USRE35832E - Electrostatically protected IC card - Google Patents

Electrostatically protected IC card Download PDF

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Publication number
USRE35832E
USRE35832E US08558285 US55828595A USRE35832E US RE35832 E USRE35832 E US RE35832E US 08558285 US08558285 US 08558285 US 55828595 A US55828595 A US 55828595A US RE35832 E USRE35832 E US RE35832E
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US
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Grant
Patent type
Prior art keywords
body
board
card
conductive
side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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US08558285
Inventor
Carl C. Perkins
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ITT Corp
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ITT Corp
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    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07735Physical layout of the record carrier the record carrier comprising means for protecting against electrostatic discharge
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K13/00Conveying record carriers from one station to another, e.g. from stack to punching mechanism
    • G06K13/02Conveying record carriers from one station to another, e.g. from stack to punching mechanism the record carrier having longitudinal dimension comparable with transverse dimension, e.g. punched card
    • G06K13/07Transporting of cards between stations
    • G06K13/077Transporting of cards between stations with intermittent movement; Braking or stopping movement
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743External electrical contacts
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00Electrical connectors
    • Y10S439/946Memory card cartridge

Abstract

A system is provided wherein an IC memory card (10, FIG. 2) is inserted into a slot (12) of an electronic device (14), which discharges any static electric charge on the card. The card includes a frame that comprises a body having opposite side beams and top and bottom conductive covers mounted on the side beams, to enclose a circuit board. The circuit board has a ground plane, and a first of the side beams has an electrically conductive surface portion directly engaged with a peripheral portion of the ground plane and with one of the covers, to connect the cover to the side beam conductive portion. The body can be constructed of molded electrically conductive material.

Description

This is a continuation of application Ser. No. 07/756,940, filed Sep. 9, 1991, now abandoned.

BACKGROUND OF THE INVENTION

Memory cards commonly are constructed with a molded plastic body having opposite sides and ends, a combination circuit board and connector that is installed in the body, and top and bottom metallic covers installed at the top and bottom of the body. Such memory cards are especially useful in electronic equipment or devices of very small thickness, such as laptop computers that may have a width and length of 81/2 inches by 11 inches, and a thickness of much less than one inch. Standard JEIDA cards have a thickness, or height, of five .Iadd.or .Iaddend.3.3 . .or.!. millimeters, which enables them to be inserted into thin slots of the electronic device.

SUMMARY OF THE INVENTION

In accordance with one embodiment of the present invention, an IC memory card is provided which enables grounding of the card during its insertion into a slot of an electronic device. The card has a frame that includes a molded body with opposite sides and forward and rearward ends, which holds a circuit board assembly having a ground plane and which hold a connector connected to the circuit board. The frame has an electrically conductive region connected to the ground plane of the circuit board.

The body of the card frame can be molded of electrically conductive material. The electrically conductive body provides good EMI (electromagnetic interference) shielding for the card (in conjunction with conductive top and bottom covers of the frame).

The novel features of the invention are set forth with particularly in the appended claims. The invention will be best understood from the following description when read in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an isometric view of an IC memory card and an electronic device in the form of a laptop computer, constructed in accordance with the present invention.

FIG. 2 is a sectional top view of the memory card and a portion of the electronic device of FIG. 1.

FIG. 3 is an exploded isometric view of the memory card of FIG. 2.

FIG. 4 is an isometric view of just the body of the frame of the memory card of FIG. 3.

FIG. 5 is a partial sectional view of a memory card taken on the line 5--5 of FIG. 2.

FIG. 6 is a side view of a combination of connector and circuit board assembly of the card of FIG. 3.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 illustrates an IC (integrated circuit) memory card 10 of the present invention that is adapted to be inserted into a slot 12 of an electronic device 14, the particular device shown being a laptop computer. One style of electronic computer has a width and length of 8.5 inches and 11 inches respectively and a thickness T that is as small as possible, preferably a small fraction of an inch. Such as laptop computer can be carried around in space designed to be occupied by ordinary sheets of paper or booklets. One source of concern in using memory cards, is that the card may have a considerable static electric charge, which must be dissipated prior to full insertion of the card, to avoid damage to components in the electronic device.

FIG. 2 shows the memory card 10 as it is being inserted into the slot 12 of the device 14. The memory card includes a frame 16 with forward and rearward ends 20, 22 and opposite sides 24, 26. A connector 30 is mounted at the forward end of the frame and has multiple socket contacts 32 that are positioned to mate when the card moves in a forward direction. The electronic device has multiple corresponding pin contacts 34 at the front end 36 of the slot, which fully engage the socket contacts when the card is fully in a forward direction inserted into the slot. The connector 30 has a housing molded of dielectric material with holes that hold the card contacts 32.

