USH1448H - High precision transfer lamination mandrel - Google Patents
High precision transfer lamination mandrel Download PDFInfo
- Publication number
- USH1448H USH1448H US07/934,079 US93407992A USH1448H US H1448 H USH1448 H US H1448H US 93407992 A US93407992 A US 93407992A US H1448 H USH1448 H US H1448H
- Authority
- US
- United States
- Prior art keywords
- iron
- mandrel
- stainless steel
- circuitry
- high precision
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
- B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
Definitions
- transfer-lamination circuitry Semi-additive circuitry
- additive circuitry The prior art techniques and circuitries in the field of the invention are commonly referred to as transfer-lamination circuitry, semi-additive circuitry, and additive circuitry.
- the current "Transfer Lamination” process uses a 300-series stainless steel plate upon which circuitry is electroformed, then laminated to a composite material, (e.g., KEVLAR/epoxy prepreg fabric). When peeled away, the resulting laminate has a permanent “curl” and circuitry which is distorted in the X-Y plane.
- a composite material e.g., KEVLAR/epoxy prepreg fabric.
- a stainless steel-cladding of a low coefficient of thermal expansion (CTE) core member of nickel-iron alloy e.g., KOVAR, iron base alloy containing Ni-Co-Mn, or INVAR, Fe-Ni-C-alloy
- CTE coefficient of thermal expansion
- a stainless steel-cladding of a low coefficient of thermal expansion (CTE) core member of nickel-iron alloy e.g., KOVAR, iron base alloy containing Ni-Co-Mn, or INVAR, Fe-Ni-C-alloy
- CTE coefficient of thermal expansion
- the outer surface of the stainless steel-cladding should be free of pits, scratches, and defects so as to yield a continuous circuitry satisfactory for military electronics.
- the stainless steel-cladded mandrel is annealed prior to being provided with a layer of electroplated copper so that the electroplated copper does not "blister" but adheres minimally so that the layer of copper can be peeled away as a smooth, continuous foil during transfer to the composite material.
- the figure of the drawing depicts a sectional view of a transfer lamination plate/mandrel 10 having a core member 12 in a sandwich construction design with stainless steel cladding members 14 having surfaces 16 free of pits, scratches, and defects on each side of the core.
- a transfer lamination plate/mandrel is constructed in a sandwich construction design wherein stainless steel cladding plates (e.g., AISI types 304, 316, or 302) are in intimate contact as the outside members in combination with a low-expansion, iron-base alloy employed as the core member having a top and bottom surface in intimate contact with said stainless steel cladding plates.
- stainless steel cladding plates e.g., AISI types 304, 316, or 302
- the above described design arrangement provides a matched coefficient of thermal expansion (CTE) of the transfer lamination plate/mandrel with a composite material to which an electroform circuitry is transfer laminated.
- the composite material is constructed of an aramid/epoxy prepreg fabric.
- the aramid is commercially available as Kevlar from Du Pont de Nemours and Company.
- the low expansion nickel/iron alloy, employed as the core is selected from KOVAR, low coefficient of thermal expansion; iron-base alloy comprising with 28-30% nickel, 15-18% cobalt, and fractional percentages of manganese, or INVAR, an iron-nickel alloy of Ciba-Geigy Co., Invar, a low coefficient of thermal expansion iron-nickel alloy, is comprised of 63.8% iron, 36% nickel, and 0.2% carbon.
- the high precision transfer lamination plate/mandrel 10 is depicted in a sandwich construction design which comprises stainless steel cladding members 14 and a core member 12 of a low coefficient of thermal expansion (CTE) nickel/iron alloy 12.
- the external stainless steel top and bottom plate surfaces 16 must be free of pits, scratches, and defects so as to yield a continuous circuitry satisfactory for military electronics.
- the plate mandrel Prior to use the plate mandrel is annealed to provide a uniform temperature surface for receiving a layer of electroplated copper which adheres minimally so that the layer of copper can be peeled away as a smooth, continuous foil during transfer to the composite material.
- Table I lists heat resisting steels AISI types suitable for use a cladding plates.
Landscapes
- Laminated Bodies (AREA)
Abstract
A high precision transfer lamination plate/mandrel is fabricated in a sanch construction design wherein an inner core is constructed of a low coefficient of thermal expansion (CTE) comprised of an iron-nickel alloy core member (e.g., Kovar or Invar) with stainless steel cladding on each side of the core member. The stainless steel is selected from AISI type 302, 304, or 316. The stainless steel cladding outer surface of the top and bottom plate to which an electroplated copper foil circuitry is applied must be free of pits, scratches, and defects so as to yield a continuous circuitry satisfactory for military electronics. A matched (CTE) of the transfer lamination plate/mandrel with a composite material to which the electronic circuitry is transferred results in adherence of the copper circuitry minimally to the plate/mandrel to avoid blistering and enables the transfer to be achieved without distortion of circuitry features due to CTE mismatch. The composite material to which the electronic circuitry is laminated is an aramid/epoxy prepreg fabric (e.g., Kevlar/epoxy prepreg fabric).
