で、 組立の場合はこの面を金 属の平定盤(図示せず) に置き、 パックプレー ト 4と平 定盤との間の静電容量を測定しつつ保持体 1 0を徐々に 圧入し、 上記静電容量が所定値に達したとき、 保持体 , 1 0 と ケー ス 1 9 と の接触面に後端からシ ァノ アク リ レ ー ト系瞬間接着剤を適量注入して固定を終る。 電界効果 ト ラ ンジスタ 1 4は ドレ ン、 ソ ースの端子 1 όをプリ ン ト基板 1 7に ンダ付けし、 ゲー トにはスプ リ ング 1 5 を嵌着してパックプレー ト の中空カシメ孔に揷入し、 端 子 1 όにコー ド 2 7を接続し、 ねじ蓋 2 5を施す。 つい でシー ルドケー ス 1 9の平坦面 2 8に振動板を載せ、 前 面開口 3 0を有するキャップ 2 9を締め付けてマイク口 ホンを完成する。 — I do. The flat surface 28 at the upper end of the shield case 19 is a reference surface for placing the diaphragm. In the case of assembly, this surface is placed on a metal flat plate (not shown) and While gradually measuring the capacitance between the plate 4 and the leveling plate, the holder 10 is gradually press-fitted. When the capacitance reaches a predetermined value, the connection between the holder 10, 10 and the case 19 is established. Inject an appropriate amount of cyanoacrylate instant adhesive from the rear end to the contact surface to complete the fixation. The field-effect transistor 14 has the drain and source terminals 1 ό attached to the printed circuit board 17, and the spring 15 is fitted to the gate to form the hollow caulking of the pack plate. Insert into the hole, connect cord 27 to terminal 1, and apply screw cap 25. Then, the diaphragm is placed on the flat surface 28 of the shield case 19, and the cap 29 having the front opening 30 is tightened to complete the microphone microphone.
以上 3種の実施例に使用した本発明のパック プレ一 ト は、 総て銅合金またはアル ミ ニゥム等の金属ぺ レ ッ トを 冷間鍛造法により、 精密金型を用いて製作すれば、 高精 度のものを安価に多量生産して供給することができる。 - しかも、 小型マイ ク ロ ホ ンと して賞用されるエレク ト レ ト マイ ク ロ ホ ンの場合には第 9図 (断面図) のように、 真空成型法によって、 エ レク 卜 レ ツ ト膜( ホ?リ弗化工チ レンその他の化合 ¾/ ) 2 4を多数の金属のパックプレー 卜の表面 7に同時に被着することができ、 不要部分(耳 という ) の打抜きはテ一パ面を利用すれば容易である。 また、 エ レク ト レッ トマイク ロホ ンでは、 分'極処理( ホ c: ?ι — リ ン グ ) を行う必要があるが、 本発明のパック プレ一 トを使用した構成体では、 間隙設定工程を完了したもの について行う ことができるので、 触手劣化等の電荷減衰 がなく有利である。 この分極処理は 1個ずつ行う高圧法 と、 同時に多数に実施する低圧法とのいずれをも利用で きる。 即ち、 ト ラ ン ジス タ用開孔 2 3 に接地電極を挿入 してパックプレー 卜を接地しておき、 高圧法では、 針端 電極を対向させ、 直流 2 5 K V 以上の高電圧のコ ロナ放 電を行う。 また、 低圧法では、 治具上に'並べた多数のパ ックプ レー ト構成体の表面に、 電界印加用の多極電極を 密着し加熱雰囲気中で、 直流 2 5 0 V以上の電圧を印加 し、 徐冷して安定で良好なヱ レク ト レツ ト電荷がえられThe pack plate of the present invention used in the above three examples can be manufactured by using a precision die in a cold forging method using a metal plate such as a copper alloy or aluminum. High-precision products can be mass-produced and supplied at low cost. -In addition, in the case of electret microphones, which are awarded as small microphones, as shown in Fig. 9 (cross-sectional view), the electret microphones are formed by vacuum molding. Can be simultaneously coated on the surface 7 of a large number of metal pack plates, and unnecessary parts (called ears) can be punched out with a taper. It is easy if you use the surface. In the electret microphone, minute-polar processing (c:? Ι However, in the structure using the pack plate of the present invention, since the gap setting step can be performed on the completed structure, there is no charge decay such as deterioration of tentacles, which is advantageous. is there. This polarization treatment can be performed using either the high-pressure method, which is performed one by one, or the low-pressure method, which is performed simultaneously on a large number. That is, a ground electrode is inserted into the transistor opening 23 to ground the pack plate. In the high-pressure method, the needle end electrodes are opposed to each other, and a high-voltage collector of DC 25 KV or more is used. Discharge. In the low-pressure method, a multipole electrode for applying an electric field is adhered to the surface of a number of pack plate components arranged on a jig, and a voltage of 250 V DC or more is applied in a heating atmosphere. Slowly cools to obtain stable and good electret charges.