FIG. 3 shows details of the memory card 10, which includes the frame 16 and connector 30 that is mounted at the forward end of the frame. A circuit board assembly 40 that is mounted on the frame, includes a circuit board 42 and a plurality of circuit components 44 mounted on the board. FIG. 6 illustrates how the rear ends 46 of the connector socket contacts 32 are connected to conductive traces on the board 42. The frame 16 (FIG. 3) includes an injection molded body 50 and upper and lower electrically conductive covers 52, 54 that can be mounted on the top and bottom of the frame body 50. The card is assembled by first installing the combination circuit board assembly 40 and connector 30 on the body 50. Then the upper and lower covers 52, 54 are attached to opposite faces of the body.

FIG. 4 illustrate details of the molded body 50. The body includes a pair of side beams 60, 62 forming the opposite sides or side edges 24, 26 of the card, .Iadd.with the side edges 24, 26 forming the outside of the side beams 60, 62, .Iaddend.and a rear beam 64 forming the rear end 22 of the card. The body also includes a pair of cross beams 66, 68 which strengthen the body. .Iadd.Each vertical crossbeam 66, 68 has a vertical thickness that is much less than that of the side beams 60, 62..Iaddend.

In accordance with the present invention, the injection molded body 50 is formed of injection molded plastic material which is electrically conductive. A variety of plastic conductive materials are known, which often include multiple particles or fibers of conductive material, such as silver, embedded in a dielectric plastic material, such as a polyester. Such material can be referred to as a molded electrically conductive primarily polymeric material. Although the electrical resistivity of molded plastic material is much higher than that of some metals such as silver and copper, often having a bulk resistivity that is about one or two orders of magnitude greater than that of copper. .. The dielectric material of the connector 30 (FIG. 2) therefore has a resistivity more than 4 orders of magnitude greater than that of copper (Whose.!. .Iadd.whose .Iaddend.electrical resistivity is 1.7 microhm-centimeter . .the.!..Iadd.. The .Iaddend.resistivity of such conductive plastic material.Iadd.s .Iaddend.is moderate and they are considered to be electrically conductive (their resistivities are less than four orders of magnitude greater than that of copper). .Iadd.The dielectric material of the connector 30 (FIG. 2) therefore has a resistivity more than 4 orders of magnitude greater than that of copper. .Iaddend.The use of an electrically conductive body results in important advantages for the memory card. One advantage is that the conductive side and rear beams provide protection against EMI (electromagnetic interference) that might otherwise pass between the metal upper and lower covers . .50.!. .Iadd.52.Iaddend., 54 of the frame. The circuitry in highly compact electronic devices such as laptop computers is typically very close together and it is important to minimize electromagnetic interference between components in the card and those in the electronic device. .Iadd.The sides 24, 26 of the electrically conductive body have electrically conductive surface regions, or portions 70, 72..Iaddend.

FIG. 5 illustrates some details of the connection of the circuit board assembly 40 and the electrically conductive body 50 of the frame. The circuit board 42 of the assembly includes a ground plane 80 of electrically conductive material such as foil, which is connected to grounded locations on the electronic components on the board. The ground plane lies on the opposite faces 82, 84 of the board adjacent to the edges 85 of the board. When the card is assembled as shown in FIG. 5, the ground plane 80 lies facewise against a surface 86 of the frame body 50, to ground the body 50. The bottom cover 54 has a horizontally-extending face 90 and has an edge portion 92 that is bent to extend largely vertically and that has an extreme edge 92e. The edge of the edge portion bears against the ground plane at 80, to assure that the lower cover 54 is maintained at the same potential as the ground plane of the circuit board and the conductive body 50. The top cover 52 also has a face 94 and a bent edge portion 96 whose edge contacts the conductive body to keep the upper cover grounded. This construction avoids the need to use springs or the like to connect the top and bottom covers to each other and to the ground plane, as is used in U.S. Pat. No. 4,780,791. The card can include a frame with a body having portions lying along opposite sides and the rear end of the card, with the body formed of electrically conductive material. Forming the body of electrically conductive material has the additional advantage of providing EMI (electromagnetic interference) shielding along most of the edge area of the card.

.Iadd.It is apparent from the drawings and from the fact that edge portions 92, 96 of the covers are bent, that the electrically conductive covers are formed of sheet metal, that is, of metal having a uniform thickness as opposed to a block of metal that has been machined to cut away metal so as to form depressions and projections..Iaddend.

Although particular embodiments of the invention have been described and illustrated herein, it is recognized that modifications and variations may readily occur to those skilled in the art, and consequently, it is intended that the claims be interpreted to cover such modifications and equivalents.

