WO1981001115A1 - Process for welding pieces and apparatus for implementing such process - Google Patents

Process for welding pieces and apparatus for implementing such process Download PDF

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Publication number
WO1981001115A1
WO1981001115A1 PCT/EP1980/000114 EP8000114W WO8101115A1 WO 1981001115 A1 WO1981001115 A1 WO 1981001115A1 EP 8000114 W EP8000114 W EP 8000114W WO 8101115 A1 WO8101115 A1 WO 8101115A1
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WO
WIPO (PCT)
Prior art keywords
parts
soldering
time
heating
solder
Prior art date
Application number
PCT/EP1980/000114
Other languages
German (de)
French (fr)
Inventor
G Zschimmer
Original Assignee
G Zschimmer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by G Zschimmer filed Critical G Zschimmer
Publication of WO1981001115A1 publication Critical patent/WO1981001115A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B23K3/0471—Heating appliances electric using resistance rod or bar, e.g. carbon silica
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0004—Resistance soldering

Definitions

  • the invention relates to a method for soldering parts by means of a soldering stamp, the pressure bracket through which an electrical heating current flows and is provided with a thermocouple controlling the current.
  • the invention has for its object to provide measures that counteract this heat dissipation.
  • This object is achieved in that at least one of the parts is flowed through by a second heating current.
  • 1 denotes a first part
  • 2 a second part that is to be soldered to the first part
  • 3 a soldering stamp
  • 4 its pressure bracket
  • 5 a thermocouple
  • 6 two electrodes and 7 a control circuit
  • the thermal voltage of the thermocouple 5, the voltage of a target temperature and the soldering time are given in the comparator 8.
  • a heating current flows through the bracket 4 and part 1.
  • the soldering stamp 3 and the electrodes 6 are pressed down.
  • the triacs 10 control the mains currents that flow through the transformer 11.
  • the temperature distribution in the parts 1, 2 can be changed in a predetermined manner during the time. For example, it makes sense to first bring the temperature to such a level that the flux melts or the solvent slowly evaporates, and then to a second value that melts the solder. In another case, if the parts are not yet in good thermal contact with one another, the temperature is brought to a higher value in such a way that rapid heat transfer from the soldering stamp to the parts 1, 2 takes place, and then the temperature is brought to a suitable soldering temperature lowered.
  • the invention also relates to an apparatus for performing the method.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Process for welding pieces by means of a welding press element having a welding member which is travelled by an electric heating current and which has a thermal controlled element by means of which one of the pieces to be welded may be subjected to a complementary heating.