Ό o Ό o
以上の本発明のパックプレー トおよびその構成体の特 長を列挙すると次の通りである。  The features of the above-described pack plate of the present invention and its components are listed below.
(1) パックプレー ト 4は無孔で、 有効表面 7を回転曲面 で構成し、 その曲率半径を選択することによって、 粘 弾性効果の最良値が求められ直流パィ ァス式またはェ レク ト レ ツ ト式のいずれの型にも適用して小型良質の コ ンデンサマイ ク ロホンを構成することができる。  (1) The pack plate 4 is non-porous, the effective surface 7 is composed of a rotating curved surface, and by selecting the radius of curvature, the best value of the viscoelastic effect is obtained, and the DC pass type or electret A compact and high-quality condenser microphone can be constructed by applying it to any of the tube-type models.
(2) パックプレー ト 4はテーパした周端面を絶縁性の保  (2) Pack plate 4 keeps the tapered peripheral end face insulating.
持体 1 0の保持爪 1 1 で挾持したうえ、 中間筒に圧入 して緊締するカヽ あるいは、 支持足をもつものでは保 持体 1 0の中心にかしめ付けて固定するから、 安定し た性能を維持できる。 かつ有効表面 7が曲面であるた  Holds the holding claw 10 with the holding claw 11 and presses it into the intermediate cylinder to tighten it. Or, if it has supporting feet, it will be caulked to the center of the holding body 10 and fixed, so stable performance Can be maintained. And the effective surface 7 is a curved surface
CMPI め多少の傾きがある場合も支障にならない。 CMPI It does not matter if there is some inclination.
(3) 間隙設定用リ ングが不要であるため、 組立作業中の 塵埃混人による不良や感度のばらつきが少なく、 組立 作業を自動化する上で有利である。 (3) Since a ring for setting the gap is not required, there are few defects and variations in sensitivity due to dust mixing during the assembly work, which is advantageous in automating the assembly work.
(4) パックプレー トの周辺部と リ ング枠 2 、 シ ー ル ドケ ース 1 9 との間等に生じる漂遊容量を最少にできるた め感度損失を減じ、 ΖΝ比が向上し、 非直線ひずみ (主として第 3次高調波ひずみ) を改善できるので、 特に小口径の小形マイ クロホンを構成する場合有利で ある。 (4) The stray capacitance generated between the periphery of the pack plate and the ring frame 2 or the shield case 19 can be minimized to reduce sensitivity loss, improve ΖΝ ratio, and increase nonlinearity. Distortion (mainly third harmonic distortion) can be improved, which is particularly advantageous when constructing a small microphone with a small diameter.
(5) エ レク ト レッ ト マ イ ク 口 ホンの場合には、 真空成型 法を利用して多数のパックプレー トの表面にエレク ト レ ッ ト膜を同時に被着すると共に不要部分である耳の 切除が容易でパリ、 めくれの発生する懼れがない。 分 極は組立中間工程において行えば触手劣化などの減衰 を少なくできる。 ' - (5) In the case of electret microphones, the electret film is simultaneously applied to the surface of many pack plates by vacuum molding, The excision is easy and there is no danger of turning over. If the polarization is performed during the assembly process, attenuation such as tentacle deterioration can be reduced. '-
(6) 組立の中間工程において、 ト ラ ンジス タ用開孔を利 用して、 静電容量、 電荷量、 絶緣度等のチェックを適 時実施でき、 不良品の早期検出排除ができ、 品質管理 を徹底して実施できる。 (6) Capacitance, electric charge, insularity, etc. can be checked in a timely manner in the intermediate process of assembling by using the transistor opening, the early detection and rejection of defective products can be achieved, and the quality can be improved. Thorough management can be implemented.
0: ?1 0:? 1