Claims (9)

I claim:
1. An IC card which includes a frame having opposite sides, forward and rearward ends, and top and bottom .Iadd.electrically conductive .Iaddend.cover regions, said card including a circuit board assembly which lies in said frame and which includes a circuit board having a ground plane and at least one circuit component mounted in said circuit board, said card being constructed to be inserted into a slot of an electronic device until card contacts at the front end of the card mate with device contacts in the device, characterized by:
at least said opposite sides of said frame are formed of molded electrically conductive plastic material having an electrical resistivity which is a plurality of times greater than that of copper, and said opposite sides of said frame are electrically connected to said ground plane of said circuit board.
2. The IC card described in claim 1 wherein:
said frame includes a connector lying at said forward end of said frame and comprising a housing constructed of molded dielectric material having a resistivity more than four orders . .fo.!. .Iadd.of .Iaddend.magnitude greater than the resistivity of copper, said housing having a plurality of holes which hold said card contacts.
3. The IC card described in claim 1 wherein:
said frame includes a molded body of said electrically conductive plastic material, said body having opposite side edges forming at least part of said frame sides, and said frame also includes top and bottom covers mounted over said body and forming said top and bottom cover regions;
said circuit board has opposite faces and opposite edges, with a first of said circuit board edges lying adjacent to a first of said body edges, and said ground plane of said circuit board includes a portion lying on one of said circuit board faces adjacent to said first board edge;
a first of said covers has a primarily horizontally-extending face and has an edge portion bent to extend largely vertically, said edge portion having an extreme edge bearing against said ground plane portion on said circuit board.
4. An IC card comprising:
a frame having opposite sides and front and rear ends and having top and bottom conductive cover regions;
a circuit board assembly which includes a board and at least one circuit component mounted on said board, said board having a ground plane;
a connector which is mounted on said front end of said frame and which has a plurality of contacts;
said frame including a body extending at least along said opposite sides, said body being constructed of molded electrically conductive primarily polymeric material molded into the shape of said body and connected to said ground plane of said board.
5. The card described in claim 4 wherein:
said molded electrically conductive primarily polymeric material has a bulk resistivity which is at least one order to magnitude greater than that of copper, but less than 4 orders of magnitude greater than that of copper. . .6. An IC card comprising:
a frame having opposite sides and front and rear ends and including a body having opposite body side beams;
said frame has first and second conductive covers that each has a peripheral cover portion, with one of said covers being a top cover that generally lies over said body and the other cover being a bottom cover that generally lies under said body;
a circuit board assembly mounted to said body side beams, said circuit board assembly including a board and at least one circuit component mounted on said board, said board assembly having a ground plane;
said board has a peripheral board portion, and said ground plane includes a peripheral ground plane lying at said board peripheral portion and electrically connected to both of said cover peripheral portions;
said body side beams each having an inner first portion sandwiched between said cover peripheral portions, said side beams each having an outer second portion which lies outside said board and said cover peripheral portions to protect the edges of said board and of said covers;
at least one of said body side beams having an electrically conductive surface portion directly engaged with said peripheral ground plane portion; and
one of said covers having a vertically bent edge directly engaged with said side beam conductive surface portion..!.. .7. The IC card described in claim 6 wherein:
said outer second portions of said body side beams each have inner surfaces where they merge with said inner first portions, and said vertically bent edge of said one cover lies substantially against the inner surface of said outer second portion of said one body side beam..!.. .8. An IC card comprising:
a frame which includes a body having opposite sides and forming opposite side beams at said opposite sides, said body also having opposite forward and rearward ends with the distance between said opposite ends being greater than the distance between said opposite sides, said body having upper and lower surfaces, said frame including top and bottom conductive covers that lie respectively over said body upper and lower surfaces and that each has a peripheral cover portion;
a connector mounted on a first of said frame ends and having contacts positioned to mate when the card moves in a forward direction;