Description
The invention described herein may be manufactured, used, and licensed by or for the Government for governmental purposes without the payment to me of any royalties thereon.
The fabrication of precisely located and precisely dimensional electronic circuitry is a desirable feature which is needed, particularly for multilayer electronic circuitry construction.
The prior art techniques and circuitries in the field of the invention are commonly referred to as transfer-lamination circuitry, semi-additive circuitry, and additive circuitry.
The current "Transfer Lamination" process uses a 300-series stainless steel plate upon which circuitry is electroformed, then laminated to a composite material, (e.g., KEVLAR/epoxy prepreg fabric). When peeled away, the resulting laminate has a permanent "curl" and circuitry which is distorted in the X-Y plane. The described effects are major obstacles to multilayer circuitries construction. These effects are due to the coefficient of thermal expansion (CTE) mismatch between the stainless steel substrate and the composite materials.
A stainless steel-cladding of a low coefficient of thermal expansion (CTE) core member of nickel-iron alloy (e.g., KOVAR, iron base alloy containing Ni-Co-Mn, or INVAR, Fe-Ni-C-alloy) provides a high precision transfer lamination plate/mandrel, which is matched to the coefficient of thermal expansion (CTE) of the composite material to which circuitry is transferred from the stainless steel plate of the mandrel. Because of the matched CTE of the plate/mandrel and the composite material, distortion is minimized at all lamination temperatures. The outer surface of the stainless steel-cladding should be free of pits, scratches, and defects so as to yield a continuous circuitry satisfactory for military electronics. The stainless steel-cladded mandrel is annealed prior to being provided with a layer of electroplated copper so that the electroplated copper does not "blister" but adheres minimally so that the layer of copper can be peeled away as a smooth, continuous foil during transfer to the composite material.
The figure of the drawing depicts a sectional view of a transfer lamination plate/mandrel 10 having a core member 12 in a sandwich construction design with stainless steel cladding members 14 having surfaces 16 free of pits, scratches, and defects on each side of the core.
A transfer lamination plate/mandrel is constructed in a sandwich construction design wherein stainless steel cladding plates (e.g., AISI types 304, 316, or 302) are in intimate contact as the outside members in combination with a low-expansion, iron-base alloy employed as the core member having a top and bottom surface in intimate contact with said stainless steel cladding plates.
The above described design arrangement provides a matched coefficient of thermal expansion (CTE) of the transfer lamination plate/mandrel with a composite material to which an electroform circuitry is transfer laminated. The composite material is constructed of an aramid/epoxy prepreg fabric. The aramid is commercially available as Kevlar from Du Pont de Nemours and Company. The low expansion nickel/iron alloy, employed as the core, is selected from KOVAR, low coefficient of thermal expansion; iron-base alloy comprising with 28-30% nickel, 15-18% cobalt, and fractional percentages of manganese, or INVAR, an iron-nickel alloy of Ciba-Geigy Co., Invar, a low coefficient of thermal expansion iron-nickel alloy, is comprised of 63.8% iron, 36% nickel, and 0.2% carbon.
In further reference to the figure of the drawing, the high precision transfer lamination plate/mandrel 10 is depicted in a sandwich construction design which comprises stainless steel cladding members 14 and a core member 12 of a low coefficient of thermal expansion (CTE) nickel/iron alloy 12. The external stainless steel top and bottom plate surfaces 16 must be free of pits, scratches, and defects so as to yield a continuous circuitry satisfactory for military electronics. Prior to use the plate mandrel is annealed to provide a uniform temperature surface for receiving a layer of electroplated copper which adheres minimally so that the layer of copper can be peeled away as a smooth, continuous foil during transfer to the composite material.
Table I lists heat resisting steels AISI types suitable for use a cladding plates.
TABLE I
__________________________________________________________________________
ELEMENT NOMINAL COMPOSITION, PERCENT
AUSTENITIC STEELS
AISI Type
C Mn, max
Si, max
Cr Ni Other.sup.a
__________________________________________________________________________
301 0.15 max
2.00 1.00
16.00-18.00
6.00-8.00
304 0.08 max
2.00 1.00
18.00-20.00
8.00-12.00
316 0.08 max
2.00 1.00
16.00-18.00
10.00-14.00
2.00-3.00 Mo
__________________________________________________________________________
.sup.a Other elements in addition to those shown above are as follows:
phosphorus is 0.045 percent max; sulphur is 0.030 percent max; and balanc
percent is iron.