Description

"Verfahren zum Verlöten von Teilen und Vorrichtung zu dessen Durchführung""Method for soldering parts and device for carrying them out"
Die Erfindung betrifft ein Verfahren zum Verlöten von Teilen mittels eines Lötstempels, dessen Andruckbügel von einem elektrischen Heizstrom durchflössen wird und mit einem den Strom steuernden Thermoelement versehen ist.The invention relates to a method for soldering parts by means of a soldering stamp, the pressure bracket through which an electrical heating current flows and is provided with a thermocouple controlling the current.
Hierbei ist häufig die Wärmeableitung über eines der Teile zu groß, um eine einwandfreie Verlötung zu erhalten.The heat dissipation from one of the parts is often too great to ensure perfect soldering.
Der Erfindung liegt die Aufgabe zugrunde, Maßnahmen vorzusehen, die dieser Wärmeableitung entgegenwirken.The invention has for its object to provide measures that counteract this heat dissipation.
Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß mindestens eines der Teile von einem zweiten Heizstrom durchflössen wird.This object is achieved in that at least one of the parts is flowed through by a second heating current.
Weitere Einzelheiten der Erfindung werden anhand der einzigen Figur der Zeichnung erläutert.Further details of the invention will be explained with reference to the single figure of the drawing.
Darin ist mit 1 ein erstes Teil, mit 2 ein zweites Teil, das mit dem ersten Teil verlötet werden soll, mit 3 ein LötStempel, mit 4 dessen Andruckbügel, mit 5 ein Thermoelement, mit 6 zwei Elektroden und mit 7 ein Steuerkreis bezeichnet, der einen Komparator 8, zwei Anpassungsglieder 9, zwei Triacs 10 und einen Transformator 11 aufweist. Die ThermoSpannung des Thermoelementes 5, die Spannung einer Solltemperatur und die Lötzeit werden in den Komparator 8 gegeben. Durch den Bügel 4 und das Teil 1 fließt je ein Heizstrom. Zum Verlöten der Teile 1 und 2 werden der Lötstempel 3 und die Elektroden 6 nach unten gedrückt. Die Triacs 10 steuern die Netzströme, die durch den Transformator 11 fliessen.In it, 1 denotes a first part, 2 a second part that is to be soldered to the first part, 3 a soldering stamp, 4 its pressure bracket, 5 a thermocouple, 6 two electrodes and 7 a control circuit, which has a comparator 8, two matching elements 9, two triacs 10 and a transformer 11. The thermal voltage of the thermocouple 5, the voltage of a target temperature and the soldering time are given in the comparator 8. A heating current flows through the bracket 4 and part 1. To solder the parts 1 and 2, the soldering stamp 3 and the electrodes 6 are pressed down. The triacs 10 control the mains currents that flow through the transformer 11.
Die Temperaturverteilung in den Teilen 1,2 kann in vorgegebener Weise während der Zeit geändert werden. So ist es beispielsweise sinnvoll, die Temperatur zunächst auf einen solchen Wert zu bringen, daß das Flußmittel schmilzt bzw. Lösungsmittel langsam verdampft, und dann auf einen zweiten Wert, der das Lot zum Schmelzen bringt. In einem anderen Fall wird zunächst, wenn die Teile noch keinen guten thermischen Kontakt miteinander haben, die Temperatur auf einen höheren Wert ge bracht, derart, daß ein schneller Wärmetransport vom Lötstempel auf die Teile 1,2 erfoHgjt, und dann wird die Temperatur auf eine geeignete Löttemperat abgesenkt.The temperature distribution in the parts 1, 2 can be changed in a predetermined manner during the time. For example, it makes sense to first bring the temperature to such a level that the flux melts or the solvent slowly evaporates, and then to a second value that melts the solder. In another case, if the parts are not yet in good thermal contact with one another, the temperature is brought to a higher value in such a way that rapid heat transfer from the soldering stamp to the parts 1, 2 takes place, and then the temperature is brought to a suitable soldering temperature lowered.
Die Erfindung bezieht sich auch auf eine Vorrichtung zur Durchführung des Verfahrens.The invention also relates to an apparatus for performing the method.
Die Gedanken gemäß den Ansprüchen 4 bis 9 sind auch dann von erfindungsgemässer Bedeutung, wenn nur ein Heizkreis, z.B. der durch den Lötstempel, vorhanden ist. The ideas according to claims 4 to 9 are also of importance according to the invention if only one heating circuit, e.g. which is available through the soldering stamp.