a circuit board assembly mounted to said frame, said circuit board assembly including a board with a peripheral portion mounted on said body side beams and with most of said board lying between said body side beams, said board having a ground plane with a peripheral ground plane portion lying at said board peripheral portion; and
a first of said body beams having an electrically conductive surface portion directly engaged with said board ground plane peripheral portion and with a first of said covers, to electrically connect said board ground plane peripheral portion to said first of said covers..!.. .9. An IC card comprising:
a frame having opposite sides and front and rear ends and including a body having opposite side beams, said body including upper and lower surfaces and top and bottom conductive covers that lie respectively over said body upper and lower surfaces and that each has a peripheral cover portion;
a circuit board assembly mounted to said frame, said circuit board including a board mounted on said body side beams, said board lying between said body side beams and having a peripheral board portion and at least one circuit component mounted on said board, said board having a ground plane with a peripheral ground plane portion lying at said board peripheral portion;
at least one of said body beams having an electrically conductive surface portion directly engaged with said peripheral ground plane portion; and
a first of said covers has a primarily horizontally extending face and has an edge portion which is bent to extend vertically and directly engages
said side beam conductive surface portion..!.10. The combination of components which when assembled, forms the frame of an IC card that is adapted to contain a circuit board assembly, said combination comprising:
a body for supporting the circuit board assembly of said IC card, said body having a top and bottom, opposite sides, and front and rear ends, with said ends spaced apart by a greater distance than said sides;
a pair of .Iadd.electrically conductive sheet metal .Iaddend.covers for mounting respectively at said top and bottom of said body to enclose the circuit board assembly;
said body having spaced opposite side beams at said sides, with each of said side beams having upwardly and downwardly-facing surfaces;
at least a first of said body side beams has an electrically conductive surface portion, with parts of said conductive surface portion lying at the outside of said first side beam . .at said body side.!., and at both said upwardly and downwardly-facing surfaces of said first side beam;
a first of said covers has a peripheral cover portion .Iadd.with a periphery having a vertically-facing cover surface .Iaddend.that directly engages said electrically conductive surface portion .Iadd.of said first side beam and that provides a direct electrical connection thereat between said first cover and said first side beam .Iaddend.when said covers are
mounted on said body. 11. The combination described in claim 10 wherein:
first cover has a vertically bent edge which forms said peripheral cover portion that directly engages one of said parts of said electrically
conductive surface portion when said covers are mounted on said body. 12. The combination described in claim 10 wherein:
said body is constructed of a molded electrically conductive polymeric
material. .Iadd.13. The IC card described in claim 10 wherein:
said body includes a plurality of cross beams extending between said body side beams;
said cross beams each has a thickness less than that of said side beams..Iaddend..Iadd.14. The combination of components which when assembled, forms the frame of an IC card that is adapted to contain a circuit board assembly, said combination comprising:
a body for supporting the circuit board assembly of said IC card, said body having a top and a bottom, opposite sides, and front and rear ends that are spaced along a length direction, with said ends spaced apart by a greater distance than said sides;
a pair of electrically conductive sheet metal covers for mounting respectively at said top and bottom of said body to enclose the circuit board assembly;
said body having spaced opposite side beams at said sides, with each of said side beams having upwardly and downwardly-facing surfaces;
each of said body side beams has an electrically conductive surface portion, with parts of said conductive surface portion lying at the outside of each of said side beams at said body sides, and at both said upwardly and downwardly-facing surfaces of each of said side beams, with the conductive surface portion at the outside of each of said side beams extending along substantially the entire length of the side beam;
a first of said sheet metal covers has a cover periphery that directly engage said upwardly-facing surfaces of said side beams when said covers are mounted on said body, with said first sheet metal cover being electrically connected to said side beams only at said cover periphery..Iaddend.
US08558285 1991-09-09 1995-11-13 Electrostatically protected IC card Expired - Lifetime USRE35832E (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US75694091 true 1991-09-09 1991-09-09
US08084034 US5319516A (en) 1991-09-09 1993-06-28 Electrostatically protected IC card
US08558285 USRE35832E (en) 1991-09-09 1995-11-13 Electrostatically protected IC card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08558285 USRE35832E (en) 1991-09-09 1995-11-13 Electrostatically protected IC card

