USH133H - Printed wiring board circuit isolator tool - Google Patents
Printed wiring board circuit isolator tool Download PDFInfo
- Publication number
- USH133H USH133H US06/698,726 US69872685A USH133H US H133 H USH133 H US H133H US 69872685 A US69872685 A US 69872685A US H133 H USH133 H US H133H
- Authority
- US
- United States
- Prior art keywords
- tool
- pin
- shank
- board
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000463 material Substances 0.000 claims abstract description 7
- 239000004020 conductor Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0242—Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
Definitions
- the present invention is directed to a tool for electrically isolating circuitry on a printed wiring board from a component pin after the pin has been soldered in place on the board.
- a tool for isolating printed wiring from component pins includes a rotatable shank having an internal cavity and external cutting flutes formed on an end thereof. The end of the tool is pushed over the exposed end of a pin such that the cutting flutes bear against the solder material which bridges the gap between the printed wiring trace and the component pin. The tool is then rotated to remove the bridge of solder material and the underlying conductor trace material to isolate the trace and pin from each other.
- FIGURE of the drawing is a partially sectioned front view of the circuit isolator tool of the present invention, and a sectioned portion of a typical printed wiring board having a connector pin thereon.
- the circuit isolator tool of the invention is designated generally by the reference number 2.
- the tool 2 is generally cylindrical in shape and is illustrated with a section taken through part of the longitudinal axis thereof. It has a shank 4 having a tapered portion 6 which reduces its outer diameter D1 to diameter D2 at the end 8 thereof.
- a internal cavity 10 of diameter D3 is formed in end 8 of shank 4 and cutting flutes 12 are formed on the external surface of the end 8 of shank 4.
- the drawing also illustrates a portion of a typical printed circuit or wiring board 20 shown in a section taken through the longitudinal diameter of a pin 22 emanating from a component 24 installed thereon.
- Component 24 may be a connector, including a multipin connector, or may be any electronic device having rigid pins. Pin 22 of component 24 is inserted through an aperture or hole 26 formed through the insulative substrate 28 of printed wiring board 20.
- Reference numeral 30 designates a metallic foil conductor or trace formed on the substrate 28 of printed wiring board 20. Trace 30 surrounds hole 26 and has a hole therethrough of substantially the same diameter as the hole 26. Pin 22 is retained in printed wiring board 20 by solder material 32 which bridges the pin 22 and wiring trace conductor 30 thus providing a mechanical and electrical bond therebetween.
- end 8 of isolator tool 2 is pushed over the exposed extremity of pin 22 such that pin 22 slides within hole 10 which forms a receptacle therefor.
- Tool 2 is then rotated and cutting flutes 12 remove solder 32 bridging the gap between pin 22 and conductor 30, as well as any portion of conductor 30 lying below the cutting flutes 12. Since pin 22 is now electrically isolated from conductor 30, it is now possible to apply different circuitry to pin 22, as by soldering a jumper wire thereto.
- shank diameter D2 is 0.060 inches
- hole 10 has a diameter D3 of 0.030 inches
- the end 8 of shank 2 has a length L of 0.180 inches.
- the diameter D1 of tool 2 is not critical in most applications and is preferrably given a dimension which will fit into the chuck of a T-bar wrench, electric drill, or milling machine.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
A tool for isolating a printed circuit wiring trace from a component pin, said tool having a rotatable shank with an internal cavity and external cutting flutes formed on an end thereof. The end of the tool is pushed over the exposed end of the pin such that the cutting flutes bear against the solder material which bridges the gap between the printed wiring trace and the component pin. The tool is then rotated to remove the solder bridge and any underlying wiring trace material to isolate the wiring trace and pin from each other.
Description
The invention described herein may be manufactured and used by or for the Government for governmental purposes without the payment of any royalty thereon.
The present invention is directed to a tool for electrically isolating circuitry on a printed wiring board from a component pin after the pin has been soldered in place on the board.
The concept of transferring signals to and from conductive foil strips (often called traces) formed on a printed circuit board, by way of connectors having their pins soldered to the traces, is old and well-established. Usually the end of a trace is enlarged to form a metallic pad having a hole therethrough which accepts a connector pin. The pin is soldered to the trace to provide an electrical connection and mechanical bond therebetween.