Claims

Patentansprüche : Claims:
1. Verfahren zum Verlöten von Teilen mittels eines Lötstempels, dessen Andruckbügel von einem elektrischen Heizstrom durchflössen wird und mit einem den Strom steuernden Thermoelement versehen ist, dadurch gekennzeichnet, daß mindestens eines der Teile (1) von einem zweiten Heizstrom durchflössen wird.1. A method for soldering parts by means of a soldering stamp, the pressure bracket is flowed through by an electrical heating current and is provided with a current-controlling thermocouple, characterized in that at least one of the parts (1) is flowed through by a second heating current.
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß der zweite Heizstrom ebenfalls von dem Thermoelement (5) gesteuert wird.2. The method according to claim 1, characterized in that the second heating current is also controlled by the thermocouple (5).
3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß der zweite Heizstrom in der Zeit fließt, in welcher der erste Heizstrom fließt oder auch kurze Zeit davor und/oder auch kurze Zeit danach.3. The method according to claim 1 or 2, characterized in that the second heating current flows in the time in which the first heating current flows or a short time before and / or a short time after.
4. Verfahren nach einem oder mehreren der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die Temperaturverteilung in den Teilen (1,2) in vorgegebener Weise während der Zeit geändert wird, insbesondere durch Steuerung der Ströme.4. The method according to one or more of claims 1 to 3, characterized in that the temperature distribution in the parts (1,2) is changed in a predetermined manner during the time, in particular by controlling the currents.
5. Verfahren nach einem oder mehreren der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß die vorgegebene Lötzeit beginnt, wenn das Lot zu schmelzen beginnt. 5. The method according to one or more of claims 1 to 4, characterized in that the predetermined soldering time begins when the solder begins to melt.
6. Verfahren nach einem oder mehreren der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß die Zeit von Beginn des Anheizens bis zum Schmelzen des Lotes und/oder die Temperatur während dieser Zeit gemessen und ausgewertet werden, z.B. in der Weise, daß die darauf folgende Lötzeit und/oder die Löttemperatur entsprechend eingestellt werden.6. The method according to one or more of claims 1 to 5, characterized in that the time from the start of heating up to the melting of the solder and / or the temperature during this time are measured and evaluated, e.g. in such a way that the subsequent soldering time and / or the soldering temperature are set accordingly.
7. Verfahren nach Anspruch 5 oder 6, dadurch gekennzeichnet, daß zum Erkennen des Schmelzens des Lotes die damit im Zusammenhang stehende plötzliche Energie bedarfsänderung benützt wird.7. The method according to claim 5 or 6, characterized in that the associated sudden energy change in demand is used to detect the melting of the solder.
8. Verfahren nach einem oder mehreren der Ansprüche 1 bis 7, dadurch gekennzeichnet, daß der Beginn der Heizung der Teile (1,2) durch die Anpreßkraft ausgelöst wird.8. The method according to one or more of claims 1 to 7, characterized in that the beginning of the heating of the parts (1,2) is triggered by the contact pressure.
9. Verfahren nach einem oder mehreren der Ansprüche 1 bis 8, dadurch gekennzeichnet, daß die Teile (1,2) nach dem Lötvorgang durch einen Gasström, insbesondere durch ein während des Lötvorganges angewandtes Schutz- oder Reduk tionsgas, gekühlt werden.9. The method according to one or more of claims 1 to 8, characterized in that the parts (1, 2) are cooled after the soldering process by a gas flow, in particular by a protective or reducing gas used during the soldering process.
10. Vorrichtung zur Durchführung des Verfahrens nach einem oder mehreren der Ansprüche 1 bis 9, dadurch gekennzeichnet, daß zur Schaffung einer geeigneten Temperatur- Verteilung mehr als zwei Elektroden (1,6), die an das (die) Teil(e) (1,2) angelegt werden, und/oder mehr als ein Thermoelement (5) vorgesehen sind.10. Device for performing the method according to one or more of claims 1 to 9, characterized in that to create a suitable temperature Distribution more than two electrodes (1,6) which are applied to the part (s) (1,2) and / or more than one thermocouple (5) are provided.
11. Vorrichtung zur Durchführung des Verfahrens nach einem oder mehreren der Ansprüche 1 bis 9, dadurch gekennzeichnet, daß die Elektroden (6) und/oder der Heizstempel (3,5) Formen aufweisen, die den Teilen (1,2) und/oder dem Lot angepaßt sind, z.B. in der Weise, daß der Heizstempel (3,5) auch zum Transportieren und/oder Positionieren eines der Teile (2) und/ oder des Lotes ausgelegt ist. 11. The device for performing the method according to one or more of claims 1 to 9, characterized in that the electrodes (6) and / or the heating stamp (3,5) have shapes that the parts (1,2) and / or are adapted to the solder, e.g. in such a way that the heating stamp (3, 5) is also designed for transporting and / or positioning one of the parts (2) and / or the solder.
PCT/EP1980/000114 1979-10-23 1980-10-17 Process for welding pieces and apparatus for implementing such process WO1981001115A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2943243 1979-10-23
DE19792943243 DE2943243C3 (en) 1979-10-23 1979-10-23 Method for soldering parts and device for its implementation

Publications (1)

Publication Number Publication Date
WO1981001115A1 true WO1981001115A1 (en) 1981-04-30

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PCT/EP1980/000114 WO1981001115A1 (en) 1979-10-23 1980-10-17 Process for welding pieces and apparatus for implementing such process