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
US75694091 Continuation 1991-09-09 1991-09-09
US08084034 Reissue US5319516A (en) 1991-09-09 1993-06-28 Electrostatically protected IC card

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USRE35832E true USRE35832E (en) 1998-06-30

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US08084034 Expired - Lifetime US5319516A (en) 1991-09-09 1993-06-28 Electrostatically protected IC card
US08558285 Expired - Lifetime USRE35832E (en) 1991-09-09 1995-11-13 Electrostatically protected IC card

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US08084034 Expired - Lifetime US5319516A (en) 1991-09-09 1993-06-28 Electrostatically protected IC card

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US (2) US5319516A (en)
EP (2) EP0532160B1 (en)
JP (1) JP2935612B2 (en)
DE (3) DE69226999D1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070287332A1 (en) * 2004-06-10 2007-12-13 Commscope Inc. Of North Carolina Shielded jack assemblies and methods for forming a cable termination

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992012612A1 (en) * 1990-12-26 1992-07-23 Eastman Kodak Company Web edge discharging system
DE69226999D1 (en) 1991-09-09 1998-10-22 Itt Mfg Enterprises Inc System for grounding a map
US5414253A (en) * 1991-12-03 1995-05-09 Texas Instruments Incorporated Integrated circuit card
US5333100A (en) * 1992-06-29 1994-07-26 Itt Corporation Data card perimeter shield
JPH0798620A (en) * 1992-11-13 1995-04-11 Seiko Epson Corp Electronic device and computer using it
US5481434A (en) * 1993-10-04 1996-01-02 Molex Incorporated Memory card and frame for assembly therefor
US5596486A (en) * 1993-11-10 1997-01-21 Kaman Aerospace Corporation Hermetically sealed memory or PC card unit having a frame, header and covers in bonded engagement
US6773291B1 (en) 1993-11-12 2004-08-10 Intel Corporation Compliant communications connectors
US6863554B1 (en) 1993-11-12 2005-03-08 Intel Corporation PCMCIA compliant communications connectors
US7074061B1 (en) 1993-11-12 2006-07-11 Intel Corporation Versatile communications connectors
US5773332A (en) * 1993-11-12 1998-06-30 Xircom, Inc. Adaptable communications connectors
US5477421A (en) * 1993-11-18 1995-12-19 Itt Corporation Shielded IC card
US5477426A (en) * 1993-12-15 1995-12-19 Itt Corporation IC card with board positioning means
US5563770A (en) * 1994-02-25 1996-10-08 Itt Corporation IC card with board positioning means
JPH07302318A (en) * 1994-03-09 1995-11-14 Seiko Epson Corp Card type electronic device
DE69500015T2 (en) * 1994-04-12 1997-02-06 Molex Inc Grounding arrangement for IC cards
US5490043A (en) * 1994-04-15 1996-02-06 Hon Hai Precision Ind. Co., Ltd. Grounding clip structure of I/O card
JPH0823149A (en) * 1994-05-06 1996-01-23 Seiko Epson Corp Semiconductor device and its production
US5526235A (en) * 1994-06-23 1996-06-11 Garmin Communication And Navigation Electronic storage device and receptacle
US5548483A (en) * 1995-01-24 1996-08-20 Elco Corporation Frameless IC card and housing therefor
JPH09147068A (en) * 1995-11-17 1997-06-06 Toshiba Corp Ic card reader/writer
US5754404A (en) * 1996-05-14 1998-05-19 Itt Cannon Gmbh IC card rear board-connector support
US5988510A (en) * 1997-02-13 1999-11-23 Micron Communications, Inc. Tamper resistant smart card and method of protecting data in a smart card
US6273339B1 (en) 1999-08-30 2001-08-14 Micron Technology, Inc. Tamper resistant smart card and method of protecting data in a smart card
US5833473A (en) * 1997-03-12 1998-11-10 Itt Manufacturing Enterprises, Inc. Cardbus Bridge
US5940275A (en) * 1997-08-08 1999-08-17 Xircom, Inc. PCMCIA card frame connector and cover assembly
US6282097B1 (en) 1998-10-28 2001-08-28 Garmin Corporation Data card having a retractable handle
US6215671B1 (en) 1998-12-10 2001-04-10 Garmin Corporation Method and apparatus for connecting circuit boards
US6250553B1 (en) 1998-12-30 2001-06-26 Garmin Corporation Data card having a retractable handle
US6151219A (en) * 1999-02-01 2000-11-21 Itt Manufacturing Enterprises, Inc. Electronic card with sheet metal and overmolded plastic frame parts
US20050195581A1 (en) * 2004-03-08 2005-09-08 Super Talent Electronics, Inc. PC card assembly with panels having substantially identical connection structures
US7908080B2 (en) 2004-12-31 2011-03-15 Google Inc. Transportation routing
DE102006040525B3 (en) * 2006-08-30 2008-04-30 Johnson Controls Automotive Electronics Gmbh Potential limiter for electronic device e.g. liquid crystal display, has electrically conductive connection to reference potential and circuit medium e.g. copper strip, for connection at electronic device
KR101701245B1 (en) 2010-10-22 2017-02-02 삼성디스플레이 주식회사 Display apparatus
KR20140122496A (en) * 2013-04-10 2014-10-20 삼성전자주식회사 Board assembly