It is often the case that after a printed wiring board has been fabricated, and components, (such as connectors and other components having rigid metallic terminals posts or pins) have been mounted thereon and soldered thereto, system design changes, are made which necessitate the isolation of circuitry from a particular component pin or pins. One method for accomplishing this end is to unsolder the component pin or pins, remove the component, enlarge the hole and reinstall the component. This method is time consuming and involves the risk of damaging the board. In some instances, it may be possible to remove the pin and drill a hole elsewhere in the board to accept a new pin, but this method is not always possible if the board is densely packed or if the component pin must be at a precise location on the board.
It is therefore an object of the present invention to provide a new and improved tool for isolating printed wiring circuitry from a component pin.
It is another object of the present invention to provide a tool of the general character described above which is easy and economical to manufacture, which is rugged and durable, which is highly effective and dependable in operation, and which may be quickly and easily employed for isolating printed circuit wiring from a connector or other component pin.
In accordance with these and other objects, a tool for isolating printed wiring from component pins includes a rotatable shank having an internal cavity and external cutting flutes formed on an end thereof. The end of the tool is pushed over the exposed end of a pin such that the cutting flutes bear against the solder material which bridges the gap between the printed wiring trace and the component pin. The tool is then rotated to remove the bridge of solder material and the underlying conductor trace material to isolate the trace and pin from each other.
The foregoing and other objects, features and advantages of the present invention will become apparent as the description thereof proceeds when considered in connection with the accompanying illustrative drawing.
The sole FIGURE of the drawing is a partially sectioned front view of the circuit isolator tool of the present invention, and a sectioned portion of a typical printed wiring board having a connector pin thereon.
Referring now the the accompanying drawing in detail, the circuit isolator tool of the invention is designated generally by the reference number 2. The tool 2 is generally cylindrical in shape and is illustrated with a section taken through part of the longitudinal axis thereof. It has a shank 4 having a tapered portion 6 which reduces its outer diameter D1 to diameter D2 at the end 8 thereof. A internal cavity 10 of diameter D3 is formed in end 8 of shank 4 and cutting flutes 12 are formed on the external surface of the end 8 of shank 4.
The drawing also illustrates a portion of a typical printed circuit or wiring board 20 shown in a section taken through the longitudinal diameter of a pin 22 emanating from a component 24 installed thereon. Component 24 may be a connector, including a multipin connector, or may be any electronic device having rigid pins. Pin 22 of component 24 is inserted through an aperture or hole 26 formed through the insulative substrate 28 of printed wiring board 20.
In instances, as described earlier, where it becomes desireable to isolate pin 22 from conductor 30, end 8 of isolator tool 2 is pushed over the exposed extremity of pin 22 such that pin 22 slides within hole 10 which forms a receptacle therefor. Tool 2 is then rotated and cutting flutes 12 remove solder 32 bridging the gap between pin 22 and conductor 30, as well as any portion of conductor 30 lying below the cutting flutes 12. Since pin 22 is now electrically isolated from conductor 30, it is now possible to apply different circuitry to pin 22, as by soldering a jumper wire thereto.
The preferred embodiment of the present invention described herein has been constructed wherein shank diameter D2 is 0.060 inches, hole 10 has a diameter D3 of 0.030 inches and the end 8 of shank 2 has a length L of 0.180 inches.
The diameter D1 of tool 2 is not critical in most applications and is preferrably given a dimension which will fit into the chuck of a T-bar wrench, electric drill, or milling machine.
Although the invention has been described with reference to a particular embodiment, it will be understood to those skilled in the art that the invention is capable of a variety of alternative embodiments within the spirit and scope of the appended claims.
Claims (6)
1. A tool for isolating circuitry foil conductors formed on the surface of a printed wiring board from component pins inserted in said board and soldered to said conductors, said tool comprising:
a rotatable shank having a first and a second end;
a receptable means formed at said first end of said shank for receiving the extremity of a pin protruding through said board and soldered to a conductor disposed on the surface of said board nearest said extremity of said pin; and
cutting means formed on said first end of said shank for removing metallic material on said board electrically connecting said pin and said conductor.
2. A tool of the type described in claim 1 wherein said receptacle means comprises a cylindrical cavity in said first end of said shank and coaxial with the longitudinal axis of said shank.
3. A tool of the type described in claim 2 wherein said cutting means comprises cutting flutes formed on the exterior surface of said first end of said shank.
4. A tool of the type described in claim 3 wherein said cutting flutes terminate at an angle substantially normal to the longitudinal axis of said shank of said tool.
