USH1001H - Method of transferring an optical quality film - Google Patents
Method of transferring an optical quality film Download PDFInfo
- Publication number
- USH1001H USH1001H US07/416,681 US41668189A USH1001H US H1001 H USH1001 H US H1001H US 41668189 A US41668189 A US 41668189A US H1001 H USH1001 H US H1001H
- Authority
- US
- United States
- Prior art keywords
- film
- optical quality
- substrate
- master
- adhesion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 230000010076 replication Effects 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 230000008020 evaporation Effects 0.000 claims description 8
- 238000001704 evaporation Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000004568 cement Substances 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 2
- 229910003556 H2 SO4 Inorganic materials 0.000 claims 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000010408 film Substances 0.000 description 15
- 239000011521 glass Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007516 diamond turning Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011505 plaster Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
- B05D5/067—Metallic effect
Definitions
- This invention relates in general to a method of providing an optical quality film and in particular, to a method of transferring an optical quality film from a master optical surface to a secondary substrate by means of a replication technique using a master optical surface as a mold.
- High frequency integrated optic (IO) devices employing electrodes above and below the thin-film IO structures require an optically smooth lower electrode(s) of excellent conductivity to be formed on the device substrate.
- the fabrication of optical surfaces in metal substrates is difficult and usually requires techniques such as diamond turning.
- the general object of this invention is to provide a method of obtaining a metal surface of sufficient critical quality to serve as a substrate for IO devices and of sufficient thickness to serve as an electrode(s) for high frequency IO devices. It is a further object of the invention to provide such a method that does not require high temperature bonding. A still further object of the invention is to provide a method of transferring an optical quality film from a master optical surface to a secondary substrate.
- the method described here allows relatively thick metal films of excellent conductivity and of high optical quality to be transferred to a secondary or device substrate.
- the method that is relatively easy to implement, produces optically smooth metal surfaces of excellent conductivity needed for high frequency IO devices.
- the resulting metal-optics surface need not be flat and such structures may find use in other areas such as metal mirrors.
- FIG. 1 shows the evaporation deposition of an adhesion film followed by a conductive film onto a master substrate while exposing the assembly to air between evaporations
- FIG. 2 shows the electroplating of a layer of the same conductive film onto the conductive film of FIG. 1 of sufficient thickness to achieve the necessary conductivity in the electroplated layer
- FIG. 3 shows the bonding of a secondary substrate to the electroplated layer with a replication cement
- FIG. 4 shows the separation of the secondary substrate and both bonded conductive layers from the adhesion coated master leaving the optical quality surface of the conductive electrode exposed.
- FIGS. 1 to 4 of the drawing The steps involved in carrying out the invention and transferring an optical quality film from a master optical surface to a secondary substrate are shown in FIGS. 1 to 4 of the drawing wherein a chrome film is used for adhesion and a copper film is the transferred film.
- a chrome film, 12, of about 1000 angstroms in thickness for adhesion followed by the evaporation deposit of a copper film, 14, of about 1000 angstroms in thickness.
- the assembly is exposed to air between evaporations.
- a copper layer, 16 is electroplated onto the copper film, 14 of sufficient thickness to achieve the necessary conductivity in the copper layer, 16.
- the copper layer, 16 has a naturally rough surface, 18.
- a secondary or device substrate, 20 is bonded to the electroplated copper layer, 16 with replication cement, 22.
- the naturally rough surface, 18 of the electroplated layer, 16 facilitates good adhesion of the cement, 22.
- the device substrate, 20 and both bonded copper layers, 16 and 14, are separated from the chrome coated master, 12 and 10, leaving the optical quality surface of the copper electrode exposed.
- the optical quality master substrate, 10 can be composed of glass, fused silicon, plaster, and the like.
- the secondary or device substrate can be composed of glass, metals, plastics, etc.
- the replication cement used is a low shrink cement.
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
An optical quality film is transferred from a master optical surface to a condary substrate by means of a replication technique using a master optical surface as a mold.
Description
The Government has rights in this invention under Contract No. DAAL01-85-C-0197 with the Department of the Army.
This invention relates in general to a method of providing an optical quality film and in particular, to a method of transferring an optical quality film from a master optical surface to a secondary substrate by means of a replication technique using a master optical surface as a mold.
High frequency integrated optic (IO) devices employing electrodes above and below the thin-film IO structures require an optically smooth lower electrode(s) of excellent conductivity to be formed on the device substrate. The fabrication of optical surfaces in metal substrates is difficult and usually requires techniques such as diamond turning.
More particularly, it has been difficult to achieve sufficient thickness in optical quality electrodes formed by evaporation or sputtering onto optical quality substrates. Electroplating alone has resulted in rough exposed surfaces.
The general object of this invention is to provide a method of obtaining a metal surface of sufficient critical quality to serve as a substrate for IO devices and of sufficient thickness to serve as an electrode(s) for high frequency IO devices. It is a further object of the invention to provide such a method that does not require high temperature bonding. A still further object of the invention is to provide a method of transferring an optical quality film from a master optical surface to a secondary substrate.
It has now been found that the aforementioned objects can be attained by means of a replication technique using a master optical surface as a mold.
The method described here allows relatively thick metal films of excellent conductivity and of high optical quality to be transferred to a secondary or device substrate.
The method, that is relatively easy to implement, produces optically smooth metal surfaces of excellent conductivity needed for high frequency IO devices. The resulting metal-optics surface need not be flat and such structures may find use in other areas such as metal mirrors.