Claims

請 求 の 範 囲  The scope of the claims
1. 有効表面が無孔であり、 かつ平坦面でない回転曲面 をもって構成したことを特徵とするコ ンデンサマイク 口 ホ ンの ック プレ一 ト。  1. A condenser microphone mouthpiece phon plate characterized in that the effective surface is non-porous and has a non-flat rotating surface.
2. 特許請求の範囲 1 において、 パックプレー トの底面 を除く他の外面にエレク ト レツ ト膜を被着し、 永久電 荷を帯電させたコ ンデンサマイ ク 口 ホ ンのパック プレ 一 ト。  2. The pack plate of the condenser mic opening horn according to claim 1, wherein an electret film is applied to an outer surface other than the bottom surface of the pack plate and a permanent charge is applied.
5. 有効平面が無孔であり、 かつ平坦面でない回転曲面 を もって構成したコ ンデンサマイ ク ロ ホ ンのパック プ レー トの傾斜した周端面(9)を、 絶縁性の保持体(10) に突設した複数の保持爪( 11 )の三角形の切込み  5. The inclined peripheral end face (9) of the condenser plate of condenser microphones, which has a non-perforated and non-flat rotating surface, is attached to the insulating holder (10). Triangular cuts of a plurality of protruding holding claws (11)
( 11a) に係合させて保持し、 該保持体(10)を該マ イ ク 口ホンの一部を構成する他の筒に嵌入し固定した コ ンデンサマイ ク ロ ホ ンの ミック プレー ト の構成体。 (11a), and the holding body (10) is fitted and fixed in another cylinder constituting a part of the microphone mouthpiece, thereby forming a microphone plate of the condenser microphone. body.
4. 特許請求の範囲 3において、 パックプレー ト保持体 ( 10)とコ ンデンサマイクロホンを構成する他の筒た る中間筒 ( 12 )とを摺動可能にし、 パックプレー ト の 有効表面と中間筒 ( 12)の規準端面に接して張設され る振動膜との間隙寸法を所定値に設定した後、 パック プレー ト保持体( 10)と中間筒 ( 12)とを固定したコ ンデンサマ イ ク ロ ホンのパ'ック プレ— 卜-構成体。 4. In Claim 3, the pack plate holder (10) and the other intermediate tube (12) constituting the capacitor microphone are slidable, and the effective surface of the pack plate and the intermediate tube After the gap between the diaphragm and the diaphragm stretched in contact with the reference end face of (12) is set to a predetermined value, the capacitor micro that fixes the pack plate holder (10) and the intermediate tube (12) is fixed. Hong's pack plate-construction.
5. 特許請求の範囲 3又は 4において、 パックプレー ト 保持体( 10 )に ト ラ ンジス タ用開孔 (23 )を設け、 コ イ ノレス プリ ング ( 15)をゲー ト に篏合した ト ラ ンジス  5. In claims 3 or 4, the pack plate holder (10) is provided with a transistor opening (23), and the coilless spring (15) is fitted to the gate. Ngis
、ぐ -、 タを該開孔(23)に挿入し、 該ス プリ ング (15)を介 して ミック フ。レー ト (4)と トラ ンジスタのゲー ト とを 導通させたコ ンデンサマ イ ク ロ ホンの ミック プレー ト 構成体。 , Gu-, A hole is inserted into the opening (23), and the microphone is inserted through the spring (15). Mic plate structure of a condenser microphone with conduction between the rate (4) and the gate of the transistor.
PCT/JP1981/000047 1980-08-21 1981-03-06 Back plate for condenser microphone and structure thereof WO1982000745A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11396280A JPS5739700A (en) 1980-08-21 1980-08-21 Back plate of condensor microphone and its constituent
JP80/113962800821 1980-08-21

Publications (1)

Publication Number Publication Date
WO1982000745A1 true WO1982000745A1 (en) 1982-03-04

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WO (1) WO1982000745A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1120996A2 (en) 2000-01-27 2001-08-01 AKG Acoustics GmbH Electroacoustic transducer
EP1296536A2 (en) * 2001-09-20 2003-03-26 AKG Acoustics GmbH Electroacoustic transducer

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60134573A (en) * 1983-12-22 1985-07-17 Fuji Photo Film Co Ltd Video synthesis recorder

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50110322A (en) * 1974-02-06 1975-08-30
JPS5114046A (en) * 1974-07-25 1976-02-04 Hitachi Shipbuilding Eng Co MAIKUROPPON
JPS51131315A (en) * 1975-05-10 1976-11-15 Hitachi Zosen Corp Microphone
JPS5586291A (en) * 1978-12-23 1980-06-28 Toshiba Corp Condenser type microphone

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50110322A (en) * 1974-02-06 1975-08-30
JPS5114046A (en) * 1974-07-25 1976-02-04 Hitachi Shipbuilding Eng Co MAIKUROPPON
JPS51131315A (en) * 1975-05-10 1976-11-15 Hitachi Zosen Corp Microphone
JPS5586291A (en) * 1978-12-23 1980-06-28 Toshiba Corp Condenser type microphone

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1120996A2 (en) 2000-01-27 2001-08-01 AKG Acoustics GmbH Electroacoustic transducer
US6510231B2 (en) 2000-01-27 2003-01-21 Akg Acoustics Gmbh Electroacoustic transducer
AT411513B (en) * 2000-01-27 2004-01-26 Akg Acoustics Gmbh ELECTROACOUSTIC CONVERTER
EP1296536A2 (en) * 2001-09-20 2003-03-26 AKG Acoustics GmbH Electroacoustic transducer
EP1296536A3 (en) * 2001-09-20 2004-01-28 AKG Acoustics GmbH Electroacoustic transducer

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Publication number Publication date
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