USH1396H - Oxide substrate with a strongly adherent gold film of 10 to 40 nm in thickness on the substrate - Google Patents
Oxide substrate with a strongly adherent gold film of 10 to 40 nm in thickness on the substrate Download PDFInfo
- Publication number
- USH1396H USH1396H US08/125,050 US12505093A USH1396H US H1396 H USH1396 H US H1396H US 12505093 A US12505093 A US 12505093A US H1396 H USH1396 H US H1396H
- Authority
- US
- United States
- Prior art keywords
- substrate
- oxide
- gold film
- thickness
- oxide substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 26
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 17
- 239000010931 gold Substances 0.000 title claims abstract description 17
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 17
- 230000001464 adherent effect Effects 0.000 title claims abstract description 4
- 239000010453 quartz Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000000151 deposition Methods 0.000 abstract description 4
- 239000000356 contaminant Substances 0.000 abstract description 3
- 238000004140 cleaning Methods 0.000 abstract description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000313 electron-beam-induced deposition Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
Definitions
- the invention relates in general to the art of coating an oxide surface or substrate with a gold film and in particular to a method of depositing a strongly adhering gold film onto a quartz substrate and to the gold film so deposited.
- the general object of this invention is to provide a gold film that will strongly adhere to an oxide surface.
- a more particular object of the invention is to provide such a gold film without an intermediate adhesion layer.
- a particular object of the invention is to provide such a gold film for a quartz surface or substrate.
- an adherent gold film can be deposited on an oxide surface or substrate by cleaning the oxide surface so as to remove all organic contaminants and then vacuum depositing onto the clean oxide surface a gold film of up to 40 nanometers in thickness.
- the surface of a quartz substrate is first cleaned and all organic contaminants removed by standard UV-ozone technique such as described in U.S. Pat. No. 4,028,135 by Vig et al.
- the cleaned quartz substrate is placed into an ultrahigh vacuum system.
- a gold film is then vacuum deposited by a clean deposition method such as thermal evaporation or electron beam deposition.
- the thickness of the film is in the range of 10 to 30 nanometers.
- the film adheres very strongly as evidenced by the fact that it cannot be removed by the Scotch tape test, or by ultrasonic agitation in water, alcohol or acetone, or by mechanical abrasion with objects such as cleanroom wipes, sponge tips and wooden sticks.
- quartz one can use any substrate with an oxide surface, such as silicon wafers, glass and aluminum oxide.
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
An adherent gold film is deposited onto an oxide substrate by cleaning thexide surface so as to remove all contaminants and then vacuum depositing onto the clean oxide surface a gold film of up to 40 nm in thickness.
Description
The invention described herein may be manufactured, used, and licensed by or for the Government for governmental purposes without the payment to us of any royalties thereon.
The invention relates in general to the art of coating an oxide surface or substrate with a gold film and in particular to a method of depositing a strongly adhering gold film onto a quartz substrate and to the gold film so deposited.
It has been well known that gold films do not adhere to oxide surfaces, such as quartz. For example, the generally accepted criterion for adhesion between a metal film and an oxide surface or substrate has been that the metal must be oxygen active so as to react chemically with the oxide surface. Since gold does not form a stable oxide under normal conditions, having a heat of oxide formation of +19 kcal/mol it, supposedly, does not adhere to oxide surfaces as, for example, quartz. Adhesion layers, such as chromium or titanium are often used as adhesion layers between the oxide and the gold. In some cases, however, it would be highly desirable to not have to use an intermediate layer.
The general object of this invention is to provide a gold film that will strongly adhere to an oxide surface. A more particular object of the invention is to provide such a gold film without an intermediate adhesion layer. A particular object of the invention is to provide such a gold film for a quartz surface or substrate.
It has now been found that an adherent gold film can be deposited on an oxide surface or substrate by cleaning the oxide surface so as to remove all organic contaminants and then vacuum depositing onto the clean oxide surface a gold film of up to 40 nanometers in thickness.
Gold films of thickness 10 nm, 20 nm and 30 nm adhere strongly, whereas films of greater than 40 nm thickness adhere very weakly. In this connection, the Scotch tape test readily removes the thicker films but not the thinner ones.
The surface of a quartz substrate is first cleaned and all organic contaminants removed by standard UV-ozone technique such as described in U.S. Pat. No. 4,028,135 by Vig et al.
The cleaned quartz substrate is placed into an ultrahigh vacuum system. A gold film is then vacuum deposited by a clean deposition method such as thermal evaporation or electron beam deposition. The thickness of the film is in the range of 10 to 30 nanometers.
The film adheres very strongly as evidenced by the fact that it cannot be removed by the Scotch tape test, or by ultrasonic agitation in water, alcohol or acetone, or by mechanical abrasion with objects such as cleanroom wipes, sponge tips and wooden sticks. In lieu of quartz one can use any substrate with an oxide surface, such as silicon wafers, glass and aluminum oxide.