Citations (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2995686A (en) * 1959-03-02 1961-08-08 Sylvania Electric Prod Microelectronic circuit module
US3200361A (en) * 1962-07-20 1965-08-10 Sperry Rand Corp Printed circuit board connector assembly
US3372310A (en) * 1965-04-30 1968-03-05 Radiation Inc Universal modular packages for integrated circuits
US4146291A (en) * 1977-08-03 1979-03-27 Msi Data Corporation Antistatic electrical connector housing
US4179178A (en) * 1978-02-02 1979-12-18 Rca Corporation Plug-in circuit cartridge with electrostatic charge protection
US4381129A (en) * 1981-07-13 1983-04-26 Zenith Radio Corporation Grounded, multi-pin connector for shielded flat cable
US4384368A (en) * 1980-05-22 1983-05-17 Siemens Aktiengesellschaft Insulated insert with high electric strength
US4386814A (en) * 1981-08-17 1983-06-07 Amp Incorporated Kit for converting a panel opening to a shielded pin receptacle
US4388671A (en) * 1981-06-29 1983-06-14 Honeywell Information Systems Inc. Cathode ray tube display terminal having an enclosure for protection of a logic board
US4399487A (en) * 1980-09-12 1983-08-16 Siemens Ag Insulated plug-in module
US4455448A (en) * 1981-12-02 1984-06-19 Watkins-Johnson Company Housing for microwave electronic devices
US4457575A (en) * 1982-09-21 1984-07-03 Amp Incorporated Electrical connector having improved shielding and keying systems
US4479263A (en) * 1980-05-22 1984-10-23 Siemens Aktiengesellschaft Device for acquiring and processing electrical signals
US4491981A (en) * 1980-05-22 1985-01-01 Siemens Aktiengesellschaft Galvanically separating coupling location for energy and/or signal transmission
US4521062A (en) * 1983-07-26 1985-06-04 International Telephone And Telegraph Corporation Electrical connector with optional grounding element
US4531176A (en) * 1983-06-27 1985-07-23 At&T Bell Laboratories Cartridge having improved electrostatic discharge protection
US4602164A (en) * 1985-01-31 1986-07-22 International Business Machines Corp. Radiation shield system
JPS61282982A (en) * 1985-06-10 1986-12-13 Hitachi Maxell Ltd Ic card
US4642735A (en) * 1984-02-27 1987-02-10 General Electric Company Frequency synthesizer module
US4661889A (en) * 1984-11-16 1987-04-28 Canon Kabushiki Kaisha Electronic apparatus with a battery
JPS6314977A (en) * 1986-07-08 1988-01-22 Mixton Co Ltd Electric revolving lifting door
US4739453A (en) * 1986-03-20 1988-04-19 Kabushiki Kaisha Toshiba Shielding apparatus for a printed circuit board
US4780791A (en) * 1986-04-08 1988-10-25 Fujisoku Electric Co., Ltd. Card-shaped memory having an IC module
US4780570A (en) * 1987-03-30 1988-10-25 Unisys Corporation EMI/RFI shielding for electronic assemblies
US4821146A (en) * 1987-11-17 1989-04-11 International Business Machines Corporation Plugable interposer and printed circuit card carrier
US4823235A (en) * 1986-02-06 1989-04-18 Fujitsu Limited Earth connection device in metal core printed circuit board
US4849944A (en) * 1986-08-18 1989-07-18 Tokyo Electric Company, Ltd. Connecting structure for connecting a memory unit to a memory unit controller
US4868716A (en) * 1988-07-15 1989-09-19 Hewlett-Packard Company RF interconnect and shielding system
US4872091A (en) * 1986-07-21 1989-10-03 Ricoh Company, Ltd. Memory cartridge
US4889498A (en) * 1987-10-21 1989-12-26 Mitsubishi Denki Kabushiki Kaisha Memory card having an elastomer connector
US4889495A (en) * 1988-09-08 1989-12-26 Mitsubishi Denki Kabushiki Kaisha Connecting mechanism for memory card
US4893001A (en) * 1986-01-20 1990-01-09 Itt Corporation IC card
US4905124A (en) * 1987-03-31 1990-02-27 Mitsubishi Denki Kabushiki Kaisha IC card
US4945633A (en) * 1989-03-01 1990-08-07 Nokia-Mobira Oy Method of mounting a printed circuit board and securing the earthing to a casing
US4955817A (en) * 1988-02-12 1990-09-11 Seiko Epson Corporation Construction for removing electronic charges in connectors
JPH02239699A (en) * 1989-03-13 1990-09-21 Fujitsu Ltd Shielding structure of printed board
US4967315A (en) * 1990-01-02 1990-10-30 General Electric Company Metallized ceramic circuit package
US4980856A (en) * 1986-10-20 1990-12-25 Brother Kogyo Kabushiki Kaisha IC memory cartridge and a method for providing external IC memory cartridges to an electronic device extending end-to-end
EP0417648A2 (en) * 1989-09-09 1991-03-20 Mitsubishi Denki Kabushiki Kaisha IC card
US5014160A (en) * 1989-07-05 1991-05-07 Digital Equipment Corporation EMI/RFI shielding method and apparatus
US5050041A (en) * 1990-06-25 1991-09-17 Max Shafi Modem mountable in wall of a computer housing with readily accessible, on/off switch, indicator means and internal switch connecting either modem or an auxiliary serial port to an I/O port
US5053613A (en) * 1990-05-29 1991-10-01 Mitsubishi Denki Kabushiki Kaisha IC card
US5053924A (en) * 1990-03-30 1991-10-01 Motorola, Inc. Electromagnetic shield for electrical circuit
JPH04107191A (en) * 1990-08-28 1992-04-08 Fujitsu Ltd Ic card
US5107404A (en) * 1989-09-14 1992-04-21 Astec International Ltd. Circuit board assembly for a cellular telephone system or the like
US5167326A (en) * 1990-03-19 1992-12-01 R. H. Murphy Co., Inc. Carriers for integrated circuits and the like
US5244397A (en) * 1992-11-20 1993-09-14 Itt Corporation IC card and cable harness