Claims (2)
1. A high precision transfer lamination plate/mandrel fabricated in a sandwich construction and method coefficient of thermal expansion with a composite material to which an electronic circuitry is transfer laminated, said high precision transfer lamination plate/mandrel comprising: P1 (i) an iron-nickel allow core member having a low coefficient of thermal expansion in the form of a plate; and P1 (ii) heat-resisting stainless steel cladding plates free of pits, scratches, and defects positioned in intimate contact on a top surface and a bottom surface of said core member to form said high precision transfer lamination plate/mandrel having a matched coefficient of thermal expansion with a composite material to which an electronic circuitry is transfer laminated.
2. The high precision transfer lamination plate/mandrel as defined in claim 1 wherein said iron-nickel alloy core member is selected from an iron-base alloy comprised of 28-30% nickel, 15-18% cobalt, fractional percentages of manganese, and balance iron and an iron-nickel alloy comprised of 63.8% iron, 36% nickel, and 0.2% carbon, and wherein said heat-resisting stainless steel cladding plates are selected from a stainless steel defined by austenitic steels having AISI number 301, 304, and 316 as specifically defined in Table I set forth below as follows:
TABLE I
__________________________________________________________________________
ELEMENT NOMINAL COMPOSITION, PERCENT
AISI Type
C Mn, max
Si, max
Cr Ni Other.sup.a
__________________________________________________________________________
301 0.15 max
2.00 1.00
16.00-18.00
6.00-8.00
304 0.08 max
2.00 1.00
18.00-20.00
8.00-12.00
316 0.08 max
2.00 1.00
16.00-18.00
10.00-14.00
2.00-3.00 Mo
__________________________________________________________________________
.sup.a phosphorus is 0.045 percent maximum; sulphur is 0.030 percent
maximum; and balance of steel, iron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/934,079 USH1448H (en) | 1992-08-24 | 1992-08-24 | High precision transfer lamination mandrel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/934,079 USH1448H (en) | 1992-08-24 | 1992-08-24 | High precision transfer lamination mandrel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USH1448H true USH1448H (en) | 1995-06-06 |
Family
ID=25464932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US07/934,079 Abandoned USH1448H (en) | 1992-08-24 | 1992-08-24 | High precision transfer lamination mandrel |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USH1448H (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5613181A (en) * | 1994-12-21 | 1997-03-18 | International Business Machines Corporation | Co-sintered surface metallization for pin-join, wire-bond and chip attach |
| US6675456B2 (en) * | 2000-02-24 | 2004-01-13 | Honeywell International Inc. | Alignment plate with matched thermal coefficient of expansion method |
| US20040148756A1 (en) * | 2002-09-09 | 2004-08-05 | Pommer Richard J. | Alignment plate with matched thermal coefficient of expansion |
| WO2006110409A1 (en) * | 2005-04-07 | 2006-10-19 | Gmic, Corp. | Metal sprayed composite part |
-
1992
- 1992-08-24 US US07/934,079 patent/USH1448H/en not_active Abandoned
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5613181A (en) * | 1994-12-21 | 1997-03-18 | International Business Machines Corporation | Co-sintered surface metallization for pin-join, wire-bond and chip attach |
| US5639562A (en) * | 1994-12-21 | 1997-06-17 | International Business Machines Corporation | Co-sintered surface metallization for pin-join, wire-bond and chip attach |
| US5655213A (en) * | 1994-12-21 | 1997-08-05 | International Business Machines Corporation | Co-sintered surface metallization for pin-join, wire-bond and chip attach |
| US6675456B2 (en) * | 2000-02-24 | 2004-01-13 | Honeywell International Inc. | Alignment plate with matched thermal coefficient of expansion method |
| US20040148756A1 (en) * | 2002-09-09 | 2004-08-05 | Pommer Richard J. | Alignment plate with matched thermal coefficient of expansion |
| WO2006110409A1 (en) * | 2005-04-07 | 2006-10-19 | Gmic, Corp. | Metal sprayed composite part |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: UNITED STATES OF AMERICA, THE, AS REPRESENTED BY T Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:GOODE, HERBERT S., JR.;REEL/FRAME:007345/0100 Effective date: 19920808 |
|
| STCF | Information on status: patent grant |
Free format text: PATENTED CASE |