USRE46141E1 - Semiconductor device and timing control method for the same - Google Patents
Semiconductor device and timing control method for the same Download PDFInfo
- Publication number
- USRE46141E1 USRE46141E1 US14/207,015 US201414207015A USRE46141E US RE46141 E1 USRE46141 E1 US RE46141E1 US 201414207015 A US201414207015 A US 201414207015A US RE46141 E USRE46141 E US RE46141E
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- US
- United States
- Prior art keywords
- circuit
- power supply
- clock
- supply line
- input signal
- Prior art date
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/4074—Power supply or voltage generation circuits, e.g. bias voltage generators, substrate voltage generators, back-up power, power control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/4076—Timing circuits
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
- H03K3/01—Details
- H03K3/012—Modifications of generator to improve response time or to decrease power consumption
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
- H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
- H03K3/353—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of field-effect transistors with internal or external positive feedback
- H03K3/356—Bistable circuits
- H03K3/356104—Bistable circuits using complementary field-effect transistors
- H03K3/356113—Bistable circuits using complementary field-effect transistors using additional transistors in the input circuit
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2207/00—Indexing scheme relating to arrangements for writing information into, or reading information out from, a digital store
- G11C2207/22—Control and timing of internal memory operations
- G11C2207/2227—Standby or low power modes
Definitions
- the present invention relates to a semiconductor device and a timing control method for the same, and in particular to a semiconductor device including an internal circuit connected to a power supply via a source transistor as well as to a timing control method for such a semiconductor device.
- LPDDR2-SDRAMs Low Power Double Data Rate2 Synchronous Dynamic Random Access Memories
- the power supply voltage of a peripheral circuit is 1.2V and the operating frequency is 667 MHz.
- DDR2 DDR2-SDRAM
- DDR2 DDR2-SDRAM
- the source transistor must be turned ON before a command is input to the memory control circuit. Moreover, in order to ensure stable operation of the memory control circuit, there must be a sufficient time difference (operating margin) between a switching timing of the source transistor and a command input timing.
- the present inventors have recognized that the increased operation speed is a cause of difficulty in achieving a sufficient operating margin.
- the inventors have also recognized that the current consumption will be increased if simply the source transistor switching timing is made earlier in order to assure a sufficient operating margin.
- the present invention seeks to solve one or more of the above-described problems.
- a semiconductor device that includes a power-supply control portion for supplying power to an internal circuit in response to an input signal synchronized with rising of clock; and a latch portion for latching the input signal in synchronization with falling of the clock to supply the input signal to the internal circuit.
- a source transistor serving as the power supply control portion is turned ON in response to the rising of clock, and then a command signal as the input signal is supplied to the internal circuit in response to the falling of the clock.
- a timing control method for a semiconductor device that including supplying power to an internal circuit in response to an input signal synchronized with rising of clock; and latching the input signal in synchronization with falling of the clock to supply the input signal to the internal circuit.
- FIG. 1 is a block diagram showing a principal part of a known semiconductor device
- FIG. 2 is a timing chart for explaining operation of the semiconductor device shown in FIG. 1 ;
- FIG. 3 is a block diagram showing a principal part of a semiconductor device according to a first embodiment of the present invention
- FIG. 4 is a timing chart for explaining operation of the semiconductor device shown in FIG. 3 ;
- FIG. 5 is a block diagram showing a principal part of a semiconductor device according to a second embodiment of the present invention.
- a pull-up source transistor 103 is connected between a main power-supply line 101 and an auxiliary power-supply line 102
- a pull-down source transistor 106 is connected between a main ground line 104 and an auxiliary ground line 105 .
- This configuration is such that the source transistor is turned ON by using a source transistor control signal before inputting a memory operation control signal to a memory control circuit 107 .
- FIG. 2 is a timing chart showing operation timings of the DDR2. As shown in FIG. 2 , if a RAS signal is at a low level at the rising timing of clock CK, an Active command is generated as an internal command signal, whereas if a CAS signal is at a low level, a Read/Write command is generated.
- the Active command is supplied to a RAS control circuit.
- the source transistor control signal is supplied to a RAS control circuit source transistor so that the RAS control circuit source transistor is turned ON before the Active command is input to the RAS control circuit.
- the Read/Write command is supplied to CAS control circuits 1 and 2 .
- a source transistor control signal is supplied to source transistors of the CAS control circuits 1 and 2 so that the source transistors of the CAS control circuits 1 and 2 are turned ON before the Read/Write command is input to the CAS control circuits 1 and 2 .
- the CAS control circuit 1 Since the internal circuit cannot be activated before input of a Read/Write command, the CAS control circuit 1 is designed such that the source transistor is turned ON in response to an Active command in a previous cycle. In this case, a sufficient difference (operating margin M 2 ) can be ensured between the source transistor switching timing and the command input timing. However, off-current will flow through the internal circuit during the period of the operating margin M 2 , resulting in increase of the current consumption.