5. A tool of the type described in claim 4 wherein said conductor comprises metallic foil material encircling said pin.
6. A method for isolating the pin of a component soldered to a foil conductor of a printed circuit board, said method using a tool having a pin receptacle and cutting flutes at an end of the shank thereof, said method comprising the steps of:
pushing said end of said tool onto said pin to enclose the extremity of said pin within said pin receptacle; and
simultaneously forcing said end of said tool against said conductor and rotating said shank of said tool to cause said cutting flutes to remove metallic material on said board surrounding said pin below said tool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/698,726 USH133H (en) | 1985-02-06 | 1985-02-06 | Printed wiring board circuit isolator tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/698,726 USH133H (en) | 1985-02-06 | 1985-02-06 | Printed wiring board circuit isolator tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USH133H true USH133H (en) | 1986-09-02 |
Family
ID=24806423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US06/698,726 Abandoned USH133H (en) | 1985-02-06 | 1985-02-06 | Printed wiring board circuit isolator tool |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USH133H (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3222766A (en) | 1963-07-01 | 1965-12-14 | Union Aircraft Co | Terminal pin removing tool |
| US3376630A (en) | 1966-05-05 | 1968-04-09 | Paul A. Lempka | Method of boring away bearing material integral with a frame containing a journal |
| US3521678A (en) | 1968-06-28 | 1970-07-28 | Western Electric Co | Wire unwrap tool |
| US3588983A (en) | 1969-03-10 | 1971-06-29 | Augat Inc | Extractor tool |
| US3649809A (en) | 1971-04-19 | 1972-03-14 | William Meredith Halstead | Soldering and de-soldering tip for connector pins of electrical components |
| GB1357066A (en) | 1971-06-29 | 1974-06-19 | Ibm | Method for debonding |
| DE2505241A1 (en) | 1975-02-07 | 1976-08-19 | Zeleny | Cold desoldering tool for printed circuits - removes solder around joint by turning tool |
| US4028790A (en) | 1976-03-25 | 1977-06-14 | Northern Telecom Limited | Removal of connector pins |
| US4168569A (en) | 1978-03-06 | 1979-09-25 | The Bendix Corporation | Electrical contact extraction apparatus |
| US4409732A (en) | 1981-01-05 | 1983-10-18 | John Grant | Circuit isolator |
-
1985
- 1985-02-06 US US06/698,726 patent/USH133H/en not_active Abandoned
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3222766A (en) | 1963-07-01 | 1965-12-14 | Union Aircraft Co | Terminal pin removing tool |
| US3376630A (en) | 1966-05-05 | 1968-04-09 | Paul A. Lempka | Method of boring away bearing material integral with a frame containing a journal |
| US3521678A (en) | 1968-06-28 | 1970-07-28 | Western Electric Co | Wire unwrap tool |
| US3588983A (en) | 1969-03-10 | 1971-06-29 | Augat Inc | Extractor tool |
| US3649809A (en) | 1971-04-19 | 1972-03-14 | William Meredith Halstead | Soldering and de-soldering tip for connector pins of electrical components |
| GB1357066A (en) | 1971-06-29 | 1974-06-19 | Ibm | Method for debonding |
| DE2505241A1 (en) | 1975-02-07 | 1976-08-19 | Zeleny | Cold desoldering tool for printed circuits - removes solder around joint by turning tool |
| US4028790A (en) | 1976-03-25 | 1977-06-14 | Northern Telecom Limited | Removal of connector pins |
| US4168569A (en) | 1978-03-06 | 1979-09-25 | The Bendix Corporation | Electrical contact extraction apparatus |
| US4409732A (en) | 1981-01-05 | 1983-10-18 | John Grant | Circuit isolator |
Non-Patent Citations (1)
| Title |
|---|
| Western Electric Tech Digest No. 55 Jul. 1979 p. 25 by Rapp. |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: UNITED STATES OF AMERICA AS REPRESENTED BY THE SEC Free format text: ASSIGNMENT OF ASSIGNORS INTEREST. SUBJECT TO LICENSE RECITED;ASSIGNORS:HUXSOL, ROBERT D.;SNYDER, LEON J.;REEL/FRAME:004403/0409 Effective date: 19850125 |
|
| STCF | Information on status: patent grant |
Free format text: PATENTED CASE |