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01119167U (en) * 1988-02-06 1989-08-11
JPH0322499A (en) * 1989-06-20 1991-01-30 Citizen Watch Co Ltd Electromagnetic shielding structure of card
DE69226999D1 (en) 1991-09-09 1998-10-22 Itt Mfg Enterprises Inc System for grounding a map

Patent Citations (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2995686A (en) * 1959-03-02 1961-08-08 Sylvania Electric Prod Microelectronic circuit module
US3200361A (en) * 1962-07-20 1965-08-10 Sperry Rand Corp Printed circuit board connector assembly
US3372310A (en) * 1965-04-30 1968-03-05 Radiation Inc Universal modular packages for integrated circuits
US4146291A (en) * 1977-08-03 1979-03-27 Msi Data Corporation Antistatic electrical connector housing
US4179178A (en) * 1978-02-02 1979-12-18 Rca Corporation Plug-in circuit cartridge with electrostatic charge protection
US4491981A (en) * 1980-05-22 1985-01-01 Siemens Aktiengesellschaft Galvanically separating coupling location for energy and/or signal transmission
US4479263A (en) * 1980-05-22 1984-10-23 Siemens Aktiengesellschaft Device for acquiring and processing electrical signals
US4384368A (en) * 1980-05-22 1983-05-17 Siemens Aktiengesellschaft Insulated insert with high electric strength
US4399487A (en) * 1980-09-12 1983-08-16 Siemens Ag Insulated plug-in module
US4388671A (en) * 1981-06-29 1983-06-14 Honeywell Information Systems Inc. Cathode ray tube display terminal having an enclosure for protection of a logic board
US4381129A (en) * 1981-07-13 1983-04-26 Zenith Radio Corporation Grounded, multi-pin connector for shielded flat cable
US4386814A (en) * 1981-08-17 1983-06-07 Amp Incorporated Kit for converting a panel opening to a shielded pin receptacle
US4455448A (en) * 1981-12-02 1984-06-19 Watkins-Johnson Company Housing for microwave electronic devices
US4457575A (en) * 1982-09-21 1984-07-03 Amp Incorporated Electrical connector having improved shielding and keying systems
US4531176A (en) * 1983-06-27 1985-07-23 At&T Bell Laboratories Cartridge having improved electrostatic discharge protection
US4521062A (en) * 1983-07-26 1985-06-04 International Telephone And Telegraph Corporation Electrical connector with optional grounding element
US4642735A (en) * 1984-02-27 1987-02-10 General Electric Company Frequency synthesizer module
US4661889A (en) * 1984-11-16 1987-04-28 Canon Kabushiki Kaisha Electronic apparatus with a battery
US4602164A (en) * 1985-01-31 1986-07-22 International Business Machines Corp. Radiation shield system
JPS61282982A (en) * 1985-06-10 1986-12-13 Hitachi Maxell Ltd Ic card
US4893001A (en) * 1986-01-20 1990-01-09 Itt Corporation IC card
US4823235A (en) * 1986-02-06 1989-04-18 Fujitsu Limited Earth connection device in metal core printed circuit board
US4739453A (en) * 1986-03-20 1988-04-19 Kabushiki Kaisha Toshiba Shielding apparatus for a printed circuit board
US4780791A (en) * 1986-04-08 1988-10-25 Fujisoku Electric Co., Ltd. Card-shaped memory having an IC module
JPS6314977A (en) * 1986-07-08 1988-01-22 Mixton Co Ltd Electric revolving lifting door
US4872091A (en) * 1986-07-21 1989-10-03 Ricoh Company, Ltd. Memory cartridge
US4849944A (en) * 1986-08-18 1989-07-18 Tokyo Electric Company, Ltd. Connecting structure for connecting a memory unit to a memory unit controller
US4980856A (en) * 1986-10-20 1990-12-25 Brother Kogyo Kabushiki Kaisha IC memory cartridge and a method for providing external IC memory cartridges to an electronic device extending end-to-end
US4780570A (en) * 1987-03-30 1988-10-25 Unisys Corporation EMI/RFI shielding for electronic assemblies
US4905124A (en) * 1987-03-31 1990-02-27 Mitsubishi Denki Kabushiki Kaisha IC card
US4889498A (en) * 1987-10-21 1989-12-26 Mitsubishi Denki Kabushiki Kaisha Memory card having an elastomer connector
US4821146A (en) * 1987-11-17 1989-04-11 International Business Machines Corporation Plugable interposer and printed circuit card carrier
US4955817A (en) * 1988-02-12 1990-09-11 Seiko Epson Corporation Construction for removing electronic charges in connectors
US4868716A (en) * 1988-07-15 1989-09-19 Hewlett-Packard Company RF interconnect and shielding system
US4889495A (en) * 1988-09-08 1989-12-26 Mitsubishi Denki Kabushiki Kaisha Connecting mechanism for memory card
US4945633A (en) * 1989-03-01 1990-08-07 Nokia-Mobira Oy Method of mounting a printed circuit board and securing the earthing to a casing
JPH02239699A (en) * 1989-03-13 1990-09-21 Fujitsu Ltd Shielding structure of printed board
US5014160A (en) * 1989-07-05 1991-05-07 Digital Equipment Corporation EMI/RFI shielding method and apparatus
EP0417648A2 (en) * 1989-09-09 1991-03-20 Mitsubishi Denki Kabushiki Kaisha IC card
US5038250A (en) * 1989-09-09 1991-08-06 Ryoden Kasei Co. Ltd. IC card
US5107404A (en) * 1989-09-14 1992-04-21 Astec International Ltd. Circuit board assembly for a cellular telephone system or the like
US4967315A (en) * 1990-01-02 1990-10-30 General Electric Company Metallized ceramic circuit package
US5167326A (en) * 1990-03-19 1992-12-01 R. H. Murphy Co., Inc. Carriers for integrated circuits and the like
US5053924A (en) * 1990-03-30 1991-10-01 Motorola, Inc. Electromagnetic shield for electrical circuit
US5053613A (en) * 1990-05-29 1991-10-01 Mitsubishi Denki Kabushiki Kaisha IC card
US5050041A (en) * 1990-06-25 1991-09-17 Max Shafi Modem mountable in wall of a computer housing with readily accessible, on/off switch, indicator means and internal switch connecting either modem or an auxiliary serial port to an I/O port
JPH04107191A (en) * 1990-08-28 1992-04-08 Fujitsu Ltd Ic card
US5244397A (en) * 1992-11-20 1993-09-14 Itt Corporation IC card and cable harness