We wish it to be understood that we do not desire to be limited to the exact details of construction shown and described for obvious modifications will occur to a person skilled in the art.
Claims (6)
1. An oxide substrate with a strongly adherent gold film of 10 to 40 nm in thickness on the substrate.
2. An oxide substrate according to claim 1 wherein the oxide substrate is selected from the group consisting of a quartz substrate, a silicon wafer, a glass substrate and aluminum oxide.
3. An oxide substrate according to claim 2 wherein the oxide substrate is quartz.
4. An oxide substrate according to claim 2 wherein the oxide substrate is a silicon wafer.
5. An oxide substrate according to claim 2 wherein the oxide substrate is a glass substrate.
6. An oxide substrate according to claim 2 wherein the oxide substrate is aluminum oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/125,050 USH1396H (en) | 1993-09-21 | 1993-09-21 | Oxide substrate with a strongly adherent gold film of 10 to 40 nm in thickness on the substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/125,050 USH1396H (en) | 1993-09-21 | 1993-09-21 | Oxide substrate with a strongly adherent gold film of 10 to 40 nm in thickness on the substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USH1396H true USH1396H (en) | 1995-01-03 |
Family
ID=22417989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US08/125,050 Abandoned USH1396H (en) | 1993-09-21 | 1993-09-21 | Oxide substrate with a strongly adherent gold film of 10 to 40 nm in thickness on the substrate |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USH1396H (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3653946A (en) * | 1969-09-30 | 1972-04-04 | Bell Telephone Labor Inc | Method of depositing an adherent gold film on the surfaces of a suitable substrate |
| US3833410A (en) * | 1971-12-30 | 1974-09-03 | Trw Inc | High stability thin film alloy resistors |
| US4005229A (en) * | 1975-06-23 | 1977-01-25 | Ppg Industries, Inc. | Novel method for the rapid deposition of gold films onto non-metallic substrates at ambient temperatures |
| US4028080A (en) * | 1976-06-23 | 1977-06-07 | The United States Of America As Represented By The Secretary Of The Army | Method of treating optical waveguide fibers |
| US4309460A (en) * | 1977-11-11 | 1982-01-05 | Bell Telephone Laboratories, Incorporated | Process for producing gold films |
| US4457972A (en) * | 1981-12-07 | 1984-07-03 | California Institute Of Technology | Enhanced adhesion by high energy bombardment |
| US4888204A (en) * | 1988-09-12 | 1989-12-19 | Hughes Aircraft Company | Photochemical deposition of high purity gold films |
| US4933204A (en) * | 1988-09-23 | 1990-06-12 | Rockwell International Corporation | Method of producing a gold film |
| US4959257A (en) * | 1987-07-17 | 1990-09-25 | Lucas Industries Public Limited Company | Transparencies |
| US5139856A (en) * | 1988-12-20 | 1992-08-18 | Ngk Insulators, Ltd. | Plated ceramic or glass substrate having undercoat |
| US5288558A (en) * | 1991-09-13 | 1994-02-22 | Flachglas Aktiengesellschaft | Attachment for video screens having dual optical active dereflection layers |
-
1993
- 1993-09-21 US US08/125,050 patent/USH1396H/en not_active Abandoned
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3653946A (en) * | 1969-09-30 | 1972-04-04 | Bell Telephone Labor Inc | Method of depositing an adherent gold film on the surfaces of a suitable substrate |
| US3833410A (en) * | 1971-12-30 | 1974-09-03 | Trw Inc | High stability thin film alloy resistors |
| US4005229A (en) * | 1975-06-23 | 1977-01-25 | Ppg Industries, Inc. | Novel method for the rapid deposition of gold films onto non-metallic substrates at ambient temperatures |
| US4028080A (en) * | 1976-06-23 | 1977-06-07 | The United States Of America As Represented By The Secretary Of The Army | Method of treating optical waveguide fibers |
| US4309460A (en) * | 1977-11-11 | 1982-01-05 | Bell Telephone Laboratories, Incorporated | Process for producing gold films |
| US4457972A (en) * | 1981-12-07 | 1984-07-03 | California Institute Of Technology | Enhanced adhesion by high energy bombardment |
| US4959257A (en) * | 1987-07-17 | 1990-09-25 | Lucas Industries Public Limited Company | Transparencies |
| US4888204A (en) * | 1988-09-12 | 1989-12-19 | Hughes Aircraft Company | Photochemical deposition of high purity gold films |
| US4933204A (en) * | 1988-09-23 | 1990-06-12 | Rockwell International Corporation | Method of producing a gold film |
| US5139856A (en) * | 1988-12-20 | 1992-08-18 | Ngk Insulators, Ltd. | Plated ceramic or glass substrate having undercoat |
| US5288558A (en) * | 1991-09-13 | 1994-02-22 | Flachglas Aktiengesellschaft | Attachment for video screens having dual optical active dereflection layers |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| STCF | Information on status: patent grant |
Free format text: PATENTED CASE |