UST105403I4 - Method of manufacturing a sealing cap for an integrated circuit carrying substrate - Google Patents

Method of manufacturing a sealing cap for an integrated circuit carrying substrate Download PDF

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Publication number
UST105403I4
UST105403I4 US06/636,877 US63687784A UST105403I4 US T105403 I4 UST105403 I4 US T105403I4 US 63687784 A US63687784 A US 63687784A US T105403 I4 UST105403 I4 US T105403I4
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US
United States
Prior art keywords
integrated circuit
manufacturing
sealing cap
carrying substrate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
US06/636,877
Inventor
Eric B. Hultmark
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed filed Critical
Priority to US06/636,877 priority Critical patent/UST105403I4/en
Application granted granted Critical
Publication of UST105403I4 publication Critical patent/UST105403I4/en
Pending legal-status Critical Current

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    • H10W99/00—
    • H10W76/12—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/877—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/16—Two dimensionally sectional layer
    • Y10T428/161—Two dimensionally sectional layer with frame, casing, or perimeter structure

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A cap for sealing a substrate having integrated circuit chips thereon is manufactured by ultrasonically machining a pattern of channels in the top surface of a plate, the pattern of channels defining a plurality of pedestals at locations corresponding to integrated circuit chip locations on the substrate. The pedestal tops are then ultrasonically machined so that each top lies a predetermined distance from the top surface of the plate.
Ceramic caps manufactured according to the present invention may be mass produced with precise dimensional tolerances.
US06/636,877 1982-09-07 1984-08-02 Method of manufacturing a sealing cap for an integrated circuit carrying substrate Pending UST105403I4 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US06/636,877 UST105403I4 (en) 1982-09-07 1984-08-02 Method of manufacturing a sealing cap for an integrated circuit carrying substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US41476482A 1982-09-07 1982-09-07
US06/636,877 UST105403I4 (en) 1982-09-07 1984-08-02 Method of manufacturing a sealing cap for an integrated circuit carrying substrate

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US41476482A Continuation 1982-09-07 1982-09-07

Publications (1)

Publication Number Publication Date
UST105403I4 true UST105403I4 (en) 1985-05-07

Family

ID=27022705

Family Applications (1)

Application Number Title Priority Date Filing Date
US06/636,877 Pending UST105403I4 (en) 1982-09-07 1984-08-02 Method of manufacturing a sealing cap for an integrated circuit carrying substrate

Country Status (1)

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US (1) UST105403I4 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5703397A (en) * 1991-11-28 1997-12-30 Tokyo Shibaura Electric Co Semiconductor package having an aluminum nitride substrate
US6252776B1 (en) * 1998-07-23 2001-06-26 Nec Corporation Heat radiating member for heat generating device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5703397A (en) * 1991-11-28 1997-12-30 Tokyo Shibaura Electric Co Semiconductor package having an aluminum nitride substrate
US6252776B1 (en) * 1998-07-23 2001-06-26 Nec Corporation Heat radiating member for heat generating device

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