- FIG. 3 is a block diagram showing a memory control unit and source transistor control unit of a semiconductor device according to a first embodiment of the present invention.
- the memory control unit has a command decode portion (command decoder) 11 , a fall command latch portion (fall command latch) 12 , and a memory operation control portion (RAS/CAS control) 13 .
- the source transistor control unit has a driver portion (Source Tr. Driver) 14 and a source transistor portion (Source Tr) 15 .
- the command decode portion 11 operates as input means (or an input portion) for the memory operation control portion 13 . Specifically, the command decode portion 11 decodes a memory operation control command input to command pins CA 0 TO CA 9 and outputs an internal command signal in synchronization with a first clock PCLKMRB.
- the fall command latch portion (D latch) 12 latches the internal command signal received from the command decode portion 11 in synchronization with a second clock PCLKMFB and supplies the latched signal to the memory operation control portion 13 .
- the memory operation control portion 13 performs a predetermined memory control operation (e.g., an address input) in accordance with the input internal command signal.
- a predetermined memory control operation e.g., an address input
- the driver portion 14 has a pair of drivers (pull-up and pull-down drivers) associated with a pair of source transistors forming the source transistor portion 15 . These drivers drive the corresponding source transistors, respectively, in response to an internal command signal supplied by the command decode portion 11 . This means that these drivers function as drive means (or drive portions).
- the source transistor portion 15 is composed of a pair of source transistors.
- One of the source transistors (pull-up source transistor) is connected between a main power-supply line and an auxiliary power-supply line, while the other source transistor (pull-down source transistor) is connected between a main ground line and an auxiliary ground line.
- the main power-supply line is supplied with an external power supply voltage VPERI
- the main ground line is supplied with an external ground voltage VSS.
- the auxiliary power-supply line is supplied with a power supply voltage VPERIZ and the auxiliary ground line is supplied with a ground voltage VSSZ.
- the source transistors function as power supply control means (or power-supply control portions). Since these source transistors are driven by separate drivers, respectively, they may be of different characteristics from each other.
- this semiconductor device actually includes three circuit groups, namely RAS, first CAS, and second CAS circuit groups. Specifically, the semiconductor device has three memory operation control portions 13 , and source transistor portions 15 , driver portions 14 , and fall command latch portions 12 corresponding to these memory operation control portions 13 , respectively.
- FIG. 4 only shows an Active signal to the command pins CA 0 and a Read/Write signal to the CA 1 .
- the command decode portion 11 decodes the input memory operation control command and outputs the decoded signal as an internal command signal.
- the internal command signal output by the command decode portion 11 is branched into three by branch lines (branch means) and supplied to the drivers of the driver portion 14 and to the fall command latch portion 12 .
- this semiconductor circuit has three circuit groups in total consisting of a RAS circuit group and first and second CAS circuit groups. If the internal command signal is an Active command, it is supplied to the RAS circuit group, whereas if the internal command signal is a Read/Write command, it is supplied to the first and second CAS circuit groups.
- the drivers of the driver portion 14 Upon receiving the internal command signal from the command decode portion 11 , the drivers of the driver portion 14 turn ON the corresponding source transistors, respectively. If the signal output by the command decode portion 11 is an Active command, the RAS source transistor is turned ON and the RAS control circuit ( 13 ) is supplied with power. If the signal output by the command decode portion 11 is a Read/Write command, the first and second CAS source transistors are turned ON and both the first and second CAS control circuits are supplied with power. Thus, according to the present embodiment, the power supply control of the memory operation control portion 13 is performed at a specified timing based on the rising of the clock CK.
- the fall command latch portion 12 is supplied with a second clock PCLKMFB generated on the basis of the falling of the external clock CK.
- a phase difference between the first clock PCLKMRB and the second clock PCLKMFB that is equal to a half cycle of the external clock CK (tCK/2, where tCK is a cycle of the external clock).
- the fall command latch portion 12 latches the internal command signal received from the command decode portion 11 and outputs the latched signal to the memory operation control portion 13 . After that, the fall command latch portion 12 is reset by a reset signal generated by delaying the second clock PCLKMFB by a predetermined period of time in the delay circuit 16 .
- the input of a command signal to the memory operation control portion 13 i.e., a memory control operation such as address input
- the input of a command signal to the memory operation control portion 13 is performed at a specified timing based on the falling of the clock CK.
- the provision of sufficient operating margins enables the first CAS control circuit, as well as the second CAS control circuit, to turn the source transistor ON in response to a Read/Write command This makes it possible to reduce the current consumption in a period of time between the input of an Active command to the input of a Read/Write command.
- a semiconductor device according to a second embodiment of the present invention will be described in detail with reference to FIG. 5 .
- FIG. 5 is a block diagram showing a memory control unit and a source transistor control unit of the semiconductor device according to the second embodiment of the present invention.
- like components to those of FIG. 1 are given like reference characters.
- a single source transistor driver 21 is provided in place of the driver portion 14 of the first embodiment.