FIG. 1 shows the evaporation deposition of an adhesion film followed by a conductive film onto a master substrate while exposing the assembly to air between evaporations,
FIG. 2 shows the electroplating of a layer of the same conductive film onto the conductive film of FIG. 1 of sufficient thickness to achieve the necessary conductivity in the electroplated layer,
FIG. 3 shows the bonding of a secondary substrate to the electroplated layer with a replication cement, and
FIG. 4 shows the separation of the secondary substrate and both bonded conductive layers from the adhesion coated master leaving the optical quality surface of the conductive electrode exposed.
The steps involved in carrying out the invention and transferring an optical quality film from a master optical surface to a secondary substrate are shown in FIGS. 1 to 4 of the drawing wherein a chrome film is used for adhesion and a copper film is the transferred film.
Referring to FIG. 1, onto an optical quality master substrate, 10, there is first evaporation deposited a chrome film, 12, of about 1000 angstroms in thickness for adhesion followed by the evaporation deposit of a copper film, 14, of about 1000 angstroms in thickness. The assembly is exposed to air between evaporations.
Referring to FIG. 2, a copper layer, 16, is electroplated onto the copper film, 14 of sufficient thickness to achieve the necessary conductivity in the copper layer, 16. The copper layer, 16 has a naturally rough surface, 18.
Referring to FIG. 3, a secondary or device substrate, 20 is bonded to the electroplated copper layer, 16 with replication cement, 22. The naturally rough surface, 18 of the electroplated layer, 16 facilitates good adhesion of the cement, 22.
Referring to FIG. 4, the device substrate, 20 and both bonded copper layers, 16 and 14, are separated from the chrome coated master, 12 and 10, leaving the optical quality surface of the copper electrode exposed.
In the foregoing method, the optical quality master substrate, 10 can be composed of glass, fused silicon, plaster, and the like.
The secondary or device substrate can be composed of glass, metals, plastics, etc.
The replication cement used is a low shrink cement.
I wish it to be understood that I do not desire to be limited to the exact details of construction shown and described for obvious modifications will occur to a person skilled in the art.
Claims (4)
1. Method of transferring a relatively thick metal film of excellent conductivity and of high optical quality to a secondary substrate from a master substrate, said method including the steps of:
(A) evaporation depositing an adhesion film followed by a conductive film onto a master substrate while exposing the assembly to air between evaporations,
(B) electroplating a layer of the same conductive film onto the conductive film of step (A) of sufficient thickness to achieve the necessary conductivity in the electroplated layer,
(C) bonding a secondary substrate to the electroplated layer with a replication cement, and
(D) separating the secondary substrate and both bonded conductive layers from the adhesion coated master leaving the optical quality surface of the conductive electrode exposed.
2. Method according to claim 1 wherein the adhesion film is a chrome film and wherein the conductive film is copper.
3. Method according to claim 2 wherein each of the films of claim 2 is about 1000Å in thickness.
4. Method according to claim 1 wherein in step (B), electroplating is carried in a solution containing 400 parts water, 100 parts CuSO4. 5H2 O, and 4-10 parts H2 SO4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/416,681 USH1001H (en) | 1989-09-21 | 1989-09-21 | Method of transferring an optical quality film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/416,681 USH1001H (en) | 1989-09-21 | 1989-09-21 | Method of transferring an optical quality film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USH1001H true USH1001H (en) | 1991-12-03 |
Family
ID=23650880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US07/416,681 Abandoned USH1001H (en) | 1989-09-21 | 1989-09-21 | Method of transferring an optical quality film |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USH1001H (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050100665A1 (en) * | 2003-11-06 | 2005-05-12 | General Electric Company | Method for applying an optical coating to a surface of an article |
-
1989
- 1989-09-21 US US07/416,681 patent/USH1001H/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050100665A1 (en) * | 2003-11-06 | 2005-05-12 | General Electric Company | Method for applying an optical coating to a surface of an article |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5254493A (en) | Method of fabricating integrated resistors in high density substrates | |
| US4383003A (en) | Transfer lamination of copper thin sheets and films, method and product | |
| EP0205490A1 (en) | Fine line printed conductors fabrication process | |
| EP0384072A3 (en) | Composite including an inorganic image and method of transferring such an image | |
| US3878061A (en) | Master matrix for making multiple copies | |
| CA2053192A1 (en) | Use of amorphous carbon to promote adhesion between electroactive polymer films and conductive substrates | |
| CN102471867A (en) | Method for producing structured coatings on substrates, coated substrates and semi-finished products comprising coated substrates | |
| JPH02260492A (en) | Patterning method and product | |
| JPH0268992A (en) | Multilayered interconnection board | |
| EP0814509A3 (en) | Method for making a substrate structure with improved heat dissipation | |
| GB1248142A (en) | Improvements in or relating to electrical circuits assemblies | |
| GB1208962A (en) | Method of fabricating thin films and membranes | |
| USH1001H (en) | Method of transferring an optical quality film | |
| US4309460A (en) | Process for producing gold films | |
| AU3788785A (en) | Production of a matte surface om a metal layer | |
| JPH02288240A (en) | Metal covering formed on rear of semiconductor device and method of forming the same | |
| JPS6173901A (en) | Production of metallic mirror for infrared detector | |
| US6972049B2 (en) | Method for fabricating a diamond film having low surface roughness | |
| CN115537722A (en) | Preparation process and product of conductive black and insulating black on same surface layer | |
| US3702808A (en) | Process for the production of star tracklng reticles | |
| JPS61295291A (en) | Method of flatening ceramic substrate surface | |
| KR19980071237A (en) | Process for Film Transfer Metallization | |
| JPS6235361A (en) | photo mask material | |
| JPH04180231A (en) | Manufacture of semiconductor device provided with fine bump electrode | |
| JPS62119924A (en) | Manufacture of transmitting mask |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| STCF | Information on status: patent grant |
Free format text: PATENTED CASE |