Non-Patent Citations (6)

* Cited by examiner, † Cited by third party
Title
Elektronik OEM AK, vol. 37, No. 17, 19 Aug. 1988, Munchen p 42 `Speicher: viel leistung-wenig plaz` *whole document*.
Elektronik OEM AK, vol. 37, No. 17, 19 Aug. 1988, Munchen p 42 Speicher: viel leistung wenig plaz *whole document*. *
Patent Abstracts of Japan, vol. 11, No. 147 (P 575) 14 May 1987 & JP A 61 282 982 (Hitachi Maxell Ltd) *abstract*. *
Patent Abstracts of Japan, vol. 11, No. 147 (P-575) 14 May 1987 & JP-A-61 282 982 (Hitachi Maxell Ltd) *abstract*.
Patent Abstracts of Japan, vol. 16, No. 350 (M 1287) 28 Jul. 1992 & JP A 04 107191 (Fujitsu Ltd) 8 Apr. 1992 *abstract*. *
Patent Abstracts of Japan, vol. 16, No. 350 (M-1287) 28 Jul. 1992 & JP-A-41 07 191 (Fujitsu Ltd) 8 Apr. 1992 *abstract*.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070287332A1 (en) * 2004-06-10 2007-12-13 Commscope Inc. Of North Carolina Shielded jack assemblies and methods for forming a cable termination
US7510439B2 (en) * 2004-06-10 2009-03-31 Commscope, Inc. Of North Carolina Shielded jack assemblies and methods for forming a cable termination

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Publication number Publication date Type
EP0532160B1 (en) 1998-09-16 grant
EP0682322B1 (en) 2001-09-26 grant
EP0532160A2 (en) 1993-03-17 application
JP2935612B2 (en) 1999-08-16 grant
DE69226999T2 (en) 1999-04-29 grant
EP0532160A3 (en) 1993-04-21 application
EP0682322A2 (en) 1995-11-15 application
EP0682322A3 (en) 1999-02-03 application
JPH05315783A (en) 1993-11-26 application
DE69226999D1 (en) 1998-10-22 grant
US5319516A (en) 1994-06-07 grant
DE69232087D1 (en) 2001-10-31 grant

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