- the circuit configuration can be simplified by using this single source transistor driver 21 to turn ON and OFF the pair of the source transistors of the source transistor portion 15 .
- a fall command decode portion 22 formed with a logic circuit as latch means is provided in place of the fall command latch portion 12 .
- a through latch may be used as the latch means.
- a sufficient operating margin can be provided in a period of time from the turning ON of the source transistor until the input of an internal command signal to the memory operation control portion 13 , and hence the current consumption in that period can be reduced.
- the semiconductor device according to the present invention is designed, as described above, such that the internal circuit is supplied with power in response to the rising of clock, and an input signal is supplied to the internal circuit in response to the falling of the clock, whereby the operation can be stabilized and the current consumption can be reduced. Thus, both rapid operation and low current consumption can be achieved.
Abstract
Description
Claims (27)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US14/207,015 USRE46141E1 (en) | 2007-10-26 | 2014-03-12 | Semiconductor device and timing control method for the same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007279520A JP5457628B2 (en) | 2007-10-26 | 2007-10-26 | Semiconductor device and timing control method thereof |
JP2007-279520 | 2007-10-26 | ||
US12/257,758 US8134405B2 (en) | 2007-10-26 | 2008-10-24 | Semiconductor device and timing control method for the same |
US14/207,015 USRE46141E1 (en) | 2007-10-26 | 2014-03-12 | Semiconductor device and timing control method for the same |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/257,758 Reissue US8134405B2 (en) | 2007-10-26 | 2008-10-24 | Semiconductor device and timing control method for the same |
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USRE46141E1 true USRE46141E1 (en) | 2016-09-06 |
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US12/257,758 Ceased US8134405B2 (en) | 2007-10-26 | 2008-10-24 | Semiconductor device and timing control method for the same |
US14/207,015 Active 2029-01-28 USRE46141E1 (en) | 2007-10-26 | 2014-03-12 | Semiconductor device and timing control method for the same |
Family Applications Before (1)
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US12/257,758 Ceased US8134405B2 (en) | 2007-10-26 | 2008-10-24 | Semiconductor device and timing control method for the same |
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US (2) | US8134405B2 (en) |
JP (1) | JP5457628B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5742508B2 (en) * | 2011-06-27 | 2015-07-01 | 富士通セミコンダクター株式会社 | Semiconductor memory, system, and operation method of semiconductor memory |
JP2014130674A (en) * | 2014-01-09 | 2014-07-10 | Ps4 Luxco S A R L | Semiconductor device and timing control method thereof |
US10254782B2 (en) * | 2016-08-30 | 2019-04-09 | Micron Technology, Inc. | Apparatuses for reducing clock path power consumption in low power dynamic random access memory |
Citations (18)
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US20090273383A1 (en) * | 2008-04-30 | 2009-11-05 | Fujitsu Microelectronics Limited | Logic circuit having gated clock buffer |
-
2007
- 2007-10-26 JP JP2007279520A patent/JP5457628B2/en not_active Expired - Fee Related
-
2008
- 2008-10-24 US US12/257,758 patent/US8134405B2/en not_active Ceased
-
2014
- 2014-03-12 US US14/207,015 patent/USRE46141E1/en active Active
Patent Citations (20)
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US5408144A (en) * | 1993-01-07 | 1995-04-18 | Hitachi, Ltd. | Semiconductor integrated circuits with power reduction mechanism |
US5381455A (en) * | 1993-04-28 | 1995-01-10 | Texas Instruments Incorporated | Interleaved shift register |
US5659517A (en) * | 1994-09-09 | 1997-08-19 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor memory device with an improved hierarchical power supply line configuration |
US5724297A (en) * | 1995-12-21 | 1998-03-03 | Hitachi, Ltd. | Semiconductor integrated circuit device and method of activating the same |
US5926430A (en) * | 1995-12-21 | 1999-07-20 | Hitachi, Ltd. | Semiconductor integrated circuit device and method of activating the same |
US6885216B2 (en) * | 1998-05-14 | 2005-04-26 | Renesas Technology Corp. | Semiconductor circuit device having active and standby states |
JP2000195254A (en) | 1999-01-04 | 2000-07-14 | Mitsubishi Electric Corp | Semiconductor memory |
JP2002074953A (en) | 2000-09-04 | 2002-03-15 | Fujitsu Ltd | Synchronous type semiconductor memory, and latch control method for its input information |
US20040257117A1 (en) * | 2002-12-13 | 2004-12-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display appliance using the semiconductor device |
US6876252B2 (en) * | 2003-06-28 | 2005-04-05 | International Business Machines Corporation | Non-abrupt switching of sleep transistor of power gate structure |
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US20050283696A1 (en) * | 2004-04-07 | 2005-12-22 | Robert Warren | Integrated circuit |
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Also Published As
Publication number | Publication date |
---|---|
JP2009110568A (en) | 2009-05-21 |
US20090108897A1 (en) | 2009-04-30 |
US8134405B2 (en) | 2012-03-13 |
JP5457628B2 (en) | 2014-04-02 |
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