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EP (1) EP0038333A1 (en)
DE (1) DE2943243C3 (en)
WO (1) WO1981001115A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0136575A1 (en) * 1983-09-21 1985-04-10 Siemens Aktiengesellschaft Soldering equipment, especially for the production of supplementary connecting modifications on printing boards
DE3828597A1 (en) * 1988-08-23 1990-03-15 Productech Gmbh Method of changing process parameters in pulse soldering
DE3828590A1 (en) * 1988-08-23 1990-03-22 Productech Gmbh Changes to the process parameters as a function of the thermal loads of a heat source especially during pulse soldering

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3404945A1 (en) * 1984-02-11 1985-08-14 Robert Bosch Gmbh, 7000 Stuttgart Method for controlling the power of the heat source of a soldering device
DE4433548A1 (en) * 1994-09-06 1996-03-07 Ingbuero Wolf & Partner Gmbh Soldering copper@ alloys by electrical resistance heating
DE19832887A1 (en) * 1998-07-22 2000-01-27 Innotronic Vertriebs Gmbh Setting parameter values for a soldering station, with the target soldering temperature set by entering of a code via a code reader directly connected to the temperature control unit of the soldering tool

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2790059A (en) * 1955-06-13 1957-04-23 Zepher Mfg Co Resistance soldering device and method
US3777109A (en) * 1972-04-20 1973-12-04 Bourns Inc Process and apparatus for removing undesired windings from wirewound elements
US3870850A (en) * 1972-02-02 1975-03-11 Igor Naumovich Larionov Method of connecting electrically conducting bodies
US3874549A (en) * 1972-05-26 1975-04-01 Norman Hascoe Hermetic sealing cover for a container for a semiconductor device
FR2278443A1 (en) * 1974-07-19 1976-02-13 Berco Ste Civile Etude Rech Soldering iron tip made of insulating and conducting materials - of high mechanical resistance and reliability by maintaining precise temp
FR2306041A1 (en) * 1975-04-01 1976-10-29 Honeywell Bull Soc Ind Soldering tool for making contacts on semiconductor chips - using soldering bit shaped to reduce soldering time
DE2836731A1 (en) * 1978-08-22 1980-03-06 Siemens Ag Electric resistance soldering of components with large surfaces - via two pairs of electrodes connected via power diodes to split sec. winding of transformer

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2790059A (en) * 1955-06-13 1957-04-23 Zepher Mfg Co Resistance soldering device and method
US3870850A (en) * 1972-02-02 1975-03-11 Igor Naumovich Larionov Method of connecting electrically conducting bodies
US3777109A (en) * 1972-04-20 1973-12-04 Bourns Inc Process and apparatus for removing undesired windings from wirewound elements
US3874549A (en) * 1972-05-26 1975-04-01 Norman Hascoe Hermetic sealing cover for a container for a semiconductor device
FR2278443A1 (en) * 1974-07-19 1976-02-13 Berco Ste Civile Etude Rech Soldering iron tip made of insulating and conducting materials - of high mechanical resistance and reliability by maintaining precise temp
FR2306041A1 (en) * 1975-04-01 1976-10-29 Honeywell Bull Soc Ind Soldering tool for making contacts on semiconductor chips - using soldering bit shaped to reduce soldering time
DE2836731A1 (en) * 1978-08-22 1980-03-06 Siemens Ag Electric resistance soldering of components with large surfaces - via two pairs of electrodes connected via power diodes to split sec. winding of transformer

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
IBM Technical Disclosure Bulletin, Band 14, Nummer 12, Mai 1972 (New York), T.A. BURNS und A.W. RZANT, "Microbrasing termination technique for magnet wire" siehe Seite 3590. *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0136575A1 (en) * 1983-09-21 1985-04-10 Siemens Aktiengesellschaft Soldering equipment, especially for the production of supplementary connecting modifications on printing boards
DE3828597A1 (en) * 1988-08-23 1990-03-15 Productech Gmbh Method of changing process parameters in pulse soldering
DE3828590A1 (en) * 1988-08-23 1990-03-22 Productech Gmbh Changes to the process parameters as a function of the thermal loads of a heat source especially during pulse soldering

Also Published As

Publication number Publication date
EP0038333A1 (en) 1981-10-28
DE2943243A1 (en) 1981-05-14
DE2943243C3 (en) 1982-04-01
DE2943243B2 (en) 1981-08-20

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